CN215069891U - Multistage compression ring cooperative working device - Google Patents

Abstract

The utility model belongs to the technical field of semiconductor integrated circuit manufacturing process, concretely relates to multistage clamping ring collaborative work device, press the split type clamping ring that establishes on the wafer, split type clamping ring is including the first clamping ring portion and the second clamping ring portion that all are platelike, and first clamping ring portion both ends end is extended a mesa step-like structure down and is formed first upper ledge, and second clamping ring portion both ends end is extended a mesa step-like structure up and is formed first lower ledge, and first lower ledge is connected with first upper ledge; a first extension part is arranged on one side, away from the inner arc, of the first pressing ring part, and a second extension part is arranged on one side, away from the inner arc, of the second pressing ring part; the first extension part and the second extension part are respectively connected with a driving device. The utility model discloses a split type clamping ring and each clamping ring portion all have independent drive arrangement, have solved because the clamping ring slope leads to the clamping ring to be certain angle on the wafer surface, and the wafer that leads to local area is not compressed tightly to the problem that back of the body helium ran out from this position.

Description

Multistage compression ring cooperative working device

Technical Field

The utility model belongs to the technical field of semiconductor integrated circuit manufacturing process, concretely relates to multistage clamping ring collaborative work device.

Background

In the manufacturing process of semiconductor devices and the like, the function of the pressure ring is crucial, because in the process, due to the function of the radio frequency power supply, process gas is ionized and then becomes plasma, and the process of etching the surface of the wafer is accelerated, a large amount of heat is accumulated on the surface of the wafer in the process, and the wafer needs to be cooled in order to prevent the surface of the wafer from being burnt by high temperature. In the semiconductor industry, a water chiller is generally used to cool a mechanical electrode, and helium gas, also called back helium, is introduced between the electrode and the back surface of a wafer to transfer the low temperature of the electrode to the wafer to cool the wafer. However, in the process, the process chamber is in a vacuum state, the chamber pressure is low, and the existence of the back helium can cause the wafer to be blown away, so that the wafer needs to be pressed on the surface of the electrode by using the pressing ring in the process, and the helium on the back of the wafer is sealed after the wafer is pressed to form the back pressure, and the existence of the back pressure can be used for judging whether the wafer is damaged or not.

In present plasma etching equipment, the clamping ring mechanism generally is located the below of cavity, use a cylinder drive, drive the lift of clamping ring, but because the special design of cavity, vacuum parts such as molecular pump can be installed to whole below of technology cavity, therefore the cylinder of clamping ring can only be installed at the chamber bottom one side, come the pulling clamping ring through one or two transfer bars and go up and down, the clamping ring device of one side driven can lead to the local region of wafer not compressed tightly, lead to back of the body helium to run out from this position, influence the cooling effect of wafer, cause the board to judge that data is wrong simultaneously.

SUMMERY OF THE UTILITY MODEL

The utility model provides a multistage clamping ring collaborative work device has solved because the clamping ring slope leads to the clamping ring to be certain angle on the wafer surface, and the wafer that leads to local area is not compressed tightly to the problem that back of the body helium ran out from this position.

The utility model provides a technical scheme that its technical problem adopted is: a multi-stage compression ring co-operating apparatus comprising: the wafer clamping device comprises a wafer, a split type clamping ring and a clamping ring, wherein the wafer is pressed on the wafer, the split type clamping ring comprises a first plate-shaped clamping ring part and a second plate-shaped clamping ring part, the two ends of the first clamping ring part extend out of a downward step-shaped structure of a table top to form a first upper protruding part, the two ends of the second clamping ring part extend out of an upward step-shaped structure of the table top to form a first lower protruding part, and the first lower protruding part is connected with the first upper protruding part;

one end of the first extension part is arranged on one side of the first pressure ring part close to the external environment, and the other end of the first extension part is a free end;

one end of the second extension part is arranged on one side, close to the external environment, of the second pressure ring part, and the other end of the second extension part is a free end;

the top of the first transmission corrugated pipe is connected with the free end of the first extension part;

the top of the second transmission corrugated pipe is connected with the free end of the second extending part.

As a further preferred aspect of the present invention, the first pressure ring portion and the second pressure ring portion enclose a closed structure, wherein two of the first upper protruding portions and two of the first lower protruding portions are connected to each other.

