CN215031406U - Probe cleaning mechanism and probe station comprising same - Google Patents
Probe cleaning mechanism and probe station comprising same Download PDFInfo
- Publication number
- CN215031406U CN215031406U CN202121523433.7U CN202121523433U CN215031406U CN 215031406 U CN215031406 U CN 215031406U CN 202121523433 U CN202121523433 U CN 202121523433U CN 215031406 U CN215031406 U CN 215031406U
- Authority
- CN
- China
- Prior art keywords
- positioning
- plate
- probe
- cleaning mechanism
- support
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
The utility model provides a probe cleaning mechanism and a probe station comprising the same, wherein the mechanism comprises a bracket; the positioning adjusting plate is arranged above the support, a first positioning surface and a second positioning surface are arranged on the lower end surface of the positioning adjusting plate along the length direction, and the first positioning surface is lower than the second positioning surface; the positioning plate is arranged on the upper end face of the support, a positioning part is arranged on the upper surface of the positioning plate, the positioning plate is driven to horizontally move along the length direction to enable the positioning part to be opposite to the first positioning surface or the second positioning surface, the positioning adjusting plate is driven to move up and down to enable the positioning part to be abutted against the first positioning surface to determine the needle cleaning position of the positioning adjusting plate, or abutted against the second positioning surface to determine the non-needle cleaning position of the positioning adjusting plate; through location portion and first, two locating surfaces cooperations, make the position of location regulating plate stable not rock, clear needle position and clear needle position between accurate the switching, can not influence other operations.
Description
Technical Field
The utility model belongs to semiconductor test equipment field relates to a probe clearance mechanism and including the probe platform of this mechanism.
Background
The whole process of manufacturing semiconductor devices can be divided into wafer manufacturing, wafer probing, and chip packaging. Wafer Probing (CP) is an important part of semiconductor Chip manufacturing process, and the purpose of CP testing is to perform a Test on electrical functions of a Chip, so that the Chip with poor electrical functions is filtered before entering a package, thereby avoiding increasing the manufacturing cost of the defective product. At present, a testing machine is generally used to test electrical functions of a chip, and the testing machine includes a probe station (probe) having a probe card thereon, and the probe card includes at least one probe (probe needle). In the step of testing the electrical function of the chip, one or more test pads (pads) are usually disposed on the chip, and the probe needs to contact with the test pads to complete the functional test.
After a long test, the tip of the probe is oxidized, thereby increasing the instantaneous impedance. Meanwhile, contaminants (test pad residues, generally aluminum chips) are generated on the surface of the probe, so that the needle mark in the functional test step is too large, too deep or deviated, the yield of the functional test is affected, and even the chip is scrapped. Therefore, in order to ensure that the functional test is performed properly, the probe must be cleared at intervals.
At present, the positioning accuracy of a probe cleaning mechanism in a full-automatic probe station is poor, so that the lifting height of a probe cleaning platform is too large or too small, and when the lifting height is too large, the pressure applied to the probe tip of a probe card is too large, so that the probe tip of the probe card is damaged, and further the probe card is damaged. If the probe is not cleaned in place, the needle marks in the functional test step are too large, too deep or offset, so that the excellent rate of the functional test is influenced, even chips are scrapped, and the cost of the wafer and the probe card with about one hundred rhenium tungsten probes is high, so that the cost is wasted.
SUMMERY OF THE UTILITY MODEL
Based on this, the utility model discloses to the one or more problems of pointing out in the background art, provide a probe clearance mechanism, clearance position positioning accuracy is high.
According to the utility model discloses a probe clearance mechanism, include:
a support;
the positioning adjusting plate is arranged above the support, a first positioning surface and a second positioning surface are arranged on the lower end surface of the positioning adjusting plate along the length direction or the width direction of the support, and the first positioning surface is lower than the second positioning surface;
the locating plate sets up on the up end of support, be provided with location portion on its upper surface, the locating plate is driven along length or width direction horizontal migration makes location portion with first locating surface or the second locating surface is just right, the location regulating plate is driven and is reciprocated the messenger location portion with first locating surface conflicts in order to confirm the clear needle position of location regulating plate, or with the conflict of second locating surface is in order to confirm the clear needle position of non-of location regulating plate.
