CN215114745U

CN215114745U - Multi-beam level meter

Info

Publication number: CN215114745U
Application number: CN202121322378.5U
Authority: CN
Inventors: 呼秀山; 夏阳
Original assignee: Beijing Ruida Instrument Co ltd
Current assignee: Beijing Ruida Instrument Co ltd
Priority date: 2021-05-17
Filing date: 2021-06-15
Publication date: 2021-12-10
Anticipated expiration: 2031-06-15
Also published as: CN113252138B; CN113865668B; CN113865668A; CN113252138A; CN215865393U

Abstract

The present disclosure provides a multi-beam level gauge comprising: the microwave radio frequency device is used for respectively generating microwave signals in a plurality of frequency bands; an antenna device for emitting at least microwave signals of a plurality of frequency bands at different beam angles; the signal processing device is used for acquiring and processing echo signals of microwave signals of multiple frequency bands to at least obtain an echo signal curve of a first wave beam and an echo signal curve of a second wave beam; and the signal control device controls the microwave radio frequency device, and the microwave radio frequency device respectively generates microwave signals in a plurality of frequency bands based on the control of the signal control device.

Description

Multi-beam level meter

Technical Field

The disclosure belongs to the technical field of level measurement, and particularly relates to a multi-beam level meter.

Background

In the prior art, the radar level gauges are all based on a single beam, and during the level measurement process, a material storage device inevitably has interferents to microwave signals, which are formed by the structure of the material storage device, and the echo signals of the interferents need to be removed, or the amplitude of the echo signals of the interferents needs to be reduced as much as possible during the measurement process.

Since the smaller the beam angle, the smaller the amplitude of the generated interferer echo signal, the interferer echo signal may be reduced by making the radar level gauge generate a very small beam angle.

However, for a radar level gauge generating a single beam, generating a very small beam angle requires a strict radar level gauge structural design and microwave signal control.

SUMMERY OF THE UTILITY MODEL

In order to solve at least one of the above technical problems, the present disclosure provides a multi-beam based level gauge and a multi-beam level gauge.

The multi-beam-based level measurement method and the multi-beam level meter are realized by the following technical scheme.

According to an aspect of the present disclosure, there is provided a multi-beam based level gauging method, comprising:

generating microwave signals in a plurality of frequency bands respectively to generate a plurality of beams, wherein the plurality of beams at least comprise a first beam and a second beam, the first beam has a first beam angle, and the second beam has a second beam angle;

acquiring at least an echo signal curve of the first beam and an echo signal curve of the second beam;

identifying an interfering object echo signal and a target object echo signal at least based on the echo signal curve of the first beam and the echo signal curve of the second beam; and the number of the first and second groups,

and removing the interfering object echo signal at least based on the echo signal curve of the first beam and the echo signal curve of the second beam to obtain a target object echo signal.

According to the fill level measuring method based on the multi-beam in at least one embodiment of the present disclosure, the plurality of frequency bands are a plurality of frequency sweep frequency bands.

According to the multi-beam based level gauging method of at least one embodiment of the present disclosure, the sweep frequency ranges of each of the plurality of sweep frequency bands are different from each other.

According to the multi-beam based level gauging method of at least one embodiment of the present disclosure, the swept frequency ranges of each of the plurality of swept frequency bands do not coincide with each other.

According to the multi-beam-based level measurement method in at least one embodiment of the present disclosure, there is one or more than two overlapping portions between the sweep frequency ranges of each of the plurality of sweep frequency bands, and the sweep center frequencies of each of the sweep frequency bands are different from each other.

According to the multi-beam based level gauging method of at least one embodiment of the present disclosure, the echo signals of each of the plurality of beams are measured at different time instants to obtain an echo signal curve of each beam.

According to the multi-beam-based level gauging method of at least one embodiment of the present disclosure, said plurality of frequency sweep bands comprises at least 76Ghz-77Ghz and 79Ghz-81 Ghz.

According to the multi-beam-based level gauging method of at least one embodiment of the present disclosure, said plurality of frequency sweep bands comprises at least 117Ghz-127Ghz and 119Ghz-121 Ghz.

