CN215178493U

CN215178493U - Clamp for multi-chip module drop test

Info

Publication number: CN215178493U
Application number: CN202121362562.2U
Authority: CN
Inventors: 张娜娜
Original assignee: Shanghai Falab Test Technology Co ltd
Current assignee: Shanghai Falab Test Technology Co ltd
Priority date: 2021-06-18
Filing date: 2021-06-18
Publication date: 2021-12-14
Anticipated expiration: 2031-06-18

Abstract

The utility model relates to the technical field of chip module clamp equipment, in particular to a multi-chip module drop test clamp which comprises a test bed and a substrate, the test bed is connected with a substrate, the test bed and the substrate are both connected with a first stud, the substrate is connected with a test board, a first coupler and a second coupler, the first coupler and the second coupler are both connected with a copper contact block and a connecting block, the test board and the substrate are both connected with a second stud, the test board is connected with an iron-cobalt alloy layer, a conductive contact block, a conductive circuit substrate, a slide block and a chip module, the slider is connected with rubber layer and magnet layer, the rubber layer is connected with the chip module, the utility model discloses a slider, rubber layer, magnet layer and iron cobalt alloy layer accomplish the spacing fixed function of adsorption contact to the chip module, are worth using widely.

Description

Clamp for multi-chip module drop test

Technical Field

The utility model relates to a chip module anchor clamps equipment technical field specifically is a multi-chip module is anchor clamps for drop test.

Background

A multi-chip module is a general electronic component, in which a plurality of integrated circuits, including semiconductor dies and other discrete components, are integrated and usually placed on a unified substrate, so that it is regarded as a single component when in use, and a chip drop test is used to simulate and verify the influence of vertical impact on a module circuit inside a chip when the chip is dropped and stopped at different heights.

General multi-chip module for drop test anchor clamps have the lower problem of the chip module stop gear change efficiency that sets up, and general multi-chip module for drop test anchor clamps have the relatively poor problem of the test mechanism utilization ratio of the survey test panel that sets up and base plate, consequently, propose a multi-chip module for drop test anchor clamps to above-mentioned problem.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a multi-chip module is anchor clamps for drop test to solve the problem that proposes among the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme:

a clamp for a multi-chip module drop test comprises a test bed and a substrate, wherein the front end of the test bed is in contact connection with the substrate, the inner part of the front end of the test bed and the inner part of the substrate are respectively connected with a first stud in a chimeric thread manner, the front end of the substrate is fixedly connected with a first coupler and a second coupler, the left and right ends of the first coupler and the right end of the second coupler are respectively and fixedly connected with a copper contact block, the bottom end of the first coupler and the left end of the second coupler are respectively and fixedly connected with a connecting block, the inner part of the front end of the substrate is in chimeric sliding connection with a test board, the inner part of the test board and the inner part of the front end of the substrate are respectively and fixedly connected with a second stud in a chimeric thread manner, the inner part of the top end of the test board and the inner part of the bottom end are respectively in chimeric contact connection with a slide block and a chip module, the bottom end of the slide block is fixedly connected with a rubber layer, and the bottom end of the rubber layer is in contact connection with the chip module, the testing board is fixedly connected with an iron-cobalt alloy layer, a conductive contact block and a conductive circuit substrate in an embedded mode, and the slider is fixedly connected with a magnet layer in an embedded mode in the top side.

Preferably, the connecting blocks positioned at the top end and the bottom end of the first coupler are fixedly communicated with an electric wire of the electric test circuit, and the connecting blocks positioned at the left end and the right end of the second coupler are fixedly communicated with an electric wire of the electric test circuit.

Preferably, the top end and the bottom end of the conductive contact block are in contact connection with the chip module.

Preferably, the number of the first studs, the number of the second couplers and the number of the test boards are four, and the first studs, the second couplers and the test boards are symmetrically distributed on two sides of the vertical central axis of the base plate.

Preferably, the shortest horizontal distance between the left end and the right end of the first coupler and the test board is 4.5-6.5 CM.

Compared with the prior art, the beneficial effects of the utility model are that:

1. in the utility model, through the arranged test board, the slide block, the rubber layer, the chip module, the iron-cobalt alloy layer, the conductive contact block and the magnet layer, the clamp can lead the chip module to be embedded and slide into the inner groove of the test board before use, the rubber layer is driven to contact and move with the chip module by manually pushing the slide block until the chip module contacts and touches the conductive contact block inside the test board, at the moment, the fixed magnet layer of inside gomphosis of slider adsorbs the contact with the fixed iron cobalt alloy layer of survey test panel outside gomphosis, accomplishes to the swift absorption of taking of chip module fixed, has greatly improved the change efficiency to multi-chip module drop test, has practiced thrift the experimental test time of changing the chip module more than 50%, has solved the lower problem of chip module stop gear change efficiency of general multi-chip module for drop test anchor clamps setting, has greatly improved the practicality of device.

