CN214975341U - Semi-automatic optical chip glue spreading machine - Google Patents
Semi-automatic optical chip glue spreading machine Download PDFInfo
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- CN214975341U CN214975341U CN202121223150.0U CN202121223150U CN214975341U CN 214975341 U CN214975341 U CN 214975341U CN 202121223150 U CN202121223150 U CN 202121223150U CN 214975341 U CN214975341 U CN 214975341U
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Abstract
The utility model discloses a semi-automatic optical chip glue spreader relates to chip technical field. This semi-automatic optical chip glue spreading machine, including the support, the last fixed surface of support is connected with the supporting body, and the inside sliding connection of supporting body has the glue spreading head, and the top sliding connection of support has the fixed block, and the inside of fixed block is provided with fixture, and roof mechanism includes the circular slot, and the circular slot is seted up at the upper surface of fixed block. This semi-automatic optical chip glue spreading machine is through setting up chip and fixture, when the not unidimensional chip of needs centre gripping, at first supports the inside at the cardboard with one side of chip, when the cardboard roll-off to the size of adaptation chip, the elasticity of first spring can make the cardboard grasp the chip, and the device is convenient for the not unidimensional chip of centre gripping.
Description
Technical Field
The utility model relates to a chip technical field specifically is a semi-automatic optical chip glue spreader.
Background
Along with the development of science and technology, electronic products are more and more advanced and smaller in size, the development of the electronic products mainly lies in the use of a large number of electronic chips, and an electronic chip glue spreading machine is generally applied as one of devices for chip processing and production.
The head is glued including the cloth that can remove in the frame generally, locate the mesa in the frame, the track that is used for carrying and fixed chip that sets up on the mesa, the track design becomes can carry on spacingly to the chip from both sides, and when to not unidimensional chip, can adjust the track width, and above-mentioned glue spreading machine is in the in-service use process, the track is once adjusted after appointed width, can only be applicable to the track of same size, consequently, when to every not unidimensional chip, all will carry out once alone and adjust, it is very inconvenient, it is not enough based on current technique, the utility model discloses a semi-automatic optical chip glue spreading machine.
SUMMERY OF THE UTILITY MODEL
Technical problem to be solved
Not enough to prior art, the utility model discloses a semi-automatic optical chip glue spreader to solve the problem that proposes in the above-mentioned background art.
(II) technical scheme
In order to achieve the above purpose, the utility model discloses a following technical scheme realizes: a semi-automatic optical chip glue spreader, comprising:
the upper surface of the bracket is fixedly connected with a bearing body, the inside of the bearing body is connected with a rubber distribution head in a sliding manner, the top of the bracket is connected with a fixed block in a sliding manner, and a clamping mechanism is arranged inside the fixed block;
the top plate mechanism comprises a circular groove, and the circular groove is formed in the upper surface of the fixing block.
Preferably, the upper surface of the bracket is provided with a groove, and the lower surface of the fixing block is fixedly connected with a connecting block.
Preferably, fixture includes spout, round bar, first spring, connecting plate and cardboard, and the spout is seted up in one side of fixed block, and the inside sliding connection of spout has the round bar, and the surface activity of round bar has cup jointed first spring, one side fixedly connected with connecting plate of round bar, one side fixedly connected with cardboard of connecting plate.
Preferably, cardboard sliding connection is in one side of fixed block, and connecting plate sliding connection is in the inside of spout.
Preferably, roof mechanism still includes second spring, spacing ring, connecting rod and fixed plate, and second spring activity joint is in the inside of circular slot, and spacing ring sliding connection is in the inside of circular slot, and the last fixed surface of spacing ring is connected with the connecting rod, and the last fixed surface of connecting rod is connected with the fixed plate.
Preferably, connecting rod sliding connection is in the inside of circular slot, and fixed plate sliding connection is at the upper surface of fixed block, and fixed plate sliding connection is in the inside of cardboard.
The utility model discloses a semi-automatic optical chip glue spreader, its beneficial effect who possesses as follows:
1. this semi-automatic optical chip glue spreading machine is through setting up chip and fixture, when the not unidimensional chip of needs centre gripping, at first supports the inside at the cardboard with one side of chip, when the cardboard roll-off to the size of adaptation chip, the elasticity of first spring can make the cardboard grasp the chip, and the device is convenient for the not unidimensional chip of centre gripping.
2. This semi-automatic optical chip glue spreading machine, when needs support tight chip, at first put the chip at the top of fixed plate, then when the size of cardboard adaptation chip, loosen the chip, the inside second spring of circular slot makes spacing ring and connecting rod upwards slide this moment, spacing ring and connecting rod drive the fixed plate and upwards slide simultaneously, the fixed plate drives the chip and slides to the interior top of cardboard, the tension of second spring makes the chip tightly support the top at the fixed plate and the interior top of cardboard this moment, the device is convenient for support tight chip.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic view of the bracket structure of the present invention;
FIG. 3 is a schematic view of the structure of the clamping mechanism of the present invention;
fig. 4 is a schematic structural diagram of the top plate mechanism of the present invention.