By last, the utility model discloses a first locating surface on the location regulating plate realizes the clear needle location of location regulating plate with the contact of location portion, realizes the clear needle location of the non-of location regulating plate through the contact of second locating surface and location portion to make the location regulating plate not rock because the support of locating plate and stable in position.
The utility model discloses an in some embodiments, be provided with first constant head tank and second constant head tank on the lower surface of location regulating plate, first locating surface is the bottom surface of first constant head tank, the second locating surface is the bottom surface of second constant head tank, location portion is bellied locating piece, the locating piece sets up first constant head tank or in the second constant head tank.
In some embodiments of the present invention, the probe cleaning mechanism further comprises:
the supporting plate is arranged between the bracket and the positioning adjusting plate and is fixedly connected with the bracket;
the vertical driving assembly is used for driving the positioning adjusting plate to move up and down, and comprises a first linear driver, wherein the first linear driver is fixedly connected with the positioning adjusting plate and arranged on the supporting plate.
In some embodiments of the utility model, this probe clearance mechanism still includes vertical direction subassembly, vertical direction subassembly include with a plurality of guide posts that the lower surface of location regulating plate links firmly pass a plurality of sliding sleeve that backup pad and link firmly with it, the sliding sleeve with guide post one-to-one and both sliding connection.
In some embodiments of the present invention, the probe cleaning mechanism further comprises a horizontal driving assembly for driving the positioning plate to move horizontally, the horizontal driving assembly comprises a second linear driver, and the second linear driver is disposed on the supporting plate and is fixedly connected to the positioning plate.
In some embodiments of the present invention, the first linear actuator is a vertical cylinder with an extension rod extending upward, and the extension rod of the vertical cylinder is fixedly connected to the positioning adjustment plate after passing through the support plate;
the second linear driver is a horizontal cylinder with an extension rod extending horizontally along the length direction of the positioning adjusting plate, and the extension rod of the horizontal cylinder is fixedly connected with the positioning plate.
The utility model discloses an in some embodiments, this probe clearance mechanism still includes horizontal direction subassembly, horizontal direction subassembly include two with the parallel guide rail of length direction of location regulating plate, be provided with on the bottom surface of locating plate with the recess that the guide rail matches, the guide rail sets up in the recess.
In some embodiments of the present invention, the probe cleaning mechanism further comprises an adjusting bolt, wherein a first connecting through hole is provided along the length of the adjusting bolt, an external thread is provided on the first connecting through hole, a second threaded through hole is provided on the support plate, a third threaded hole is provided on the support, the adjusting bolt is arranged below the support plate, the third threaded hole is provided with an adjustable length, the support plate is detachably connected with the support frame through the second threaded through hole, the first connecting through hole and the third threaded hole.
In some embodiments of the present invention, the probe cleaning mechanism further comprises a needle cleaning plate disposed on the positioning adjustment plate.
In some embodiments of the present invention, the support is disposed on the Z-axis moving mechanism and is driven to move up and down by the Z-axis moving mechanism.
The utility model also provides a probe platform, it includes above probe clearance mechanism.
Compared with the prior art, this probe clearance mechanism has following advantage:
the positioning block is arranged, so that the positioning adjusting plate can be stably and reliably supported, and the needle cleaning plate is arranged on the positioning needle cleaning plate, so that the positioning precision of the needle cleaning plate is improved, the needle cleaning effect is improved, the damage to the probe is effectively avoided, and the cost is reduced; still be provided with first, two locating surfaces on the location regulating plate, be provided with the locating piece on the locating plate to switch through the contact of locating piece and first, two locating surfaces and realize the setting of clear needle location and non-location, not only clear needle positioning accuracy is high, through reducing the second locating surface when not needing clear needle and making the location regulating plate withdraw from clear needle position with the locating piece contact, from not influencing other operations.
Drawings
Fig. 1 is one of schematic structural diagrams of a probe station provided with a probe cleaning mechanism according to the present invention;
fig. 2 is a second schematic structural diagram of a probe station provided with a probe cleaning mechanism according to the present invention;
fig. 3 is one of the schematic structural diagrams of a probe cleaning mechanism according to the present invention;
fig. 4 is a second schematic structural diagram of a probe cleaning mechanism according to the present invention;
fig. 5 is a rear view of a probe cleaning mechanism of the present invention;
fig. 6 is a cross-sectional view of a positioning block of a probe cleaning mechanism shown in the present invention contacting a first positioning surface;
fig. 7 is a cross-sectional view of a probe cleaning mechanism according to the present invention, with the positioning block separated from the first positioning surface;
fig. 8 is a cross-sectional view of a positioning block of a probe cleaning mechanism shown in the present invention contacting a second positioning surface;
fig. 9 is a cross-sectional view of the probe cleaning mechanism according to the present invention, showing the connection between the support and the supporting plate.
