CN214960749U - Thermal protection device of flight data recorder - Google Patents
Thermal protection device of flight data recorder Download PDFInfo
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- CN214960749U CN214960749U CN202121305878.8U CN202121305878U CN214960749U CN 214960749 U CN214960749 U CN 214960749U CN 202121305878 U CN202121305878 U CN 202121305878U CN 214960749 U CN214960749 U CN 214960749U
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Abstract
The utility model discloses a thermal protection device of a flight data recorder, which comprises a heat storage layer and a heat insulation layer from inside to outside, wherein the center part of the heat storage layer is provided with a groove for embedding a chip box; an inner shell is arranged between the heat storage layer and the heat insulation layer, and an outer shell is arranged outside the heat insulation layer; the heat storage layer, the inner shell, the heat insulation layer and the outer shell are provided with openings for leading out power lines of the chip boxes, and heat insulation materials are filled in gaps between the openings and the power lines, so that the problem that heat protection is invalid due to heat leakage of packaging seams is solved. The utility model discloses an inside heat accumulation layer, outside insulating layer two parts are constituteed, use ming ke material and multilayer thermal insulation material range upon range of as the insulating layer, have solved the not enough problem of simple thermal insulation material ability. The utility model discloses can effectual thermal-insulated heat preservation, satisfy the temperature field operation requirement of flight data recorder under the high temperature condition.
Description
Technical Field
The utility model belongs to the technical field of the thermal protection technique and specifically relates to a hot protector for aircraft data recorder.
Background
The flight data recorder is an instrument for storing the flying condition of an airplane, is commonly called a black box, and the airborne flight data recorder needs to have the heat protection capability of resisting high-temperature fire and medium-temperature baking. The ED-112 "lowest operating performance requirement for crash-resistant airborne recording system" of the European aviation equipment organization and the TSO-C124b "technical Standard for flight data recording System" of the United states' Federal aviation administration stipulate that the flight data recorder should meet the following thermal protection requirements: 1) the flight parameter recorder bears a fully-enclosed flame (temperature 900-1100 ℃, heat flux more than 158 kW/m)2) At least 1 hour of ablation, the cartridge data can be read; 2) the flight data recorder is placed in an environment at 260 ℃ for at least 10 hours, and the chip box data can be read.
In order to achieve the thermal protection technical indexes of 'TSO-C124 b' and 'ED-112', the flight data recorder adopts a thermal protection structure combining heat insulation and heat storage: namely, the heat conduction is reduced by using a heat insulation material; meanwhile, the phase-change heat storage material is used for absorbing heat conducted into the shell, and the temperature of a chip box in the flight data recorder is reduced. Because the total weight and the volume of the flight parameter recorder are strictly limited, the selection of proper heat insulation materials and heat storage materials is two major keys for solving the problem of thermal protection of the flight parameter recorder.
The patent with publication number CN203882351U discloses a thermal protection flight parameter recorder, which adopts paraffin wax encapsulated in a protective shell, and utilizes the paraffin wax as a heat absorbing material to enhance the thermal protection capability of the flight parameter recorder. The patent with publication number CN102181296A discloses a heat-insulating, flame-retardant and moisture-proof material for an aircraft black box and a preparation method thereof, wherein a silicon dioxide condensate composite fiber is used as a heat-insulating material to insulate heat, preserve heat, drain water and prevent moisture for the aircraft black box. However, the above-mentioned technologies do not address the problem that the power line of the aircraft data logger is led out from the thermal protection device, and the power line led out from the thermal protection device may cause a splicing line in the middle of the thermal protection device, which causes a heat leakage phenomenon, and the thermal protection device fails.
Disclosure of Invention
In order to solve the technical problem, the utility model provides a thermal protection device of flight data recorder can effectual thermal-insulated heat preservation, satisfies the temperature field operation requirement of flight data recorder under the high temperature condition.
