CN215069943U - DFN encapsulation supporting structure - Google Patents
DFN encapsulation supporting structure Download PDFInfo
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- CN215069943U CN215069943U CN202121164380.4U CN202121164380U CN215069943U CN 215069943 U CN215069943 U CN 215069943U CN 202121164380 U CN202121164380 U CN 202121164380U CN 215069943 U CN215069943 U CN 215069943U
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- China
- Prior art keywords
- plate
- chip
- outer frame
- heat conduction
- encapsulation
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- 238000005538 encapsulation Methods 0.000 title claims abstract description 34
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 40
- 229910052802 copper Inorganic materials 0.000 claims abstract description 39
- 239000010949 copper Substances 0.000 claims abstract description 39
- 238000004806 packaging method and process Methods 0.000 claims abstract description 19
- 238000007789 sealing Methods 0.000 claims abstract description 15
- 239000011093 chipboard Substances 0.000 claims description 14
- 230000002093 peripheral effect Effects 0.000 claims description 4
- 230000010354 integration Effects 0.000 claims description 2
- 238000003756 stirring Methods 0.000 abstract description 4
- 230000000694 effects Effects 0.000 abstract description 3
- 230000017525 heat dissipation Effects 0.000 abstract description 3
- 238000009434 installation Methods 0.000 abstract description 2
- 230000001737 promoting effect Effects 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004100 electronic packaging Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009422 external insulation Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses a DFN packaging support structure, which comprises a packaging outer frame, wherein the packaging outer frame is a rectangular frame with an opening at the bottom end surface, a chip component is arranged in the packaging outer frame, an insulating rubber plate is arranged on the side wall of the top part in the packaging outer frame, an upper heat conduction copper plate is arranged below the insulating rubber plate, the chip component is arranged below the upper heat conduction copper plate, a sealing plate is arranged in the opening at the bottom end surface of the packaging outer frame, the structure is simple, the structure is clear and understandable, the insulating stirring and the upper heat conduction copper plate are arranged in the packaging outer frame, then the clamping block is arranged around the lower part of the upper heat conduction copper plate, the chip plate and the lower heat conduction copper plate are arranged between the surrounding clamping blocks for installation, then the sealing plate is covered at the opening at the bottom end of the packaging outer frame, finally, the rotating plate is rotated to ensure that the clamping plate is abutted against the bottom end surface, the packaging operation of the whole chip is realized, and the chip plate is convenient to install, the heat dissipation effect is splendid, long service life, and the encapsulation leakproofness is good, and structural strength is high, is worth promoting.
Description
Technical Field
The utility model relates to an electronic component encapsulates technical field, specifically is a DFN packaging support structure.
Background
DFN is a latest electronic packaging technology, and the conventional electronic chip elements are inconvenient to package, disassemble and assemble, poor in sealing performance, poor in heat dissipation, short in service life and low in structural strength, so that a DFN packaging support structure is needed.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a DFN encapsulates supporting structure to solve the problem that proposes among the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme:
the utility model provides a DFN encapsulation supporting structure, includes the encapsulation frame, the encapsulation frame sets up for bottom face open-ended rectangle frame, install the chip subassembly in the encapsulation frame, the insulating offset plate is installed to the top lateral wall in the encapsulation frame, the insulating offset plate below is provided with the heat conduction copper, the heat conduction copper below is arranged in to the chip subassembly, install the shrouding in the encapsulation frame bottom face opening.
Preferably, the chip assembly comprises fixture blocks, the fixture blocks are arranged around the lower portion of the upper heat-conducting copper plate, a chip board is clamped between the fixture blocks, a plurality of pins are connected to the left end and the right end of the chip board, and the lower ends of the pins penetrate through the sealing plate and are arranged outside the packaging outer frame.
Preferably, the upper end of the upper heat conducting copper plate is integrally connected with a plurality of upper radiating fins, and the upper ends of the upper radiating fins extend out of the upper end surface of the packaging outer frame.