In the figure, 1, a support plate; 2. cleaning the needle plate; 3. positioning a plate; 4. a guide bar; 5. a sliding bearing; 6. a vertical cylinder; 7. a pressure lever; 8. positioning blocks; 9. a first positioning groove; 10. a second positioning groove; 11. a horizontal cylinder; 12. a horizontal guide rail; 13. a support; 14. a third threaded hole; 15. adjusting the bolt; 16. a screw; 17. a vertical guide rail; 18. a Z-axis drive member; 19. a Z-axis motion mechanism; 20. a wafer bearing table; 21. positioning an adjusting plate; 22. and a limiting block.
Detailed Description
The following are specific embodiments of the present invention and the accompanying drawings are used to further describe the technical solution of the present invention, but the present invention is not limited to these embodiments.
The upper end of the Z-axis movement mechanism 19 of the probe station shown in fig. 1 and 2 is provided with a stage 20, the stage 20 includes a chuck on which a wafer (not shown) is placed, and a probe card (not shown) is located above the stage 20. The Z-axis movement mechanism 19 comprises a Z-axis driving part 18, the wafer bearing platform 20 is arranged on the Z-axis driving part 18, and the Z-axis driving part 18 drives the wafer bearing platform 20 to lift up and down. During the test, Z axle driving piece 18 drive wafer bearing platform 20 including the chuck rises, has placed the wafer in the chuck, and the electrical properties of every chip of a plurality of chip test areas on the wafer on the chuck and a plurality of probe one-to-one contact test on the probe card, in long-time use, can bond the aluminium bits that have chip test area on the probe, need clear up the probe.
The probe cleaning mechanism is arranged on a Z-axis movement mechanism 19 shown in figures 1 and 2, and specifically, the probe cleaning mechanism is arranged on a Z-axis driving part 18, and the Z-axis driving part 18 drives the probe cleaning mechanism and the wafer bearing table 20 to move up and down together. Meanwhile, the Z-axis movement mechanism 19 is arranged on the XY movement platform, and when the probe needs to be cleaned, the probe cleaning mechanism is contacted with the probe above through the XY movement platform and the Z-axis movement mechanism 19 and is cleaned.
As shown in fig. 1 to 5, a probe cleaning mechanism mainly comprises a support 13, a support plate 1 fixedly connected with the support 13, a positioning adjusting plate 21 arranged above the support plate 1, and a positioning plate 3 arranged on the upper end surface of the support plate 1 and matched with the positioning adjusting plate 21 to support and position the same, wherein a needle cleaning plate 2 is arranged on the upper surface of the positioning adjusting plate 21, and needle cleaning paper is adhered to the needle cleaning plate 2. When cleaning the needle, the probe cleaning mechanism is moved through the XY motion platform and the Z-axis motion mechanism 19 to enable the needle cleaning paper to be over against the probe above, and after the needle cleaning position of the positioning adjusting plate 21 is well positioned, aluminum scraps on the probe are bonded through the needle cleaning paper.
The probe cleaning mechanism further comprises a vertical driving assembly which is arranged on the supporting plate 1 and drives the positioning adjusting plate 21 to ascend and descend vertically, and a horizontal driving assembly which is arranged on the supporting plate 1 and drives the positioning plate 3 to move horizontally.
Specifically, as shown in fig. 6 to 8, a first positioning groove 9 and a second positioning groove 10 are disposed on the lower surface of the positioning adjustment plate 21 along the length direction thereof, the bottom surfaces of the first positioning groove 9 and the second positioning groove 10 are a first positioning surface and a second positioning surface, respectively, and the height of the first positioning surface is lower than that of the second positioning surface. The upper end face of the positioning plate 3 is provided with a raised positioning block 8 (i.e. a positioning part), and the width of the positioning block 8 is matched with the widths of the first positioning groove 9 and the second positioning groove 10. When the positioning block 8 is positioned in the first positioning groove 9 and is contacted with the first positioning surface, the needle cleaning plate 2 is positioned at the needle cleaning position, and the upper surface of the needle cleaning plate 2 is higher than the wafer bearing table 20 by a certain distance, such as 2 mm; when the positioning block 8 is positioned in the second positioning groove 10 and contacts with the second positioning surface, the needle cleaning plate 2 is lowered to be in a non-needle cleaning position, and the upper surface of the needle cleaning plate 2 is lower than the upper surface of the wafer bearing platform 20. The first positioning groove 9 and the second positioning groove 10 are closer to each other, so that the movement distance of the positioning plate 3 can be reduced.
