CN215179306U

CN215179306U - Accurate measuring device for microelectronic packaging shear strength

Info

Publication number: CN215179306U
Application number: CN202120890002.8U
Authority: CN
Inventors: 陈刚; 林强; 冯少武; 梅云辉; 王强; 徐仲斌
Original assignee: Kyle Measurement And Control Technology Tianjin Co ltd; Tianjin University; Tianjin Polytechnic University
Current assignee: Kyle Measurement And Control Technology Tianjin Co ltd; Tianjin University; Tianjin Polytechnic University
Priority date: 2021-04-23
Filing date: 2021-04-23
Publication date: 2021-12-14
Anticipated expiration: 2031-04-23

Abstract

The utility model belongs to the technical field of electronic packaging test, and discloses an accurate measuring device for microelectronic packaging shear strength, which comprises a bonding strength shear test mechanism and a double-shaft extensometer; the bonding strength shear test mechanism comprises two lead screws with reverse threads, the two lead screws are connected with two cross beams, the two cross beams are respectively connected with a shear fixture fixing chuck and a shear fixture pushing head, the upper surface of the shear fixture fixing chuck is used for fixing a substrate of an electronic packaging sample, and the shear fixture pushing head is used for pushing an electronic element fixed on the substrate; the biaxial extensometer is placed on a test specimen with one of its four gauge rods against the surface of the electronic component and the other three against the surface of the substrate. The utility model places the double-shaft extensometer on the measured electronic packaging sample, and the rod fulcrum distance of the gauge rod of the double-shaft extensometer can change when the shearing test is carried out, thereby obtaining the accurate deformation value; the deformability of the solder can also be analyzed based on the difference in deformation under different forces.

Description

Accurate measuring device for microelectronic packaging shear strength

Technical Field

The utility model belongs to the technical field of the electronic packaging test, specific theory relates to an accurate measuring device suitable for microelectronic packaging shear strength.

Background

With the aging of electronic packaging technology, the packaging substrate of high-density thin electronic packaging develops toward smaller size, increased pin number, finer pin line width and pitch, and the like, and the process technology difficulty is higher and higher, so that the device for measuring the shear strength of the packaging technology is also more and more important.

The existing bonding strength test aiming at the solder mainly comprises a forward drawing test and a lateral shearing test, is limited by the imperfection of test equipment and test means in the lateral shearing test process, is difficult to measure the actual deformation of the solder in the shearing process, and generally approximately considers the displacement of a clamp as the deformation size of the solder. However, in practice, the displacement of the fixture during the test includes the deformation of the solder and the deformation of the substrate, and the deformation of the test sample substrates with different sizes and different forms is also inconsistent, which affects the accuracy of the related test data.

SUMMERY OF THE UTILITY MODEL

The utility model provides a microelectronic package shearing strength accurate measurement device, which is characterized in that a double-shaft extensometer is placed on a measured electronic package sample, and the rod fulcrum distance of a gauge rod of the double-shaft extensometer can be changed when the electronic package sample shearing test is carried out, so that an accurate deformation value is obtained; the deformability of the solder can also be analyzed based on the difference in deformation under different forces.

In order to solve the technical problem, the utility model discloses a following technical scheme realizes:

an accurate measurement device for microelectronic package shear strength comprises a bonding strength shear test mechanism and a double-shaft extensometer;

the bonding strength shear test mechanism comprises two lead screws with reverse threads, and two ends of each lead screw are fixed through bearings respectively; the two lead screws are connected with the two cross beams, and each cross beam is provided with a lead screw hole for the two lead screws to pass through; the two beams are respectively connected with a shearing clamp fixing chuck and a shearing clamp pushing head through external clamp connecting pieces, the shearing clamp fixing chuck is used for fixing a substrate of an electronic packaging sample, and the shearing clamp pushing head is used for pushing an electronic element fixed on the substrate;

the double-shaft extensometer is placed on the electronic packaging sample and comprises four gauge rods, namely a first gauge rod, a second gauge rod, a fourth gauge rod and a third gauge rod in the clockwise direction; the first scale distance rod abuts against the surface of the electronic element, and the second scale distance rod, the third scale distance rod and the fourth scale distance rod all abut against the surface of the substrate.