As a further preferred aspect of the present invention, the inner diameter of the closed structure surrounded by the first pressure ring portion and the second pressure ring portion is smaller than the outer diameter of the wafer by 4-6 mm.

As the utility model discloses a further preferred, split type clamping ring is still including being platelike third clamping ring portion, third clamping ring portion one end punishment extend and stretch out mesa one step-like structure form the second down and go up the protruding portion, and other end punishment extend and stretch out a mesa step-like structure form the second down the protruding portion.

As a further preferred embodiment of the present invention, the first pressure ring portion, the second pressure ring portion and the third pressure ring portion are enclosed to form a closed structure, wherein one of the first upper protruding portion and one of the second pressure ring portion is connected to the first lower protruding portion, the other of the first pressure ring portion is connected to the first upper protruding portion and the second lower protruding portion, and the other of the second pressure ring portion is connected to the first lower protruding portion and the second upper protruding portion.

As a further preferred aspect of the present invention, the pressure relief valve further comprises a third extension portion, wherein one end of the third extension portion is disposed on one side of the third pressing ring portion close to the external environment, and the other end of the third extension portion is a free end.

As the utility model discloses a further preferred, still include third transmission bellows and third drive actuating cylinder, third transmission bellows bottom is provided with the third drives actuating cylinder, third transmission bellows top with the free end of third extension is connected.

As a further preferred aspect of the present invention, the inner diameter of the closed structure surrounded by the first pressure ring portion, the second pressure ring portion and the third pressure ring portion is smaller than the outer diameter of the wafer by 4-6 mm.

As the utility model discloses a further preferred, split type clamping ring adopts non-metallic material.

Through above technical scheme, for prior art, the utility model discloses following beneficial effect has:

the utility model discloses a split type clamping ring and each clamping ring portion all have independent drive arrangement, have solved because clamping ring mechanism slope, lead to the clamping ring to be a low-angle on the wafer surface, lead to local area's wafer not compressed tightly to the problem that back of the body helium ran out from this position.

The utility model discloses each clamping ring portion junction adopts step form overlay type, and this connected mode guarantees that the wafer is all covered by 360 at the in-process edge, can not appear simultaneously that each clamping ring portion junction has the existence in gap and lead to marginal condition inconsistent, and then influences the homogeneity of sculpture.

Drawings

The present invention will be further explained with reference to the drawings and examples.

FIG. 1 is a schematic diagram of a pressure ring inclination of a conventional plasma etcher;

FIG. 2 is a working schematic diagram of the two-stage split pressure ring of the present invention;

fig. 3 is a schematic view of the first pressing ring part and the second pressing ring part of the present invention;

FIG. 4 is a two-stage split work flow diagram of the present invention;

FIG. 5 is a working schematic diagram of the three-level split pressure ring of the present invention;

fig. 6 is a schematic view of the first, second and third pressing ring portions of the present invention;

FIG. 7 is a schematic view of the split type three-level pressure ring of the present invention;

fig. 8 is a three-level split type work flow chart of the present invention.

In the figure: 1. a chamber; 2. a wafer; 3. a first drive bellows; 4. a first driving cylinder; 5. a second transmission bellows; 6. a second driving cylinder; 7. a third transmission bellows; 8. a third driving cylinder; 9. a second upper projection; 10. a second lower projection; 11. a first pressure ring part; 12. a second pressure ring part; 13. a third pressure ring part; 14. a first lower protrusion; 15. a first upper projection; 16. a first extension portion; 17. a second extension portion; 18. a third extension portion; 19. an electrode; 20. a thimble mechanism; 21. a transfer chamber; 100. and (4) a split type pressure ring.

Detailed Description

The present invention will now be described in further detail with reference to the accompanying drawings. These drawings are simplified schematic drawings and illustrate the basic structure of the present invention only in a schematic manner, and thus show only the components related to the present invention.

