CN215147989U - Polishing machine - Google Patents
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- CN215147989U CN215147989U CN202121226936.8U CN202121226936U CN215147989U CN 215147989 U CN215147989 U CN 215147989U CN 202121226936 U CN202121226936 U CN 202121226936U CN 215147989 U CN215147989 U CN 215147989U
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Abstract
The utility model relates to the technical field of chemical mechanical polishing, in particular to a polishing machine; the polishing machine comprises a base disc, a polishing pad, a polishing head, a temperature sensor and a water cooling assembly, wherein the polishing pad is arranged on the first end face of the base disc; the polishing head is arranged above the polishing pad and is used for arranging a wafer to be polished, and the wafer is positioned between the polishing head and the polishing pad under the condition that the wafer is arranged on the polishing head; the temperature sensor is arranged on the base disc and used for detecting the temperature of the polishing pad; the water cooling assembly is used for conveying cooling water to the second end face of the base plate. The utility model discloses a burnishing machine can improve the error and the hysteresis quality of polishing temperature control, improves the accuracy and the stability of control, and then improves the quality and the success rate of polishing.
Description
Technical Field
The utility model relates to a chemical mechanical polishing technical field particularly, relates to a burnishing machine.
Background
The hard and brittle material is widely applied in the fields of electronic information and precision engineering due to excellent mechanical property, dielectric property and chemical stability, and becomes a high-quality substrate and substrate material for preparing high-temperature superconducting films, infrared optical materials, microelectronic devices and the like. These substrate wafers are fabricated by long crystal growth, slicing, grinding, chamfering, annealing, polishing, and cleaning. The chemical mechanical polishing (CMP polishing) is cooperated with mechanical action and chemical action to obtain an ultra-precise and nondestructive processing surface, which is generally used as the last step of surface processing, and the removal amount is generally 1-2 um.
In the CMP polishing process of hard and brittle material processing, a polishing pad is used for carrying out chemical mechanical polishing treatment on the surface of a wafer. The material removal rate and surface quality in CMP are affected by a number of factors, with polishing interface temperature being one of the major factors. The polishing interface includes a polished surface of the wafer and an upper surface of the polishing pad with a polishing fluid therebetween. The polishing interface temperature is increased, so that the activity of the polishing solution is improved, the chemical reaction speed is accelerated, and the material removal rate is improved. However, when the temperature of the polishing interface is too high, the pH value of the polishing solution changes, so that the nanoparticles in the polishing solution agglomerate to cause scratching; the characteristics of the fibers on the surface of the polishing pad can be changed, the roughness peak hardness of the surface of the polishing pad is reduced, the polishing pad is gradually glazed, the polishing rate is influenced, and the service life of the polishing pad is shortened; the carrier for placing the wafer may be deformed by heat, and the wafer may be separated from the carrier to cause the damage of the whole wafer; it follows that temperature has a significant impact on wafer polishing quality and success rate during CMP.
However, in the related art, there are errors and hysteresis in the control of the polishing temperature, and the control is inaccurate and unstable, resulting in poor polishing quality and a reduced success rate.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a burnishing machine, its error and the hysteresis quality that can improve polishing temperature control improve the accuracy and the stability of control, and then improve the quality and the success rate of polishing.
The embodiment of the utility model is realized like this:
the utility model provides a polishing machine, include:
a base plate;
the polishing pad is arranged on the first end surface of the base plate;
the polishing head is arranged above the polishing pad and is used for arranging a wafer to be polished, and the wafer is positioned between the polishing head and the polishing pad under the condition that the wafer is arranged on the polishing head;
the temperature sensor is arranged on the base plate and used for detecting the temperature of the polishing pad;
and the water cooling assembly is used for conveying cooling water to the second end face of the base plate.
In an alternative embodiment, the temperature sensor is a non-contact infrared temperature sensor.
In an alternative embodiment, the polishing machine comprises a temperature detection assembly, the temperature detection assembly comprises a plurality of temperature sensors, the cross section of the polishing head is circular, the temperature detection assembly can be opposite to the polishing head, and under the condition that the temperature detection assembly is opposite to the polishing head, the plurality of temperature sensors are distributed at intervals along the radial direction of the polishing head.