Of course, in this embodiment, the first positioning groove 9 and the second positioning groove 10 are not limited to be disposed along the length direction of the positioning adjustment plate 21, and may be disposed along the width direction.
In order to realize the needle-cleaning positioning and the non-needle-cleaning positioning by contacting the positioning block 8 with the positioning adjusting plate 21, the two positioning grooves 9 and 10 need to be horizontally pushed and pulled, the positioning block 8 is switched between the first positioning groove 9 and the second positioning groove 10, a horizontal driving assembly is arranged on the supporting plate 1, and meanwhile, the positioning adjusting plate 21 needs to be moved up and down due to the difference of the height of the first positioning surface and the second positioning surface, so that a vertical driving assembly needs to be arranged.
A horizontal driving component for driving the positioning plate 3 to move horizontally is arranged on the supporting plate 1. As shown in fig. 4-6, the horizontal driving assembly includes a horizontal cylinder 11 fixed on the supporting plate 1, and an extension rod of the horizontal cylinder 11 extends along the length direction of the positioning adjusting plate 21, and is fixedly connected with the positioning plate 3. When the extension rod of the horizontal cylinder 11 extends to the limited position, the positioning block 8 is positioned right below the second positioning slot 10, as shown in fig. 8, when the piston of the horizontal cylinder 11 retracts to the limit, the positioning block 8 is positioned right below the first positioning slot 9.
In order to set the limit position, a limit block 22 is arranged on the support plate 1 in front of the extension rod of the horizontal cylinder 11, as shown in fig. 8, when the extension rod of the horizontal cylinder 11 with the positioning plate 3 extends horizontally, the positioning plate 3 is blocked by the limit block 22, and the positioning block 8 is located right below the second positioning slot 10.
As shown in fig. 6, the vertical driving assembly includes a vertical cylinder 6 disposed on the supporting plate 1 and having an extension rod extending upward, the extension rod of the jacking cylinder extends upward through the supporting plate 1, and the extension rod extends or retracts to drive the positioning adjusting plate 21 to move up and down, so as to cooperate with the horizontal cylinder 11 to switch the positioning block 8 between the first positioning slot 9 and the second positioning slot 10.
When the extension rod of the vertical cylinder 6 is shorter, a compression bar 7 is fixedly connected with the end part of the extension rod along the length direction of the extension rod, and the upper end of the compression bar 7 is fixedly connected with an adjusting positioning plate 21. When the vertical cylinder 6 works, the pressure rod 7 stretches up and down, so that the positioning adjusting plate 21 is driven to lift up and down, and the needle cleaning plate 2 is finally driven to lift up and down.
The following describes the positioning switching process of the positioning block 8 between the first positioning slot 9 and the second positioning slot 10: as shown in fig. 8, when the extension rod of the horizontal cylinder 11 horizontally extends to the limited position, the positioning plate 3 abuts against the limiting block 22, the positioning block 8 is located right below the second positioning slot 10, the extension rod of the vertical cylinder 6 retracts to drive the positioning adjusting plate 21 to move downwards, so that the second positioning slot 10 abuts against the positioning block 8 downwards, and at this time, the needle cleaning plate 2 is at the lowest position and is in a non-needle cleaning state. When the needle needs to be cleaned, as shown in fig. 6 and 7, the extension rod of the vertical cylinder 6 extends out, the positioning adjusting plate 21 is pushed upwards to the highest position, then the extension rod of the horizontal cylinder 11 retracts to drive the positioning plate 3 to move horizontally, so that the positioning block 8 is arranged right below the first positioning groove 9, the extension rod of the vertical cylinder 6 retracts to drive the positioning adjusting plate 21 to descend, the positioning block 8 is positioned in the first positioning groove 9 and abuts against the first positioning surface, and the position of the positioning adjusting plate 21 is the needle cleaning position at the moment.