According to the multi-beam based level gauging method of at least one embodiment of the present disclosure, the first beam angle is different from the second beam angle.

According to yet another aspect of the present disclosure, there is provided a multi-beam level gauge capable of performing the multi-beam based level gauging method of any one of the above, comprising:

a microwave radio frequency device for generating microwave signals in a plurality of frequency bands, respectively;

an antenna device for emitting at least the microwave signals of the plurality of frequency bands at different beam angles;

the signal processing device is used for acquiring and processing the echo signals of the microwave signals of the multiple frequency bands so as to at least obtain an echo signal curve of a first wave beam and an echo signal curve of a second wave beam;

the signal processing device further identifies an interfering object echo signal and a target object echo signal at least based on the echo signal curve of the first beam and the echo signal curve of the second beam;

the signal processing device further removes an interferent echo signal based on at least the echo signal curve of the first beam and the echo signal curve of the second beam to obtain a target echo signal; and the number of the first and second groups,

the signal control device controls the microwave radio frequency device, and the microwave radio frequency device respectively generates microwave signals in a plurality of frequency bands based on the control of the signal control device.

According to the multi-beam level gauge in at least one embodiment of the present disclosure, the signal control device controls the microwave radio frequency device to generate microwave signals of different frequency bands at different times.

According to the multi-beam level gauge of at least one embodiment of the present disclosure, the antenna device is a dipole antenna, a line board trace antenna or a microstrip antenna.

According to the multi-beam level gauge of at least one embodiment of the present disclosure, the microwave radio frequency device has more than two adjustable frequency bands.

The multi-beam level gauge according to at least one embodiment of the present disclosure further comprises a waveguide that guides the microwave signal emitted by the antenna arrangement and the echo signal.

The multi-beam level gauge according to at least one embodiment of the present disclosure further comprises an energy harvesting device disposed between the waveguide and the antenna device.

According to the multi-beam level gauge of at least one embodiment of the present disclosure, the second end of the waveguide is provided with a horn structure.

The multi-beam level gauge according to at least one embodiment of the present disclosure further includes a shielded housing, the microwave radio frequency device, the antenna device, the signal processing device, the signal control device, and the energy harvesting device are all disposed within the shielded housing, a portion of the waveguide is disposed within the shielded housing, and the waveguide extends from within the shielded housing.

According to the multi-beam level gauge of at least one embodiment of the present disclosure, a wave-absorbing material portion is disposed within the shielding housing.

The multi-beam level gauge according to at least one embodiment of the present disclosure further includes a wave-transparent partition disposed adjacent to the horn structure.

According to the multi-beam level gauge of at least one embodiment of the present disclosure, the wave-transparent partition is provided with a lens device at a position facing the wave-transparent partition.

According to the multi-beam level gauge of at least one embodiment of the present disclosure, the lens arrangement includes a first lens and a second lens, the first lens and the second lens are both disposed opposite to the wave-transparent partition, and a size of the first lens is smaller than a size of the second lens.

The multi-beam level gauge according to at least one embodiment of the present disclosure further includes a first housing within which the shield housing and a portion of the waveguide extending out of the shield housing are disposed, the waveguide extending out of the first housing, a space between the first housing and the shield housing and a space between the first housing and the waveguide being potted.

According to at least one embodiment of the present disclosure, the first housing includes at least a circumferential wall and a bottom wall, the bottom wall of the first housing having a through hole formed therein, the waveguide extending from the through hole.

According to the multi-beam level gauge of at least one embodiment of the present disclosure, the bottom wall of the first housing is provided with a waveguide seal portion disposed inside the bottom wall of the first housing and a waveguide fixing portion disposed outside the bottom wall of the first housing.

The multi-beam level gauge according to at least one embodiment of the present disclosure further includes a sealed enclosure, the wave-transparent partition and the lens arrangement being disposed within the sealed enclosure.

According to the multi-beam level gauge of at least one embodiment of the present disclosure, the first end of the sealing cover is arc-shaped, and the second end of the sealing cover is formed with an extension that is capable of being fitted with a flange member.

Drawings

The accompanying drawings, which are included to provide a further understanding of the disclosure and are incorporated in and constitute a part of this specification, illustrate exemplary embodiments of the disclosure and together with the description serve to explain the principles of the disclosure.