Furthermore, the bottoms of the two cross beams are connected with the linear guide rail through clamping grooves.

Further, the cross beam connected with the pushing head of the shearing clamp is provided with a groove, and the groove is used for installing a load sensor.

Further, the actual deformation value X of the solder can be obtained as α 1- α 2 by the lever fulcrum distance variation value α 1 between the first gauge bar and the third gauge bar and the lever fulcrum distance variation value α 2 between the second gauge bar and the fourth gauge bar.

The utility model has the advantages that:

the utility model provides a microelectronic packaging shear strength accurate measurement device, wherein a bonding strength shear test mechanism drives a beam by a lead screw, so that a shear fixture fixing chuck drives a substrate, a shear fixture pushing head pushes an electronic element, and a shear test is realized; the magnitude of the pushing force is received by the load sensor, and can be adjusted according to the received numerical value and the requirement; the device can simultaneously carry out in-situ measurement.

The utility model provides a pair of microelectronic package shear strength accurate measurement device, its biax extensometer are placed on the electronic packaging sample of measurationing, when carrying out electronic packaging sample shear test, and the pole fulcrum distance of biax extensometer scale mark apart from the pole can change, and then is worth the actual deformation value of solder according to pole fulcrum distance change, has effectively reduced the error of test, obtains accurate data.

Drawings

FIG. 1 is a schematic view of an assembly structure of the device for accurately measuring the shear strength of microelectronic package of the present invention;

FIG. 2 is a schematic view of the assembly structure of the bonding strength shear test mechanism of the present invention;

FIG. 3 is a schematic view of the connection between the shear fixture fixing chuck and the shear fixture pusher in the adhesion strength shear test mechanism of the present invention;

fig. 4 is an installation schematic diagram of the load sensor in the adhesion strength shear test mechanism of the present invention.

In the above figures: 1: a bonding strength shear test mechanism; 2: a dual-axis extensometer; 3: a cross beam; 4: a lead screw; 5: a linear guide rail; 6: connecting the clamp with a connecting piece; 7: a shearing clamp fixing chuck; 8: shearing a clamp pushing head; 9: a load sensor; 10: an electronic component; 11: a bearing; 12: a first gauge length rod; 13: a second gauge length rod; 14: a third gauge length rod; 15: a fourth gauge length rod; 16: a substrate.

Detailed Description

For further understanding of the contents, features and effects of the present invention, the following embodiments will be exemplified in conjunction with the accompanying drawings as follows:

as shown in fig. 1, the present embodiment provides an apparatus for accurately measuring the shear strength of a microelectronic package, which mainly includes an adhesive strength shear test mechanism 1 and a biaxial extensometer 2. After the shearing strength of the electronic element is tested by the bonding strength shearing test mechanism 1, the actual deformation value is obtained by the change of the distance of the lever fulcrum of the gauge rod of the biaxial extensometer 2.

As shown in fig. 2, the bonding strength shear test mechanism 1 includes a cross beam 3, a screw 4, a linear guide rail 5, an external clamp connector 6, a shear clamp fixing chuck 7, a shear clamp pushing head 8, a load sensor 9, and a bearing 11. The two lead screws 4 are provided with reverse threads, and two ends of each lead screw 4 are respectively arranged on a shell of the bonding strength shear test mechanism 1 through bearings 11. Two crossbeams 3 all span and install on two lead screws 4, and every crossbeam 3 is provided with two lead screw holes respectively for pass two lead screws 4 respectively. The bottom both ends of two crossbeams 3 all are provided with the draw-in groove, are connected with two linear guide 5 through the draw-in groove, and two linear guide 5 are installed in bonding strength shear test mechanism 1 bottom surface.