As shown in fig. 1, the ring pressing mechanism is generally located below the chamber 1, and is driven by one cylinder to drive the pressing ring to ascend and descend, but due to the special design of the chamber 1, vacuum components such as a molecular pump and the like are installed right below the chamber 1, so that the cylinder of the pressing ring can only be installed at one side of the bottom of the chamber, the pressing ring is pulled to ascend and descend by one or two transmission rods, the ring pressing mechanism driven at one side can cause the wafer 2 in a local area not to be pressed, so that back helium runs out from the position, the cooling effect of the wafer 2 is affected, and meanwhile, errors in machine judgment data are caused. Due to the fact that the ring pressing mechanism inclines, the pressing ring is small in angle on the surface of the wafer, and the wafer 2 cannot be pressed comprehensively at the moment. To solve the above problems, the present application provides the following embodiments:

example 1

The embodiment provides a preferred embodiment, and a multi-stage compression ring cooperative working device, which is characterized in that a compression ring is divided into a plurality of parts to form a split type compression ring 100, and the split type compression ring 100 is generally made of non-metal materials such as ceramics, quartz or plastics. As shown in fig. 2 and fig. 3, the split pressure ring 100 in this embodiment is divided into two parts, namely, a first pressure ring part 11 and a second pressure ring part 12, because the wafer 2 in this embodiment is circular, the first pressure ring part 11 and the second pressure ring part 12 are both arc-shaped and form a circular ring with an inner diameter D1, the circular ring is pressed above the wafer 2, preferably, D1 is smaller than the outer diameter of the wafer 2 by 4-6mm, specifically, the difference between D1 and the outer diameter of the wafer 2 may be 4mm, 5mm and 6 mm. The split type pressure ring 100 can be pressed to the edge of the wafer 2, and meanwhile, the wafer 2 cannot be excessively shielded to influence the etching uniformity. The closed structure enclosed by the first pressure ring part 11 and the second pressure ring part 12 needs to be consistent with the shape of the wafer 2, so that the wafer 2 in any shape can be conveniently pressed with high matching degree.

The present embodiment further comprises a first lower protrusion 14, a first upper protrusion 15, a first extension 16, a second extension 17, a first transmission bellows 3, a first drive cylinder 4, a second transmission bellows 5 and a second drive cylinder 6, the end heads of the two ends of the first pressure ring part 11 extend out of a step-shaped structure with a downward table top to form a first upper protruding part 15, the end heads of the two ends of the second pressure ring part 12 extend out of a step-shaped structure with an upward table top to form a first lower protruding part 14, the two first lower protruding parts 14 on the second pressure ring part 12 cover the two first upper protruding parts 15 on the first pressure ring part 11, so that the edge of the wafer 2 is completely covered by 360 degrees in the process, the design of the shape can not cause the edge condition inconsistency at the joint of the first pressure ring part 11 and the second pressure ring part 12 due to the existence of the gap, thereby influencing the etching uniformity.

One end of the first extending portion 16 is disposed on one side of the first pressing ring portion 11 away from the inner arc, and the other end of the first extending portion 16 is a free end; one end of the second extending portion 17 is disposed on one side of the second pressing ring portion 12 away from the inner arc, and the other end of the first extending portion 16 is a free end. The bottom of the first transmission corrugated pipe 3 is provided with a first driving cylinder 4, and the top of the first transmission corrugated pipe 3 is connected with the free end of the first extension part 16; the bottom of the second transmission bellows 5 is provided with the second driving cylinder 6, and the top of the second transmission bellows 5 is connected with the free end of the second extension part 17. The lifting of the first pressure ring part 11 depends on the kinetic energy of the first driving cylinder 4 transferred by the first transmission bellows 3 to move, the lifting of the second pressure ring part 12 depends on the kinetic energy of the second driving cylinder 6 transferred by the second transmission bellows 5 to move, and the driving of the first pressure ring part 11 and the second pressure ring part 12 is independent. Due to the existence of the first upper protruding part 15 and the first lower protruding part 14, the first press ring part 11 and the second press ring part 12 ascend and descend in sequence, and the sequential work flow chart of the two is shown in fig. 4.

As shown in fig. 1 and 4, the working flow of the two-stage pressure ring is as follows: the mechanical arm carries the wafer 2 to enter the process chamber 1, an ejector pin in the ejector pin mechanism 20 is lifted, the mechanical arm returns to the transmission cavity 21, the ejector pin mechanism 20 drives the ejector pin to descend, the wafer 2 is placed on the surface of the electrode 19, the second pressure ring part 12 descends under the action of the second driving cylinder 6 to perform tabletting, the first pressure ring part 11 descends under the action of the first driving cylinder 4 to perform tabletting, namely the split type pressure ring 100 is completely pressed on the upper surface of the wafer 2; and starting the etching process, after the process is finished, the first pressure ring part 11 rises under the action of the first driving cylinder 4, the second pressure ring part 12 rises under the action of the second driving cylinder 6, the thimble of the thimble mechanism 20 rises, the manipulator enters the process chamber 1, the thimble of the thimble mechanism 20 falls, the manipulator carries the wafer 2, exits the process chamber 1, returns to the transmission cavity 21, takes out the etched wafer 2, puts in a new wafer 2 to be etched, and the etching process is repeated.