Fig. 1 is a schematic flow diagram of a multi-beam based level gauging method according to an embodiment of the present disclosure.

Fig. 2 is a measurement schematic diagram of a multi-beam based level measurement method according to an embodiment of the present disclosure.

Fig. 3 is a flowchart of a method of removing an interfering object echo signal to obtain a target object echo signal according to an embodiment of the present disclosure.

Fig. 4 is an exemplary diagram of the target echo signal acquisition according to the method of removing an interfering object echo signal to obtain a target echo signal shown in fig. 3.

FIG. 5 is a schematic structural view of a multi-beam level gauge according to one embodiment of the present disclosure.

Fig. 6 is a schematic structural view of a waveguide seal of a multi-beam level gauge according to one embodiment of the present disclosure.

Description of the reference numerals

100 multi-beam level meter

101 circuit board

102 antenna device

103 energy collecting device

104 shield case

105 wave-absorbing material part

106 waveguide

107 waveguide seal

108 waveguide fixing part

109 first casing

110 horn structure

111 first lens

112 second lens

113 wave-transparent isolation part

114 sealing cover

1141 an extension part.

Detailed Description

The present disclosure will be described in further detail with reference to the drawings and embodiments. It is to be understood that the specific embodiments described herein are for purposes of illustration only and are not to be construed as limitations of the present disclosure. It should be further noted that, for the convenience of description, only the portions relevant to the present disclosure are shown in the drawings.

It should be noted that the embodiments and features of the embodiments in the present disclosure may be combined with each other without conflict. Technical solutions of the present disclosure will be described in detail below with reference to the accompanying drawings in conjunction with embodiments.

Unless otherwise indicated, the illustrated exemplary embodiments/examples are to be understood as providing exemplary features of various details of some ways in which the technical concepts of the present disclosure may be practiced. Accordingly, unless otherwise indicated, features of the various embodiments may be additionally combined, separated, interchanged, and/or rearranged without departing from the technical concept of the present disclosure.

The use of cross-hatching and/or shading in the drawings is generally used to clarify the boundaries between adjacent components. As such, unless otherwise noted, the presence or absence of cross-hatching or shading does not convey or indicate any preference or requirement for a particular material, material property, size, proportion, commonality between the illustrated components and/or any other characteristic, attribute, property, etc., of a component. Further, in the drawings, the size and relative sizes of components may be exaggerated for clarity and/or descriptive purposes. While example embodiments may be practiced differently, the specific process sequence may be performed in a different order than that described. For example, two processes described consecutively may be performed substantially simultaneously or in reverse order to that described. In addition, like reference numerals denote like parts.

When an element is referred to as being "on" or "on," "connected to" or "coupled to" another element, it can be directly on, connected or coupled to the other element or intervening elements may be present. However, when an element is referred to as being "directly on," "directly connected to" or "directly coupled to" another element, there are no intervening elements present. For purposes of this disclosure, the term "connected" may refer to physically, electrically, etc., and may or may not have intermediate components.

For descriptive purposes, the present disclosure may use spatially relative terms such as "below … …," below … …, "" below … …, "" below, "" above … …, "" above, "" … …, "" higher, "and" side (e.g., "in the sidewall") to describe one component's relationship to another (other) component as illustrated in the figures. Spatially relative terms are intended to encompass different orientations of the device in use, operation, and/or manufacture in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as "below" or "beneath" other elements or features would then be oriented "above" the other elements or features. Thus, the exemplary term "below … …" can encompass both an orientation of "above" and "below". Further, the devices may be otherwise positioned (e.g., rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

The terminology used herein is for the purpose of describing particular embodiments and is not intended to be limiting. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. Furthermore, when the terms "comprises" and/or "comprising" and variations thereof are used in this specification, the presence of stated features, integers, steps, operations, elements, components and/or groups thereof are stated but does not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components and/or groups thereof. It is also noted that, as used herein, the terms "substantially," "about," and other similar terms are used as approximate terms and not as degree terms, and as such, are used to interpret inherent deviations in measured values, calculated values, and/or provided values that would be recognized by one of ordinary skill in the art.

