CN215069911U - Adsorption type chip transfer device and chip repair equipment - Google Patents

Abstract

The utility model discloses an absorption formula chip transfer device, it includes the base plate, the slide, drive assembly, the sliding seat, inhale the pole, inhale and chew and the elastic component, the slide is located on the base plate along vertical slidable, drive assembly drive slide removes, the sliding seat is located on the slide along vertical slidable, inhale the pole and install on the sliding seat, it is connected with vacuum generator to inhale the pole, inhale to chew and connect the lower extreme at the pole of inhaling, the elastic component is located between slide and the sliding seat along the slip direction of sliding seat telescopically, the sliding seat is taken and is supported the upper end at the elastic component, thereby make the sliding seat suspension on the slide. The utility model discloses an absorption formula chip transfer device has played the cushioning effect to the chip during absorption chip, has effectively overcome and has absorb the chip in-process, and the chip has realized the harmless transfer of chip because of receiving the condition that too big pressure takes place the damage. The utility model also discloses a chip reprocesses equipment with this absorption formula chip transfer device.

Description

Adsorption type chip transfer device and chip repair equipment

Technical Field

The utility model relates to a chip shifts technical field, especially, relates to an absorption formula chip transfer device and chip reprocess equipment.

Background

In the GBA chip repair process, chip repair equipment is generally used for operations, which are mainly responsible for unsoldering, mounting, and welding the chip. When pasting the dress chip, the suction nozzle moves down and contacts with the chip, then through the suction nozzle with the chip absorption live and transfer to wait to weld the position on the circuit board, this in-process, if the descending stroke control of suction nozzle is improper, the suction nozzle can exert great pressure to the chip, leads to the chip to take place to damage because of the pressurized is too big easily.

Therefore, in the field of chip repair technology, how to realize lossless chip transfer is an urgent problem to be solved in the field.

SUMMERY OF THE UTILITY MODEL

In view of the above, there is a need for an adsorption type chip transfer device that can buffer chips;

it is also necessary to provide a chip repairing apparatus with the adsorption type chip transferring device.

The utility model provides a technical scheme that its technical problem adopted is: the utility model provides an absorption formula chip transfer device, includes base plate, slide, drive assembly, sliding seat, inhales the pole, inhales and the elastic component, the slide is located along vertical slidable ground on the base plate, the drive assembly drive the slide removes, the sliding seat is located along vertical relative slidable ground on the slide, it installs to inhale the pole on the sliding seat, it is connected with vacuum generator to inhale the pole, inhale to chew and connect and be in inhale the lower extreme of pole, the elastic component is followed the slip direction telescopically of sliding seat is located the slide with between the sliding seat, the sliding seat takes to support the upper end of elastic component, thereby makes the sliding seat suspension is in on the slide.

Furthermore, the sliding plate is connected with a supporting block, the movable seat is connected with a butting block corresponding to the supporting block, the lower end of the elastic part butts against the supporting block, and the butting block butts against the upper end of the elastic part.

Furthermore, a guide post is fixedly connected to the upper end face of the supporting block, the guide post slidably penetrates through the abutting block, the elastic piece is a spring, and the spring is sleeved outside the guide post.

Further, install the double-shaft motor on the sliding seat, the output shaft of double-shaft motor is cavity tubular structure, the lower extreme of the output shaft of double-shaft motor pass through the shaft coupling with the upper end of inhaling the pole is connected, the upper end of the output shaft of double-shaft motor pass through the adapter with vacuum generator connects. The precise suction rod is directly connected with the hollow motor, so that the verticality of the suction rod is improved, and the suction force is enhanced to meet the requirements of absorption and mounting of a large-size BGA chip.

Furthermore, the movable seat comprises a connecting seat, and a first fixing seat and a second fixing seat which are oppositely arranged on the connecting seat, the connecting seat is connected with the sliding plate in a relatively slidable manner, the first fixing seat and the second fixing seat are perpendicular to the connecting seat, and the suction rod rotatably penetrates through the first fixing seat and the second fixing seat.

Further, the driving assembly comprises a driving motor, a driving pulley, a driven pulley and a transmission belt, the driving motor is fixedly installed on one side of the base plate, which is opposite to the sliding plate, the driving pulley and the driven pulley are both rotatably connected with the base plate, an output shaft of the driving motor is connected with the driving pulley, the transmission belt is sleeved outside the driving pulley and the driven pulley, and one side of the transmission belt is fixedly connected with the sliding plate.

Furthermore, the adsorption type chip transfer device further comprises a photoelectric switch and a controller, wherein the photoelectric switch comprises a transmitter installed on the sliding plate and a receiver installed on the movable seat, and the receiver and the vacuum generator are electrically connected with the controller.

A chip repair device comprises the adsorption type chip transfer device.

Furthermore, the chip repair equipment further comprises a platform mechanism for placing the chip, and the adsorption type chip transfer device is movably arranged above the platform mechanism.

Further, the chip repair equipment further comprises a machine table, the loading platform mechanism is arranged on the machine table, a longitudinal beam is fixedly mounted on the machine table, a cross beam is slidably mounted on the longitudinal beam, the cross beam and the longitudinal beam are perpendicular to each other, a movable plate is slidably mounted on the cross beam, and the substrate is fixedly connected with the movable plate.

The utility model has the advantages that: the utility model provides an absorption formula chip transfer device or chip reprocess equipment, compact structure, design benefit can hover a certain height with inhaling, when the sliding seat downstream and make to inhale when propping to press the chip, the elastic component resets gradually, thereby good cushioning effect has been played, make the acting force that the sliding seat was used on the chip reduce greatly, effectively overcome and absorb the chip in-process, the condition of chip because of receiving too big pressure and taking place to damage has realized the harmless transfer of chip. Especially to the subsides dress of small-size chip, it is bigger to the pressure that its surface produced, and the hidden danger of existence is bigger, uses the utility model discloses an equipment is reprocessed to absorption formula chip transfer device or chip can improve the reliability in the use.

The utility model also provides a tear-off weld heating mechanism, the heating device who has this tear-off weld heating mechanism and the chip that has this heating device of tearing off weld the equipment of reprocessing of the tear-off weld that efficient, can in time absorb the chip of tearing off weld.