In the figure: 1. a support; 101. a groove; 102. connecting blocks; 103. a fixed block; 2. a carrier; 201. a glue spreading head; 3. a clamping mechanism; 301. a chute; 302. a round bar; 303. a first spring; 304. a connecting plate; 305. clamping a plate; 4. a roof plate mechanism; 401. a circular groove; 402. a second spring; 403. a limiting ring; 404. a connecting rod; 405. and (7) fixing the plate.
Detailed Description
The embodiment of the utility model discloses semi-automatic optical chip glue spreader, as shown in fig. 1-4, include:
the device comprises a support 1, wherein the upper surface of the support 1 is fixedly connected with a bearing body 2, a cloth rubber head 201 is connected inside the bearing body 2 in a sliding manner, the top of the support 1 is connected with a fixing block 103 in a sliding manner, and a clamping mechanism 3 is arranged inside the fixing block 103;
the top plate mechanism 4, the top plate mechanism 4 includes a circular groove 401, and the circular groove 401 is opened on the upper surface of the fixing block 103.
The upper surface of the bracket 1 is provided with a groove 101, and the lower surface of the fixing block 103 is fixedly connected with a connecting block 102.
When the semi-automatic optical chip glue spreading machine is used, in an initial state, the top of a support 1 is provided with a supporting body 2, one side of the supporting body 2 is provided with a glue spreading head 201, the glue spreading head 201 slides on the top of the support 1, the top of the support 1 is provided with a groove 101, a connecting block 102 slides in the groove 101, the top of the connecting block 102 is provided with a fixed block 103, one side of the fixed block 103 is provided with a clamping mechanism 3, the top of the fixed block 103 is provided with a top plate mechanism 4, the clamping mechanism 3 is used for clamping chips with different sizes, and the top plate mechanism 4 is used for supporting the chips in the clamping mechanism 3;
The clamping plate 305 is connected to one side of the fixing block 103 in a sliding mode, and the connecting plate 304 is connected to the inside of the sliding groove 301 in a sliding mode.
When the not unidimensional chip of needs centre gripping, at first put the chip at the top of fixed block 103, support the inside at cardboard 305 with one side of chip, make cardboard 305 drive connecting plate 304 and slide to one side, connecting plate 304 drives pole 302 and slides to one side of cardboard 305 simultaneously, the first spring 303 of pole 302 surface is in compression state this moment, and connecting plate 304 is from the inside roll-off of spout 301, when cardboard 305 roll-off to the size of adaptation chip, the elasticity of first spring 303 can make connecting plate 304 drive cardboard 305 and slide to the inside of spout 301, can live the chip centre gripping this moment, the device is convenient for the not unidimensional chip of centre gripping.
The top plate mechanism 4 further comprises a second spring 402, a limiting ring 403, a connecting rod 404 and a fixing plate 405, the second spring 402 is movably clamped inside the circular groove 401, the limiting ring 403 is slidably connected inside the circular groove 401, the connecting rod 404 is fixedly connected to the upper surface of the limiting ring 403, and the fixing plate 405 is fixedly connected to the upper surface of the connecting rod 404.
Connecting rod 404 sliding connection is in the inside of circular slot 401, and fixed plate 405 sliding connection is on the upper surface of fixed block 103, and fixed plate 405 sliding connection is in the inside of cardboard 305.
When the chip needs to be supported tightly, the chip is firstly placed at the top of the fixing plate 405, then when the clamping plate 305 adapts to the size of the chip, the chip is loosened, the second spring 402 in the circular groove 401 enables the limiting ring 403 and the connecting rod 404 to slide upwards, meanwhile, the limiting ring 403 and the connecting rod 404 drive the fixing plate 405 to slide upwards, the fixing plate 405 drives the chip to slide towards the inner top of the clamping plate 305, the tension of the second spring 402 enables the chip to be tightly supported against the top of the fixing plate 405 and the inner top of the clamping plate 305, and the device is convenient for supporting the chip tightly.