Preferably, a lower heat conduction copper plate is clamped between clamping blocks on the periphery of the chip assembly, the lower heat conduction copper plate is abutted to the bottom end face of the chip board, the bottom end face of the lower heat conduction copper plate is integrally connected with a plurality of lower radiating fins, and the lower ends of the lower radiating fins penetrate through the sealing plate.
Preferably, the front side wall and the rear side wall of the packaging outer frame are rotatably connected with one end of a rotating plate through hinges, the other end of the rotating plate is integrally connected with a clamping plate, and the clamping plate is abutted to the bottom end face of the sealing plate.
Preferably, the peripheral end face of the sealing plate is connected with an annular rubber sealing ring.
Compared with the prior art, the beneficial effects of the utility model are that: the utility model discloses simple structure, the structure is clear understandable, stir insulating and go up the heat conduction copper and arrange the encapsulation frame in, arrange the fixture block in afterwards around heat conduction copper below, place chip board and lower heat conduction copper and install between fixture block all around, afterwards, locate the bottom opening part of encapsulation frame with the shrouding lid, and finally, rotate the rotor plate, make cardboard and shrouding bottom face butt, realize the encapsulation operation of whole chip, chip board simple to operate, the radiating effect is splendid, long service life, the encapsulation leakproofness is good, structural strength is high, and is worth promoting.
Drawings
FIG. 1 is a schematic cross-sectional front view of a DFN package support structure;
FIG. 2 is a schematic diagram of a top view of a DFN package support structure;
fig. 3 is a schematic diagram of a chip assembly of a DFN package support structure.
In the figure: 1-lower heat radiating fin, 2-sealing plate, 3-lower heat conducting copper plate, 4-pin, 5-chip assembly, 6-outer packaging frame, 7-insulating glue plate, 8-upper heat radiating fin, 9-upper heat conducting copper plate, 10-chip plate, 11-clamping block, 12-clamping plate, 13-rotating plate and 14-hinge.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1 to 3, the present invention provides a technical solution: the utility model provides a DFN encapsulation supporting structure, includes encapsulation frame 6, encapsulation frame 6 is bottom face open-ended rectangle frame setting, install chip subassembly 5 in the encapsulation frame 6, insulating offset plate 7 is installed to the top lateral wall in the encapsulation frame 6, insulating offset plate 7 below is provided with heat conduction copper 9, heat conduction copper 9 below is arranged in to chip subassembly 5, install shrouding 2 in the 6 bottom face openings of encapsulation frame.
The utility model provides a chip subassembly 5 installs in encapsulation frame 6, is provided with heat conduction copper 9 and insulating stirring 7 on it, is used for the heat dissipation and the external insulation of chip subassembly 5 respectively, installs shrouding 2 in the 6 bottom face openings of encapsulation frame for the sealed lid of lower extreme open-ended of encapsulation frame 6 is established.
The chip assembly 5 comprises fixture blocks 11, the fixture blocks 11 are arranged around the lower portion of the upper heat-conducting copper plate 9, chip boards 10 are clamped between the fixture blocks 11, the left end and the right end of each chip board 10 are connected with a plurality of pins 4, and the lower ends of the pins 4 penetrate through the sealing plate 2 and are arranged outside the packaging outer frame 6.
The chip plate 10 is clamped between the peripheral clamping blocks 11, wherein the opposite ends and the lower ends of the peripheral clamping blocks 11 are provided with openings, so that the chip plate 10 is convenient to mount.
The upper end of the upper heat-conducting copper plate 9 is integrally connected with a plurality of upper radiating fins 8, the upper ends of the upper radiating fins 8 extend out of the upper end surface of the packaging outer frame 6, the lower heat-conducting copper plate 3 is clamped between the clamping blocks 11 on the periphery of the chip assembly 5, the lower heat-conducting copper plate 3 is abutted to the bottom end surface of the chip board 10, the bottom end surface of the lower heat-conducting copper plate 3 is integrally connected with a plurality of lower radiating fins 1, and the lower ends of the lower radiating fins 1 penetrate through the sealing plate 2.