In an alternative embodiment, the temperature detection assembly comprises three temperature sensors, and in the case that the temperature detection assembly is opposite to the polishing head, one of the temperature sensors is opposite to the center of the polishing head, and the other two temperature sensors are distributed on two sides of the center of the polishing head.
In an alternative embodiment, the polisher includes a plurality of polishing heads distributed about the axis of the base plate.
In an alternative embodiment, the water cooling assembly includes a water cooler and a cooling pipe connected to the water cooler, the cooling pipe is disposed on the second end surface of the base plate, and the water cooler is used for delivering cooling water to the cooling pipe, so that the cooling water is guided by the cooling pipe to flow to the second end surface of the base plate.
In an alternative embodiment, the temperature sensor is communicatively coupled to the water cooling assembly.
In an optional embodiment, the polishing machine further comprises a data acquisition device, and the temperature sensor is in communication connection with the water cooling assembly through the data acquisition device.
In an alternative embodiment, the polishing machine further comprises a display, and the temperature sensor is in communication with the display.
In an alternative embodiment, the polisher further comprises a frame, and the base plate and the polishing head are both mounted to the frame.
The utility model discloses burnishing machine's beneficial effect includes: the embodiment of the utility model provides a polishing machine includes base plate, polishing pad, polishing head, temperature sensor and water-cooling subassembly, and the polishing pad sets up in the first terminal surface of base plate; the polishing head is arranged above the polishing pad and is used for arranging a wafer to be polished, and the wafer is positioned between the polishing head and the polishing pad under the condition that the wafer is arranged on the polishing head; the temperature sensor is arranged on the base disc and used for detecting the temperature of the polishing pad; the water cooling assembly is used for conveying cooling water to the second end face of the base plate. Therefore, the temperature of the polishing pad can be detected in real time by using the temperature sensor arranged on the base disc, namely, the temperature of a polishing interface can be detected in real time, reliably and accurately in the polishing process, the cooling water is conveyed to the second end face of the base disc by using the water cooling assembly according to the temperature detected by the temperature sensor to adjust the temperature of the polishing disc, and the error and the hysteresis of the temperature detected by the temperature sensor are improved because the temperature sensor is arranged on the base disc, so when the polishing temperature is adjusted by using the cooling water conveyed by the water cooling assembly according to the temperature detected by the temperature sensor, the error and the hysteresis can be improved, the accuracy and the stability of control are improved, and the polishing quality and the success rate are favorably improved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention, and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
Fig. 1 is a schematic structural diagram of a polishing machine according to an embodiment of the present invention;
FIG. 2 is a schematic structural diagram of a base plate, a polishing head and a temperature sensor according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of a temperature sensor according to an embodiment of the present invention.
Icon: 010-polishing machine; 100-a frame; 110-a base plate; 120-a polishing pad; 130-a polishing head; 140-a temperature sensor; 141-a temperature detection component; 150-a water-cooled component; 151-water chiller; 152-a cooling conduit; 161-data acquisition means; 162-display.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention, as generally described and illustrated in the figures herein, may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the present invention, presented in the accompanying drawings, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", and the like indicate the position or positional relationship based on the position or positional relationship shown in the drawings, or the position or positional relationship which is usually placed when the utility model is used, and are only for convenience of description and simplification of the description, but do not indicate or imply that the device or element to be referred must have a specific position, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and the like are used merely to distinguish one description from another, and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "disposed" and "connected" are to be interpreted broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Referring to fig. 1, the present embodiment provides a polishing machine 010, which can be used for performing a chemical mechanical polishing process on a wafer.