The working principle is as follows: when the semi-automatic optical chip glue spreading machine is used, in an initial state, the top of a support 1 is provided with a supporting body 2, one side of the supporting body 2 is provided with a glue spreading head 201, the glue spreading head 201 slides on the top of the support 1, the top of the support 1 is provided with a groove 101, a connecting block 102 slides in the groove 101, the top of the connecting block 102 is provided with a fixed block 103, one side of the fixed block 103 is provided with a clamping mechanism 3, the top of the fixed block 103 is provided with a top plate mechanism 4, the clamping mechanism 3 is used for clamping chips with different sizes, and the top plate mechanism 4 is used for supporting the chips in the clamping mechanism 3;
when the not unidimensional chip of needs centre gripping, at first put the chip at the top of fixed block 103, support the inside at cardboard 305 with one side of chip, make cardboard 305 drive connecting plate 304 and slide to one side, connecting plate 304 drives pole 302 and slides to one side of cardboard 305 simultaneously, the first spring 303 of pole 302 surface is in compression state this moment, and connecting plate 304 is from the inside roll-off of spout 301, when cardboard 305 roll-off to the size of adaptation chip, the elasticity of first spring 303 can make connecting plate 304 drive cardboard 305 and slide to the inside of spout 301, can live the chip centre gripping this moment, the device is convenient for the not unidimensional chip of centre gripping.
When the chip needs to be supported tightly, the chip is firstly placed at the top of the fixing plate 405, then when the clamping plate 305 adapts to the size of the chip, the chip is loosened, the second spring 402 in the circular groove 401 enables the limiting ring 403 and the connecting rod 404 to slide upwards, meanwhile, the limiting ring 403 and the connecting rod 404 drive the fixing plate 405 to slide upwards, the fixing plate 405 drives the chip to slide towards the inner top of the clamping plate 305, the tension of the second spring 402 enables the chip to be tightly supported against the top of the fixing plate 405 and the inner top of the clamping plate 305, and the device is convenient for supporting the chip tightly.
The basic principles and the main features of the invention and the advantages of the invention have been shown and described above. It will be understood by those skilled in the art that the present invention is not limited to the above embodiments, and that the foregoing embodiments and descriptions are provided only to illustrate the principles of the present invention without departing from the spirit and scope of the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (6)
1. The utility model provides a semi-automatic optical chip gluing machine which characterized in that includes:
the device comprises a support (1), wherein a bearing body (2) is fixedly connected to the upper surface of the support (1), a cloth rubber head (201) is connected to the inside of the bearing body (2) in a sliding mode, a fixing block (103) is connected to the top of the support (1) in a sliding mode, and a clamping mechanism (3) is arranged inside the fixing block (103);
the top plate mechanism (4) comprises a circular groove (401), and the circular groove (401) is formed in the upper surface of the fixing block (103).
2. The semi-automatic optical chip glue spreading machine according to claim 1, characterized in that: the upper surface of the support (1) is provided with a groove (101), and the lower surface of the fixing block (103) is fixedly connected with a connecting block (102).
3. The semi-automatic optical chip glue spreading machine according to claim 1, characterized in that: fixture (3) include spout (301), round bar (302), first spring (303), connecting plate (304) and cardboard (305), one side at fixed block (103) is seted up in spout (301), the inside sliding connection of spout (301) has round bar (302), first spring (303) have been cup jointed in the surface activity of round bar (302), one side fixedly connected with connecting plate (304) of round bar (302), one side fixedly connected with cardboard (305) of connecting plate (304).
4. The semi-automatic optical chip glue spreading machine according to claim 3, characterized in that: the clamping plate (305) is connected to one side of the fixing block (103) in a sliding mode, and the connecting plate (304) is connected to the inside of the sliding groove (301) in a sliding mode.
5. The semi-automatic optical chip glue spreading machine according to claim 1, characterized in that: roof mechanism (4) still includes second spring (402), spacing ring (403), connecting rod (404) and fixed plate (405), the inside of second spring (402) activity joint at circular slot (401), spacing ring (403) sliding connection is in the inside of circular slot (401), the last fixed surface of spacing ring (403) is connected with connecting rod (404), the last fixed surface of connecting rod (404) is connected with fixed plate (405).
6. The semi-automatic optical chip glue spreading machine according to claim 5, characterized in that: connecting rod (404) sliding connection is in the inside of circular slot (401), fixed plate (405) sliding connection is on the upper surface of fixed block (103), fixed plate (405) sliding connection is in the inside of cardboard (305).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121223150.0U CN214975341U (en) | 2021-06-02 | 2021-06-02 | Semi-automatic optical chip glue spreading machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121223150.0U CN214975341U (en) | 2021-06-02 | 2021-06-02 | Semi-automatic optical chip glue spreading machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214975341U true CN214975341U (en) | 2021-12-03 |
Family
ID=79085752
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121223150.0U Active CN214975341U (en) | 2021-06-02 | 2021-06-02 | Semi-automatic optical chip glue spreading machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214975341U (en) |
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2021
- 2021-06-02 CN CN202121223150.0U patent/CN214975341U/en active Active
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