Go up heat conduction copper 9 and chip board 10 and oppose, lower heat conduction copper 3 and chip board 10 direct contact, go up heat conduction copper 9 and heat conduction copper 3 homogeneity down and be connected with fin 8 and fin 1 down, can be with the direct air outside the encapsulation frame 6 of transmitting of the heat that chip board 10 produced, the radiating effect is splendid.
The side wall rotates through hinge 14 around the encapsulation frame 6 and connects 13 one ends of rotor plate, 13 other ends of rotor plate integration are connected with cardboard 12, cardboard 12 and 2 bottom end face butts of shrouding, 2 terminal surface all around of shrouding are connected with annular rubber seal.
During specific installation, at first, arrange insulating stirring 7 and last heat conduction copper 9 in encapsulation frame 6, arrange fixture block 11 in afterwards around heat conduction copper 9 below, place chip board 10 and lower heat conduction copper 3 and install between fixture block 11 all around, afterwards, locate the bottom opening part of encapsulation frame 6 with 2 covers of shrouding, finally, rotate rotor plate 13 for cardboard 12 and 2 bottom faces butt of shrouding realize the encapsulation operation of whole chip.
It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (6)
1. A DFN encapsulation supporting structure comprises an encapsulation outer frame (6), and is characterized in that: encapsulation frame (6) are bottom face open-ended rectangle frame setting, install chip subassembly (5) in encapsulation frame (6), insulating offset plate (7) are installed to encapsulation frame (6) inside the top lateral wall, insulating offset plate (7) below is provided with heat conduction copper (9), heat conduction copper (9) below is arranged in to chip subassembly (5), install shrouding (2) in encapsulation frame (6) bottom face opening.
2. The DFN package support structure of claim 1, wherein: the chip assembly (5) comprises clamping blocks (11), the clamping blocks (11) are arranged around the lower portion of the upper heat-conducting copper plate (9), chip boards (10) are clamped between the clamping blocks (11) on the periphery, a plurality of pins (4) are connected to the left end and the right end of each chip board (10), and the lower ends of the pins (4) penetrate through the sealing plate (2) and are arranged outside the packaging outer frame (6).
3. The DFN package support structure of claim 2, wherein: the upper end of the upper heat conducting copper plate (9) is integrally connected with a plurality of upper radiating fins (8), and the upper ends of the upper radiating fins (8) extend out of the upper end face of the packaging outer frame (6).
4. The DFN package support structure of claim 3, wherein: lower heat-conducting copper plates (3) are clamped between clamping blocks (11) on the periphery of the chip component (5), the lower heat-conducting copper plates (3) are abutted to the bottom end face of the chip plate (10), a plurality of lower radiating fins (1) are integrally connected to the bottom end face of the lower heat-conducting copper plates (3), and the lower ends of the lower radiating fins (1) penetrate through the sealing plate (2).
5. The DFN package support structure of claim 4, wherein: the side wall rotates through hinge (14) around encapsulation frame (6) and connects rotor plate (13) one end, rotor plate (13) other end integration is connected with cardboard (12), cardboard (12) and shrouding (2) bottom face butt.
6. The DFN package support structure of claim 5, wherein: the peripheral end face of the sealing plate (2) is connected with an annular rubber sealing ring.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121164380.4U CN215069943U (en) | 2021-05-27 | 2021-05-27 | DFN encapsulation supporting structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121164380.4U CN215069943U (en) | 2021-05-27 | 2021-05-27 | DFN encapsulation supporting structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215069943U true CN215069943U (en) | 2021-12-07 |
Family
ID=79211532
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121164380.4U Active CN215069943U (en) | 2021-05-27 | 2021-05-27 | DFN encapsulation supporting structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215069943U (en) |
-
2021
- 2021-05-27 CN CN202121164380.4U patent/CN215069943U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address |
Address after: 215000 No. 33 Xinghai street, Suzhou Industrial Park, Jiangsu Province Patentee after: Yuancheng Technology (Suzhou) Co.,Ltd. Address before: 215000 No. 33 Xinghai street, Suzhou Industrial Park, Jiangsu Province Patentee before: Powertech Technology (Suzhou) Co.,Ltd. |
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| CP03 | Change of name, title or address |