Referring to fig. 1, the polishing machine 010 includes a frame 100, a base plate 110, a polishing pad 120, and a polishing head 130, wherein the base plate 110 and the polishing head 130 are disposed on the frame 100, the polishing pad 120 is disposed on a first end surface of the base plate 110, and the polishing head 130 is disposed above the polishing pad 120 and is used for disposing a wafer to be polished, and in a case where the wafer is disposed on the polishing head 130, the wafer is disposed between the polishing head 130 and the polishing pad 120. In use, the polishing liquid can be dropped onto the polishing pad 120, so that a polishing interface is formed between the side of the wafer facing the polishing pad 120, the side of the polishing pad 120 facing the wafer, and the polishing liquid therebetween, and the side of the wafer facing the polishing pad 120 can be subjected to a polishing process.
Optionally, the polishing machine 010 further includes a base disc driving mechanism, and the base disc driving mechanism is in transmission connection with the base disc 110 and is used for driving the base disc 110 to rotate around its own rotating shaft; wherein, when the base disc driving mechanism drives the base disc 110 to rotate around its own rotation axis, the polishing pad 120 disposed on the base disc 110 rotates synchronously with the base disc 110.
Further, the polishing machine 010 further includes a polishing head driving mechanism, and the polishing head driving mechanism is in transmission connection with the polishing head 130 and is used for driving the polishing head 130 to rotate around its own rotating shaft.
With this arrangement, the polishing process can be efficiently performed on the wafer set on the polishing head 130 by the rotation of the polishing pad 120 and the polishing head 130.
It should be noted that the base disc driving mechanism and the polishing head driving mechanism are both disposed on the frame 100, and the structure and the working principle of the base disc driving mechanism and the polishing head driving mechanism are similar to those of the related art, and are not described herein again.
Of course, in other embodiments, the base disc driving mechanism and the polishing head driving mechanism may be alternatively provided, that is, only one of the base disc 110 and the polishing head 130 may be allowed to rotate around its own rotation shaft.
The manner of disposing the polishing pad 120 on the first end surface of the base plate 110 can be selected according to the requirement, and the polishing pad 120 of the present embodiment is adhered to the first end surface of the base plate 110. Of course, in other embodiments, the polishing pad 120 may be connected to the base plate 110 by a fastener such as a screw, and the like, and is not particularly limited herein.
The manner of disposing the wafer to be polished on the polishing head 130 may be selected as desired, for example: pasting wax, vacuum adsorption or placing by a carrier, etc., and the specific arrangement manner is similar to that of the related art, and is not described herein again.
Referring to fig. 1, 2 and 3, the polishing machine 010 of the present embodiment further includes a temperature sensor 140 and a water cooling assembly 150, wherein the temperature sensor 140 is disposed on the base plate 110 and is used for detecting the temperature of the polishing pad 120; the water cooling unit 150 is used to deliver cooling water to the second end surface of the base plate 110. Thus, the temperature of the polishing pad 120 can be detected in real time by the temperature sensor 140 disposed on the base plate 110, that is, the temperature of the polishing interface can be detected in real time, reliably and accurately during the polishing process, and the temperature of the polishing pad can be adjusted by delivering the cooling water to the second end surface of the base plate 110 by the water cooling module 150 according to the temperature detected by the temperature sensor 140. since the temperature sensor 140 is disposed on the base plate 110, the error and the hysteresis of the temperature detected by the temperature sensor 140 are improved, when the polishing temperature is adjusted by delivering the cooling water by the water cooling module 150 according to the temperature detected by the temperature sensor 140, the error and the hysteresis can be improved, the accuracy and the stability of the control can be improved, and the polishing quality and the success rate can be improved.
In the related art, the temperature sensor 140 is disposed above the polishing head 130, so that the detection distance is long, the detection result error is large and has time delay, and cooling on the basis further causes errors and hysteresis, which makes it difficult to ensure accuracy and stability of temperature control in the polishing process, and is not favorable for the quality and success rate of polishing. And this embodiment sets up temperature sensor 140 in basal disc 110, and the interval distance is close, can reduce detection error and time delay nature effectively, through cooling control polishing temperature on this basis, has ensured accuracy and stability effectively, is favorable to promoting the quality and the success rate of polishing.