A thermal protection device of a flight data recorder comprises a heat storage layer and a thermal insulation layer from inside to outside, wherein a groove is formed in the center of the heat storage layer and used for embedding a chip box; an inner shell is arranged between the heat storage layer and the heat insulation layer; an outer shell is arranged outside the heat insulation layer; the heat storage layer, the inner shell, the heat insulation layer and the outer shell are provided with openings for leading out a power line of the chip box, and heat insulation materials are filled in gaps between the openings and the power line.
Further, the thermal insulation layer is formed by laminating a ming ke material and multiple layers of thermal insulation materials, the multiple layers of thermal insulation materials are formed by laminating a reflection layer and a spacing layer at intervals, the reflection layer is any one of molybdenum foil, gold foil, copper foil, aluminum foil and stainless steel foil, and the spacing layer is any one of glass fiber paper, high silica fiber cloth, woven quartz cloth and boron nitride fiber paper.
Furthermore, the reflecting layer in the multilayer heat-insulating material is formed by alternately laminating molybdenum foils and high-silica cloth as spacing layers, and the maximum service temperature of the multilayer heat-insulating material formed by alternately laminating the molybdenum foils and the high-silica cloth reaches 1125 ℃, so that the service requirement of the outer surface temperature of the flight data recorder is met.
Furthermore, the heat insulation layer is sequentially provided with a first ming ke material layer, a plurality of layers of heat insulation material layers and a second ming ke material layer from inside to outside in a stacking mode, one side of each of the plurality of layers of heat insulation material layers is provided with an opening for leading out a power line of the chip box, the thermal resistance of the opening is low, a large amount of heat can be immersed into the chip box through the position, the heat insulation effect of the chip box can be greatly reduced, therefore, a ming ke material is filled in a gap between the opening and the power line, namely the ming ke material is filled in the gap between the opening and the power line.
Further, the thermal-insulating layer is a second multilayer thermal-insulating material layer, a first ming ke material layer, a first multilayer thermal-insulating material layer and a second ming ke material layer from inside to outside in sequence in a stacking mode, the first multilayer thermal-insulating material layer and the second multilayer thermal-insulating material layer are respectively provided with an opening for leading out a power line of the chip box, thermal-insulating materials are made of ming ke materials, namely the opening and the gap of the power line are filled with the ming ke materials, the first multilayer thermal-insulating material layer and the opening of the second multilayer thermal-insulating material layer are arranged on wall surfaces in different directions, heat transferred by the opening can be effectively blocked, and therefore the thermal-insulating effect is greatly improved.
Further, the material is prepared by mechanically mixing fumed silica, an opacifier, ceramic fibers and other raw materials through a dispersion machine, wherein the opacifier is titanium dioxide powder, and the mixed materials are subjected to compression molding in a mold through a heating flat vulcanizing machine under certain compression molding pressure to form a compression plate.
Furthermore, the heat storage layer is made of a phase-change material, and the phase-change material has the advantages of large heat storage density, small volume of the heat storage container, high heat efficiency and the like. The paraffin has large phase change latent heat and wide phase change temperature range. The maximum temperature which can be born by the normal work of the flight data recorder is 70 ℃, and the phase change material is fully refined paraffin C with the carbon atom number of 3030H62The melting point temperature is 65.4 ℃, which is less than the highest temperature that the chip box can bear during normal operation. Processing phase change material into two parts, combining the two parts into a designed shape, placing a chip box in a groove at the central part of the phase change material, combining the two parts of the phase change material, wrapping an inner shell outside the phase change material, gradually heating to 69 ℃, and eliminating the phase change materialAnd cooling the gap between the material and the chip box to room temperature.
Further, the outer part of the multi-layer heat insulation material is coated with a cladding which is made of stainless steel or titanium alloy, a cavity is formed inside the cladding, and the multi-layer heat insulation material is filled in the cavity of the cladding.
Further, the inner shell and the outer shell are made of stainless steel.
Further, a heat reflection coating is arranged outside the shell, and the heat reflection coating is formed by a film forming substance, an insulating heat conduction filler, a solvent and a dispersing agent according to a mass ratio of 25-50: 20-40: 25-50 of the above-mentioned materials.
