CN215003516U

CN215003516U - Sapphire wafer thickness detection device

Info

Publication number: CN215003516U
Application number: CN202120861337.7U
Authority: CN
Inventors: 王慧芳; 林传宝
Original assignee: Jiaozuo Huahan Photoelectric Co ltd
Current assignee: Jiaozuo Huahan Photoelectric Co ltd
Priority date: 2021-04-25
Filing date: 2021-04-25
Publication date: 2021-12-03
Anticipated expiration: 2031-04-25

Abstract

The utility model provides a sapphire wafer thickness detection device, which relates to the technical field of sapphire processing, and comprises a base, wherein the upper surface of the base is connected with a placing plate for placing a sapphire wafer in a sliding manner, a detection device for detecting the thickness of the sapphire wafer is arranged above the placing plate, the bottom of the base is provided with a driving device, and the driving device is used for driving the placing plate to do intermittent motion along the length direction of the base so as to enable the detection device to detect the thickness of the sapphire wafer; place a plurality of sapphires at the upper surface of placing the board to start drive arrangement drive and place the board and do intermittent motion along base length direction, in the time of placing the board dwell, can detect the thickness of sapphire wafer, detect the back when thickness, drive arrangement can carry the sapphire wafer that does not detect to detection device's below and accomplish the detection, consequently detect sapphire wafer thickness efficiency higher.

Description

Sapphire wafer thickness detection device

Technical Field

The utility model relates to a sapphire processing technology field specifically is a sapphire wafer thickness detection device.

Background

Sapphire has excellent optical properties, mechanical properties and chemical stability. The quality of which plays a critical role in the quality, lifetime, etc. of the device. With the development of science and technology, the application field of sapphire is more and more extensive, and relates to various fields such as scientific research, aerospace, national defense, life and the like, such as a precision grinding bearing, a laser infrared light-transmitting material, a substrate sheet of a semiconductor chip, a surface mirror and the like.

A wafer thickness measuring device is disclosed in a Chinese patent with an authorization publication number of CN201721274721.7, belonging to the technical field of processing of LED sapphire substrate wafers. The utility model comprises a base, a fixed mount and a scale frame, wherein the fixed mount and the scale frame are vertically fixed on the base, the fixed mount is provided with a wafer retaining piece, the scale frame is provided with a scale, and a scale probe and the wafer retaining piece are on the same horizontal line; the utility model discloses a turn into point to point measurement with traditional point-to-surface measurement, the spring in wafer holder and the scale on vertical support makes the wafer vertical unsettled, measures through wafer holder and scale probe centre gripping, and the contact segment with the wafer all is punctiform, has reduced the error that traditional approach caused because of plane wearing and tearing.

However, the above-mentioned technical solution has the following defect that after the thickness of the wafer is measured, the wafer needs to be taken out to perform thickness detection on other wafers, and the efficiency is low.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a sapphire wafer thickness detection device aims at solving the problem that sapphire wafer thickness detection efficiency is low among the prior art.

In order to achieve the above purpose, the utility model adopts the following technical scheme: the utility model provides a sapphire wafer thickness detection device, includes the base, the upper surface sliding connection of base has the board of placing that is used for placing the sapphire wafer, the top of placing the board is provided with the detection device who is used for detecting sapphire wafer thickness, the bottom of base is provided with drive arrangement, drive arrangement is used for the drive to place the board and is the thickness that intermittent motion so that detection device detects the sapphire wafer along the length direction of base.

In order to make the utility model discloses have the effect that the board was placed in the slip, the utility model discloses a further technical scheme does, place the equal fixedly connected with slider in both sides of board, the spout with slider looks adaptation is seted up to the inside wall of base.

In order to make the utility model have the function of driving the placing plate to do intermittent motion, the further technical proposal of the utility model is that the driving device comprises two supporting plates fixedly connected at the bottom of the base, the bottom of the supporting plates is fixedly connected with a transverse plate, a driving box is fixedly connected between the two transverse plates, a telescopic part is fixedly arranged inside the driving box, the output end of the telescopic part is fixedly connected with a sliding plate, the inside of the sliding plate is slidably connected with a guide rod, the two ends of the guide rod are respectively and fixedly connected on the two side walls of the driving box, the upper end of the sliding plate is rotatably connected with a rotating rod, the two ends of the rotating rod respectively penetrate through the two sides of the sliding plate and are fixedly connected with bulges, the two sides of the sliding plate are fixedly connected with L-shaped limiting plates, the outer surface of the rotating rod is fixedly connected with a pawl, and the lower surface of the placing plate is fixedly connected with at least three fixing plates, and one side of the sliding plate, which is close to the telescopic part, is provided with an elastic resetting component, and the elastic resetting component is used for resetting the sliding plate so that the bulge is contacted with the L-shaped limiting plate.

In order to make the utility model discloses have the effect that promotes the sliding plate motion, the utility model discloses a further technical scheme does, telescopic part is cylinder, pneumatic cylinder or electric telescopic handle's one kind.