As shown in fig. 3, the shear clamp fixing clamp 7 and the shear clamp pushing head 8 are respectively connected with the opposite surfaces of the two beams 3 through the external clamp connecting piece 6. Wherein, the upper surface of the shearing clamp fixing chuck 7 fixes the substrate 16 provided with the electronic element 10 through a screw; the shearing jig pushing head 8 abuts against the side of the electronic component 10 for pushing the electronic component 10.

Therefore, the two cross beams 3 can perform opposite or opposite linear motion along the linear guide rail 5 through the rotary motion of the screw rod 4, so that the shearing clamp fixing chuck 7 drives the substrate 16 and the shearing clamp pushing head 8 to push the electronic element 10, and the in-situ shearing test is realized.

As shown in fig. 4, the cross beam 3 connected with the shearing fixture push head 8 is provided with a groove, the groove is used for installing a load sensor 10, and the load sensor 10 can detect the pushing force value of the shearing fixture push head 8, so that the pushing force value can be adjusted.

The double-shaft extensometer 2 is arranged on an electronic element 10 and a substrate 16 of an electronic packaging sample, the double-shaft extensometer 2 has light weight, and a gauge length rod can be fixed by friction force; after the shear strength of the electronic element is tested by the bonding strength shear test mechanism, the distance of the rod fulcrum of the gauge rod of the biaxial extensometer 2 can be changed, and then a numerical value is obtained. The double-shaft extensometer 2 comprises four scale distance rods which are named as a first scale distance rod 12, a second scale distance rod 13, a fourth scale distance rod 15 and a third scale distance rod 14 respectively in the clockwise direction. The first gauge length rod 12 abuts against the surface of the electronic component 10, and the second gauge length rod 13, the third gauge length rod 14 and the fourth gauge length rod 15 abut against the surface of the substrate 16. In the test process, the rod fulcrum distances of the first gauge rod 12 and the third gauge rod 14 are changed, and the change values of the rod fulcrum distances between the first gauge rod 12 and the third gauge rod 14 and between the second gauge rod 13 and the fourth gauge rod 15 can be measured through the double-shaft extensometer. Marking the change value of the lever fulcrum distance measured by the first distance marking lever 12 and the third distance marking lever 14 as alpha 1, and marking the change value of the lever fulcrum distance measured by the second distance marking lever 13 and the fourth distance marking lever 15 as alpha 2; data extraction is carried out on alpha 1 and alpha 2 through measurement software, and the actual deformation value X of the solder is obtained as alpha 1-alpha 2.

The bonding strength shear test mechanism 1 and the double-shaft extensometer 2 are matched to realize in-situ measurement, so that the positive center position of an electronic packaging sample can be kept still, the position change of the double-shaft extensometer 2 can be reduced while observation is facilitated, and the measurement error introduced by the double-shaft extensometer 2 is reduced.

Although the preferred embodiments of the present invention have been described with reference to the accompanying drawings, the present invention is not limited to the above embodiments, which are only illustrative and not restrictive, and those skilled in the art can make various changes without departing from the spirit and the scope of the invention as claimed.

Claims

1. An accurate measurement device for microelectronic package shear strength is characterized by comprising a bonding strength shear test mechanism and a double-shaft extensometer;

2. The apparatus of claim 1, wherein the bottom portions of the two beams are connected to the linear guide via a slot.

3. The apparatus of claim 1, wherein the beam is configured with a groove for receiving a load sensor, the groove being configured to engage the pusher of the shear clamp.

4. The apparatus of claim 1, wherein the actual deformation value X α 1- α 2 of the solder is obtained by a variation of the fulcrum distance α 1 between the first and third gauge bars and a variation of the fulcrum distance α 2 between the second and fourth gauge bars.