Has the advantages that:
the utility model adopts the technical scheme that the packing material is filled in the packaging seam to prevent heat from entering the splicing seam to affect the heat protection capability of the heat protection device, the internal heat storage layer and the external heat insulation layer are formed, and the packing material and the multilayer heat insulation material are stacked to be used as the heat insulation layer, so that the problem of insufficient capability of the pure heat insulation material is solved; paraffin with the melting point of 65 ℃ is used as a heat storage layer, and the packaging temperature of the heat storage layer is lower than the using temperature of the flight data recorder chip, so that the influence of packaging on the chip is reduced. The utility model discloses can effectual thermal-insulated heat preservation, satisfy the temperature field operation requirement of flight data recorder under the high temperature condition.
Drawings
Fig. 1 is a schematic cross-sectional view of embodiment 1 of the present invention;
fig. 2 is a schematic cross-sectional view of embodiment 2 of the present invention;
1. a chip cartridge; 1-1, a power line; 2. a heat storage layer; 3. an inner housing; 4-1, a first layer of acrylic material; 4-2, a second layer of acrylic material; 5. a first plurality of layers of thermal insulation material; 5-1, a first opening; 5-2, a second plurality of layers of thermal insulation material; 5-3, a second opening; 6. an outer housing.
Detailed Description
The invention will be further explained and illustrated with reference to specific examples. It should be understood that the following examples are illustrative of the present invention only and are not intended to limit the scope of the present invention.
Example 1:
a thermal protection device of a flight data recorder comprises a heat storage layer 2 and a thermal insulation layer from inside to outside, wherein a groove is formed in the center of the heat storage layer 2 and used for embedding a chip box 1; an inner shell 3 is arranged between the heat storage layer 2 and the heat insulation layer, the heat insulation layer is sequentially composed of a first ming material layer 4-1, a first multilayer heat insulation material layer 5 and a second ming material layer 4-2 which are laminated from inside to outside, the first multilayer heat insulation material layer 5 is formed by laminating 40 layers of molybdenum foil and 41 layers of high silica fiber cloth, and an outer shell 6 is arranged outside the heat insulation layer; the heat storage layer 2, the inner shell 3, the heat insulation layer and the outer shell 6 are provided with openings for leading out power lines 1-1 of the chip box 1; one side of the first multi-layer heat insulation material layer 5 is provided with a first opening 5-1 for leading out a power line 1-1 of the chip box 1, the thermal resistance at the position of the first opening 5-1 is low, a large amount of heat can be immersed into the chip box 1 through the position, the heat insulation effect of the chip box 1 can be greatly reduced, and therefore, a gap between the opening and the power line 1-1 is filled with a Mingke material; .
The maximum service temperature of the multilayer heat-insulating material formed by alternately laminating the molybdenum foil and the high-silica cloth reaches 1125 ℃, and the service requirement of the temperature of the outer surface of the flight data recorder is met.
The material is prepared by mechanically mixing fumed silica, an opacifier, ceramic fiber and other raw materials through a dispersion machine, wherein the opacifier is titanium dioxide powder, and performing compression molding on the mixed materials in a mold through a heating flat vulcanizing machine under certain compression molding pressure to form a compression plate.
The heat storage layer 2 is made of a phase-change material, and the phase-change material has the advantages of large heat storage density, small volume of a heat storage container, high heat efficiency and the like. The paraffin has large phase change latent heat and wide phase change temperature range. The maximum temperature which can be borne by the normal operation of the flight data recorder is 70 ℃, the phase change material is C30H62 of fully refined paraffin with the carbon number of 30, the melting point temperature is 65.4 ℃, and the temperature is less than the maximum temperature which can be borne by the normal operation of the chip box 1.