During needle cleaning, as shown in fig. 6 and 7, the needle cleaning paper is attached to the needle cleaning plate 2, the extension rod of the vertical cylinder 6 retracts to drive the positioning adjusting plate 21 to descend, so that the positioning block 8 is positioned in the first positioning groove 9 and abuts against the bottom surface of the first positioning groove 9, at the moment, the upper surface of the needle cleaning plate 2 is higher than the wafer bearing table 20 by 2mm, the probe card is kept still, the whole Z-axis driving piece 18 moves up and down back and forth, the whole probe cleaning mechanism is driven to move up and down, and therefore the needle cleaning paper can be bound to the probes on the probe card back and forth, and sticky objects on the probes are removed.
When the probe is not required to be cleaned, the positioning plate 3 is separated from the support of the positioning adjusting plate 21 (the positioning plate 3 can move to the side of the positioning adjusting plate 21), and the probe cleaning plate 2 can be far away from the probe cleaning position, so that the probe card is prevented from being influenced by the probe measurement of a wafer.
In some embodiments, the needle cleaning plate 2 is not provided, and the needle cleaning paper can be directly adhered to the upper surface of the positioning adjusting plate.
In some embodiments, the positioning adjustment plate 21 is vertically moved by a first linear actuator such as an electric push rod, a hydraulic rod, and a linear motor.
In some embodiments, a second linear actuator such as an electric push rod, a hydraulic rod, a linear motor and the like is used for realizing the horizontal movement of the positioning plate 3.
As shown in fig. 5, in order to increase the stability of the positioning adjustment plate 21 when moving up and down by the vertical cylinder 6, a guide assembly is provided between the positioning adjustment plate 21 and the support plate 1. The guide assembly comprises 4 guide rods 4 fixed on the lower surface of the positioning adjusting plate 21 and 4 sliding bearings 5 penetrating through the support plate 1 and arranged on the support plate, the sliding bearings 5 are arranged in one-to-one correspondence with the guide rods 4, and each guide rod 4 is sleeved in the sliding bearing 5 correspondingly arranged with the guide rod for sliding fit. When the positioning adjusting plate 21 is driven by the vertical cylinder 6 to lift up and down, the guide rod 4 is driven to move up and down in the sliding bearing 5, and the stability of the up-and-down movement of the positioning adjusting plate 21 is improved. Because the guide rod 4 and the needle cleaning plate 2 synchronously move downwards, the extension rod of the vertical cylinder 6 can be retracted when the needle cleaning is not needed, so that the height of the positioning adjusting plate 21 is reduced, and the height of the whole probe cleaning mechanism is effectively reduced.
In some embodiments, the number of the sliding bearings 5 and the guide rods 4 can be 2, 3 or more.
In some embodiments, the sliding bearing 5 is replaced by a sliding sleeve which passes through the attachment hole of the support plate and is in interference fit therewith, and the guide rod 4 passes through the sliding sleeve and is slidably attached thereto.
When switching the cooperation of locating plate 3 with first constant head tank 9 and second constant head tank 10, in order to increase the stationarity of push-and-pull locating plate 3 motion, as shown in fig. 3 and 4, be equipped with two horizontal guide rail 12 that are parallel to each other on backup pad 1, be provided with the spout that matches with horizontal guide rail 12 on the bottom surface of locating plate 3, horizontal guide rail 12 sets up in the spout, when horizontal cylinder 11 drive locating plate 3 along the length direction horizontal migration of location regulating plate 21, horizontal guide rail 12 has increased the motion stability of locating plate 3 with the sliding fit of spout.
When the height of the horizontal guide rail 12 is insufficient, heightening blocks may be provided below the horizontal guide rail.
In some embodiments, the supporting plate 1 may not be provided, and the positioning plate 3, the vertical driving assembly, the horizontal driving assembly, the vertical guiding assembly, the horizontal guiding assembly and the limiting block 22 are all disposed on the bracket 13.
