CN215118934U

CN215118934U - Miniature LED packaging structure

Info

Publication number: CN215118934U
Application number: CN202121316415.1U
Authority: CN
Inventors: 程天朗
Original assignee: Zhongshan Zhongsi Microelectronics Co ltd
Current assignee: Zhongshan Zhongsi Microelectronics Co ltd
Priority date: 2021-06-11
Filing date: 2021-06-11
Publication date: 2021-12-10
Anticipated expiration: 2031-06-11

Abstract

The utility model relates to a miniature LED packaging structure, miniature LED packaging structure includes a plurality of encapsulation units, and the encapsulation unit includes LED chip, printing opacity membrane and the welding piece that two mirrors are symmetrically arranged, each welding piece includes the protruding portion that holds mouthful and two symmetrically arranged, and the holding mouth of each welding piece arranges respectively a part of LED chip; the light-transmitting film is arranged around the outer sides of the LED chip and the welding sheet; the electrode at the bottom of the LED chip and the bottom surface of the welding sheet are positioned on the same side of the light-transmitting film. Besides welding materials, no other medium is used for increasing thermal resistance between the LED chip and the circuit board, enough welding area is guaranteed through the welding sheet, firmness in use is enhanced, the LED chip does not need to bear quality risks caused by secondary welding, heat conduction can be prevented from being blocked, welding reliability is improved, and working stability of the miniature LED is guaranteed.

Description

Miniature LED packaging structure

Technical Field

The utility model belongs to the technical field of the LED encapsulation, concretely relates to miniature LED packaging structure.

Background

The micro LED is a diode for converting electricity into light, and since a part of energy is converted into heat in the conversion process, the luminous efficiency and the service life of the micro LED are both related to the working temperature, and the higher the working temperature is, the lower the luminous efficiency of the chip is, and the shorter the service life is, therefore, the heat generated by the operation of the micro LED is conducted to the outside and dissipated to the air through the heat sink as much as possible in the use process of the micro LED.

The current packaging structure of the single micro LED device comprises an SMD (surface mounted device) patch structure and a chip-level packaging structure, wherein heat of a chip in the SMD patch structure is conducted outwards through media such as multiple welding materials, brackets and the like, so that the heat conduction outwards is influenced, and the luminous efficiency is reduced; the chip scale package device is formed by welding a direct chip electrode and a circuit board, has good heat conduction performance, but has low yield in the welding process due to extremely small chip electrode, and is easy to be desoldered due to the influence of external force after welding to cause the failure of the LED due to small welding area.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing a guarantee miniature LED job stabilization nature's miniature LED packaging structure.

In order to achieve the main purpose, the utility model provides a micro LED package structure includes a plurality of package units, the package units include LED chips, light-transmitting films and two mirror symmetry arranged welding sheets, each welding sheet includes a receiving opening and two symmetrical arranged protruding parts, the receiving opening is located between the two protruding parts, the receiving openings of the two welding sheets are arranged oppositely, the receiving opening of each welding sheet is arranged with a part of the LED chip; the light-transmitting film is arranged around the outer sides of the LED chip and the welding sheet, and the bottom surface of the welding sheet is exposed out of the light-transmitting film; along the opposite direction of the two accommodating openings, the distance between the main bodies of the two welding sheets is not less than the electrode spacing of the LED chip; the electrode at the bottom of the LED chip and the bottom surface of the welding sheet are positioned on the same side of the light-transmitting film.

It is thus clear from the above-mentioned scheme, miniature LED packaging structure is when pasting dress use on the circuit board, except that welding material between LED chip and the circuit board, there is not other medium to increase the thermal resistance, and weld with the soldering lug, guarantee sufficient welding area, can bear bigger external stress after the welding, fastness when strengthening the use, the LED chip need not stand the quality risk that is brought by the secondary welding, therefore, miniature LED packaging structure can avoid heat conduction to be obstructed, promote welding reliability, guarantee miniature LED job stabilization nature.

Drawings

The invention is further described with the aid of the accompanying drawings, in which, however, the embodiments do not constitute any limitation to the invention, and for those skilled in the art, other drawings may be obtained without inventive effort from the following drawings.

Fig. 1 is a structural diagram of an embodiment of a micro LED package structure of the present invention.

Fig. 2 is a structural diagram of another view angle of an embodiment of a micro LED package structure according to the present invention.

Fig. 3 is a partial structure diagram of an embodiment of a micro LED package structure of the present invention.

Fig. 4 is a schematic layout view of a solder pad according to an embodiment of the present invention.

Fig. 5 is a schematic process structure diagram of a micro LED packaging method for manufacturing a micro LED packaging structure according to the present invention.

Fig. 6 is a schematic process structure diagram of a micro LED packaging method for manufacturing a micro LED packaging structure according to the present invention.

Fig. 7 is a schematic process structure diagram of a micro LED packaging method for manufacturing a micro LED packaging structure according to the present invention.

Fig. 8 is a schematic process structure diagram of a micro LED packaging method for manufacturing a micro LED packaging structure according to the present invention.

Fig. 9 is a schematic process structure diagram of a micro LED packaging method for manufacturing a micro LED packaging structure according to the present invention.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the invention.

Referring to fig. 1 to 4, the micro LED package structure provided in this embodiment includes a plurality of package units 1, each package unit includes an LED chip 2, a light-transmitting film 3, and two welding sheets 4 symmetrically arranged in a mirror image, each welding sheet 4 includes an accommodating opening 5 and two protruding portions 6 symmetrically arranged, the accommodating opening 5 is located between the two protruding portions 6, the accommodating openings 5 of the two welding sheets 4 are arranged oppositely, a portion of the LED chip 2 is arranged in the accommodating opening 5 of each welding sheet 4, and the micro LED package structure can be used to manufacture a plurality of integrated LED light sources.

