CN215073153U - Heat dissipation type circuit board - Google Patents
Heat dissipation type circuit board Download PDFInfo
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- CN215073153U CN215073153U CN202121726189.4U CN202121726189U CN215073153U CN 215073153 U CN215073153 U CN 215073153U CN 202121726189 U CN202121726189 U CN 202121726189U CN 215073153 U CN215073153 U CN 215073153U
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- heat dissipation
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Abstract
The utility model belongs to the technical field of circuit boards, in particular to a heat dissipation type circuit board, which comprises a circuit board main body and a circuit layer arranged at the upper end of the circuit board main body, wherein the lower end surface of the circuit board main body is fixedly connected with a cooling layer, a cooling pipe is arranged inside the cooling layer, the upper end surface of the circuit board main body is provided with a heat dissipation frame, two fans are arranged at the top of the heat dissipation frame, the left side and the right side of the heat dissipation frame are both provided with convection ports, through the arrangement of the cooling layer, the cooling pipe is arranged inside the cooling layer, cooling liquid is injected into the cooling pipe, heat is absorbed through the cooling liquid, thereby the temperature reduction and the heat dissipation are carried out from the bottom of the circuit board main body, and the heat conduction plate at the bottom of the cooling layer plays a heat conduction role to lead out the heat of the cooling liquid, thereby being convenient for cooling the cooling liquid, solving the problems that the existing circuit board does not have a heat dissipation structure and the heat dissipation effect is not good, the long-term use can cause the problems of unsmooth work and reduced service life due to the heating problem.
Description
Technical Field
The utility model relates to a circuit board technical field, concretely relates to heat dissipation type circuit board.
Background
The circuit board enables the circuit to be miniaturized and visualized, and plays an important role in batch production of fixed circuits and optimization of electric appliance layout. The circuit board can be called as a printed circuit board or a printed circuit board, and the birth and development of FPC circuit boards and rigid-flex printed circuit boards (FPC) and Printed Circuit Boards (PCB) urge the birth of a new product of rigid-flex printed circuit boards (FPC). Therefore, the rigid-flex circuit board is a circuit board with FPC (flexible printed circuit) characteristics and PCB (printed circuit board) characteristics, which is formed by combining a flexible circuit board and a rigid circuit board according to relevant process requirements through processes such as pressing and the like.
The existing circuit board does not have a heat dissipation structure, the heat dissipation effect is poor, and the work is not smooth and the service life is reduced due to the heating problem after long-term use.
SUMMERY OF THE UTILITY MODEL
For solving the problem that proposes among the above-mentioned background art, the utility model provides a heat dissipation type circuit board has that the radiating effect is good, and the radiating mode is various, is convenient for in time cool down long service life's characteristics to the circuit board.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a heat dissipation type circuit board, includes circuit board main part and installs the circuit layer in circuit board main part upper end, the lower terminal surface fixedly connected with cooling layer of circuit board main part, the inside of cooling layer is provided with the cooling tube, the lower terminal surface fixedly connected with heat-conducting plate of cooling layer, the up end of circuit board main part is provided with the heat dissipation frame, two fans are installed at the top of heat dissipation frame, the convection current mouth has all been seted up to the left and right sides of heat dissipation frame.
For the convenience of being the inside coolant liquid that adds of cooling tube, conduct the utility model relates to a heat dissipation type circuit board is preferred, the cooling tube is "S" type and distributes, the left and right sides wall of cooling layer is provided with inlet and liquid outlet respectively, the one end of cooling tube runs through the inner wall of cooling layer and extends to the left side and the inlet intercommunication of cooling layer, the other end of cooling tube runs through the inner wall of cooling layer and extends to the right side and the liquid outlet intercommunication of cooling layer.
In order to improve the heat conduction effect, as the utility model relates to a heat dissipation type circuit board is preferred, the heat-conducting plate is copper aluminum alloy material.
In order to make things convenient for dismouting heat dissipation frame, as the utility model relates to a heat dissipation type circuit board is preferred, the equal fixedly connected with of the lower terminal surface left and right sides of heat dissipation frame inserts the post, the up end left and right sides of circuit board main part all seted up with post assorted slot, the heat dissipation frame can be dismantled with the circuit board main part through inserting post, slot and be connected.
In order to make things convenient for the heat to run off from the bottom, as the utility model relates to a heat dissipation type circuit board is preferred, the equal fixedly connected with landing leg in lower terminal surface four corners department of heat-conducting plate.
In order to avoid debris to get into the heat dissipation frame, as the utility model relates to a heat dissipation type circuit board is preferred, two the inside of convection current mouth all is provided with the filter screen.
For the convenience of cooling heat dissipation, as the utility model relates to a heat dissipation type circuit board is preferred, a plurality of evenly distributed's through-hole has been seted up to the outer wall of heat dissipation frame.