Example 2

In this embodiment, on the basis of embodiment 1, as shown in fig. 5 to 7, the split pressure ring 100 further includes a third pressure ring portion 13, a third extending portion 18, a third transmission bellows 7, and a third driving cylinder 8, wherein one end of the third pressure ring portion 13 extends out of a step-shaped structure with a downward mesa to form a second upper protruding portion 9, and the other end of the third pressure ring portion extends out of a step-shaped structure with an upward mesa to form a second lower protruding portion 10. Because the wafer 2 is circular in the present embodiment, the first pressure ring part 11, the second pressure ring part 12 and the third pressure ring part 13 are all circular arc plate-shaped and enclose a circular ring with an inner diameter D2, the circular ring is pressed above the wafer 2, preferably D2 is smaller than the outer diameter of the wafer 2 by 4-6mm, specifically, the difference between D2 and the outer diameter of the wafer 2 may be 4mm, 5mm and 6 mm. The closed structure enclosed by the first pressure ring part 11, the second pressure ring part 12 and the third pressure ring part 13 needs to be consistent with the shape of the wafer 2, so that the wafer 2 in any shape can be conveniently pressed and installed with high matching degree.

One first upper protruding part 15 on the first press ring part 11 is connected with one first lower protruding part 14 on the second press ring part 12, the other first upper protruding part 15 on the first press ring part 11 is connected with the second lower protruding part 10 on the third press ring part 13, and the other first lower protruding part 14 on the second press ring part 12 is connected with the second upper protruding part 9 on the third press ring part 13.

One end of the third extending portion 18 is disposed on a side of the third press ring portion 13 away from the inner arc, and the other end of the third extending portion 18 is a free end. The bottom of the third transmission bellows 7 is provided with a third driving cylinder 8, and the top of the third transmission bellows 7 is connected with the free end of the third extension part 18. The first pressure ring part 11, the second pressure ring part 12 and the third pressure ring part 13 are lifted in sequence, and the sequential work flow charts of the three parts are shown in fig. 8.

As shown in fig. 5 and 8, the working flow of the three-stage pressure ring is as follows: the mechanical arm carries the wafer 2 to enter the process chamber 1, an ejector pin in the ejector pin mechanism 20 is lifted, the mechanical arm returns to the transmission cavity 21, the ejector pin mechanism 20 drives the ejector pin to descend, the wafer 2 is placed on the surface of the electrode 19, the second pressure ring part 12 descends under the action of the second driving cylinder 6 to perform tabletting, the third pressure ring part 13 descends under the action of the third driving cylinder 8 to perform tabletting, the first pressure ring part 11 descends under the action of the first driving cylinder 4 to perform tabletting, namely, the split type pressure ring 100 is completely pressed on the upper surface of the wafer 2; and starting an etching process, after the process is finished, the first pressure ring part 11 rises under the action of the first driving cylinder 4, the third pressure ring part 13 rises under the action of the third driving cylinder 8, the second pressure ring part 12 rises under the action of the second driving cylinder 6, the ejector pin of the ejector pin mechanism 20 rises, the manipulator enters the process chamber 1, the ejector pin of the ejector pin mechanism 20 falls, the manipulator carrying the wafer 2 exits the process chamber 1, returns to the transmission cavity 21, takes out the etched wafer 2, puts in a new wafer 2 to be etched, and the etching process is repeated.

The split type pressure ring is adopted, each pressure ring part is provided with the independent driving device, and the problem that the pressure ring is inclined on the surface of the wafer, so that the pressure ring is small in angle, the wafer 2 in a local area is not pressed, and the back helium flows out from the position is solved; the step-shaped covering type is adopted at the joint of each pressure ring part, the connection mode ensures that the edge of the wafer 2 is completely covered by 360 degrees in the process, and meanwhile, the phenomenon that the edge condition is inconsistent due to the existence of gaps at the joint of each pressure ring part can not occur, so that the etching uniformity is influenced.

It will be understood by those skilled in the art that, unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the prior art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.