Fig. 1 is a schematic flow diagram of a multi-beam based level gauging method according to an embodiment of the present disclosure. Fig. 2 is a measurement schematic diagram of a multi-beam based level measurement method according to an embodiment of the present disclosure. Fig. 3 is a flowchart of a method of removing an interfering object echo signal to obtain a target object echo signal according to an embodiment of the present disclosure. Fig. 4 is an exemplary diagram of the target echo signal acquisition according to the method of removing an interfering object echo signal to obtain a target echo signal shown in fig. 3. FIG. 5 is a schematic structural view of a multi-beam level gauge according to one embodiment of the present disclosure. Fig. 6 is a schematic structural view of a waveguide seal of a multi-beam level gauge according to one embodiment of the present disclosure.

The multi-beam-based level measuring method and the multi-beam level meter according to the present disclosure are described in detail with reference to fig. 1 to 6.

According to one embodiment of the present disclosure, as shown in fig. 1, a multi-beam based level measuring method S100 includes:

s102, respectively generating microwave signals in a plurality of frequency bands to generate a plurality of beams, wherein the plurality of beams at least comprise a first beam and a second beam, the first beam has a first beam angle, and the second beam has a second beam angle;

s104, at least acquiring an echo signal curve of the first wave beam and an echo signal curve of the second wave beam;

s106, identifying an interfering object echo signal and a target object echo signal at least based on the echo signal curve of the first wave beam and the echo signal curve of the second wave beam; and the number of the first and second groups,

and S108, removing the interfering object echo signal at least based on the echo signal curve of the first beam and the echo signal curve of the second beam to obtain a target object echo signal.

The disclosed fill level measuring method based on multiple beams, referring to fig. 2, can obtain an echo curve obtained only by a very small beam angle through two or more beams with different beam angles, especially through generating microwave signals in multiple frequency bands to generate multiple beams, thereby equivalently obtaining a radar fill level meter with a very small beam angle and removing interfering object echo signals.

For example, when the multi-beam-based level measurement method according to the present disclosure is used for measuring the liquid level, the echo signal from which the echo signal of the interfering object is removed may be subjected to signal analysis, the height of the liquid level may be obtained, and the height of the liquid level may be output.

For the multi-beam based level gauging method of the above embodiment, preferably, the plurality of frequency bands is a plurality of swept frequency bands.

More preferably, the swept frequency ranges of the respective swept frequency bands of the plurality of swept frequency bands are different from each other.

More preferably, the swept frequency ranges of each of the plurality of swept frequency bands do not coincide.

More preferably, there are one or more overlapping portions between the sweep frequency ranges of the sweep frequency bands in the plurality of sweep frequency bands, and the sweep center frequencies of the sweep frequency bands are different from each other.

According to a multi-beam based level gauging method according to yet another embodiment of the present disclosure, on the basis of the above respective embodiments, echo signals of respective ones of the plurality of beams are measured at different times to obtain echo signal curves of the respective beams.

The frequency bands at least comprise 76Ghz-77Ghz and 79Ghz-81 Ghz.

The plurality of frequency sweep bands may further include 117Ghz-127Ghz and 119Ghz-121 Ghz.

For the multi-beam based level gauging method of the above embodiments, the first beam angle is different from the second beam angle.

For the multi-beam-based level gauging method according to the above embodiment, preferably, the identifying S106 of the interfering object echo signal and the target object echo signal based on at least the echo signal curve of the first beam and the echo signal curve of the second beam includes:

and identifying the interfering object echo signal and the target object echo signal based on the waveform difference between the echo signal curve of the first wave beam and the echo signal curve of the second wave beam.

The wave forms of the target object echo (such as a liquid level echo) obtained by the beam with the small opening angle and the beam with the large opening angle are not greatly different and are main reflection parts of energy. Whereas the interfering echo amplitude of the small opening angle beam is significantly smaller than the echo of the large opening angle beam.

By obtaining the echo curves at different angles and determining the amplitude of the interfering object echo of the echo curves at different angles, the echo signal of the target object and the echo signal of the interfering object can be determined based on the relation of amplitude changes in the two curves.