As shown in fig. 9, generally, the upper surface of the support plate 1 fixedly connected to the bracket 13 needs to be kept horizontal, but sometimes the upper surface of the support plate 1 may be inclined due to machining errors and errors, and at this time, in order to adjust the levelness of the support plate 1, three adjusting bolts 15 are provided, in which a first connecting through hole is provided along the length thereof and an external thread is provided thereon. Be provided with three second screw through-hole on the backup pad 1, be provided with three third screw hole 14 on the support 13, first connect the through-hole, second screw through-hole and the 14 one-to-one of third screw hole, adjusting bolt 15 in the below setting of backup pad 1 is in the third screw hole to accessible rotation adjusting bolt 15 is adjusted and is set up length in the third screw hole, the screw pass second screw through-hole first connect the through-hole with the third screw hole will backup pad 1 with support 13 detachability is connected. When the levelness of the support plate 1 needs to be adjusted, the screw 16 is firstly screwed to be withdrawn from the second threaded through hole and the third threaded hole, then the adjusting bolts 15 are rotated, and the height of each adjusting bolt 15 is adjusted until the levelness of the upper surface of the support frame 1 reaches the requirement.
The bracket 13 is arranged on a Z-axis movement mechanism, the Z-axis movement mechanism comprises a Z-axis driving component, and the bracket 13 is driven by the Z-axis driving component to move up and down; meanwhile, a wafer bearing table mounting seat is also arranged on the Z-axis driving assembly, and a wafer bearing table is arranged on the wafer bearing table mounting seat, so that the Z-axis driving assembly simultaneously drives the wafer bearing table and the probe cleaning mechanism to move up and down, namely the wafer bearing table and the probe cleaning mechanism share one driving assembly.
In order to increase the stability of the probe cleaning mechanism during up-and-down movement, 4 vertical sliding rails are further arranged on the Z-axis movement mechanism, a sliding groove is formed in the bottom surface, facing the sliding rails, of the support 13, and the probe cleaning mechanism moves more stably when the Z-axis driving assembly drives the probe cleaning mechanism to move up and down through the sliding rails and the sliding groove.
The utility model also provides a probe platform, it includes above probe clearance mechanism.
The specific embodiments described herein are merely illustrative of the spirit of the invention. Various modifications, additions and substitutions for the specific embodiments described herein may be made by those skilled in the art without departing from the spirit of the invention or exceeding the scope of the invention as defined in the accompanying claims.
Claims (11)
1. A probe cleaning mechanism, comprising:
a support;
the positioning adjusting plate is arranged above the support, a first positioning surface and a second positioning surface are arranged on the lower end surface of the positioning adjusting plate along the length direction or the width direction, and the first positioning surface is lower than the second positioning surface;
the locating plate sets up on the support, be provided with location portion on its upper surface, the locating plate is driven along length or width direction horizontal migration makes location portion with first locating surface or the second locating surface is just right, the location regulating plate is driven to reciprocate and makes location portion with first locating surface conflicts in order to confirm the clear needle position of location regulating plate, or with the conflict of second locating surface is in order to confirm the clear needle position of non-of location regulating plate.
2. The probe cleaning mechanism according to claim 1, wherein a first positioning groove and a second positioning groove are provided on a lower surface of the positioning adjustment plate, the first positioning surface is a bottom surface of the first positioning groove, the second positioning surface is a bottom surface of the second positioning groove, the positioning portion is a raised positioning block, and the positioning block is disposed in the first positioning groove or the second positioning groove.
3. The probe cleaning mechanism of claim 1 or 2, further comprising:
the supporting plate is arranged between the bracket and the positioning adjusting plate and is fixedly connected with the bracket;
the vertical driving assembly is used for driving the positioning adjusting plate to move up and down, and comprises a first linear driver, wherein the first linear driver is fixedly connected with the positioning adjusting plate and arranged on the supporting plate.
4. The probe cleaning mechanism according to claim 3, further comprising a vertical guiding assembly, wherein the vertical guiding assembly comprises a plurality of guiding columns fixedly connected with the lower surface of the positioning adjusting plate, and a plurality of sliding sleeves penetrating through the supporting plate and fixedly connected with the supporting plate, and the sliding sleeves correspond to the guiding columns one by one and are connected with the guiding columns in a sliding manner.
5. The probe cleaning mechanism according to claim 3, further comprising a horizontal driving assembly for driving the positioning plate to move horizontally, wherein the horizontal driving assembly comprises a second linear driver, and the second linear driver is disposed on the supporting plate and is fixedly connected with the positioning plate.