The number of the polishing heads 130 provided in the polishing machine 010 can be selected as needed, and the polishing machine 010 of the embodiment includes a plurality of polishing heads 130, and the plurality of polishing heads 130 are distributed around the axis of the base plate 110. Specifically, the polishing machine 010 of the present embodiment includes four polishing heads 130, and the four polishing heads 130 are uniformly distributed around the axis of the base 110. Of course, in other embodiments, the number of the polishing heads 130 of the polishing machine 010 may also be one, two, three, etc., and is not limited herein.
Referring to fig. 2, the polishing machine 010 of the embodiment includes a temperature detecting assembly 141, the temperature detecting assembly 141 includes a plurality of temperature sensors 140, the cross-section of the polishing head 130 is circular, the temperature detecting assembly 141 can be opposite to the polishing head 130, and the plurality of temperature sensors 140 are spaced apart from each other in a radial direction of the polishing head 130 when the temperature detecting assembly 141 is opposite to the polishing head 130. With this arrangement, the temperature of the polishing interface can be detected more reliably by the temperature detection assembly 141, so that the polishing temperature can be controlled more reliably and timely.
It should be noted that the temperature detection assembly 141 can be opposite to the polishing head 130, which means: during the rotation of the base plate 110 about its axis, the base plate 110 can be rotated to a position where the temperature detection assembly 141 is opposed to the polishing head 130.
Further, the polishing machine 010 of the present embodiment includes four temperature detection assemblies 141, and the four temperature detection assemblies 141 can correspond to the four polishing heads 130 one to one; each temperature detection assembly 141 includes three temperature sensors 140, and in a case where the temperature detection assembly 141 is opposite to the polishing head 130, one of the temperature sensors 140 is opposite to the center of the corresponding polishing head 130, and the other two temperature sensors 140 are distributed on both sides of the center of the polishing head 130. With this arrangement, the temperature of the polishing interface opposite to each polishing head 130 can be reliably detected by the corresponding temperature detection assembly 141.
It should be noted that the four temperature detecting assemblies 141 of the present embodiment have 12 temperature sensors 140 in total, and each 4 of the 12 temperature sensors 140 are combined to be uniformly distributed around the central axis of the substrate 110 to form three concentric circles.
Of course, in other embodiments, the number of the temperature detection assemblies 141 may also be one, two, etc., and is not limited in particular. In other embodiments, the number of the temperature sensors 140 of the temperature detection assembly 141 may also be one, two, or four, etc., and is not limited in particular.
It should be understood that, in other embodiments, the plurality of temperature sensors 140 of the temperature detection assembly 141 may be distributed in a ring shape, or may also be distributed in a rectangular array, etc., and is not limited in particular.
Optionally, the temperature sensor 140 is a non-contact infrared temperature sensor, so that the temperature of the polishing pad 120 during the chemical mechanical polishing process can be measured by using the temperature sensor 140 disposed on the base disk 110 and using a non-contact temperature measurement method, and due to the non-contact temperature measurement, the surface temperature of the polishing pad 120 can be obtained by using the infrared radiation principle without the temperature sensor 140 contacting the polishing pad 120, and the detection result is accurate and reliable.
It should be noted that the detection principle of the non-contact infrared temperature sensor is similar to that of the related art, and is not described herein again.
It should be understood that in other embodiments, the temperature sensor 140 may alternatively be a temperature sensor having other principles of operation.
It should be noted that the temperature sensor 140 of the present embodiment may be disposed in the substrate 110 to ensure the accuracy of the detection and not interfere with the polishing process. In other embodiments, the temperature sensor 140 may be disposed on the second end surface of the substrate 110, so long as the temperature sensor 140 can detect the temperature of the polishing pad 120 and is not damaged by the polishing process.
Referring to fig. 1, the water cooling assembly 150 of the present embodiment includes a water chiller 151 and a cooling pipe 152 connected to the water chiller 151, wherein the cooling pipe 152 is disposed at the second end surface of the base 110, and the water chiller 151 is configured to deliver cooling water to the cooling pipe 152, so that the cooling water is guided by the cooling pipe 152 to flow to the second end surface of the base 110. With such an arrangement, the temperature of the base disk 110 and the polishing pad 120 disposed on the base disk 110 is reduced by the cooling water in the cooling pipe 152 on the second end surface of the base disk 110, so as to control the temperature of the polishing interface; further, the cooling pipe 152 connected to the water chiller 151 is provided at the second end surface of the base 110, and interference with the polishing work can be prevented.