Compared with the prior art, the beneficial effects of the utility model are that:
1. through setting up the cooling layer, the inside of cooling layer is provided with the cooling tube, the inside coolant liquid that pours into of cooling tube, absorb the heat through the coolant liquid, thereby cool down the heat dissipation from the bottom of circuit board main part, and the heat-conducting plate of cooling layer bottom plays the heat conduction effect, derive the heat of coolant liquid, be convenient for cool down to the coolant liquid, through setting up the heat dissipation frame, two fans are installed at the top of heat dissipation frame, blow the cooling down to the circuit layer from the top through radiator fan, the radiating effect is greatly improved, the convection current mouth of the heat dissipation frame left and right sides is convenient for the circulation of air simultaneously, make things convenient for the heat to spill out, the cooling effect is good.
2. Inside being convenient for through the inlet with the coolant liquid injection cooling pipe, being convenient for discharge the coolant liquid through the liquid outlet, be convenient for change the coolant liquid, and the cooling tube is "S" type and distributes, enlarges the cooling tube distribution range, improves the cooling effect, and the heat-conducting plate is copper aluminium alloy material, and the heat conduction effect is good, leads to the outside from the heat of hot convenient with the cooling layer.
To sum up, this kind of heat dissipation type circuit board has that the radiating effect is good, and the radiating mode is various, is convenient for in time cool down the circuit board, long service life's characteristics.
Drawings
The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention, and together with the description serve to explain the invention and not to limit the invention.
In the drawings:
FIG. 1 is an overall structure diagram of the present invention;
FIG. 2 is a top cross-sectional structural view of the cooling layer of the present invention;
FIG. 3 is a schematic view of the overall exploded structure of the present invention;
in the figure, 1, a circuit board main body; 2. a circuit layer; 3. a cooling layer; 4. a cooling tube; 5. a heat conducting plate; 6. a heat dissipation frame; 7. a fan; 8. a convection port; 9. a liquid inlet; 10. a liquid outlet; 11. inserting a column; 12. a slot; 13. and (7) supporting legs.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
In the description of the present invention, it is to be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are merely for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. In addition, in the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.
Referring to fig. 1-3, the present invention provides the following technical solutions: the utility model provides a heat dissipation type circuit board, includes circuit board main part 1 and installs circuit layer 2 in circuit board main part 1 upper end, the lower terminal surface fixedly connected with cooling layer 3 of circuit board main part 1, and the inside of cooling layer 3 is provided with cooling tube 4, and the lower terminal surface fixedly connected with heat-conducting plate 5 of cooling layer 3, the up end of circuit board main part 1 are provided with heat dissipation frame 6, and two fans 7 are installed at the top of heat dissipation frame 6, and convection current mouth 8 has all been seted up to the left and right sides of heat dissipation frame 6.
In this embodiment: through setting up cooling layer 3, the inside of cooling layer 3 is provided with cooling tube 4, the inside coolant liquid that pours into of cooling tube 4, absorb the heat through the coolant liquid, thereby cool down the heat dissipation from the bottom of circuit board main part 1, and the heat-conducting plate 5 of cooling layer 3 bottom plays the heat conduction effect, derive the heat of coolant liquid, be convenient for cool down the coolant liquid, through setting up heat dissipation frame 6, two fans 7 are installed to heat dissipation frame 6's top, blow the cooling to circuit layer 2 from the top through radiator fan 7, the radiating effect is greatly improved, the circulation of air of being convenient for of convection current mouth 8 of the 6 left and right sides of heat dissipation frame simultaneously, make things convenient for the heat to spill out, the cooling effect is good.
As a technical optimization scheme of the utility model, cooling tube 4 is "S" type and distributes, and the left and right sides wall of cooling layer 3 is provided with inlet 9 and liquid outlet 10 respectively, and the one end of cooling tube 4 runs through the inner wall of cooling layer 3 and extends to the left side and the inlet 9 intercommunication of cooling layer 3, and the other end of cooling tube 4 runs through the inner wall of cooling layer 3 and extends to the right side and the liquid outlet 10 intercommunication of cooling layer 3.
In this embodiment: be convenient for through inlet 9 inside 4 with the coolant liquid injection cooling tubes, be convenient for discharge the coolant liquid through liquid outlet 10, be convenient for change the coolant liquid, and cooling tube 4 is "S" type and distributes, enlarges 4 distribution ranges of cooling tube, improves the cooling effect.
As a technical optimization scheme of the utility model, the heat conducting plate 5 is made of copper-aluminum alloy.
In this embodiment: the heat conducting plate 5 is made of copper-aluminum alloy, has good heat conducting effect, and conveniently conducts heat of the cooling layer 3 to the outside.
As a technical optimization scheme of the utility model, the equal fixedly connected with inserted column 11 of the lower terminal surface left and right sides of heat dissipation frame 6, the up end left and right sides of circuit board main part 1 all seted up with inserted column 11 assorted slot 12, heat dissipation frame 6 can dismantle with circuit board main part 1 through inserted column 11, slot 12 and be connected.
