CN215069939U - POP packaging structure - Google Patents
POP packaging structure Download PDFInfo
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- CN215069939U CN215069939U CN202121708940.8U CN202121708940U CN215069939U CN 215069939 U CN215069939 U CN 215069939U CN 202121708940 U CN202121708940 U CN 202121708940U CN 215069939 U CN215069939 U CN 215069939U
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Abstract
The utility model provides a POP packaging structure, include: a first packaging unit and a second packaging unit; the first packaging unit comprises a first substrate, and a first chip is arranged on the first substrate; a plurality of metal contacts are arranged on the surface of one side of the first substrate, which is provided with the first chip; the first packaging unit further comprises a plastic packaging adhesive film, the plastic packaging adhesive film covers the first chip, the partial surface of the first substrate facing the first chip, the side parts of the plurality of metal contacts and the top parts of the plurality of metal contacts; and a space exists between the highest position of the plastic packaging adhesive film and the second packaging unit.
Description
Technical Field
The utility model relates to a chip package technical field, concretely relates to POP packaging structure.
Background
As a main method of packaging high-density integration at present, POP (Package On Package) packages are gaining more and more attention. Stacking of chips is a major approach to increase the density of electronic packages. In the prior POP stack package technology, the plurality of package units are exposed, and the electrically connected solder balls or metal posts and chips are exposed to the air. The conventional means of the prior art is to prepare a plastic packaging layer to coat the chip and the metal column. However, such a process needs to additionally prepare a plastic package layer, and then the plastic package layer is ground to be thin and expose the top end of the metal pillar, so that the process is relatively complex, and the plastic package layer needs to have a certain height due to the need to prepare the plastic package layer, so that the distance between two package units is limited to a certain extent, and the overall height of the POP package structure is relatively high.
SUMMERY OF THE UTILITY MODEL
Based on the problem the utility model provides a POP packaging structure is with the height that reduces POP packaging structure.
The utility model provides a POP packaging structure, include: a first packaging unit and a second packaging unit; the first packaging unit comprises a first substrate, and a first chip is arranged on the first substrate; a plurality of metal contacts are arranged on the surface of one side of the first substrate, which is provided with the first chip; the first packaging unit further comprises a plastic packaging adhesive film, the plastic packaging adhesive film covers the first chip, the partial surface of the first substrate facing the first chip, the side parts of the plurality of metal contacts and the top parts of the plurality of metal contacts; and a space exists between the highest position of the plastic packaging adhesive film and the second packaging unit.
Optionally, the distance between the plastic packaging adhesive film and the second packaging unit is 200 μm to 500 μm.
Optionally, the thickness of the plastic packaging adhesive film is 50-100 μm
Optionally, the first package unit and the second package unit are electrically connected through solder balls.
Optionally, the second package unit includes a second substrate, the second substrate is provided with a second chip, and the second chip is disposed on a side of the second substrate opposite to the first substrate; the second substrate is electrically connected with the first substrate through solder balls.
Optionally, the first substrate is provided with a plurality of first through holes penetrating through the first substrate, and the first through holes are filled with first metal columns; a plurality of metal contacts protruding out of the surface of the first substrate are arranged on one side of each first through hole facing the second substrate; a plurality of metal contacts protruding out of the surface of the first substrate are arranged on the surface of one side, back to the second substrate, of each first through hole; each first metal column is respectively connected with the metal contacts at two sides; the second substrate is provided with a plurality of second through holes penetrating through the second substrate, and second metal columns are filled in the second through holes; a plurality of metal contacts protruding out of the surface of the second substrate are arranged on one side, facing the first substrate, of each second through hole; a plurality of metal contacts protruding out of the surface of the second substrate are arranged on the surface of one side, back to the first substrate, of each second through hole; and each second metal column is respectively connected with the metal contacts at two sides.