2. In the utility model, the detachable vertical limit fixation of the test bed and the base plate and the detachable vertical limit fixation of the base plate and the test plate are respectively completed through the first stud and the second stud through the test bed, the base plate, the first stud, the second stud, the first coupler, the second coupler, the conductive circuit base plate and the test plate, the first coupler, the copper contact block, the conductive circuit base plate and the second coupler complete the electrical test of the chip module through the contact and communication of the conductive contact block and the chip module, the drop test of the simulation chip module is fixedly communicated with the vertical hydraulic transmission mechanism through the bottom of the test bed, the qualified utilization rate of the chip module after the drop test is verified through the electrical test, the problem of poor utilization rate of the test plate and the test mechanism of the base plate which are arranged by the clamp for the common multi-chip module drop test is solved, and the test cost of the drop test of the chip module is reduced, the stability and the reliability of the device are greatly improved.

Drawings

Fig. 1 is a schematic view of the overall structure of the present invention;

FIG. 2 is a schematic diagram of the test board of FIG. 1 according to the present invention;

FIG. 3 is a schematic view of the structure at A of FIG. 1 according to the present invention;

fig. 4 is a schematic structural diagram of the point B in fig. 2 according to the present invention.

In the figure: the device comprises a test bed 1, a substrate 2, a first stud 3, a first coupler 4, a second coupler 5, a copper contact block 6, a connecting block 7, a test board 8, a second stud 9, a sliding block 10, a rubber layer 11, a chip module 12, an iron-cobalt alloy layer 13, a conductive contact block 14, a conductive circuit substrate 15 and a magnet layer 16.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-4, the present invention provides a technical solution:

a clamp for a multi-chip module drop test comprises a test bed 1 and a substrate 2, the front end of the test bed 1 is in contact connection with the substrate 2, the inner part of the front end of the test bed 1 and the inner part of the substrate 2 are in jogged threaded rotation connection with a first stud 3, the front end of the substrate 2 is fixedly connected with a first electrical connector 4 and a second electrical connector 5, the left and right ends of the first electrical connector 4 and the right end of the second electrical connector 5 are respectively and fixedly connected with a copper contact block 6, the bottom end of the first electrical connector 4 and the left end of the second electrical connector 5 are respectively and fixedly connected with a connecting block 7, the inner part of the front end of the substrate 2 is in jogged sliding connection with a test board 8, the inner part of the test board 8 and the inner part of the front end of the substrate 2 are in jogged threaded rotation connection with a second stud 9, the inner part of the top end and the inner part of the bottom end of the test board 8 are respectively in jogged contact sliding connection with a slider 10 and a chip module 12, the bottom end of the slider 10 is fixedly connected with a rubber layer 11, the bottom end of the rubber layer 11 is in contact connection with the chip module 12, the iron-cobalt alloy layer 13, the conductive contact block 14 and the conductive circuit substrate 15 are fixedly connected to the test board 8 in an embedded mode, and the magnet layer 16 is fixedly connected to the slider 10 in an embedded mode.

The connecting blocks 7 positioned at the top end and the bottom end of the first electrical connector 4 are fixedly communicated with an electric wire of the electric test circuit, and the connecting blocks 7 positioned at the left end and the right end of the second electrical connector 5 are fixedly communicated with an electric wire of the electric test circuit; the top end and the bottom end of the conductive contact block 14 are in contact connection with the chip module 12; the four first studs 3, the four second couplers 5 and the four test boards 8 are symmetrically distributed on two sides of the vertical central axis of the base plate 2; the shortest horizontal distance from the left end and the right end of the first electric coupler 4 to the test board 8 is 4.5-6.5 CM; the fixture comprises a test board 8, a slide block 10, a rubber layer 11, a chip module 12, an iron-cobalt alloy layer 13, a conductive contact block 14 and a magnet layer 16, wherein before use, the chip module 12 is embedded and slides into an inner groove in the test board 8, the rubber layer 11 is driven to contact with the chip module 12 by manually pushing the slide block 10 until the chip module 12 contacts with the conductive contact block 14 inside the test board 8, at this time, the magnet layer 16 embedded and fixed inside the slider 10 is in adsorption contact with the iron-cobalt alloy layer 13 embedded and fixed outside the test board 8, so that the chip module 12 can be quickly taken, adsorbed and fixed, the replacement efficiency of a multi-chip module drop test is greatly improved, more than 50% of test time for testing and replacing the chip module 12 is saved, the problem that the replacement efficiency of a chip module 12 limiting mechanism arranged by a clamp for a general multi-chip module drop test is lower is solved, and the practicability of the device is greatly improved; the test bed 1, the substrate 2, the first stud 3, the second stud 9, the first coupler 4, the second coupler 5, the conductive circuit substrate 15, the copper contact block 6 and the test board 8, the first stud 3 and the second stud 9 are used for respectively finishing the detachable vertical limiting fixation of the test bed 1 and the substrate 2 and the test board 8, the first coupler 4, the copper contact block 6, the conductive circuit substrate 15 and the second coupler 5 are used for finishing the electrical test on the chip module 12 through the contact communication of the conductive contact block 14 and the chip module 12, the drop test of the chip module 12 is simulated through the fixed communication of the bottom of the test bed 1 and the vertical hydraulic transmission mechanism, the qualified utilization rate of the chip module 12 after the drop test is verified through the electrical test, and the problem of poor utilization rate of the test board 8 and the test mechanism of the substrate 2 which are arranged by a common multi-chip module drop test fixture is solved, the test cost of the chip module drop test is reduced, and the stability and the reliability of the device are greatly improved.