In order to make the utility model discloses have the effect that makes the pawl reset, the utility model discloses a further technical scheme does, elasticity reset assembly includes the connecting plate, the upper end fixedly connected with extension spring of connecting plate, the other end and the pawl fixed connection of extension spring.

In order to make the utility model discloses have the effect of pulling pawl, the utility model discloses a further technical scheme does, one side that the extension spring was kept away from to the pawl is provided with the stay cord.

In order to make the utility model discloses have the effect of detecting sapphire wafer thickness, the utility model discloses a further technical scheme does, detection device includes the curb plate, bracing piece fixedly connected with mounting panel is passed through at the top of curb plate, the bottom fixed mounting of mounting panel has the detector body that is used for detecting sapphire wafer thickness.

The utility model has the advantages that:

1. place a plurality of sapphires at the upper surface of placing the board to start drive arrangement drive and place the board and do intermittent motion along base length direction, in the time of placing the board dwell, can detect the thickness of sapphire wafer, detect the back when thickness, drive arrangement can carry the sapphire wafer that does not detect to detection device's below and accomplish the detection, consequently detect sapphire wafer thickness efficiency higher.

2. This device converts the concertina movement of telescopic part into the intermittent motion that drives and place the board, is convenient for carry out thickness detection to a plurality of sapphire wafers, after placing the board and moving to the right-hand member of base, the pulling stay cord for the pawl rotates, consequently can avoid pawl and fixed plate to bump with placing the effect that the board promoted to the base.

Drawings

Fig. 1 is a schematic perspective view of an embodiment of the present invention;

fig. 2 is a schematic front view of an embodiment of the present invention;

fig. 3 is a schematic view of a sliding plate structure according to an embodiment of the present invention;

fig. 4 is a schematic view of the internal structure of the driving box according to the embodiment of the present invention;

fig. 5 is a schematic structural view of an elastic reset assembly according to an embodiment of the present invention.

In the figure: 1. a base; 2. placing the plate; 4. a drive device; 401. a support plate; 402. a transverse plate; 403. a drive box; 404. a telescopic member; 405. a sliding plate; 406. rotating the rod; 407. a protrusion; 408. an L-shaped limiting plate; 409. a pawl; 410. a fixing plate; 411. an elastic reset component; 4111. a connecting plate; 4112. a tension spring; 5. a chute; 6. pulling a rope; 7. a side plate; 8. a support bar; 9. mounting a plate; 10. the detector body.

Detailed Description

The following description will further describe embodiments of the present invention with reference to the accompanying drawings.

As shown in fig. 1 to 5, a sapphire wafer thickness detection device comprises a base 1, wherein a placing plate 2 for placing a sapphire wafer is connected to the upper surface of the base 1 in a sliding manner, a detection device for detecting the thickness of the sapphire wafer is arranged above the placing plate 2, a driving device 4 is arranged at the bottom of the base 1, and the driving device 4 is used for driving the placing plate 2 to make intermittent motion along the length direction of the base 1 so as to enable the detection device to detect the thickness of the sapphire wafer.

In this embodiment, place a plurality of sapphires at the upper surface of placing board 2 to start drive arrangement 4 drive and place board 2 and do intermittent motion along base 1 length direction, in the time of placing board 2 stop, can detect the thickness of sapphire wafer, detect the back when thickness detection is accomplished, drive arrangement 4 can carry the sapphire wafer that does not detect to detection device's below and accomplish the detection, consequently detect sapphire wafer thickness efficiency higher.

The utility model discloses an in another embodiment, place the equal fixedly connected with slider in both sides of board 2, the inside wall of base 1 set up with the spout 5 of slider looks adaptation, slide in the inside of spout 5 through the slider for place board 2 and can slide on base 1.

Specifically, the driving device 4 comprises two supporting plates 401 fixedly connected to the bottom of the base 1, a transverse plate 402 is fixedly connected to the bottom of the supporting plate 401, a driving box 403 is fixedly connected between the two transverse plates 402, a telescopic member 404 is fixedly installed inside the driving box 403, a sliding plate 405 is fixedly connected to an output end of the telescopic member 404, a guide bar is slidably connected inside the sliding plate 405, two ends of the guide bar are respectively fixedly connected to two side walls of the driving box 403, a rotating rod 406 is rotatably connected to an upper end of the sliding plate 405, two ends of the rotating rod 406 respectively penetrate through two sides of the sliding plate 405 and are fixedly connected with protrusions 407, an L-shaped limiting plate 408 is fixedly connected to both sides of the sliding plate 405, a pawl 409 is fixedly connected to an outer surface of the rotating rod 406, at least three fixing plates 410 are fixedly connected to a lower surface of the placing plate 2, and an elastic return assembly 411 is arranged on one side of the sliding plate 405 close to the telescopic member 404, the elastic reset component 411 is used for resetting the sliding plate 405 to enable the protrusion 407 to contact with the L-shaped limiting plate 408, when the telescopic component 404 is telescopic, the sliding plate 405 is pulled to horizontally slide leftwards on the guide rod, the pawl 409 climbs leftwards along the direction of the fixing plate 410, meanwhile, the pawl 409 drives the rotating rod 406 to rotate anticlockwise, after the pawl 409 moves to one side of the next fixing plate 410, the telescopic component 404 is started to push the sliding plate 405 rightwards, because the L-shaped limiting plate 408 contacts with the protrusion 407, the rotating rod 406 cannot rotate anticlockwise, so the placing plate 2 can be horizontally pushed rightwards through the pawl 409, the device converts the telescopic motion of the telescopic component 404 into the intermittent motion for driving the placing plate 2, so as to facilitate the thickness detection of a plurality of sapphire wafers, it should be noted that when the telescopic component 404 drives the sliding plate 405 to move leftwards, the pulling force of the elastic reset component 411 to the pawl 409 is smaller than the friction force between the placing plate 2 and the base 1, the placing plate 2 cannot be driven to horizontally slide leftwards.