Optionally, one end of the solder ball electrically connected to the first substrate and the second substrate is connected to the metal contact on the side of the first substrate facing the second substrate, and the other end is connected to the metal contact on the side of the second substrate facing the first substrate.
Optionally, the first chip is electrically connected to the first substrate through a routing; the second chip is electrically connected with the second substrate through a routing; the first chip is electrically connected with two nearest metal contacts on the first substrate positioned at two sides of the first chip through routing respectively; the second chip is electrically connected with two nearest metal contacts on the second substrate positioned at two sides of the second chip through routing respectively.
Optionally, the plastic-sealed adhesive film further covers a routing of the first chip connected to the first substrate.
Optionally, the second package unit further includes a plastic package layer, where the plastic package layer covers the second chip, a portion of the surface of the second substrate facing the second chip, a metal contact on a side surface of the second substrate facing the second chip, and a routing wire electrically connected to the second substrate by the second chip.
Optionally, the number of the first package units is multiple, the multiple first package units are stacked in sequence, and the multiple first package units are electrically connected through solder balls; the second packaging unit is positioned at the top of the plurality of first packaging units which are stacked in sequence and is electrically connected with the topmost first packaging unit.
The technical scheme of the utility model, have following advantage:
the utility model discloses a POP packaging structure, utilize the chip on the first encapsulation unit of plastic envelope glued membrane protection and the base plate of below, compare in using the plastic envelope layer, can adopt the direct attached technology shaping of burning again and ablating the exposure solder ball of plastic envelope glued membrane, compare in using the plastic envelope layer that the plastic envelope material packing reground formed, simple process easily operates on the one hand, on the other hand the plastic envelope glued membrane can compare the plastic envelope layer and possess thinner thickness, thereby can use the solder ball to replace the electric connection that the metal column was first encapsulation unit and second encapsulation unit, the interval can obtain reducing between the base plate of two encapsulation units, thereby make the holistic height of POP packaging structure can obtain reducing, be favorable to the miniaturization of device.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the embodiments or the technical solutions in the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic diagram of a POP package structure according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of a first package unit of a POP package structure according to an embodiment of the present invention.
Detailed Description
The technical solution of the present invention will be described clearly and completely with reference to the accompanying drawings, and obviously, the described embodiments are some, but not all embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; the connection can be mechanical connection or electrical connection; the two elements may be directly connected or indirectly connected through an intermediate medium, or may be communicated with each other inside the two elements, or may be wirelessly connected or wired connected. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Furthermore, the technical features mentioned in the different embodiments of the invention described below can be combined with each other as long as they do not conflict with each other.
Referring to fig. 1 and 2, the present embodiment provides a POP package structure, including:
a first packing unit P1 and a second packing unit P2.
The first packaging unit P1 includes a first substrate 100, on which the first chip 200 is disposed on the first substrate 100; the first substrate 100 is provided with a plurality of metal contacts on a surface of the first chip 200.
The first packaging unit P1 further includes a plastic adhesive film 300, where the plastic adhesive film 300 covers the first chip 200, a portion of the surface of the first substrate 100 facing the first chip 200, and covers the sides of the plurality of metal contacts, and exposes the tops of the plurality of metal contacts; a space exists between the highest position of the plastic packaging adhesive film 300 and the second packaging unit P2.
Further, the distance between the plastic-sealing adhesive film 300 and the second sealing unit P2 is 200 μm to 500 μm, and may be, for example, 200 μm, 300 μm, 400 μm, or 500 μm.
The thickness of the plastic sealing adhesive film 300 is 50 μm to 100 μm, and may be, for example, 50 μm, 60 μm, 70 μm, 80 μm, 90 μm, or 100 μm.
The first package unit P1 and the second package unit P2 are electrically connected by solder balls (refer to fig. 2)
The first package unit P1 does not include solder balls for electrically connecting the first package unit P1 and the second package unit P2 of fig. 1).
The second packaging unit P2 includes a second substrate 400, the second substrate 400 has a second chip 500 disposed thereon, and the second chip 500 is disposed on a side of the second substrate 400 opposite to the first substrate 100; the second substrate 400 is electrically connected to the first substrate 100 through solder balls.
Specifically, the first substrate 100 is provided with a plurality of first through holes penetrating through the first substrate 100, and the first through holes are filled with first metal columns; a plurality of metal contacts protruding from the surface of the first substrate 100 are arranged on one side of each first through hole facing the second substrate 400; a plurality of metal contacts protruding from the surface of the first substrate 100 are arranged on the surface of one side of each first through hole, which faces away from the second substrate 400; each first metal column is respectively connected with the metal contacts at two sides; the second substrate 400 is provided with a plurality of second through holes penetrating through the second substrate 400, and second metal columns are filled in the second through holes; a plurality of metal contacts protruding from the surface of the second substrate 400 are arranged on one side of each second through hole facing the first substrate 100; a plurality of metal contacts protruding from the surface of the second substrate 400 are arranged on the surface of one side of each second through hole, which faces away from the first substrate 100; and each second metal column is respectively connected with the metal contacts at two sides. The first through hole and the second through hole not only comprise a straight line type, but also comprise a broken line type; accordingly, the first metal pillar and the second metal pillar include not only a straight line type but also a broken line type.
The solder balls electrically connecting the first substrate 100 and the second substrate 400 have one end connected to the metal contact of the first substrate 100 facing the second substrate 400 and the other end connected to the metal contact of the second substrate 400 facing the first substrate 100.
The first chip 200 is electrically connected to the first substrate 100 by a wire bonding; the second chip 500 is electrically connected to the second substrate 400 by a wire bonding; the first chip 200 is electrically connected to two nearest metal contacts on the first substrate 100 at two sides of the first chip 200 through routing respectively; the second chip 500 is electrically connected to two nearest metal contacts on the second substrate 400 at two sides of the second chip 500 by wire bonding.
The plastic adhesive film 300 also covers the wire bonding of the first chip 200 to the first substrate 100.
The second package unit P2 further includes a molding compound layer 600, the molding compound layer 600 covers the second chip 500, a portion of the surface of the second substrate 400 facing the second chip 500, the metal contacts on the surface of the second substrate 400 facing the second chip 500, and the bonding wires electrically connecting the second chip 500 to the second substrate 400.
In the POP package structure of the embodiment, the first chip 200 and the first substrate 100 on the first package unit P1 are protected by the plastic package adhesive film 300, and compared with a method of using a plastic package layer, the POP package structure can be formed by a process of directly attaching and baking the plastic package adhesive film 300 and then ablating exposed solder balls, and compared with a process of filling a plastic package material and grinding the plastic package layer, on one hand, the process is simple and easy to operate; on the other hand, the plastic packaging adhesive film 300 has a thinner thickness than that of the plastic packaging layer, the thickness of the plastic packaging adhesive film is only 50-100 μm, the distance between the plastic packaging adhesive film and the second substrate is 200-500 μm, and the distance between the two substrates is larger than the range, so that the thickness is larger than the range if the plastic packaging layer filled with all the plastic packaging layer is formed, so that the solder balls can be used for replacing metal columns to electrically connect the first packaging unit and the second packaging unit, the distance between the substrates of the two packaging units can be reduced, the overall height of the POP packaging structure can be reduced, and the miniaturization of the device is facilitated.
In other embodiments, the POP package unit may have a plurality of first package units P1 stacked in sequence, and the plurality of first package units P1 are electrically connected through solder balls; the second package unit P2 is disposed at the top of the plurality of first package units P1 stacked in sequence and electrically connected to the topmost first package unit P1.
It should be understood that the above examples are only for clarity of illustration and are not intended to limit the embodiments. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. And obvious variations or modifications can be made without departing from the scope of the invention.
Claims (10)
1. A POP package structure, comprising:
a first packaging unit and a second packaging unit;
the first packaging unit comprises a first substrate, and a first chip is arranged on the first substrate; a plurality of metal contacts are arranged on the surface of one side of the first substrate, which is provided with the first chip; the first packaging unit further comprises a plastic packaging adhesive film, the plastic packaging adhesive film covers the first chip, the partial surface of the first substrate facing the first chip, and the side parts of the plurality of metal contacts, and the tops of the plurality of metal contacts are exposed; and a space exists between the highest position of the plastic packaging adhesive film and the second packaging unit.
2. The POP package structure of claim 1,
the distance between the plastic packaging adhesive film and the second packaging unit is 200-500 mu m.
3. The POP package structure of claim 1,
the thickness of the plastic packaging adhesive film is 50-100 mu m.
4. The POP package structure of claim 1,
the first packaging unit and the second packaging unit are electrically connected through a solder ball.
5. The POP package structure of claim 1,
the second packaging unit comprises a second substrate, a second chip is arranged on the second substrate, and the second chip is arranged on one side, back to the first substrate, of the second substrate; the second substrate is electrically connected with the first substrate through a solder ball.
6. The POP package structure of claim 5,
the first substrate is provided with a plurality of first through holes penetrating through the first substrate, and first metal columns are filled in the first through holes; a plurality of metal contacts protruding out of the surface of the first substrate are arranged on one side, facing the second substrate, of each first through hole; a plurality of metal contacts protruding out of the surface of the first substrate are arranged on the surface of one side, back to the second substrate, of each first through hole; each first metal column is respectively connected with metal contacts at two sides;
the second substrate is provided with a plurality of second through holes penetrating through the second substrate, and second metal columns are filled in the second through holes; a plurality of metal contacts protruding out of the surface of the second substrate are arranged on one side, facing the first substrate, of each second through hole; a plurality of metal contacts protruding out of the surface of the second substrate are arranged on the surface of one side, back to the first substrate, of each second through hole; and each second metal column is respectively connected with the metal contacts at two sides.
7. The POP package structure of claim 6,
one end of the solder ball electrically connected with the first substrate and the second substrate is connected with the metal contact of one side of the first substrate facing the second substrate, and the other end of the solder ball is connected with the metal contact of one side of the second substrate facing the first substrate.
8. The POP package structure of claim 5,
the first chip is electrically connected with the first substrate through a routing;
the second chip is electrically connected with the second substrate through a routing;
the first chip is electrically connected with two nearest metal contacts on the first substrate positioned at two sides of the first chip through routing respectively;
the second chip is electrically connected with two nearest metal contacts on the second substrate at two sides of the second chip through routing wires.
9. The POP package structure of claim 8,
the plastic packaging adhesive film also covers a routing of the first chip connected with the first substrate;
the second packaging unit further comprises a plastic packaging layer, wherein the plastic packaging layer comprises the second chip, a part of surface of the second substrate facing the second chip, a metal contact on the surface of one side of the second substrate facing the second chip, and a routing wire electrically connected with the second substrate through the second chip.
10. The POP package structure of any of claims 1-9,
the number of the first packaging units is multiple, the multiple first packaging units are stacked in sequence, and the multiple first packaging units are electrically connected through solder balls; the second packaging unit is positioned at the top of the plurality of first packaging units which are stacked in sequence and is electrically connected with the first packaging unit at the topmost part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121708940.8U CN215069939U (en) | 2021-07-26 | 2021-07-26 | POP packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121708940.8U CN215069939U (en) | 2021-07-26 | 2021-07-26 | POP packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215069939U true CN215069939U (en) | 2021-12-07 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121708940.8U Active CN215069939U (en) | 2021-07-26 | 2021-07-26 | POP packaging structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215069939U (en) |
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2021
- 2021-07-26 CN CN202121708940.8U patent/CN215069939U/en active Active
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