It should be noted that the connection between the cooling pipe 152 and the water chiller 151 may be in a circulating flow form, that is, the cooling water flowing from the water chiller 151 into the cooling pipe 152 may flow back to the water chiller 151 through the cooling pipe 152, so that the input of the cooling water can be saved. Of course, in other embodiments, the water chiller 151 may be connected to a water source, and the cooling water flowing from the water chiller 151 into the cooling pipe 152 may be directly discharged.
The manner in which the cooling duct 152 is disposed on the second end face of the base plate 110 may be selected as needed, for example: the cooling pipe 152 may be adhered to the second end surface of the base plate 110, or may be engaged with the second end surface of the base plate 110, etc., and is not particularly limited thereto.
In this embodiment, the temperature sensor 140 is in communication with the water cooling assembly 150; specifically, the temperature sensor 140 is in communication with the water chiller 151; in this way, the flow rate and temperature of the cooling water supplied from the water chiller 151 can be adjusted by the temperature detection signal output from the temperature sensor 140.
Referring to fig. 1, further, the polishing machine 010 further includes a data acquisition device 161, and the temperature sensor 140 is in communication connection with the water cooling assembly 150 through the data acquisition device 161; specifically, the temperature sensor 140 is communicatively connected to the water chiller 151 via a data acquisition device 161. So set up, can receive the detected signal that temperature sensor 140 outputs through data acquisition device 161 to according to detected signal control cold water machine 151 adjustment cooling water's flow and temperature, for example: controlling the water chiller 151 to increase the flow rate of the cooling water in the cooling pipe 152 and to decrease the temperature of the cooling water when the temperature of the polishing pad 120 detected by the temperature sensor 140 is higher than a temperature required for polishing; when the temperature sensor 140 detects that the temperature of the polishing pad 120 is lower than a temperature required for polishing, the water cooler 151 is controlled to reduce the flow rate of the cooling water in the cooling pipe 152 and increase the temperature of the cooling water.
It should be appreciated that in other embodiments, only the flow rate of the cooling water in the cooling conduit 152 or only the temperature of the cooling water may be adjusted when the temperature sensor 140 detects that the temperature of the polishing pad 120 is not desirable.
It should be noted that the temperature sensor 140 and the data acquisition device 161 may transmit the detection signal by wireless communication, for example: WiFi, bluetooth, etc., i.e., the temperature sensor 140 sends a detection signal to the data acquisition device 161 through the direction of wireless communication. Of course, in other embodiments, the temperature sensor 140 may also be electrically connected to the data acquisition device 161 via a cable, so that both are in wired communication.
Further, the communication connection between the data acquisition device 161 and the water chiller 151 may be wireless or wired, and is not particularly limited herein.
It should be further noted that the data acquisition device 161 may adopt an editable logic controller provided in the related art, and the data acquisition device has a data acquisition portion and a data transmission portion, the data acquisition portion is configured to acquire the detection data of the temperature sensor 140, and the data transmission portion is configured to transmit a control signal corresponding to the acquired detection data to the water chiller 151.
Referring to fig. 1, the polishing machine 010 of the embodiment further includes a display 162, and the display 162 is in communication connection with the temperature sensor 140; specifically, the display 162 is communicatively coupled to the temperature sensor 140 via the data acquisition device 161. So set up, be convenient for when temperature sensor 140 sends the detected signal of the temperature of polishing pad 120 that detects to data acquisition device 161, control display 162 by data acquisition device 161 and show the temperature value that corresponds to in order to the quick operating temperature who masters polishing pad 120 of user, be favorable to ensureing to launch smoothly of polishing.
It should be noted that, the display 162 and the data acquisition device 161 may be connected in a wired or wireless communication manner, and are not limited in this respect.