Specifically, the telescopic part 404 is a cylinder, a hydraulic cylinder or an electric telescopic rod, and when the telescopic part 404 is a cylinder, an electric telescopic rod or a hydraulic cylinder, the same technical effect can be achieved.

Specifically, elasticity reset subassembly 411 includes connecting plate 4111, and the upper end fixedly connected with extension spring 4112 of connecting plate 4111, the other end and the pawl 409 fixed connection of extension spring 4112, when the pawl 409 moves to one side of next fixed plate 410, extension spring 4112 can stimulate pawl 409 and reset for protruding 407 and the contact of L shape limiting plate 408.

Specifically, one side that extension spring 4112 was kept away from to pawl 409 is provided with stay cord 6, and after placing board 2 and move the right-hand member to base 1, pulling stay cord 6 for pawl 409 rotates, consequently can will place the effect that board 2 promoted to base 1, avoids pawl 409 and fixed plate 410 to collide.

Specifically, detection device includes

curb plate

7, and 8 fixedly connected with mounting panel 9 are passed through at the top of curb plate 7, and mounting panel 9's bottom fixed mounting has the detector body 10 that is used for detecting sapphire wafer thickness, and detector body 10 is thickness detector, high detector or scale, can detect the thickness of crystal.

In the description of the present invention, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.

Claims

1. A sapphire wafer thickness detection device is characterized in that: the sapphire wafer placing device is characterized by comprising a base (1), wherein a placing plate (2) used for placing sapphire wafers is connected to the upper surface of the base (1) in a sliding mode, a detection device used for detecting the thickness of the sapphire wafers is arranged above the placing plate (2), a driving device (4) is arranged at the bottom of the base (1), and the driving device (4) is used for driving the placing plate (2) to do intermittent motion along the length direction of the base (1) so that the detection device can detect the thickness of the sapphire wafers.

2. The sapphire wafer thickness detection device of claim 1, wherein both sides of the placing plate (2) are fixedly connected with sliding blocks, and the inner side wall of the base (1) is provided with a sliding groove (5) matched with the sliding blocks.

3. The sapphire wafer thickness detection device according to claim 1, wherein the driving device (4) comprises two supporting plates (401) fixedly connected to the bottom of the base (1), the bottom of the supporting plate (401) is fixedly connected with a transverse plate (402), a driving box (403) is fixedly connected between the two transverse plates (402), a telescopic member (404) is fixedly installed inside the driving box (403), the output end of the telescopic member (404) is fixedly connected with a sliding plate (405), the inside of the sliding plate (405) is slidably connected with a guide rod, two ends of the guide rod are respectively fixedly connected to two side walls of the driving box (403), the upper end of the sliding plate (405) is rotatably connected with a rotating rod (406), two ends of the rotating rod (406) respectively penetrate through two sides of the sliding plate (405) and are fixedly connected with protrusions (407), the two sides of the sliding plate (405) are fixedly connected with L-shaped limiting plates (408), the outer surface of the rotating rod (406) is fixedly connected with a pawl (409), the lower surface of the placing plate (2) is fixedly connected with at least three fixing plates (410), one side, close to the telescopic part (404), of the sliding plate (405) is provided with an elastic resetting component (411), and the elastic resetting component (411) is used for resetting the sliding plate (405) so that the protrusion (407) is in contact with the L-shaped limiting plates (408).

4. The sapphire wafer thickness detection device as claimed in claim 3, wherein the telescopic member (404) is one of an air cylinder, a hydraulic cylinder or an electric telescopic rod.

5. The sapphire wafer thickness detection device as claimed in claim 3, wherein the elastic reset component (411) comprises a connection plate (4111), a tension spring (4112) is fixedly connected to an upper end of the connection plate (4111), and the other end of the tension spring (4112) is fixedly connected to the pawl (409).

6. The sapphire wafer thickness detection device as claimed in claim 5, wherein a pull rope (6) is arranged on one side of the pawl (409) far away from the tension spring (4112).

7. The sapphire wafer thickness detection device as claimed in claim 1, wherein the detection device comprises a side plate (7), a mounting plate (9) is fixedly connected to the top of the side plate (7) through a support rod (8), and a detector body (10) for detecting the thickness of the sapphire wafer is fixedly mounted at the bottom of the mounting plate (9).