For the multi-beam based level gauging method of the above embodiments, preferably, S108, removing the interfering object echo signal based on at least the echo signal curve of the first beam and the echo signal curve of the second beam to obtain the target object echo signal, comprises:

and performing linear calculation on corresponding points of the echo signal curve of the first wave beam and the echo signal curve of the second wave beam to remove the echo signal of the interference object.

Since the difference between the interfering object echo signal in the echo signal curve of the first beam and the interfering object echo signal in the echo signal curve of the second beam depends only on the beam angle and the interfering object position, i.e. the amplitude of the interfering object echo signal in the echo signal curve of the first beam may differ from the amplitude of the interfering object echo signal in the echo signal curve of the second beam.

Thus, the interferer echo signals may be removed based on the difference in beam angle of the first beam and the second beam.

For the multi-beam based level gauging method according to the above embodiments, preferably, as shown in fig. 3, the performing a linear calculation on the corresponding points of the echo signal curve of the first beam and the echo signal curve of the second beam includes:

s1081, amplitude adjustment is performed on the echo signal curve of the first beam, so that the amplitude of the echo signal of the target in the echo signal curve of the first beam is the same as the amplitude of the echo signal of the target in the echo signal curve of the second beam;

s1082, subtracting the echo signal curve of the second wave beam from the echo signal curve of the first wave beam subjected to amplitude adjustment to obtain an interference object echo signal curve; and the number of the first and second groups,

s1083, amplitude adjustment is conducted on the interfering object echo signal curve, the echo signal curve of the second wave beam is differenced with the interfering object echo signal curve subjected to amplitude adjustment, interfering object echo signals are removed, and target object echo signals are obtained.

For example, the beam angle of the first beam is smaller than the beam angle of the second beam, the echo signal curve of the first beam is identified as a, the echo signal curve of the second beam is identified as B, and the two curves are subtracted from each other, i.e., B-a × K1, where K1 is a parameter related to the beam angle difference, which may be a constant, may be set according to the angle difference between the two beams, or may be adjusted according to the actual condition of the material storage device to be measured. Then B-a × K1 obtains the echo signal curve of the interferent from which the echo signal of the target object (i.e. the real echo signal of the measured object) is removed.

Thereafter, the following processing is performed: and B- (B-A K1) K2 removes the interfering object echo signal from the small-opening-angle echo signal curve to obtain the target object echo signal. Where K2 is also a parameter related to beam angle difference, which may be a constant, that can be set/adjusted based on the actual conditions of the material storage device being measured on site.

For the multi-beam based level gauging method according to the above embodiments, preferably, the linear calculation of the corresponding points of the echo signal curve of the first beam and the echo signal curve of the second beam comprises:

adjusting the amplitude of the echo signal curve of the second wave beam to ensure that the amplitude of the echo signal of the target object in the echo signal curve of the second wave beam is the same as the amplitude of the echo signal of the target object in the echo signal curve of the first wave beam;

the echo signal curve of the first wave beam is differenced with the echo signal curve of the second wave beam subjected to amplitude adjustment to obtain an interfering object echo signal curve; and the number of the first and second groups,

and adjusting the amplitude of the echo signal curve of the interference object, and subtracting the echo signal curve of the first wave beam from the echo signal curve of the interference object subjected to amplitude adjustment to remove the echo signal of the interference object and obtain the echo signal of the target object.

For example, the beam angle of the first beam is smaller than the beam angle of the second beam, the echo signal curve of the first beam is identified as a, the echo signal curve of the second beam is identified as B, and the two curves are subtracted from each other, i.e., a-B × K1, where K1 is a parameter related to the beam angle difference, which may be a constant, may be set according to the angle difference between the two beams, or may be adjusted according to the actual condition of the material storage device to be measured. The a-B × K1 obtains the echo signal curve of the interferent from which the echo signal of the target object (i.e. the real echo signal of the measured object) is removed.

Thereafter, the following processing is performed: and A- (A-B K1) K2 removes the interfering object echo signal from the small opening angle echo signal curve to obtain the target object echo signal. Where K2 is also a parameter related to beam angle difference, which may be a constant, that can be set/adjusted based on the actual conditions of the material storage device being measured on site.