The meaning of "and/or" as used herein is intended to include both the individual components or both.

The term "connected" as used herein may mean either a direct connection between components or an indirect connection between components via other components.

In light of the foregoing, it will be apparent to those skilled in the art from this disclosure that various changes and modifications can be made without departing from the spirit and scope of the invention. The technical scope of the present invention is not limited to the content of the specification, and must be determined according to the scope of the claims.

Claims (9)

1. A multi-stage compression ring cooperative working apparatus, comprising: the split type pressure ring (100) is pressed on a wafer (2), the split type pressure ring (100) comprises a first plate-shaped pressure ring part (11) and a second plate-shaped pressure ring part (12), the end heads of the two ends of the first pressure ring part (11) extend out of a step-shaped structure with a downward table top to form a first upper protruding part (15), the end heads of the two ends of the second pressure ring part (12) extend out of a step-shaped structure with an upward table top to form a first lower protruding part (14), and the first lower protruding part (14) is connected with the first upper protruding part (15);

one end of the first extension part (16) is arranged on one side, close to the external environment, of the first pressure ring part (11), and the other end of the first extension part (16) is a free end;

one end of the second extending part (17) is arranged on one side, close to the external environment, of the second pressure ring part (12), and the other end of the second extending part (17) is a free end;

the transmission device comprises a first transmission corrugated pipe (3) and a first driving cylinder (4), wherein the first driving cylinder (4) is arranged at the bottom of the first transmission corrugated pipe (3), and the top of the first transmission corrugated pipe (3) is connected with the free end of a first extending part (16);

the transmission device comprises a second transmission corrugated pipe (5) and a second driving cylinder (6), wherein the second driving cylinder (6) is arranged at the bottom of the second transmission corrugated pipe (5), and the top of the second transmission corrugated pipe (5) is connected with the free end of a second extending part (17).

2. A multi-stage compression ring co-operating apparatus according to claim 1, wherein: the first pressure ring part (11) and the second pressure ring part (12) enclose a closed structure, wherein two first upper protruding parts (15) on the first pressure ring part (11) are connected with two first lower protruding parts (14) on the second pressure ring part (12).

3. A multi-stage pressure ring co-operating apparatus according to claim 2, wherein: the inner diameter of a closed structure surrounded by the first pressure ring part (11) and the second pressure ring part (12) is smaller than the outer diameter of the wafer (2) by 4-6 mm.

4. A multi-stage compression ring co-operating apparatus according to claim 1, wherein: split type clamping ring (100) are still including being platelike third clamping ring portion (13), third clamping ring portion (13) one end department extends and stretches out mesa one step-like structure form second down and goes up outstanding portion (9), and other end department extends and stretches out under one mesa step-like structure form second outstanding portion (10) up.

5. A multi-stage pressure ring co-operating apparatus according to claim 4, wherein: the first pressure ring part (11), the second pressure ring part (12) and the third pressure ring part (13) enclose a closed structure, wherein one first upper protruding part (15) on the first pressure ring part (11) is connected with one first lower protruding part (14) on the second pressure ring part (12), the other first upper protruding part (15) on the first pressure ring part (11) is connected with the second lower protruding part (10) on the third pressure ring part (13), and the other first lower protruding part (14) on the second pressure ring part (12) is connected with the second upper protruding part (9) on the third pressure ring part (13).

6. A multi-stage pressure ring co-operating apparatus according to claim 5, wherein: the pressing ring further comprises a third extending portion (18), one end of the third extending portion (18) is arranged on one side, close to the external environment, of the third pressing ring portion (13), and the other end of the third extending portion is a free end.

7. A multi-stage pressure ring co-operating apparatus according to claim 6, wherein: the transmission device is characterized by further comprising a third transmission corrugated pipe (7) and a third driving cylinder (8), wherein the third driving cylinder (8) is arranged at the bottom of the third transmission corrugated pipe (7), and the top of the third transmission corrugated pipe (7) is connected with the free end of the third extending part (18).

8. A multi-stage pressure ring co-operating apparatus according to claim 4, wherein: the inner diameter of a closed structure surrounded by the first pressure ring part (11), the second pressure ring part (12) and the third pressure ring part (13) is smaller than the outer diameter of the wafer (2) by 4-6 mm.

9. A multi-stage pressure ring co-operating arrangement according to any one of claims 1 to 8, wherein: the split type pressure ring (100) is made of a non-metal material.

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