The light-transmitting film 3 is arranged around the LED chip 2 and the outer side of the welding sheet 4, and the bottom surface of the welding sheet 4 is exposed out of the light-transmitting film 3.

Along two hold mouthful 5 opposite direction, two the distance of the main part 7 of welding piece 4 is not less than the electrode spacing of LED chip 2, the electrode of chip 2 includes the P utmost point 8 and the utmost point 9, and the electrode spacing is the P utmost point 8 and the utmost point 9 is followed hold the distance of mouthful 5 opposite direction.

The electrode of the bottom of the LED chip 2 and the bottom surface of the welding sheet 4 are located on the same side of the light-transmitting film 3, the LED chip 2 is partially abutted to the inner side surface of the welding sheet 4 through the accommodating opening 5, and the light-transmitting film 3 is abutted to the outer side surface of the welding sheet 4.

Preferably, the material of the welding tab 4 is copper or iron.

Preferably, the material of the welding sheet 4 is a composite material, and the surface of the welding sheet 4 is coated with at least one of tin, silver or copper.

Preferably, the light-transmitting film 3 is a fluorescent glue film.

Preferably, the light-transmitting film 3 is a transparent adhesive film.

Preferably, the welding tab 4 has an Contraband-like or semicircular shape.

Miniature LED packaging structure is when pasting dress use on the circuit board, except that welding material between LED chip 2 and the circuit board, there is not other medium to increase the thermal resistance, and weld with bonding pad 4, guarantee sufficient welding area, can bear bigger external stress after the welding, fastness when strengthening the use, LED chip 2 need not stand the quality risk brought by the secondary welding, therefore, miniature LED packaging structure can avoid heat conduction hindered, promote welding reliability, guarantee miniature LED job stabilization nature.

Referring to fig. 5 to 9, a micro LED packaging method may be provided for manufacturing the above micro LED packaging structure, and the micro LED packaging method includes:

step S1, paving the metal sheet 11 on the planar carrier 12, wherein the surface of the planar carrier 12 is covered with a high-temperature-resistant double-sided adhesive tape, and the metal sheet 11 is adhered to the planar carrier 12;

step S2, forming a plurality of welding units 13 arranged in an array on the metal sheet 11, wherein each welding unit 13 comprises two welding sheets 4 arranged in a mirror symmetry, and forming a plurality of welding units 13 arranged in an array on the metal sheet 11 by one of the forming methods of laser cutting, die punching or chemical etching, and the welding sheets 4 are Contraband-shaped or semicircular;

step S3, disposing LED chips 2 inside the two bonding pads 4 of each bonding unit 13, wherein a part of the LED chip 2 is disposed in the receiving opening 5 of each bonding pad 4, and the LED chip 2 is adhered to the planar carrier 12;

step S4, enclosing a semi-solid light-transmitting film 3 at the outer sides of the LED chip 2 and the welding sheet 4, and solidifying the light-transmitting film 3 through vacuum pressing to form a plurality of packaging units 1;

step S5, cutting, namely cutting off the plurality of packaging units 1 from each other by a knife wheel type cutting machine or a blade type cutting machine or a laser cutting machine without cutting through the high temperature resistant double-sided adhesive tape of the planar carrier 12;

step S6, adhering the adhesive film to the welding units 13, lifting the adhesive film, and moving the welding units 13 upward synchronously with the adhesive film, thereby peeling the welding units 13 from the planar carrier 12;

and S7, reverse molding the welding unit 13 to the adhesive film to obtain the micro LED packaging structure.

Finally, it should be emphasized that the present invention is not limited to the above-described embodiments, but only to the preferred embodiments of the invention, and the invention is not limited to the above-described embodiments, and any modifications, equivalent replacements, improvements, etc. within the spirit and principle of the present invention should be included in the scope of the present invention.

Claims

1. The utility model provides a miniature LED packaging structure, includes a plurality of encapsulation unit, its characterized in that:

the packaging unit comprises an LED chip, a light-transmitting film and two welding sheets which are symmetrically arranged in a mirror mode;

each welding sheet comprises an accommodating opening and two symmetrically arranged protruding parts, the accommodating opening is positioned between the two protruding parts, the accommodating openings of the two welding sheets are arranged oppositely, and the accommodating opening of each welding sheet is respectively provided with one part of the LED chip;

the light-transmitting film is arranged around the outer sides of the LED chip and the welding sheet, and the bottom surface of the welding sheet is exposed out of the light-transmitting film;

along the opposite direction of the two accommodating openings, the distance between the main bodies of the two welding sheets is not less than the electrode spacing of the LED chip;

the electrode at the bottom of the LED chip and the bottom surface of the welding sheet are positioned on the same side of the light-transmitting film.

2. The micro LED package structure of claim 1, wherein:

the welding sheet is made of copper or iron.

3. The micro LED package structure of claim 1, wherein:

the surface of the welding sheet is coated with at least one of tin, silver or copper.

4. The micro LED package structure of claim 1, wherein:

the light-transmitting film is a fluorescent glue film.

5. The micro LED package structure of claim 1, wherein:

the light-transmitting film is a transparent adhesive film.

6. The micro LED package structure of claim 1, wherein:

a part of the LED chip arranged in the accommodating opening abuts against the inner side face of the welding sheet.

7. The micro LED package structure of claim 1, wherein:

the light-transmitting film is abutted against the outer side face of the welding sheet.

8. The micro LED package structure according to any one of claims 1 to 7, wherein:

the welding sheet is Contraband-shaped or semicircular.