6. The probe cleaning mechanism of claim 5,
the first linear driver is a vertical cylinder with an extension rod extending upwards, and the extension rod of the vertical cylinder penetrates through the support plate and then is fixedly connected with the positioning adjusting plate;
the second linear driver is a horizontal cylinder with an extension rod extending horizontally along the length direction of the positioning adjusting plate, and the extension rod of the horizontal cylinder is fixedly connected with the positioning plate.
7. The probe cleaning mechanism according to claim 6, further comprising a horizontal guide assembly, wherein the horizontal guide assembly comprises two guide rails parallel to the length direction of the positioning adjustment plate, a groove matched with the guide rails is arranged on the bottom surface of the positioning plate, and the guide rails are arranged in the groove.
8. The probe cleaning mechanism according to claim 3, further comprising an adjusting bolt having a first connecting through hole formed therein along a length thereof and having an external thread formed thereon, wherein the support plate has a second threaded through hole formed therein, wherein the support frame has a third threaded hole formed therein, wherein the adjusting bolt is disposed in the third threaded hole below the support plate and is adjustable in length thereof, and wherein the support plate and the support frame are detachably connected through the second threaded through hole, the first connecting through hole and the third threaded hole.
9. The probe cleaning mechanism of claim 1, further comprising a cleaning plate disposed on the positioning adjustment plate.
10. The probe cleaning mechanism according to claim 1, wherein the carriage is disposed on the Z-axis motion mechanism and driven by the Z-axis motion mechanism to move up and down.
11. A probe station characterized in that it comprises a probe cleaning mechanism according to any one of claims 1 to 10.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121523433.7U CN215031406U (en) | 2021-07-06 | 2021-07-06 | Probe cleaning mechanism and probe station comprising same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121523433.7U CN215031406U (en) | 2021-07-06 | 2021-07-06 | Probe cleaning mechanism and probe station comprising same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215031406U true CN215031406U (en) | 2021-12-07 |
Family
ID=79226475
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121523433.7U Active CN215031406U (en) | 2021-07-06 | 2021-07-06 | Probe cleaning mechanism and probe station comprising same |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215031406U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118218288A (en) * | 2024-05-22 | 2024-06-21 | 山东省地震工程研究院 | Self-adaptive cleaning mechanism for seismic exploration node equipment |
-
2021
- 2021-07-06 CN CN202121523433.7U patent/CN215031406U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118218288A (en) * | 2024-05-22 | 2024-06-21 | 山东省地震工程研究院 | Self-adaptive cleaning mechanism for seismic exploration node equipment |
| CN118218288B (en) * | 2024-05-22 | 2024-07-19 | 山东省地震工程研究院 | Self-adaptive cleaning mechanism for seismic exploration node equipment |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105082117A (en) | Gantry type double-arm truss robot and machining method for arc-shaped plate | |
| CN105108200A (en) | Truss type intelligent drilling device and arc plate drilling method | |
| CN215031406U (en) | Probe cleaning mechanism and probe station comprising same | |
| CN211764115U (en) | PCB on-line printing machine | |
| CN104626283A (en) | High-precision automatic drilling device | |
| CN217194077U (en) | Hoisting type drilling and milling device for processing door and window profiles | |
| CN110732467A (en) | glass centering intelligent identification and clamping device with servo control | |
| CN105798351A (en) | Improved four-head drilling machine | |
| CN102661700B (en) | Detection apparatus of long stroke leading screw installation precision and application method thereof | |
| CN212286284U (en) | Focus-adjustable optical fiber laser welding head | |
| CN114473506B (en) | Drilling chamfering machine | |
| CN114734273B (en) | High-precision numerical control cutting equipment based on sensor | |
| CN109399901A (en) | A kind of split type push and block device | |
| CN212793103U (en) | Multi-drill-bit gantry drilling machine | |
| CN115201523A (en) | Test tool assembly for electronic element | |
| CN213541739U (en) | Lifting driving guide mechanism of detection equipment | |
| CN215431670U (en) | High-precision plate machining machine tool | |
| CN216912815U (en) | Fine-adjustable stain-removing pen press-mounting machine | |
| CN219484867U (en) | Movable bed with cross beam | |
| CN216082512U (en) | Visual detection device | |
| CN221789885U (en) | PCB board point working table for glue | |
| CN219113409U (en) | Column module of machine tool | |
| CN219811011U (en) | Double-stroke chip testing device | |
| CN109605023B (en) | Front end sub-packaging table | |
| CN221495031U (en) | Beam positioning assembly of vertical lathe |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |