CN215008158U

CN215008158U - High-speed four-head die bonder for semiconductor

Info

Publication number: CN215008158U
Application number: CN202121243924.6U
Authority: CN
Inventors: 杨军
Original assignee: Shenzhen Shuge Technology Co ltd
Current assignee: Shenzhen Shuge Technology Co ltd
Priority date: 2021-06-04
Filing date: 2021-06-04
Publication date: 2021-12-03
Anticipated expiration: 2031-06-04

Abstract

The utility model discloses a solid brilliant device of high-speed four-head of semiconductor, comprising a base plate, be provided with the frame on the bottom plate, the installing port has been seted up on the frame, and the installing port runs through completely, the inside fixedly connected with motor of installing port, the output fixedly connected with threaded rod of motor, the outside cover of threaded rod is equipped with the thread bush, and the thread bush rotates on the threaded rod to be connected, the spout has been seted up to the bottom of installing port, the inside of spout is provided with electric putter, and electric putter slides in the inside of spout. The utility model discloses in, through mutually supporting of motor, threaded rod, the thread bush that sets up, the motor drives the threaded rod and rotates, can drive the thread bush when the threaded rod pivoted and remove, adjusts certain position, compares and has improved the precision when utilizing electric putter to remove in the past, reduces and deviates in the solid brilliant appearance of semiconductor to improve the effect of using.

Description

High-speed four-head die bonder for semiconductor

Technical Field

The utility model relates to a gu brilliant technical field especially relates to a solid brilliant device of high-speed four-head of semiconductor.

Background

In the packaging process of semiconductor devices, die bonding is an extremely important link. The process of die bonding is as follows: firstly, the glue is dispensed

The mechanism (also called glue dispensing module) dispenses glue on the die bonding station of the substrate, and then the die bonding swing arm of the die bonding mechanism takes the semiconductor chip out of the wafer and transfers the semiconductor chip to the die bonding station with dispensed glue. Under the condition of the same die bonding yield (quality), the die bonding efficiency of the die bonding machine is an important index for evaluating the performance of the die bonding machine;

the high-speed four-head die bonder for the semiconductor is complex in the die bonder process of the existing semiconductor, low in efficiency, low in precision in the position adjusting process, and prone to causing deviation, so that the die bonder effect of the semiconductor is poor, defective products are caused, a fixed structure is generally absent when the die bonder for the semiconductor is performed, the semiconductor is extremely unsatisfactory in die bonder, the working efficiency is seriously influenced, the requirement in the existing use cannot be met, and the high-speed four-head die bonder for the semiconductor is provided for solving the problem.

SUMMERY OF THE UTILITY MODEL

The utility model aims at solving the defects existing in the prior art and providing a high-speed four-head die bonder for semiconductors.

In order to achieve the above purpose, the utility model adopts the following technical scheme: a high-speed four-head die bonder for semiconductors comprises a bottom plate, wherein a frame is arranged on the bottom plate, a mounting opening is formed in the frame and completely penetrates through the mounting opening, a motor is fixedly connected to the inside of the mounting opening, a threaded rod is fixedly connected to the output end of the motor, a threaded sleeve is sleeved on the outer portion of the threaded rod and rotatably connected to the threaded rod, a sliding groove is formed in the bottom of the mounting opening, an electric push rod is arranged inside the sliding groove and slides inside the sliding groove, the top of the electric push rod is fixedly connected to the bottom of the threaded sleeve, a glue dispensing rod is fixedly connected to the driving end of the electric push rod, a processing groove is formed in the bottom plate, a plurality of springs are arranged on two sides of the inside of the processing groove, a connecting block is fixedly connected to one end of each spring, and a bayonet is arranged on the connecting block, the inside symmetry of processing groove is provided with and drives actuating cylinder, the drive end fixedly connected with cardboard that drives actuating cylinder.

Furthermore, a controller is arranged on the outer surface of one side of the frame and electrically connected with the motor through a lead.

Furthermore, the top of the threaded sleeve is provided with a sliding block, and the sliding block slides on the inner top wall of the mounting hole.

Furthermore, a bearing is arranged inside the mounting opening, and one end of the threaded rod is rotatably connected inside the bearing.

Furthermore, the bottom symmetry of bottom plate is provided with the base, and the base is processed for the rubber material and forms.

Furthermore, be provided with the suction box on the surface of one side of frame, the inside of frame is provided with a plurality of dust absorption pipes, and is a plurality of the dust absorption pipe communicates each other with the suction box, and is a plurality of be provided with the suction pump on the surface of dust absorption pipe, it is a plurality of one side of dust absorption pipe all is provided with the suction head.

Further, the inner side wall of the frame is provided with a lighting device.

The utility model has the advantages that:

the utility model discloses when using, through mutually supporting of the motor, threaded rod, the thread bush that set up, the motor drives the threaded rod and rotates, can drive the thread bush when the threaded rod pivoted and remove, adjusts certain position, compares and has improved the precision when utilizing electric putter to remove in the past, reduces and the solid brilliant deviation appears in the semiconductor to improve the effect of using.

Through spring, connecting block, bayonet socket that set up, drive the cooperation of actuating cylinder, cardboard and use, but the centre gripping is fixed when carrying out the solid brilliant to the semiconductor, prevents to add the deviation that appears man-hour, leads to the solid brilliant in-process of semiconductor to produce the wastrel, and then has improved the efficiency of work, has certain practicality.

Drawings

Fig. 1 is a schematic view of the internal structure of a high-speed four-head die bonder for semiconductors according to the present invention;

FIG. 2 is a front view of a high-speed four-head die bonder for semiconductor devices according to the present invention;

fig. 3 is a top view of the semiconductor high-speed four-head die bonder according to the present invention;

fig. 4 is an enlarged view of a in fig. 1 according to the present invention.

Illustration of the drawings:

1. a base; 2. a base plate; 3. a lighting device; 4. a controller; 5. a chute; 6. a motor; 7. a frame; 8. a threaded rod; 9. an installation port; 10. a slider; 11. a threaded sleeve; 12. a spring; 13. a bayonet; 14. a driving cylinder; 15. processing a tank; 16. connecting blocks; 17. a suction head; 18. an electric push rod; 19. dispensing a glue rod; 20. a dust collection box; 21. a suction pump; 22. a dust collection pipe; 23. clamping a plate; 24. and a bearing.

Detailed Description

Fig. 1 to 4 show that, a high-speed four-head die bonder for semiconductor comprises a bottom plate 2, a frame 7 is arranged on the bottom plate 2, a mounting opening 9 is arranged on the frame 7, the mounting opening 9 completely penetrates through the frame, a motor 6 is fixedly connected inside the mounting opening 9, a threaded rod 8 is fixedly connected to an output end of the motor 6, a threaded sleeve 11 is sleeved outside the threaded rod 8, the threaded sleeve 11 is rotatably connected to the threaded rod 8, a chute 5 is arranged at the bottom of the mounting opening 9, an electric push rod 18 is arranged inside the chute 5, the electric push rod 18 slides inside the chute 5, the top of the electric push rod 18 is fixedly connected to the bottom of the threaded sleeve 11, a glue applying rod 19 is fixedly connected to a driving end of the electric push rod 18, a processing groove 15 is arranged on the bottom plate 2, a plurality of springs 12 are arranged on two sides inside the processing groove 15, and a connecting block 16 is fixedly connected to one end of each spring 12, the connecting block 16 is provided with a bayonet 13, the processing groove 15 is internally and symmetrically provided with a driving air cylinder 14, and a driving end of the driving air cylinder 14 is fixedly connected with a clamping plate 23.

When using, utilize controller 4 to control, place the inside at processing groove 15 with the mounting panel, it is fixed to utilize bayonet 13 on spring 12 and the connecting block 16 to carry out the joint, place semiconductor device on the mounting panel once more, utilize and drive actuating cylinder 14 promotion cardboard 23 and carry out fixed position, open motor 6, motor 6 drives threaded rod 8 and rotates, threaded rod 8 can drive thread bush 11 when rotating and carry out the shift position, start electric putter 18 and drive down, can carry out solid brilliant processing to the semiconductor through some gluey pole 19 and handle, the effect is better, certain practicality has.

In a further scheme, the controller 4 is arranged on the outer surface of one side of the frame 7, and the controller 4 is electrically connected with the motor 6 through a lead, so that the control can be facilitated, and certain safety is improved.

In the further scheme, the top of thread bush 11 is provided with slider 10, and slider 10 slides on the interior roof of installing port 9, can be convenient for slide, can improve stability when gliding, and difficult emergence is slided.

In the further scheme, the inside of installing port 9 is provided with bearing 24, and the one end of threaded rod 8 is connected at the internal rotation of bearing 24, and the threaded rod 8 of being convenient for rotates, reduces certain friction effect to improve the life-span of using.

In the further scheme, the base 1 is symmetrically arranged at the bottom of the bottom plate 2, and the base 1 is made of rubber materials, so that the supporting effect can be achieved, and the stability of the device can be improved when the device is used.

In a further scheme, a dust suction box 20 is arranged on the outer surface of one side of the frame 7, a plurality of dust suction pipes 22 are arranged inside the frame 7, the dust suction pipes 22 are communicated with the dust suction box 20, a suction pump 21 is arranged on the outer surface of the dust suction pipes 22, a suction head 17 is arranged on one side of each dust suction pipe 22, dust can be conveniently adsorbed during processing, dust falling during processing is reduced, the crystal solidification effect of a semiconductor is improved, and the practicability is high.

In a further scheme, the lighting device 3 is arranged on the inner side wall of the frame 7, so that the use can be performed in a dark environment, and the use range is improved.

The above description is only for the preferred embodiment of the present invention, and is not intended to limit the present invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included within the protection scope of the present invention.

Claims

1. A high-speed four-head die bonder for semiconductors comprises a bottom plate (2), and is characterized in that: the processing device is characterized in that a frame (7) is arranged on the bottom plate (2), a mounting opening (9) is formed in the frame (7), the mounting opening (9) penetrates completely, a motor (6) is fixedly connected to the inside of the mounting opening (9), a threaded rod (8) is fixedly connected to the output end of the motor (6), a threaded sleeve (11) is sleeved on the outer portion of the threaded rod (8), the threaded sleeve (11) is rotatably connected to the threaded rod (8), a sliding groove (5) is formed in the bottom of the mounting opening (9), an electric push rod (18) is arranged inside the sliding groove (5), the electric push rod (18) slides inside the sliding groove (5), the top of the electric push rod (18) is fixedly connected with the bottom of the threaded sleeve (11), a glue dispensing rod (19) is fixedly connected to the driving end of the electric push rod (18), a processing groove (15) is formed in the bottom plate (2), the inside both sides of processing groove (15) all are provided with a plurality of springs (12), and are a plurality of the one end fixedly connected with connecting block (16) of spring (12), be provided with bayonet socket (13) on connecting block (16), the inside symmetry of processing groove (15) is provided with and drives actuating cylinder (14), drive end fixedly connected with cardboard (23) that drive actuating cylinder (14).

2. The high-speed four-head die bonder for semiconductors according to claim 1, wherein: the controller (4) is arranged on the outer surface of one side of the frame (7), and the controller (4) is electrically connected with the motor (6) through a lead.

3. The high-speed four-head die bonder for semiconductors according to claim 1, wherein: the top of the threaded sleeve (11) is provided with a sliding block (10), and the sliding block (10) slides on the inner top wall of the mounting hole (9).

4. The high-speed four-head die bonder for semiconductors according to claim 1, wherein: a bearing (24) is arranged inside the mounting opening (9), and one end of the threaded rod (8) is rotatably connected inside the bearing (24).

5. The high-speed four-head die bonder for semiconductors according to claim 1, wherein: the bottom of the bottom plate (2) is symmetrically provided with bases (1), and the bases (1) are made of rubber materials.

6. The high-speed four-head die bonder for semiconductors according to claim 1, wherein: be provided with dust collection box (20) on the surface of one side of frame (7), the inside of frame (7) is provided with a plurality of dust absorption pipes (22), and is a plurality of dust absorption pipe (22) and dust collection box (20) communicate each other, and are a plurality of be provided with suction pump (21) on the surface of dust absorption pipe (22), it is a plurality of one side of dust absorption pipe (22) all is provided with suction head (17).

7. The high-speed four-head die bonder for semiconductors according to claim 1, wherein: and the inner side wall of the frame (7) is provided with a lighting device (3).