Fig. 4 is an exemplary diagram illustrating the target echo signal acquisition by the method of removing the interfering object echo signal to obtain the target echo signal according to each of the above embodiments.

adjusting the amplitude of the echo signal curve of the first wave beam to ensure that the amplitude of the echo signal of the interferent in the echo signal curve of the first wave beam is the same as the amplitude of the echo signal of the interferent in the echo signal curve of the second wave beam;

the echo signal curve of the second wave beam is differenced with the echo signal curve of the first wave beam subjected to amplitude adjustment to obtain an echo signal curve of the target object; and the number of the first and second groups,

and amplifying the echo signal curve of the target object.

adjusting the amplitude of the echo signal curve of the second wave beam to ensure that the amplitude of the echo signal of the interferent in the echo signal curve of the second wave beam is the same as the amplitude of the echo signal of the interferent in the echo signal curve of the first wave beam;

the echo signal curve of the first wave beam is differenced with the echo signal curve of the second wave beam subjected to amplitude adjustment to obtain an echo signal curve of the target object; and the number of the first and second groups,

and amplifying the echo signal curve of the target object.

In the present embodiment, the signal heights (signal amplitudes) of the interfering echo signals of the echo signal curves of the two beams are obtained, and then one of the two echo signal curves of A, B is amplitude-adjusted so that the amplitudes of the interfering echo signals of the two echo signal curves are the same. For example, multiplying curve B by curve K1, the amplitude of the interferer echo of curve K1 × B is the same as the amplitude of the interferer echo of curve a, and then subtracting the two curves with the same interferer echo amplitude: and A-B K1, obtaining a curve only with the echo signal of the target object, and then properly amplifying the curve without the echo signal of the interfering object to obtain K2 (A-B K1), wherein K1 and K2 are parameters related to the beam angle difference of the two beams, and both the parameters can be set/adjusted based on the actual condition of the storage device of the measured material on site.

According to an embodiment of the present disclosure, as shown in fig. 5, a multi-beam level gauge 100 based on a multi-beam level measuring method includes:

the microwave radio frequency device is used for respectively generating microwave signals in a plurality of frequency bands;

an antenna device 102, wherein the antenna device 102 emits microwave signals of at least a plurality of frequency bands at different beam angles;

the signal processing device is used for acquiring and processing echo signals of microwave signals of multiple frequency bands to at least obtain an echo signal curve of a first wave beam and an echo signal curve of a second wave beam;

the signal processing device further identifies the interfering object echo signal and the target object echo signal at least based on the echo signal curve of the first beam and the echo signal curve of the second beam (the signal processing device can identify the interfering object echo signal and the target object echo signal by including a signal comparison circuit);

the signal processing device further removes the interferent echo signal based on at least the echo signal curve of the first beam and the echo signal curve of the second beam to obtain a target echo signal (the signal processing device may achieve removing the interferent echo signal by including a subtraction circuit to obtain the target echo signal); and the number of the first and second groups,

and the signal control device controls the microwave radio frequency device, and the microwave radio frequency device respectively generates microwave signals in a plurality of frequency bands based on the control of the signal control device.

The microwave radio frequency device may include a signal source, an oscillator, a low noise amplifier, a power amplifier, a mixer, a power supply module, a voltage conversion module, an AD acquisition module, an FFT module, a communication module, and the like, and may be disposed on the chip/circuit board 101.

Wherein the signal processing means and the signal control means may also be arranged on the chip/circuit board 101.

For the multi-beam level gauge 100 of the above embodiment, preferably, the signal control device controls the microwave rf device to generate microwave signals of different frequency bands at different times.

The antenna device 102 may be a dipole antenna, a circuit board trace antenna, or a microstrip antenna.

For the multi-beam level gauge 100 of the various embodiments described above, it is preferred that the microwave radio frequency device has more than two frequency-tunable bands.

Such as 76Ghz-77Ghz, 79Ghz-81Ghz, described above.

For the multi-beam level gauge 100 of each of the above embodiments, it is preferable that the multi-beam level gauge further includes a waveguide 106, and the waveguide 106 guides the microwave signal emitted from the antenna device 102 and the echo signal.

According to a preferred embodiment of the present disclosure, as shown in fig. 5, the multi-beam level gauge 100 further comprises an energy harvesting device 103, the energy harvesting device 103 being arranged between the waveguide 106 and the antenna device 102.

As shown in fig. 5, the energy harvesting device 103 is disposed at a first end of the waveguide 106.

Preferably, the second end of the waveguide 106 is provided with a horn structure 110.

The horn structure 110 is integrally formed with the waveguide 106 or is removably disposed.

The multi-beam level gauge 100 according to the preferred embodiment of the present disclosure further comprises a shielding housing 104, the microwave radio frequency device, the antenna device 102, the signal processing device, the signal control device and the energy harvesting device 103 are all disposed within the shielding housing 104, a portion of the waveguide 106 is disposed within the shielding housing 104, and the waveguide 106 extends from within the shielding housing 104.

Preferably, a wave-absorbing material part 105 is arranged inside the shielding shell 104.

As shown in fig. 5, the wave-absorbing material part 105 is preferably arranged at the outer periphery of the waveguide 106 and on the bottom wall of the shielding shell 104.

Preferably, the shielding shell 104 is cylindrical in shape, including a circumferential wall and a bottom wall, which form a cylindrical shape.

The end of the shielding shell 104 not forming the bottom wall is fixedly connected with the chip/circuit board 101, thereby forming a shielding cavity.

For the multi-beam level gauge 100 of each of the above embodiments, the connection between the shielding case 104 and the waveguide 106 may be made by gluing, or welding or casting.

With the multi-beam level gauge 100 of each of the above embodiments, the shield case 104 and the circuit board 101 are fixed by screws or the like.

According to a preferred embodiment of the present disclosure, the multi-beam level gauge 100 further comprises a wave-transparent partition 113, the wave-transparent partition 113 being arranged adjacent to the horn structure.

In the various embodiments described above, the waveguides 106 may be a multi-segment structure that is spliced together, and the multi-segment waveguides may have the same or different radial dimensions.

As shown in fig. 5, according to the preferred embodiment of the present disclosure, the wave-transparent partition 113 of the multi-beam level meter 100 is provided with a lens device at a position facing thereto.

As shown in fig. 5, a wave-transparent partition 113 is provided between the lens arrangement and the horn structure 110.

According to a preferred embodiment of the present disclosure, the lens device includes a first lens 111 and a second lens 112, the first lens 111 and the second lens 112 are both disposed opposite to the wave-transparent isolation portion 113, and the size of the first lens 111 is smaller than that of the second lens 112.

For the multi-beam level gauge 100 of each of the above embodiments, it is preferable that the first housing 109 is further included, the shielding housing 104 and a portion of the waveguide 106 protruding out of the shielding housing 104 are disposed inside the first housing 109, the waveguide 106 protrudes out of the first housing 109, and a space between the first housing 109 and the shielding housing 104 and a space between the first housing 109 and the waveguide 106 are potted.

With the multi-beam level gauge 100 of each of the above embodiments, the first housing 109 includes at least a circumferential wall and a bottom wall, and a through hole is formed in the bottom wall of the first housing 109, from which the waveguide 106 protrudes.

Preferably, as shown in fig. 5, the bottom wall of the first housing 109 is provided with a waveguide sealing portion 107 and a waveguide fixing portion 108, the waveguide sealing portion 107 is disposed inside the bottom wall of the first housing 109, and the waveguide fixing portion 108 is disposed outside the bottom wall of the first housing 109.

Wherein, the waveguide sealing part 107 may be an O-ring, and the waveguide fixing part 108 may be a screw nut structure.

For the multi-beam level gauge 100 of each of the above embodiments, it is preferable that the multi-beam level gauge further includes a sealing cover 114, and the wave-transparent partition 113 and the lens device are disposed inside the sealing cover 114.

Preferably, the first end of the sealing cover 114 is arc-shaped, and the second end of the sealing cover 114 is formed with an extension 1141, and the extension 1141 can be attached to the flange member.

The sealing cover 114 may be made of plastic or other wave-transparent sealing material, or may be made of a material having anti-corrosion properties, such as plastic material, e.g., PTFE or PFA.

The sealing cap 114 may also have process connection threads thereon. The outer extension of the sealing cap 114 may be integral with the surface of the flange member to provide an alternative process mounting configuration.

The lens device itself may also constitute a form of seal with the process connection structure as shown in fig. 5.

In the description herein, reference to the description of the terms "one embodiment/mode," "some embodiments/modes," "example," "specific example" or "some examples" or the like means that a particular feature, structure, material, or characteristic described in connection with the embodiment/mode or example is included in at least one embodiment/mode or example of the present disclosure. In this specification, the schematic representations of the terms used above are not necessarily intended to be the same embodiment/mode or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments/modes or examples. Furthermore, the various embodiments/aspects or examples and features of the various embodiments/aspects or examples described in this specification can be combined and combined by one skilled in the art without conflicting therewith.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present disclosure, "a plurality" means at least two, e.g., two, three, etc., unless explicitly specifically limited otherwise.

It will be understood by those skilled in the art that the foregoing embodiments are merely for clarity of illustration of the disclosure and are not intended to limit the scope of the disclosure. Other variations or modifications may occur to those skilled in the art, based on the foregoing disclosure, and are still within the scope of the present disclosure.

Claims

1. A multi-beam level gauge, comprising:

the signal processing device further removes an interferent echo signal based on at least the echo signal curve of the first beam and the echo signal curve of the second beam to obtain a target echo signal; and

2. The multi-beam level gauge of claim 1, wherein the signal control device controls the microwave radio frequency device to generate microwave signals of different frequency bands at different times.

3. The multi-beam level gauge of claim 1, wherein the antenna arrangement is a dipole antenna, a line card trace antenna, or a microstrip antenna.

4. The multi-beam level gauge of claim 1, wherein said microwave radio frequency device has more than two adjustable frequency bands.

5. The multi-beam level gauge of claim 1, further comprising a waveguide that guides the microwave signals emitted by the antenna arrangement and the echo signals.

6. The multi-beam level gauge of claim 5, further comprising an energy harvesting device disposed between the waveguide and the antenna device.

7. The multi-beam level gauge of claim 6, wherein the second end of the waveguide is provided with a horn structure.

8. The multi-beam level gauge of claim 7, further comprising a shielded housing, wherein the microwave radio frequency device, the antenna device, the signal processing device, the signal control device, and the energy harvesting device are all disposed within the shielded housing, wherein a portion of the waveguide is disposed within the shielded housing, and wherein the waveguide extends from within the shielded housing.

9. The multi-beam level gauge of claim 8, wherein a wave absorbing material portion is disposed within said shielding housing.

10. The multi-beam level gauge of claim 9, further comprising a wave-transparent isolator disposed adjacent to the horn structure.

11. The multi-beam level gauge of claim 10, wherein a lens arrangement is disposed opposite the wave-transparent partition.

12. The multi-beam level gauge of claim 11, wherein the lens arrangement includes a first lens and a second lens, the first lens and the second lens each being disposed directly opposite the wave-transparent partition, and the first lens having a smaller size than the second lens.

13. The multi-beam level gauge of claim 12, further comprising a first housing, the shielded housing and a portion of the waveguide extending out of the shielded housing being disposed within the first housing, the waveguide extending out of the first housing, a space between the first housing and the shielded housing and a space between the first housing and the waveguide being potted.

14. The multi-beam level gauge of claim 13, wherein the first housing comprises at least a circumferential wall and a bottom wall, the bottom wall of the first housing having a through hole formed therein, the waveguide extending from the through hole.

15. The multi-beam level gauge of claim 14, wherein a waveguide seal is disposed on the bottom wall of the first housing, the waveguide seal being disposed inside the bottom wall of the first housing, and a waveguide fixture disposed outside the bottom wall of the first housing.

16. The multi-beam level gauge of claim 11 or 12, further comprising a sealed envelope, wherein the wave-transparent partition and the lens arrangement are both disposed within the sealed envelope.

17. The multi-beam level gauge of claim 16, wherein the first end of the sealing cap is arcuate in shape and the second end of the sealing cap is formed with an extension that is conformable to a flange member.