In this embodiment: when the heat dissipation frame 6 is installed, the inserting columns 11 are inserted into the inserting grooves 12 in an inserting mode, and the heat dissipation frame is convenient to install and disassemble.
As a technical optimization scheme of the utility model, the equal fixedly connected with landing leg 13 of lower terminal surface four corners department of heat-conducting plate 5.
In this embodiment: the whole equipment is supported by the supporting legs 13, so that the heat conducting plate 5 is suspended, and heat dissipation is facilitated.
As a technical optimization scheme of the utility model, two convection current mouths 8's inside all is provided with the filter screen.
In this embodiment: the filter screen plays the filter effect, avoids debris to get into 6 inside influences circuit board normal workings of heat dissipation frame.
As a technical optimization scheme of the utility model, a plurality of evenly distributed's through-hole is seted up to the outer wall of heat dissipation frame 6.
In this embodiment: a plurality of through holes are integrally formed in the outer wall of the heat dissipation frame 6, heat dissipation is facilitated, and the heat dissipation effect is good.
The utility model discloses a theory of operation and use flow: through setting up cooling layer 3, the inside of cooling layer 3 is provided with cooling tube 4, the inside coolant liquid that pours into of cooling tube 4, absorb the heat through the coolant liquid, thereby cool down the heat dissipation from the bottom of circuit board main part 1, and the heat-conducting plate 5 of cooling layer 3 bottom plays the heat conduction effect, derive the heat of coolant liquid, be convenient for cool down the coolant liquid, through setting up heat dissipation frame 6, two fans 7 are installed to heat dissipation frame 6's top, blow the cooling to circuit layer 2 from the top through radiator fan 7, the radiating effect is greatly improved, the circulation of air of being convenient for of convection current mouth 8 of the 6 left and right sides of heat dissipation frame simultaneously, make things convenient for the heat to spill out, the cooling effect is good.
The above description is only exemplary of the present invention and should not be construed as limiting the present invention, and any modifications, equivalents and improvements made within the spirit and principles of the present invention are intended to be included within the scope of the present invention.
Claims (7)
1. The utility model provides a heat dissipation type circuit board, includes circuit board main part (1) and installs circuit layer (2) in circuit board main part (1) upper end, its characterized in that: the circuit board comprises a circuit board main body (1), and is characterized in that a cooling layer (3) is fixedly connected to the lower end face of the circuit board main body (1), a cooling pipe (4) is arranged inside the cooling layer (3), a heat-conducting plate (5) is fixedly connected to the lower end face of the cooling layer (3), a heat-radiating frame (6) is arranged on the upper end face of the circuit board main body (1), two fans (7) are installed at the top of the heat-radiating frame (6), and convection ports (8) are formed in the left side and the right side of the heat-radiating frame (6).
2. The heat dissipation type circuit board of claim 1, wherein: cooling tube (4) are "S" type and distribute, the left and right sides wall of cooling layer (3) is provided with inlet (9) and liquid outlet (10) respectively, the one end of cooling tube (4) runs through the inner wall of cooling layer (3) and extends to the left side and inlet (9) the intercommunication of cooling layer (3), the other end of cooling tube (4) runs through the inner wall of cooling layer (3) and extends to the right side and the liquid outlet (10) the intercommunication of cooling layer (3).
3. The heat dissipation type circuit board of claim 1, wherein: the heat conducting plate (5) is made of copper-aluminum alloy.
4. The heat dissipation type circuit board of claim 1, wherein: the equal fixedly connected with inserted column (11) of the lower terminal surface left and right sides of heat dissipation frame (6), the up end left and right sides of circuit board main part (1) all seted up with inserted column (11) assorted slot (12), heat dissipation frame (6) can be dismantled with circuit board main part (1) through inserted column (11), slot (12) and be connected.
5. The heat dissipation type circuit board of claim 1, wherein: the four corners of the lower end face of the heat conducting plate (5) are fixedly connected with supporting legs (13).
6. The heat dissipation type circuit board of claim 1, wherein: two the inside of convection current mouth (8) all is provided with the filter screen.
7. The heat dissipation type circuit board of claim 1, wherein: the outer wall of the heat dissipation frame (6) is provided with a plurality of through holes which are uniformly distributed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121726189.4U CN215073153U (en) | 2021-07-28 | 2021-07-28 | Heat dissipation type circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121726189.4U CN215073153U (en) | 2021-07-28 | 2021-07-28 | Heat dissipation type circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215073153U true CN215073153U (en) | 2021-12-07 |
Family
ID=79219863
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121726189.4U Active CN215073153U (en) | 2021-07-28 | 2021-07-28 | Heat dissipation type circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215073153U (en) |
-
2021
- 2021-07-28 CN CN202121726189.4U patent/CN215073153U/en active Active
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