CN215011234U - Quick heat abstractor is used to electronic structure part - Google Patents
Quick heat abstractor is used to electronic structure part Download PDFInfo
- Publication number
- CN215011234U CN215011234U CN202120591393.3U CN202120591393U CN215011234U CN 215011234 U CN215011234 U CN 215011234U CN 202120591393 U CN202120591393 U CN 202120591393U CN 215011234 U CN215011234 U CN 215011234U
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- Prior art keywords
- heat dissipation
- electronic
- circuit board
- electronic component
- plate
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- 230000017525 heat dissipation Effects 0.000 claims abstract description 74
- 230000007246 mechanism Effects 0.000 claims abstract description 12
- 238000010438 heat treatment Methods 0.000 claims description 9
- 230000003139 buffering effect Effects 0.000 abstract description 2
- 238000013016 damping Methods 0.000 abstract description 2
- 230000008859 change Effects 0.000 description 4
- 238000009434 installation Methods 0.000 description 3
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000035939 shock Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
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Abstract
The utility model discloses a rapid heat dissipation device for electronic structural components, which comprises a shell, a circuit board is arranged at the inner side of the shell, an electronic component is fixedly inserted near the left end of the upper surface of the circuit board, a heat dissipation mechanism is arranged at the upper end of the electronic component, the heat dissipation mechanism comprises a heat dissipation plate for compressing and fixing the electronic component, the upper surface of the heat dissipation plate is provided with evenly arranged heat dissipation fins, a heat dissipation fan is fixedly arranged at the upper end of the heat dissipation plate, the edge of the heat dissipation fan is provided with a mounting plate, the mounting plate is fixedly connected with the heat dissipation plate through a mounting screw, a spring is sleeved at the lower side part of the mounting plate through the mounting screw, the electronic component is inserted on the circuit board and is compressed and fixed through the heat dissipation plate, the later-stage electronic component is more convenient to replace, and the spring is used for buffering and damping the vibration generated by the heat dissipation fan when the heat dissipation fan works, the electronic component can be better protected.
Description
Technical Field
The utility model relates to an electronic components heat dissipation technical field specifically is an electron structural component uses quick heat abstractor.
Background
The electronic components are components of electronic elements and small machines and instruments, are usually composed of a plurality of parts and can be commonly used in similar products; some parts of industries such as electric appliances, radios, instruments and the like are general names of electronic devices such as capacitors, transistors, hairsprings, spiral springs and the like, and a large amount of heat generated by some electronic devices during working needs to be radiated to avoid influencing the service lives of the electronic devices.
The utility model discloses an applicant discovers that current heat dissipation mechanism for electronic components shakes great at the radiating work time, and the change when electrical components damages is inconvenient simultaneously.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide an electronic structure part is with quick heat abstractor aims at improving current electronic components and uses heat dissipation mechanism vibrations great at the heat dissipation during operation, the inconvenient problem of change when electrical components damages simultaneously.
The utility model discloses a realize like this:
a quick heat dissipation device for electronic structural components comprises a shell, a circuit board is arranged on the inner side of the shell, electronic components are fixedly inserted on the upper surface of the circuit board close to the left end, a heat dissipation mechanism is arranged at the upper end of the electronic components and comprises a heat dissipation plate for compressing and fixing the electronic components, uniformly arranged heat dissipation fins are arranged on the upper surface of the heat dissipation plate, a heat dissipation fan is fixedly arranged at the upper end of the heat dissipation plate, a mounting plate is arranged at the edge of the heat dissipation fan and fixedly connected with the heat dissipation plate through mounting screws, springs are sleeved at the lower side parts of the mounting plates on the mounting screws, the electronic components are inserted on the circuit board and are compressed and fixed through the heat dissipation plate, the electronic components at the later stage are convenient to replace, and meanwhile, the springs are used for buffering and damping vibration generated by the heat dissipation fan when the heat dissipation fan works, the electronic component can be better protected.
Further, the front side and the rear side of the shell are provided with air outlets, the upper port of the shell is provided with a cover plate, an air inlet is formed in the position, corresponding to the heat dissipation fan, of the upper surface of the cover plate, cold air can enter the cover plate through the arranged air inlet, and hot air can be discharged through the arranged air outlets.
Further, the lower extreme of heating panel is provided with the recess with electronic parts complex, and the upper surface of heating panel is close to four border positions and all fixes the fixed column that is provided with installation screw fixed connection, and the heating panel realizes spacing fixed to the electronic parts upper end through the recess that sets up to through the fixed column and installation screw fixed connection realize with the fixed connection of heat dissipation fan.
Furthermore, fixed support legs are arranged on the edges of the front side and the rear side of the heat dissipation plate and fixedly connected with the circuit board through screws, and the heat dissipation plate is fixedly installed through the fixed connection of the fixed support legs and the circuit board.
Furthermore, the surface of the circuit board is provided with a conductive sleeve, the lower end of the electronic component is provided with a conductive insertion column matched with the conductive sleeve, and the electronic component is inserted on the conductive sleeve through the conductive insertion column to realize the installation of the electronic component.
Compared with the prior art, the beneficial effects of the utility model are that:
the utility model discloses well electronic part assigns on the circuit board to compress tightly fixedly electronic part through the heating panel, make the change of the electronic part in later stage more convenient, the spring through setting up cushions the shock attenuation at the vibrations that the heat dissipation fan during operation produced through the heat dissipation fan simultaneously, can be better protect electronic part.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention, and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
Fig. 1 is a perspective view of a rapid heat dissipation device for electronic structural components according to the present invention;
fig. 2 is a schematic view of a heat dissipation mechanism of the rapid heat dissipation device for electronic structural components according to the present invention;
fig. 3 is an electronic component diagram of a rapid heat dissipation device for electronic structural components according to the present invention.
In the figure: 1. a cover plate; 11. an air inlet; 2. a heat dissipation mechanism; 21. a heat dissipation plate; 22. a heat sink; 23. mounting a plate; 24. a heat dissipation fan; 25. mounting screws; 26. a spring; 27. fixing the supporting legs; 28. fixing a column; 3. an electronic component; 31. a conductive post; 4. a housing; 41. an air outlet; 5. a circuit board; 51. and a conductive sleeve.
Detailed Description
To make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the drawings of the embodiments of the present invention are combined to clearly and completely describe the technical solutions of the embodiments of the present invention, and obviously, the described embodiments are some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention. Thus, the following detailed description of the embodiments of the present invention, presented in the accompanying drawings, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention.
Embodiment 1, referring to fig. 1, fig. 2 and fig. 3 in particular, a fast heat dissipation device for electronic structural components includes a housing 4, a circuit board 5 is disposed inside the housing 4, an electronic component 3 is fixedly inserted into an upper surface of the circuit board 5 near a left end, a conductive sleeve 51 is disposed on a surface of the circuit board 5, a conductive post 31 is disposed at a lower end of the electronic component 3 and is matched with the conductive sleeve 51, the electronic component 3 is mounted on the conductive sleeve 51 by inserting the conductive post 31, a heat dissipation mechanism 2 is disposed at an upper end of the electronic component 3, the heat dissipation mechanism 2 includes a heat dissipation plate 21 for compressing and fixing the electronic component 3, heat dissipation fins 22 are uniformly arranged on an upper surface of the heat dissipation plate 21, a heat dissipation fan 24 is fixedly disposed at an upper end of the heat dissipation plate 21, a mounting plate 23 is disposed at an edge of the heat dissipation fan 24, and the mounting plate 23 is fixedly connected to the heat dissipation plate 21 by a mounting screw 25, the downside position cover that mounting screw 25 is located mounting panel 23 is equipped with spring 26, and electronic parts 3 assigns on circuit board 5 to compress tightly fixedly electronic parts 3 through heating panel 21, make the change of the electronic parts 3 in later stage more convenient, the shock attenuation is cushioned to the vibrations that 24 productions were fanned in the heat dissipation through the spring 26 that sets up at 24 during operation of heat dissipation fan simultaneously, can be better protect electronic parts 3.
Referring to fig. 1, air outlets 41 are disposed on the front and rear sides of the housing 4, a cover plate 1 is disposed at an upper port of the housing 4, an air inlet 11 is disposed at a position on the upper surface of the cover plate 1 corresponding to the heat dissipation fan 24, cold air is introduced through the air inlet 11, and hot air is discharged through the air outlet 41.
Referring to fig. 2, a groove matched with the electronic component 3 is formed in the lower end of the heat dissipation plate 21, fixing posts 28 fixedly connected with mounting screws 25 are fixedly arranged on the upper surface of the heat dissipation plate 21 near four edge positions, the heat dissipation plate 21 realizes limiting and fixing of the upper end of the electronic component 3 through the groove, and realizes fixed connection with the heat dissipation fan 24 through the fixing posts 28 and the mounting screws 25, fixing legs 27 are arranged on edges of the front side and the rear side of the heat dissipation plate 21, the fixing legs 27 are fixedly connected with the circuit board 5 through screws, and the fixing of the heat dissipation plate 21 is realized through the fixing legs 27 and the fixed connection of the circuit board 5.
The working principle is that when the electronic component 3 is radiated, the external cold air is continuously blown to the radiating fins 22 by the radiating fan 24 to blow the heat generated by the electronic component 3 to the periphery and the hot air is discharged through the air outlet 41, and when the electronic component 3 is replaced, the electronic component 3 can be detached and replaced by detaching the radiating plate 21.
The device obtained by the design can basically meet the requirements of the existing heat dissipation mechanism for the electronic components that the vibration is small during the heat dissipation work and the replacement is convenient when the electric elements are damaged, but the designer further improves the device according to the aim of further improving the functions.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (5)
1. A quick heat dissipation device for electronic structural components, comprising a housing (4), characterized in that: the inboard of shell (4) is provided with circuit board (5), and the upper surface of circuit board (5) is close to the left end and inserts and be fixed with electronic parts (3), the upper end of electronic parts (3) is provided with heat dissipation mechanism (2), heat dissipation mechanism (2) are including compressing tightly fixed heating panel (21) to electronic parts (3), the upper surface of heating panel (21) is provided with align to grid's fin (22), and the upper end of heating panel (21) is fixed and is provided with heat dissipation fan (24), the edge of heat dissipation fan (24) is provided with mounting panel (23), and mounting panel (23) through mounting screw (25) and heating panel (21) fixed connection, the downside position cover that mounting screw (25) are located mounting panel (23) is equipped with spring (26).
2. The quick heat dissipation device for electronic structural components according to claim 1, wherein the front and rear sides of the housing (4) are provided with air outlets (41), the upper port of the housing (4) is provided with a cover plate (1), and an air inlet (11) is provided at a position on the upper surface of the cover plate (1) corresponding to the heat dissipation fan (24).
3. The rapid heat dissipation device for electronic structural components as claimed in claim 1, wherein the lower end of the heat dissipation plate (21) is provided with a groove for engaging with the electronic component (3), and the upper surface of the heat dissipation plate (21) is fixedly provided with fixing posts (28) fixedly connected with the mounting screws (25) near four edge positions.
4. The quick heat sink for electronic structural components according to claim 3, wherein the heat sink (21) has fixing legs (27) at both front and rear edges, and the fixing legs (27) are fixedly connected to the circuit board (5) by screws.
5. The rapid heat dissipation device for electronic structural components according to claim 4, wherein the surface of the circuit board (5) is provided with a conductive sleeve (51), and the lower end of the electronic component (3) is provided with a conductive plug (31) which is matched with the conductive sleeve (51).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120591393.3U CN215011234U (en) | 2021-03-23 | 2021-03-23 | Quick heat abstractor is used to electronic structure part |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120591393.3U CN215011234U (en) | 2021-03-23 | 2021-03-23 | Quick heat abstractor is used to electronic structure part |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215011234U true CN215011234U (en) | 2021-12-03 |
Family
ID=79162080
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120591393.3U Expired - Fee Related CN215011234U (en) | 2021-03-23 | 2021-03-23 | Quick heat abstractor is used to electronic structure part |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215011234U (en) |
-
2021
- 2021-03-23 CN CN202120591393.3U patent/CN215011234U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20211203 |