The utility model provides a technical scheme that its technical problem adopted is: a heating mechanism for unsoldering comprises a fixed plate, a sliding plate driving piece, a heating module, a sucking rod and a sucking rod driving piece, wherein the sliding plate is arranged on the fixed plate in a sliding mode along the longitudinal direction, the driving plate driving piece drives the sliding plate to move, the heating module is fixedly arranged on the sliding plate, the sucking rod is connected with a vacuum generator and arranged on the sliding plate in a sliding mode along the longitudinal direction, the heating module comprises a shell arranged on the sliding plate, a fan arranged at the top of the shell and a heater arranged inside the shell, an opening is formed in the bottom of the shell, and the sucking rod is driven by the sucking rod driving piece to movably penetrate through the opening.

Further, the casing is box-packed structure, the fan has a plurality ofly, and is a plurality of fan evenly distributed is in absorb the relative both sides of pole, a plurality of air intakes have been seted up at the top of casing, one the fan with one the air intake corresponds the connection.

Furthermore, a heat insulation plate is arranged in the shell and above the heater, and a plurality of uniformly distributed air guide grooves are formed in the heat insulation plate.

Further, the heater is a ceramic heater.

Furthermore, the suction rod driving part comprises a suction rod motor fixedly connected to the sliding plate and a sliding block arranged on the sliding plate in a sliding mode along the longitudinal direction, an output shaft of the suction rod motor is a screw rod and is in threaded connection with the sliding block, and the suction rod is connected to the sliding block.

The utility model provides a heating device, heating device includes any preceding any the tear down weld heating mechanism, heating device still includes bottom heating mechanism and local heating mechanism, tear down weld heating mechanism, local heating mechanism and bottom heating mechanism from top to bottom set gradually, wait to heat the circuit board and be located tear down weld heating mechanism with between the local heating mechanism, local heating mechanism with tear down weld heating mechanism synchronous motion.

The utility model provides an equipment is reprocessed to chip, equipment is reprocessed to chip includes aforementioned heating device, equipment is reprocessed to chip still includes the board, bottom heating mechanism fixed mounting be in on the board, the heating mechanism that unsolders with local heating mechanism locates with relative movement the top of board, fixed mounting has the longeron on the board, install the crossbeam on the longeron slidable, the crossbeam with longeron mutually perpendicular, install the fly leaf on the crossbeam slidable, fixed plate fixed mounting is in on the fly leaf.

Further, local heating mechanism include air-out cavity, connecting pipe and communicate in the air-out cavity with the cylinder heater between the connecting pipe, a plurality of exhaust vents have been seted up at the top of air-out cavity, the air-out cavity with the casing is corresponding, the connecting pipe passes through the linking arm with the fly leaf is connected, connecting pipe and air supply intercommunication.

Furthermore, the chip repair equipment further comprises a platform mechanism for placing a chip and an adsorption type chip transfer device, wherein the platform mechanism is installed on the machine table, and the adsorption type chip transfer device is movably arranged above the platform mechanism.

The utility model has the advantages that: the utility model provides a repair equipment of unsoldering heating mechanism or heating device or chip is equipped with solitary absorption pole in order to absorb the unsoldering chip during the unsoldering, accomplishes the unsoldering work back when heating module, absorbs the pole and can in time down and absorb the chip for the unsoldering process has improved the unsoldering efficiency, has guaranteed the effect of absorbing the chip.

The utility model also provides a can prevent that PCB circuit board from collapsing and warping and the microscope carrier mechanism of easy to assemble operation and have the chip of this microscope carrier mechanism and reprocess equipment.

The utility model provides a technical scheme that its technical problem adopted is: a carrier mechanism is installed on a machine table and comprises a sliding seat, a frame, a supporting plate and a supporting rod, wherein the sliding seat is slidably arranged on the machine table, the frame is rotatably installed on the sliding seat, the supporting plate and the supporting rod are slidably arranged on the frame, a side pressing piece is installed on the supporting plate, a supporting piece is installed on the supporting rod and is abutted to the upper end face of a circuit board, the supporting piece is abutted to the lower end face of the circuit board, a telescopic piece is arranged between the sliding seat and the frame, one end of the telescopic piece is hinged to the sliding seat, the other end of the telescopic piece is hinged to the frame, a positioning seat is arranged on the machine table and located on the sliding path of the sliding seat, and the frame is detachably connected with the positioning seat.

Furthermore, the top of the positioning seat is provided with a positioning hole, the bottom of the frame is convexly provided with a positioning column, and the positioning column is detachably inserted into the positioning hole.

Further, the backup pad has two, two the backup pad sets up relatively, two all set up the scarce groove of bar on the relative lateral wall of backup pad, two lack the groove and constitute jointly and be used for placing the mounting groove of circuit board.

Furthermore, the side pressure piece comprises a side pressure plate and a side pressure bolt, the side pressure plate is connected with the supporting plate, the side pressure bolt penetrates through the side pressure plate and is in threaded connection with the side pressure plate, and the lower end of the side pressure bolt is abutted to the upper end face of the circuit board.

Further, install a plurality of supplementary support piece in the backup pad, supplementary support piece is including bending pole and positioning disk, the positioning disk is connected the one end of bending pole, waist type groove has been seted up on the bending pole, be connected with locking bolt in the backup pad, locking bolt passes waist type groove just can follow waist type groove slides.

Furthermore, the supporting piece comprises a sliding block, an ejector pin and an elastic part, the sliding block is slidably arranged on the supporting rod, the ejector pin is longitudinally slidably arranged on the sliding block, and the elastic part is telescopically arranged between the sliding block and the ejector pin.

Furthermore, an accommodating groove is formed in the slider, the ejector pin is slidably arranged in the accommodating groove, a step surface is arranged on the outer side wall of the ejector pin, the upper end of the elastic component elastically abuts against the step surface, and the lower end of the elastic component elastically abuts against the groove bottom wall of the accommodating groove.

Furthermore, a locking bolt is installed on the side wall of the sliding block, one end of the locking bolt can be extruded and fixed to the ejector pin, a fixing bolt is further installed on the side wall of the sliding block, and one end of the fixing bolt can be extruded to the side wall of the supporting rod.

A chip repair device comprises the carrier mechanism of any one of the preceding claims.

Furthermore, the chip repair equipment further comprises an adsorption type chip transfer device, and the adsorption type chip transfer device is movably arranged above the carrying platform mechanism.

The utility model has the advantages that: the utility model provides a microscope carrier mechanism or chip reprocess equipment extrudes the circuit board between side casting die and support piece to the realization is to the loading fixed action of circuit board, simultaneously, can effectively avoid the circuit board to take place to sink in the heating process and warp, and, when the installation circuit board, can adjust the angle and the position of locating of circuit board, and the easy to assemble operation has promoted the loading efficiency and the loading quality of circuit board greatly.

Drawings

The present invention will be further explained with reference to the drawings and examples.

Fig. 1 is a perspective view of a chip repair apparatus according to a first embodiment of the present invention;

FIG. 2 is another perspective view of the chip rework device of FIG. 1 (with the control cabinet, protective housing and protective cover omitted);

FIG. 3 is a perspective view of the alternate view of FIG. 2;

fig. 4 is a perspective view of a stage mechanism in the chip rework apparatus shown in fig. 1;

fig. 5 is a perspective view (with a portion of the auxiliary support omitted) of another perspective view of the stage mechanism shown in fig. 4;

fig. 6 is a partially enlarged view of a portion a of the stage mechanism shown in fig. 5;

FIG. 7 is a top view of the stage mechanism shown in FIG. 5;

fig. 8 is a partial enlarged view of the stage mechanism shown in fig. 7 at B;

FIG. 9 is a cross-sectional view taken along line C-C of FIG. 8;

FIG. 10 is a cross-sectional view taken along line D-D of FIG. 8;

fig. 11 is a perspective view of the stage mechanism shown in fig. 4 in another state;

fig. 12 is a perspective view of an adsorption type chip transfer device in the chip rework apparatus shown in fig. 2;

FIG. 13 is a perspective view from another perspective of the suction chip transfer device shown in FIG. 12;

FIG. 14 is a partially exploded view of a bottom heating mechanism in the chip rework device of FIG. 2;

fig. 15 is a perspective view of a desoldering heating mechanism of the die repair apparatus shown in fig. 2;

FIG. 16 is a perspective view from another perspective of the desoldering heating mechanism shown in FIG. 15;

fig. 17 is a perspective view of a local heating mechanism in the chip rework apparatus shown in fig. 2;

fig. 18 is a partial structural schematic view of a unsoldering heating mechanism in the chip repairing apparatus according to the second embodiment of the present invention.

The names and the numbers of the parts in the figure are respectively as follows:

machine table 10 slide rail 11 longitudinal beam 12

Crossbeam 13 moves plate 14 protective shell 15

Guide bar 161 and guide block 162 of bracket 16

Stage mechanism 20 slide 21 frame 22

Positioning post 221 supports guide 222 bracket handle 223

Side pressing plate 2311 of side pressing piece 231 of support plate 23

Side pressure bolt 2312 auxiliary support piece 232 bending rod 2321

Positioning plate 2322 waist-shaped groove 2323 locking bolt 2324

Support 241 for support bar 24 of notch 233

Slider 2411 thimble 2412 elastic component 2413

Receiving groove 2414, snap spring 2415 and locking bolt 2416

Positioning seat 26 for telescopic part 25 of fixing bolt 2417

Positioning hole 261 adsorption type chip transfer device 30 substrate 31

Slide plate 32 support block 321 drive assembly 33

Driving motor 331 driving pulley 332 driven pulley 333

Driving belt 334 movable seat 34 connecting seat 341

The first fixing seat 342 and the second fixing seat 343 are disposed on the block 344

Suction rod 35, suction nozzle 36 and elastic member 37

Double-shaft motor 38 shaft coupler 381 adapter 382

Photoelectric sensor 391 baffle 392 heating device 40

The bottom heating mechanism 41 heats the heating member 412 of the housing 411

Fixing plate 421 of detaching, welding and heating mechanism 42 of protective net 413

Slide plate 422 slides plate drive 423 to heat module 424

Shell 4241 blower 4242 heater 4243

Opening 4244 air inlet 4245 heat insulation plate 4246

Air guide groove 4247 suction rod 425 suction rod driving piece 426

Local heating mechanism 43 of sliding block 4262 of suction rod motor 4261

Air outlet hole 4311 of air outlet cavity 431 and connecting pipe 432

Cartridge heater 433, 4249 shield 50 cooling module 60

Hot air mixing cavity 4248 of display panel 80 of control cabinet 70

4252 temp. sensor 4251 for air pipe joint 4251 of hot air nozzle 4250

Detailed Description

The present invention will now be described in detail with reference to the accompanying drawings. This figure is a simplified schematic diagram, and merely illustrates the basic structure of the present invention in a schematic manner, and therefore it shows only the constitution related to the present invention.

Example one

Please refer to fig. 1 and 2, the utility model provides a chip repair equipment for to the chip unsolder, shift and weld, this chip repair equipment includes board 10, locate on board 10 and be used for placing the microscope carrier mechanism 20 of chip, movably locate the absorption formula chip transfer device 30 of microscope carrier mechanism 20 top and install heating device 40 on board 10, wherein, microscope carrier mechanism 20 is used for loading fixed circuit board, absorption formula chip transfer device 30 is used for shifting the chip to the subsides dress position of circuit board, heating device 40 is used for heating the circuit board, in order to conveniently unsolder and weld.

Referring to fig. 4, the stage mechanism 20 includes a sliding base 21 slidably disposed on the machine platform 10, a frame 22 rotatably mounted on the sliding base 21, a supporting plate 23 and a supporting rod 24 slidably disposed on the frame 22, a side pressing member 231 is mounted on the supporting plate 23, a supporting member 241 is mounted on the supporting rod 24, the side pressing member 231 is used for abutting against an upper end surface of the circuit board, the supporting member 241 is used for abutting against a lower end surface of the circuit board, an expansion member 25 is disposed between the sliding base 21 and the frame 22, one end of the expansion member 25 is hinged to the sliding base 21, the other end of the expansion member 25 is hinged to the frame 22, a positioning seat 26 is disposed on a sliding path of the sliding base 21 on the machine platform 10, and the frame 22 is detachably connected to the positioning seat 26.

When the circuit board to be repaired is mounted on the frame 22, the circuit board is pressed between the pressing member 231 and the supporting member 241, thereby achieving the loading and fixing effect on the circuit board, and at the same time, effectively preventing the circuit board from collapsing and deforming in the heating process. When the frame 22 is turned over relative to the sliding base 21, the telescopic member 25 is stretched, so that one side of the frame 22 is lifted and locked at a certain angle position, and meanwhile, the sliding base 21 is slid to drive the frame 22 and the circuit board thereon to be pulled out to one side of the machine table 10, which is convenient for a user to adjust the installation position of the circuit board. After the position of the circuit board is adjusted, the sliding base 21 and the frame 22 are reset, and the frame 22 is locked on the positioning base 26, so that the circuit board can be effectively prevented from moving in the process of repairing. The loading device is simple and convenient to operate, and greatly improves the loading efficiency and the loading quality of the circuit board.

Referring to fig. 1 and 4, in the present embodiment, a slide guide rail 11 is installed on a machine table 10, and a slide 21 is slidably connected to the slide guide rail 11 to realize a slidable connection relationship between the slide 21 and the machine table 10. In addition, the two slide guides 11 and the two slide guides 21 are provided, one slide 21 corresponds to one slide guide 11, and two opposite sides of the frame 22 are respectively rotatably connected with the two slide guides 21, so that the sliding stability of the slide guides 21 and the turning stability of the frame 22 are improved.

Referring to fig. 11, in order to realize the connection between the frame 22 and the positioning seat 26, a positioning hole 261 is formed at the top of the positioning seat 26, a positioning post 221 is protruded at the bottom of the frame 22, and the positioning post 221 is detachably inserted into the positioning hole 261. When the positioning column 221 is inserted into the positioning hole 261, the frame 22 and the positioning seat 26 are in a locked state, and the sliding seat 21 cannot slide relative to the machine 10; when the frame 22 is turned upwards relative to the slide base 21, the positioning posts 221 are disengaged from the positioning holes 261, and the locking state between the frame 22 and the positioning seats 26 is released, at this time, the user can slide the slide base 21 relative to the machine 10 to drive the frame 22 to move together. It is understood that in other embodiments, not shown, the frame 22 and the positioning seat 26 can be detachably connected by a snap connection, a magnetic connection, etc., and are not limited herein.

In this embodiment, the extensible member 25 is a gas spring, and after the frame 22 is turned over, the gas spring can support the frame 22 by means of its own damping effect, which is convenient for the user to operate. In other embodiments, not shown, the extensible member 25 may also be an inner sleeve and an outer sleeve, that is, the outer sleeve is slidably sleeved outside the inner sleeve, and the friction between the outer sleeve and the inner sleeve is controlled to realize the damping effect thereof. Here, the specific structure of the extensible member 25 is not limited.

Referring to fig. 4, 5 and 7, the supporting plate 23 has two supporting plates 23, the two supporting plates 23 are disposed opposite to each other, the two opposite side walls of the two supporting plates 23 are respectively provided with a strip-shaped slot 233, and the two slots 233 together form a placement slot (not shown) for placing a circuit board. During the use, can change the distance between two backup pads 23 through sliding support plate 23, and then adjust the width of mounting groove to the installation needs of the circuit board of adaptation different widths, the commonality is strong.

Referring to fig. 6, the side pressing member 231 includes a side pressing plate 2311 and a side pressing bolt 2312, the side pressing plate 2311 is connected to the supporting plate 23, the side pressing bolt 2312 penetrates through the side pressing plate 2311 and is in threaded connection with the side pressing plate 2311, and the lower end of the side pressing bolt 2312 abuts against the upper end surface of the circuit board. When the circuit board fixing device is used, the circuit board is placed in the placing groove, then the side pressure bolts 2312 are rotated to enable the lower ends of the side pressure bolts 2312 to be extruded on the upper end face of the circuit board, and therefore the circuit board is extruded and fixed in the placing groove.

In addition, in order to adapt to the loading and fixing of the circuit board with an irregular shape, a plurality of auxiliary supporting pieces 232 are installed on the supporting plate 23, each auxiliary supporting piece 232 comprises a bending rod 2321 and a positioning disc 2322, the positioning disc 2322 is connected to one end of the bending rod 2321, a waist-shaped groove 2323 is formed in the bending rod 2321, a locking bolt 2324 is connected to the supporting plate 23, and the locking bolt 2324 penetrates through the waist-shaped groove 2323 and can slide along the waist-shaped groove 2323. When the circuit board fixing device is used, the locking bolt 2324 is unscrewed, the position and the angle of the bending rod 2321 are adjusted until the bottom of the edge of the circuit board is lapped on the positioning disc 2322, and then the circuit board can be fixed between the side pressure bolt 2312 and the positioning disc 2322 in an extruding mode by rotating the side pressure bolt 2312. The irregular-shaped circuit board refers to a circuit board whose edge cannot be lapped on the notch 233, so that the edge of the circuit board which cannot be lapped on the notch 233 can be lapped on the positioning plate 2322 by adjusting the position and the angle of the auxiliary supporting member 232, so as to facilitate the loading and fixing of the circuit board.

In this embodiment, the supporting member 241 includes a sliding block 2411, a thimble 2412 and an elastic member 2413, the sliding block 2411 is slidably disposed on the supporting rod 24, the thimble 2412 is slidably disposed on the sliding block 2411 along the longitudinal direction, the elastic member 2413 is telescopically disposed between the sliding block 2411 and the thimble 2412, when in use, the thimble 2412 is driven to move to a desired position by sliding the sliding block 2411, and the thimble 2412 is supported on the lower end surface of the circuit board under the elastic force of the elastic member 2413, so as to support the circuit board to prevent the circuit board from deforming and collapsing. Meanwhile, the protruding amount of the thimble 2412 can be changed, so that the supporting requirements of circuit boards with different thicknesses can be met.

Specifically, referring to fig. 6 and 9, a receiving groove 2414 is formed on the slider 2411, the thimble 2412 is slidably disposed in the receiving groove 2414, a step surface (not shown) is disposed on an outer side wall of the thimble 2412, an upper end of the elastic member 2413 elastically abuts against the step surface, and a lower end of the elastic member 2413 elastically abuts against a bottom wall of the receiving groove 2414.

In this embodiment, the elastic member 2413 is a spring sleeved outside the thimble 2412. It is understood that, in other embodiments not shown, the elastic component 2413 may also be a rigid and elastic element, such as a stainless steel spring plate or a copper spring plate, which is not limited herein.

In addition, in order to prevent the thimble 2412 from moving upward under the elastic force of the elastic component 2413 and further separating from the receiving groove 2414 of the slider 2411, the lower end of the thimble 2412 extends downward to the outside of the slider 2411, a snap spring 2415 is installed at the lower end of the thimble 2412, and the snap spring 2415 abuts against the bottom of the slider 2411, so that the thimble 2412 is prevented from separating from the slider 2411.

Meanwhile, referring to fig. 8-10, in order to lock the thimble 2412 to a lower position before the fixed circuit board is loaded, a locking bolt 2416 is installed on the side wall of the slider 2411, and tightening the locking bolt 2416 can make one end of the locking bolt 2416 press and fix the thimble 2412, and when loosening the locking bolt 2416, the locking state of the thimble 2412 is released, and the thimble 2412 automatically moves upward under the elastic force of the elastic component 2413 to abut against the lower end surface of the circuit board.

In addition, a fixing bolt 2417 is further installed on the side wall of the sliding block 2411, and tightening the fixing bolt 2417 can enable one end of the fixing bolt 2417 to press the side wall of the supporting rod 24, so that when the sliding block 2411 drives the thimble 2412 to slide to a desired position, the sliding block 2411 can be fixed on the supporting rod 24 by tightening the fixing bolt 2417.

In other embodiments, not shown, the elastic component 2413 may be omitted, in which case, the supporting component 241 includes a sliding block 2411 slidably disposed on the supporting rod 24 and a thimble 2412 fixedly connected to the sliding block 2411, the thimble 2412 is made of a resiliently deformable material, and in this case, the thimble 2412 can be abutted against the lower end surface of the circuit board by the elastic force generated by its own deformation. It is understood that the thimble 2412 is made of silicone or rubber material.

Referring to fig. 4, in the present embodiment, the support rails 222 are mounted on two opposite sides of the frame 22, the support rails 222 are perpendicular to the slide rail 11, and two ends of the support plate 23 and two ends of the support rod 24 are slidably connected to the support rails 222, so as to adjust the lateral pressing member 231 and the supporting member 241. A bolt (not shown) is installed on one side of the support plate 23, and one end of the bolt abuts against the frame 22 to lock and fix the support plate 23 after the position adjustment. In addition, a bracket handle 223 is installed at one side of the frame 22, so that a user can conveniently hold the bracket handle 223 to perform a turning operation on the frame 22.

Referring to fig. 12 and 13, in this embodiment, the suction type chip transferring device 30 includes a substrate 31, a sliding plate 32, a driving assembly 33, a movable seat 34, a suction rod 35, a suction nozzle 36 and an elastic member 37, the sliding plate 32 is longitudinally slidably disposed on the substrate 31, the driving assembly 33 drives the sliding plate 32 to move, the movable seat 34 is longitudinally and relatively slidably disposed on the sliding plate 32, the suction rod 35 is mounted on the movable seat 34, the suction rod 35 is connected to a vacuum generator (not shown), the suction nozzle 36 is connected to a lower end of the suction rod 35, the elastic member 37 is telescopically disposed between the sliding plate 32 and the movable seat 34 along a sliding direction of the movable seat 34, and the movable seat 34 abuts against an upper end of the elastic member 37, so that the movable seat 34 is suspended on the sliding plate 32.

When the adsorption type chip transfer device is used, the adsorption type chip transfer device 30 is moved to the position above a storage box which is placed on the machine table 10 and is used for containing chips, the driving assembly 33 drives the sliding plate 32 to move downwards relative to the base plate 31, so that the movable seat 34 is driven to move downwards together with the suction rod 35 and the suction nozzle 36, when the movable seat moves until the suction nozzle 36 abuts against the chips, the vacuum generator works, negative pressure is formed in the suction rod 35, the chips are adsorbed on the suction nozzle 36, and at the moment, the sliding plate 32 moves upwards to lift the chips. Then, the moving suction type chip transfer device 30 is integrated, moved to above the position to be soldered on the board, the movable base 34 is lowered again so that the chip is placed at the mounting position of the board, and the vacuum generator is turned off.

In the above process, in the initial state, the elastic member 37 is compressed under the gravity of the movable seat 34, and the elastic force generated by the elastic member 37 after being compressed and positioned suspends the movable seat 34, the suction rod 35 and the suction nozzle 36 at a certain height. When sliding seat 34 moves down and makes suction nozzle 36 support and press the chip, sliding seat 34 moves up, and elastic component 37 resets gradually, so, sliding seat 34's removal has complied with the trend that resets of elastic component 37, and elastic component 37 has played good cushioning effect for sliding seat 34 acts on the effort on the chip reduces greatly, has effectively solved and has absorbed the chip in-process, and the chip takes place the condition of damaging because of receiving too big pressure.

In this embodiment, the supporting block 321 is vertically connected to the sliding plate 32, the engaging block 344 is connected to the movable seat 34 corresponding to the supporting block 321, the lower end of the elastic member 37 engages with the supporting block 321, and the engaging block 344 engages with the upper end of the elastic member 37.

In addition, a guide post 3211 is fixedly connected to the upper end surface of the supporting block 321, the guide post 3211 slidably penetrates the engaging block 344, and the elastic element 37 is a spring sleeved outside the guide post 3211. Through setting up guide post 3211 can prevent effectively that the spring from to the crooked condition of lateral part in compression process, guaranteed that elastic component 37 can stable operation. It is understood that in other embodiments not shown, the guiding column 3211 may be omitted, and in this case, the elastic element 37 may be a rigid and elastic element such as a stainless steel elastic sheet or a copper elastic sheet, which is not limited herein.

In this embodiment, the driving assembly 33 includes a driving motor 331, a driving pulley 332, a driven pulley 333 and a transmission belt 334, the driving motor 331 is fixedly installed on one side of the base plate 31 opposite to the sliding plate 32, the driving pulley 332 and the driven pulley 333 are both rotatably connected with the base plate 31, an output shaft of the driving motor 331 is connected with the driving pulley 332, the transmission belt 334 is simultaneously sleeved outside the driving pulley 332 and the driven pulley 333, and one side of the transmission belt 334 is fixedly connected with the sliding plate 32. Thus, when the driving motor 331 is activated, the driving belt 334 can be driven to rotate, and the slide plate 32 is driven to move. In addition, the driving motor 331 is a forward and reverse rotation motor, thereby realizing the reciprocating movement of the slide plate 32 in the longitudinal direction.

It will be appreciated that in other embodiments not shown, the drive assembly 33 may also be constituted by a compression cylinder or a screw transmission, without being limited thereto. The sliding between the sliding plate 32 and the base plate 31 and between the movable seat 34 and the sliding plate 32 are achieved by guide rails, and the description of the guide rail structure is omitted here.

In this embodiment, the movable seat 34 is provided with a dual-shaft motor 38, an output shaft of the dual-shaft motor 38 is a hollow tubular structure, a lower end of the output shaft of the dual-shaft motor 38 is connected with an upper end of the suction rod 35 through a shaft coupler 381, and an upper end of the output shaft of the dual-shaft motor 38 is connected with the vacuum generator through an adapter 382. When the suction nozzle 36 adsorbs the chip, the double-shaft motor 38 is driven to rotate so as to drive the suction rod 35 to rotate together with the suction nozzle 36, so that the angle of the chip is adjusted, and accurate mounting is facilitated.

The movable seat 34 includes a connection seat 341 and a first fixing seat 342 and a second fixing seat 343 disposed on the connection seat 341 relatively, the connection seat 341 is connected to the sliding plate 32 relatively slidably, the first fixing seat 342 and the second fixing seat 343 are perpendicular to the connection seat 341, and the suction rod 35 rotatably penetrates through the first fixing seat 342 and the second fixing seat 343. During the use, first fixing base 342 and second fixing base 343 can play the supporting role to inhaling pole 35, prevent to take place to bend because of inhaling pole 35 overlength in adsorbing the chip in-process, have guaranteed to inhale pole 35 steady operation. In addition, bearings (not shown) are disposed between the suction rod 35 and the first fixing seat 342 and between the suction rod 35 and the second fixing seat 343, so as to ensure smooth rotation of the suction rod 35.

In this embodiment, the suction type chip transferring device 30 further includes a photoelectric switch and a controller (not shown), the photoelectric switch includes a photoelectric sensor 391 mounted on the sliding plate 32 and a blocking plate 392 mounted on the movable seat 34, and both the photoelectric sensor 391 and the vacuum generator are electrically connected to the controller. Wherein the controller is used for controlling the on/off of the vacuum generator according to the signal received by the photoelectric sensor 391.

In a specific working process, in an initial state when the chip is not adsorbed, the movable seat 34 is in a hovering state, the baffle 392 and the photoelectric sensor 391 are in opposite positions, light is shielded, the controller cannot receive a signal of the photoelectric sensor 392, and correspondingly, the controller controls the vacuum generator to not work; when the driving motor 331 drives the sliding plate 32, the photoelectric sensor 391 and the movable seat 34 (as the movable seat 34 and the sliding plate 32 are connected into a whole through the wire rail, the sliding plate 32 moves longitudinally, and correspondingly drives the movable seat 34 to move longitudinally), and the movable seat 34 moves downwards at the same time until the suction nozzle 36 contacts the chip, as the movable seat 34 is connected with the sliding plate 32 through the wire rail in a sliding manner, the movable seat and the sliding plate have a relative movement relationship along the longitudinal direction, and further when the suction nozzle 36 contacts the chip, the movable seat 34 is driven to move upwards relative to the sliding plate, so that the blocking piece 392 and the photoelectric sensor 391 are staggered mutually, no light is blocked in the photoelectric sensor 391, and an optical signal can be received, and the controller receives an electrical signal converted by the photoelectric sensor 391, so that the vacuum generator is controlled to start to adsorb the chip; meanwhile, after the driving motor 331 is stopped, the driving motor is started to rotate reversely to drive the sliding plate 32 to move upwards; after the chip is sucked and lifted, the blocking plate 392 and the photoelectric sensor 391 are in the opposite positions again, at this time, the vacuum generator continues to work until the coordinates to be mounted are reached, and then the driving motor 331 drives the sliding plate 32, the photoelectric sensor 391 and the movable seat 34 to move downwards simultaneously, so that the chip is in complete contact with the substrate bonding pad, and further the movable seat 34 is driven to move upwards relative to the sliding plate 32, so that when the blocking plate 392 and the photoelectric sensor 391 are staggered again, the controller controls the vacuum generator to stop working. Therefore, automatic control of the vacuum generator in the processes of sucking, transferring and mounting the chip is realized.

Referring to fig. 2 again, in order to realize the chip transfer by the suction type chip transfer device 30, a longitudinal beam 12 is fixedly installed on the machine table 10, a cross beam 13 is slidably installed on the longitudinal beam 12, the cross beam 13 and the longitudinal beam 12 are perpendicular to each other, a movable plate 14 is slidably installed on the cross beam 13, and the suction type chip transfer device 30 is installed on the movable plate 14. During operation, the beam 13 moves along the extending direction of the longitudinal beam 12 to drive the adsorption type chip transfer device 30 to move synchronously, and the movable plate 14 moves along the extending direction of the beam 13 to drive the adsorption type chip transfer device 30 to move synchronously, so that the adsorption type chip transfer device 30 moves transversely and longitudinally, and the suction nozzle 36 is accurately positioned. In the present embodiment, the base plate 31 is fixedly connected to the movable plate 14.

In a specific embodiment, the driving manner for driving the beam 13 to move longitudinally and the driving manner for driving the movable plate 14 to move transversely are screw drives, and it is understood that in other embodiments not shown, the moving manner of the beam 13 and the movable plate 14 can also be realized by a cylinder drive, and is not limited herein.

In addition, referring again to fig. 1, in order to achieve an aesthetic appearance and prevent a user from accidentally touching, the exterior of the side member 12 is covered with a protective outer shell 15.

Referring to fig. 1 and fig. 2 again, in the present embodiment, the heating device 40 includes a bottom heating mechanism 41, a desoldering heating mechanism 42, and a local heating mechanism 43, the bottom heating mechanism 41 is fixedly installed on the machine 10, the desoldering heating mechanism 42 and the local heating mechanism 43 are relatively movably disposed above the machine 10, the desoldering heating mechanism 42, the local heating mechanism 43, and the bottom heating mechanism 41 are sequentially disposed from top to bottom, and when in use, the circuit board is located between the desoldering heating mechanism 42 and the local heating mechanism 43. The bottom heating mechanism 41 is used for heating the circuit board as a whole, and the unsoldering heating mechanism 42 and the local heating mechanism 43 move synchronously and are used for heating the positions of the chips to be unsoldered of the circuit board at concentrated fixed points.

Referring to fig. 14, the bottom heating mechanism 41 includes a heating housing 411, a plurality of heating members 412 installed at the bottom of the heating housing 411, and a protective net 413 installed at the top of the heating housing 411, wherein the plurality of heating members 412 are uniformly distributed. In the present embodiment, the heating member 412 is a ceramic infrared heater. It is understood that the heating element 412 may also be a heating sheet, a heating rod, or the like, which generates heat when energized, and is not limited herein.

Referring to fig. 15 and 16, the desoldering heating mechanism 42 includes a fixed plate 421, a sliding plate 422, a sliding plate driving member 423, a heating module 424, a sucking rod 425 and a sucking rod driving member 426, the sliding plate 422 is longitudinally slidably disposed on the fixed plate 421, the driving plate driving member 423 drives the sliding plate 422 to move, the heating module 424 is fixedly mounted on the sliding plate 422, the sucking rod 425 is connected to the vacuum generator and longitudinally slidably disposed on the sliding plate 422, the heating module 424 includes a housing 4241 mounted on the sliding plate 422, a blower 4242 disposed at the top of the housing 4241 and a heater 4243 disposed inside the housing 4241, an opening 4244 is formed in the bottom of the housing 4241, and the sucking rod 425 movably penetrates through the opening 4244 under the driving of the sucking rod driving member 426.

When the chip is detached, the detaching and bonding heating mechanism 42 is moved to the position of the chip to be detached, the sliding plate driving member 423 drives the sliding plate 422 to move downwards and approach the chip to be detached, the blower 4242 is started, the heat generated by the heater 4243 is blown to the position to be detached through the opening 4244 by the wind generated by the blower, when a certain temperature is reached, the solder ball at the detaching position is melted, and the suction rod driving member 426 drives the suction rod 425 to move downwards and penetrate out of the bottom of the shell 4241, so that the chip is further sucked. The structure of the unsoldering heating mechanism 42 is internally provided with an independent suction rod 425 for sucking the unsoldering chip, and after the heating module 424 finishes the unsoldering work, the suction rod 425 can timely move downwards and suck the chip, so that the unsoldering process is accelerated, and the working efficiency is improved.

The shell 4241 is of a box-shaped structure, the fans 4242 are provided with a plurality of fans 4242 which are uniformly distributed on two opposite sides of the absorbing rod 425, the top of the shell 4241 is provided with a plurality of air inlets 4245, and one fan 4242 is correspondingly connected with one air inlet 4245. By arranging the two fans 4242, the uniformity of airflow heat at the opening 4244 is improved, and the position of a chip to be detached and welded on the circuit board is uniformly heated. In the present embodiment, there are two fans 4242.

Furthermore, a heat insulation plate 4246 is arranged above the heater 4243 in the shell 4241, a plurality of uniformly distributed air guide grooves 4247 are formed in the heat insulation plate 4246, and air blown into the shell 4241 can be uniformly blown out of the openings 4244 as much as possible under the action of the air guide grooves 4247 through the heat insulation plate 4246, so that the welding and dismantling effect is further improved.

In addition, in the embodiment, the heater 4243 is a ceramic heater, so that hot air is uniformly distributed when the ceramic heater works, the heat conducting performance is good, and the temperature of the surface to be detached and welded can be ensured to be uniform.

In this embodiment, the sliding plate 422 and the fixed plate 421 are slidably connected by a rail structure, and the sliding plate driving member 423 adopts the structure of the driving assembly 33 mentioned above, that is, the motor drives the conveyor belt to move, and then drives the sliding plate 422 fixed on the conveyor belt to move. In other embodiments, the sliding plate 422 may be driven to move by means of a pneumatic cylinder.

The suction rod driving member 426 adopts a screw transmission structure, specifically, the suction rod driving member 426 includes a suction rod motor 4261 fixedly connected to the sliding plate 422 and a sliding block 4262 longitudinally slidably disposed on the sliding plate 422, an output shaft of the suction rod motor 4261 is a screw and is in threaded connection with the sliding block 4262, and the suction rod 425 is connected to the sliding block 4262. When the device is used, the motor 4261 of the suction rod rotates to drive the output shaft of the suction rod to rotate, and the sliding block 4262 can only move longitudinally but cannot rotate relative to the sliding plate 422, so that the sliding block 4262 is forced to slide longitudinally, and the suction rod 425 is driven to move up and down longitudinally. In the present embodiment, slide block 4262 and slide plate 422 are connected by a rail structure so that slide block 4246 can only slide relative to slide plate 422 and cannot rotate. In addition, the suction rod motor 4261 is a forward and reverse rotation motor so that the suction rod 425 can be moved up and down in the longitudinal direction.

Referring to fig. 2 again, in the present embodiment, the fixed plate 421 is fixedly mounted on the movable plate 14, so that the sucking rod 425 precisely moves to the position of the chip to be detached.

Referring to fig. 3 and 17, the local heating mechanism 43 includes an air outlet cavity 431, a connecting pipe 432, and a cartridge heater 433 communicated between the air outlet cavity 431 and the connecting pipe 432, wherein a plurality of air outlet holes 4311 are formed at the top of the air outlet cavity 431, the air outlet cavity 431 corresponds to the housing 4241 of the heating module 424, the connecting pipe 432 is connected to the movable plate 14 through a connecting arm 434, the connecting pipe 432 is communicated with an air source, and the cartridge heater 433 can generate heat after being powered on. When the air-out cavity 431 is used, the air-out cavity 431 moves to the bottom of the chip to be detached and welded, and heat generated by the barrel heater 433 is blown out through the air outlet 4311 under the action of an air source and acts on the chip to be detached and welded, so that the fixed-point heating function is realized.

Further, referring to fig. 3 again, in order to improve the movement stability of the local heating mechanism 43, the upper end surface of the machine table 10 is connected to the support 16, the guide rod 161 is installed on the support 16, the guide block 162 is slidably connected to the guide rod 161, and the connecting pipe 432 slidably penetrates through the guide block 162, so that the guide block 162 can support the connecting pipe 432 during operation, and the connecting pipe 432 is prevented from being easily deformed.

Referring again to fig. 1, in order to achieve an aesthetic appearance and prevent the user from touching the chip, the suction type chip transfer device 30 and the desoldering and heating mechanism 42 are covered with a protective cover 50.

Referring to fig. 2 again, the chip repairing apparatus of the present invention further includes a cooling module 60 disposed on the side portion of the stage mechanism 20, wherein the cooling module 60 is used for providing a large amount of cold air to cool down the circuit board quickly. In this embodiment, the cooling module 60 is a cross flow fan, and the cross flow fan belongs to the prior art, and the structure thereof is not further described here.

Please refer to fig. 2 again, the chip repair apparatus of the present invention further includes a control cabinet 70 and a display panel 80, the control cabinet 70 is disposed at the bottom of the machine 10, the display panel 80 is disposed at one side of the machine 10, and the display panel 80 is used for displaying the running state information of the chip repair apparatus.

The utility model provides a chip reprocesses equipment, through setting up microscope carrier mechanism 20, extrude the circuit board between side casting die 231 and support piece 241 to realize the loading fixed action to the circuit board, simultaneously, can effectively avoid the circuit board to take place to sink in the heating process and warp, and, when installing the circuit board, can adjust the angle and the position of circuit board, the convenient installation operation has promoted the loading efficiency and the loading quality of circuit board greatly; by arranging the adsorption type chip transfer device 30, the suction nozzle 36 can be suspended at a certain height, and when the movable seat 34 moves downwards and the suction nozzle 36 is pressed against the chip, the elastic piece 37 gradually resets, so that a good buffer effect is achieved, the acting force of the movable seat 34 on the chip is greatly reduced, the condition that the chip is damaged due to excessive pressure in the process of sucking the chip is effectively overcome, and the nondestructive transfer of the chip is realized; in addition, the unsoldering heating mechanism 42 is internally provided with an independent suction rod 425 for sucking the unsoldering chip, and after the heating module 424 finishes the unsoldering work, the suction rod 425 can timely move downwards and suck the chip, so that the unsoldering process is accelerated, and the working efficiency is improved.

Example two

Referring to fig. 18, a second embodiment of the present invention provides a chip repairing apparatus, which is different from the first embodiment in that the structure of the desoldering heating mechanism 42 of the present invention is different, and specifically, the structure of the heating module 424 is different.

Specifically, the heating module 424 in the second embodiment includes a hot air mixing chamber 4248 mounted on the sliding plate 422, a barrel heater 4249 mounted on the top of the hot air mixing chamber 4248, and a hot air nozzle 4250 mounted on the bottom of the hot air mixing chamber 4248, the barrel heater 4249 is connected to a blower through an air pipe joint 4251, and when in use, air generated by the blower after being started passes through the barrel heater 4249 and is heated and enters the hot air mixing chamber 4248, and then flows to the chip to be detached through the hot air nozzle 4250.

In addition, in order to realize real-time monitoring of the temperature during the unsoldering, a temperature sensor 4252 is mounted on the side wall of the hot air mixing chamber 4248. In the present embodiment, the temperature sensor 4252 is a K-type thermocouple.

Other parts and connection structures not mentioned in the chip repair device of the second embodiment are the same as those of the first embodiment, and are not described herein again.

In light of the foregoing, it will be apparent to those skilled in the art from this disclosure that various changes and modifications can be made without departing from the scope of the invention. The technical scope of the present invention is not limited to the content of the specification, and must be determined according to the scope of the claims.

Claims (10)

1. The utility model provides an absorption formula chip transfer device which characterized in that: including base plate, slide, drive assembly, sliding seat, inhale the pole, inhale and chew and elastic component, the slide is located along vertical slidable ground on the base plate, the drive assembly drive the slide removes, the sliding seat is located along vertical relative slidable ground on the slide, it installs to inhale the pole on the sliding seat, it is connected with vacuum generator to inhale the pole, inhale to chew and connect the connection the lower extreme of inhaling the pole, the elastic component is followed the slip direction telescopically of sliding seat is located the slide with between the sliding seat, the sliding seat is taken and is supported the upper end of elastic component, thereby makes the sliding seat suspension is in on the slide.

2. The suction chip transfer device according to claim 1, wherein: the sliding plate is connected with a supporting block, the movable seat is connected with a butting block corresponding to the supporting block, the lower end of the elastic piece butts against the supporting block, and the butting block butts against the upper end of the elastic piece.

3. The suction chip transfer device according to claim 2, wherein: the upper end face of the supporting block is fixedly connected with a guide post, the guide post slidably penetrates through the abutting block, the elastic piece is a spring, and the spring is sleeved outside the guide post.

4. The suction chip transfer device according to claim 1, wherein: install the double-shaft motor on the sliding seat, the output shaft of double-shaft motor is cavity tubular structure, the lower extreme of the output shaft of double-shaft motor pass through the shaft coupling with the upper end of sucker rod is connected, the upper end of the output shaft of double-shaft motor pass through the adapter with vacuum generator connects.

5. The suction chip transfer device according to claim 1, wherein: the movable seat comprises a connecting seat, a first fixing seat and a second fixing seat, wherein the first fixing seat and the second fixing seat are oppositely arranged on the connecting seat, the connecting seat is connected with the sliding plate in a sliding mode relatively, the first fixing seat and the second fixing seat are perpendicular to the connecting seat, and the suction rod rotatably penetrates through the first fixing seat and the second fixing seat.

6. The suction chip transfer device according to claim 1, wherein: the driving assembly comprises a driving motor, a driving belt wheel, a driven belt wheel and a driving belt, the driving motor is fixedly installed on one side of the base plate, which is opposite to the sliding plate, the driving belt wheel and the driven belt wheel are rotatably connected with the base plate, an output shaft of the driving motor is connected with the driving belt wheel, the driving belt is sleeved outside the driving belt wheel and the driven belt wheel, and one side of the driving belt is fixedly connected with the sliding plate.

7. The suction chip transfer device according to any one of claims 1 to 6, wherein: the adsorption type chip transfer device further comprises a photoelectric switch and a controller, wherein the photoelectric switch comprises a transmitter arranged on the sliding plate and a receiver arranged on the movable seat, and the receiver and the vacuum generator are electrically connected with the controller.

8. The utility model provides a chip reprocess equipment which characterized in that: the chip rework apparatus comprising the suction type chip transfer device according to any one of claims 1 to 7.

9. The chip rework device of claim 8, wherein: the chip repairing equipment further comprises a carrying platform mechanism for placing the chip, and the adsorption type chip transfer device is movably arranged above the carrying platform mechanism.

10. The chip rework device of claim 9, wherein: the chip repair equipment further comprises a machine table, the loading platform mechanism is arranged on the machine table, a longitudinal beam is fixedly mounted on the machine table, a cross beam is slidably mounted on the longitudinal beam, the cross beam and the longitudinal beam are perpendicular to each other, a movable plate is slidably mounted on the cross beam, and the substrate is fixedly connected with the movable plate.

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