The first multi-layer heat insulation material layer 5 is externally coated with a cladding which is made of titanium alloy, a cavity is formed inside the cladding, the first multi-layer heat insulation material layer 5 is filled in the cavity of the cladding, and the cladding is also provided with a first opening 5-1 along with the first multi-layer heat insulation material layer 5.
The inner housing 3 and the outer housing 6 are stainless steel.
The outer shell is externally provided with a heat reflection coating, and the heat reflection coating is a film forming substance, an insulating heat-conducting filler, a solvent and a dispersing agent according to the mass ratio of 25: 40: 30 are mixed together.
And (3) packaging: processing a phase change material into two parts, processing an inner shell 3, a cladding and an outer shell 6 into two parts, combining the two parts of the phase change material, the inner shell 3, the cladding and the outer shell 6 into a designed shape, placing a chip box 1 in a groove at the central part of the phase change material, combining the two parts of the phase change material, wrapping the inner shell 3 outside the phase change material, welding the two parts of the inner shell 3, leading out a power wire 1-1 of the chip box 1, gradually heating to 69 ℃, eliminating a gap between the phase change material and the chip box 1, and then gradually cooling to room temperature. A first multi-layer heat insulation material layer 5 is formed by laminating 20 layers of molybdenum foil and 21 layers of high silica fiber cloth, the first multi-layer heat insulation material layer 5 is filled into the cladding, and a first opening 5-1 is reserved. The inner shell 3 is placed in the cladding, a first Ming's material layer 4-1 is formed by filling Ming's material between the inner shell 3 and the cladding, the power line 1-1 is led out from the opening, Ming's material is filled in the gap between the power line 1-1 and the opening, and then the two parts of the cladding are welded. The cladding is placed in the outer shell 6, a second acrylic material layer 4-2 is filled between the cladding and the outer shell 6, after filling, the power line 1-1 is led out, and the two parts of the outer shell 6 are welded.
After the flight data recorder is placed in an environment of 1100 ℃ for 1h, the final temperature on the chip is about 65 ℃ and less than 70 ℃, and the use requirement of the flight data recorder on the temperature field under the environment condition is met.
Example 2:
a thermal protection device of a flight data recorder comprises a heat storage layer 2 and a thermal insulation layer from inside to outside, wherein a groove is formed in the center of the heat storage layer 2 and used for embedding a chip box 1; an inner shell 3 is arranged between the heat storage layer 2 and the heat insulation layer, and the heat insulation layer is formed by laminating a ming material and a plurality of layers of heat insulation materials; an outer shell 6 is arranged outside the heat insulation layer; the heat storage layer 2, the inner shell 3, the heat insulation layer and the outer shell 6 are provided with openings for leading out power lines 1-1 of the chip box 1.
The multilayer heat insulation material is formed by stacking a reflection layer and a spacing layer at intervals, the reflection layer is a molybdenum foil, and the spacing layer is woven quartz cloth. The maximum service temperature of the multi-layer heat insulation material formed by the molybdenum foil and the woven quartz cloth in a spaced and laminated mode reaches 1425 ℃, and the use requirement of the outer surface temperature of the flight data recorder is met.
The heat insulation layer is formed by stacking a second plurality of heat insulation material layers 5-2, a first acrylic material layer 4-1, a first plurality of heat insulation material layers 5 and a second acrylic material layer 4-2 from inside to outside once, the first plurality of heat insulation material layers 5 and the second plurality of heat insulation material layers 5-2 are respectively formed by stacking 20 layers of molybdenum foils and 21 layers of woven quartz cloth, the first multilayer heat insulation material layer 5 and the second multilayer heat insulation material layer 5-2 are respectively provided with an opening for leading out a power line 1-1 of the chip box 1, a gap between the opening and the power line 1-1 is filled with a Minke material, and the first opening 5-1 of the first multilayer heat insulation material layer 5 and the second opening 5-3 of the second multilayer heat insulation material layer 5-2 are arranged on wall surfaces in different directions, so that heat transferred by the openings can be effectively blocked, and the heat insulation effect is greatly improved.