The polishing machine 010 provided by the embodiment can be used for polishing a wafer, and the using method comprises the following steps: the wafer is disposed at one end of the polishing head 130 facing the base plate 110, the polishing pad 120 is disposed at the first end surface of the base plate 110, the wafer disposed on the polishing head 130 is brought into contact with the polishing pad 120, and the polishing operation is started by dropping the polishing liquid onto the polishing pad 120.
To sum up, the utility model discloses a burnishing machine 010 can utilize the temperature that sets up in the real-time detection polishing pad 120 of temperature sensor 140 of base disc 110, detect promptly in polishing process real-time, reliably, the accurate temperature that detects the polishing interface, and utilize water-cooling module 150 to carry the temperature of polishing disc to the second terminal surface of base disc 110 with the cooling water according to temperature sensor 140 detection temperature, owing to set up temperature sensor 140 in base disc 110, the error and the hysteresis quality that temperature sensor 140 detected the temperature have been improved, the event is when utilizing water-cooling module 150 to carry the temperature of cooling water adjustment polishing according to the temperature that temperature sensor 140 detected, error and hysteresis quality can be improved, the accuracy and the stability of high control, be favorable to improving the quality and the success rate of polishing.
The above is only a preferred embodiment of the present invention, and is not intended to limit the present invention, and various modifications and changes will occur to those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. A polishing machine, comprising:
a base plate;
a polishing pad disposed on the first end surface of the base plate;
the polishing head is arranged above the polishing pad and is used for arranging a wafer to be polished, and the wafer is positioned between the polishing head and the polishing pad under the condition that the wafer is arranged on the polishing head;
a temperature sensor disposed on the base plate for detecting a temperature of the polishing pad;
and the water cooling assembly is used for conveying cooling water to the second end face of the base plate.
2. A polishing machine according to claim 1 in which the temperature sensor is a non-contact infrared temperature sensor.
3. The polishing machine as claimed in claim 1, wherein the polishing machine comprises a temperature detection assembly, the temperature detection assembly comprises a plurality of temperature sensors, the polishing head is circular in cross section, the temperature detection assembly can be opposite to the polishing head, and the temperature sensors are distributed at intervals along a radial direction of the polishing head with the temperature detection assembly opposite to the polishing head.
4. A polishing machine as claimed in claim 3 wherein said temperature sensing assembly comprises three said temperature sensors, one of said temperature sensors being opposite the center of said polishing head and two of said temperature sensors being distributed on either side of the center of said polishing head with said temperature sensing assembly being opposite said polishing head.
5. A polisher according to claim 1 comprising a plurality of the polishing heads distributed about the axis of the base.
6. The polishing machine as claimed in claim 1, wherein the water cooling assembly comprises a water cooler and a cooling pipe connected with the water cooler, the cooling pipe is arranged on the second end face of the base plate, and the water cooler is used for delivering cooling water to the cooling pipe so that the cooling water flows to the second end face of the base plate under the guidance of the cooling pipe.
7. A polishing machine as set forth in claim 1 wherein said temperature sensor is in communicative connection with said water-cooled assembly.
8. The polishing machine of claim 7, further comprising a data acquisition device, wherein the temperature sensor is in communication with the water cooling assembly through the data acquisition device.
9. The polishing machine of claim 1 further comprising a display, the temperature sensor being in communicative connection with the display.
10. The polisher of claim 1, further comprising a frame, the base and polishing head each mounted to the frame.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121226936.8U CN215147989U (en) | 2021-06-02 | 2021-06-02 | Polishing machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121226936.8U CN215147989U (en) | 2021-06-02 | 2021-06-02 | Polishing machine |
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| CN215147989U true CN215147989U (en) | 2021-12-14 |
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| CN202121226936.8U Active CN215147989U (en) | 2021-06-02 | 2021-06-02 | Polishing machine |
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| CN (1) | CN215147989U (en) |
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2021
- 2021-06-02 CN CN202121226936.8U patent/CN215147989U/en active Active
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