The working process is as follows: the utility model is to slide the chip module 12 into the inner groove of the test board 8 before the clamp is used, the rubber layer 11 is driven to contact with the chip module 12 by manually pushing the slide block 10 until the chip module 12 contacts with the conductive contact block 14 inside the test board 8, at this time, the magnet layer 16 embedded and fixed inside the slide block 10 is in adsorption contact with the iron-cobalt alloy layer 13 embedded and fixed outside the test board 8, the chip module 12 is quickly taken, adsorbed and fixed, the replacement efficiency of the multi-chip module drop test is greatly improved, the test time for replacing the chip module 12 in the test is saved by more than 50 percent, electrical testing of the chip module 12 is accomplished by the contact communication of the conductive contact block 14 with the chip module 12, through the drop test of the simulation chip module 12 which is fixedly communicated with the vertical hydraulic transmission mechanism at the bottom of the test bed 1, the qualified use rate of the chip module 12 after the drop test is verified through the electrical test to complete the use process of the device.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a multi-chip module is anchor clamps for drop test, includes test bench (1) and base plate (2), its characterized in that: the testing table is characterized in that the front end of the testing table (1) is in contact connection with a substrate (2), the inner part of the front end of the testing table (1) and the inner part of the substrate (2) are in embedded threaded connection with a first stud (3) in a rotating manner, the front end of the substrate (2) is fixedly connected with a first coupler (4) and a second coupler (5), the left and right ends of the first coupler (4) and the right end of the second coupler (5) are respectively and fixedly connected with a copper contact block (6), the bottom end of the first coupler (4) and the left end of the second coupler (5) are respectively and fixedly connected with a connecting block (7), the inner embedded part of the front end of the substrate (2) is in sliding connection with a testing plate (8), the inner part of the testing plate (8) and the inner part of the front end of the substrate (2) are respectively and are in embedded threaded connection with a second stud (9), the inner part of the top end and the inner part of the bottom end of the testing plate (8) are respectively and in embedded contact with a sliding connection with a sliding block (10) and a chip module (12), the testing device is characterized in that a rubber layer (11) is fixedly connected to the bottom end of the sliding block (10), the bottom end of the rubber layer (11) is in contact connection with a chip module (12), an iron-cobalt alloy layer (13), a conductive contact block (14) and a conductive circuit substrate (15) are fixedly connected to the interior of the testing board (8) in an embedded mode, and a magnet layer (16) is fixedly connected to the interior of the top side of the sliding block (10) in an embedded mode.

2. The multi-chip module drop test fixture of claim 1, wherein: the connecting blocks (7) are located at the top end and the bottom end of the first coupler (4) and fixedly communicated with an electric wire of the electric test circuit, and the connecting blocks (7) are located at the left end and the right end of the second coupler (5) and fixedly communicated with an electric wire of the electric test circuit.

3. The multi-chip module drop test fixture of claim 1, wherein: the top end and the bottom end of the conductive contact block (14) are in contact connection with the chip module (12).

4. The multi-chip module drop test fixture of claim 1, wherein: first double-screw bolt (3), second electrical apparatus (5) and survey test panel (8) all have four, and are the symmetric distribution and are in the both sides of the vertical axis position of base plate (2).

5. The multi-chip module drop test fixture of claim 1, wherein: the shortest transverse horizontal distance from the left end and the right end of the first coupler (4) to the test board (8) is 4.5-6.5 CM.