The material is prepared by mechanically mixing fumed silica, an opacifier, ceramic fiber and other raw materials through a dispersion machine, wherein the opacifier is titanium dioxide powder, and performing compression molding on the mixed materials in a mold through a heating flat vulcanizing machine under certain compression molding pressure to form a compression plate.
The total thickness of the first multilayer thermal insulation material layer and the second multilayer thermal insulation layer in this embodiment is the same as the thickness of the first multilayer thermal insulation layer in embodiment 1, the thickness of the first dacron material layer in this embodiment is the same as the thickness of the first dacron material layer in embodiment 1, and the thickness of the second dacron material layer in this embodiment is the same as the thickness of the second dacron material layer in embodiment 1.
The heat storage layer 2 is made of a phase-change material, and the phase-change material has the advantages of large heat storage density, small volume of a heat storage container, high heat efficiency and the like. The paraffin has large phase change latent heat and wide phase change temperature range. The maximum temperature which can be borne by the normal operation of the flight data recorder is 70 ℃, the phase change material is C30H62 of fully refined paraffin with the carbon number of 30, the melting point temperature is 65.4 ℃, and the temperature is less than the maximum temperature which can be borne by the normal operation of the chip box 1.
The outer part of the multi-layer heat insulation material is coated with an envelope, the envelope is made of stainless steel, a cavity is arranged inside the envelope, and the multi-layer heat insulation material is filled in the cavity of the envelope.
The inner housing 3 and the outer housing 6 are stainless steel.
The outer shell is externally provided with a heat reflection coating, and the heat reflection coating is formed by a film forming substance, an insulating heat-conducting filler, a solvent and a dispersing agent according to a mass ratio of 50: 20: 50, and mixing.
And (3) packaging: processing a phase change material into two parts, processing an inner shell 3, a cladding and an outer shell 6 into two parts, combining the two parts of the phase change material, the inner shell 3, the cladding and the outer shell 6 into a designed shape, placing a chip box 1 in a groove at the central part of the phase change material, combining the two parts of the phase change material, wrapping the inner shell 3 outside the phase change material, welding the two parts of the inner shell 3, leading out a power wire 1-1 of the chip box 1, gradually heating to 69 ℃, eliminating a gap between the phase change material and the chip box 1, and then gradually cooling to room temperature. The molybdenum foil with 20 layers and the woven quartz cloth with 21 layers are laminated into a plurality of heat insulation material layers, and the plurality of heat insulation materials are filled into the cladding with openings left. The inner shell 3 is placed in a second shell of a second multi-layer heat insulation material layer 5-2, a Ming material is filled between the inner shell 3 and the first shell to serve as the second multi-layer heat insulation material layer 5-2, a power line 1-1 is led out from a second opening 5-3 of the first shell, a Ming material is filled in a gap between the power line 1-1 and the second opening 5-3, and then the two parts of the first shell are welded. Placing a second package shell of a second multi-layer heat insulation material layer 5-2 in a first package shell of the first multi-layer heat insulation material layer 5, leading a power line 1-1 out from a first opening 5-1, filling a Mingkg material in a gap between the power line 1-1 and the first opening 5-1, respectively locating the first opening 5-1 and a second opening 5-3 on wall surfaces opposite to each other in respective directions, filling the Mingkg material between the first package shell and the second package shell to be used as a first Mingkg material layer 4-1, then welding two parts of the second package shell, filling the Mingkg material between the first package shell and an outer shell 6 to be used as a second Mingkg material layer 4-2, leading the power line 1-1 out after filling, and welding two parts of the outer shell 6.
After the flight data recorder is placed in an environment of 1100 ℃ for 1h, the final temperature on the chip is about 37.6 ℃ and less than 70 ℃, and the use requirement of the flight data recorder on the temperature field under the environment condition is met.
Claims (10)
1. A thermal protection device for a flight data recorder, comprising: the heat storage layer and the heat insulation layer are arranged from inside to outside, and a groove is formed in the center of the heat storage layer and used for embedding the chip box; an inner shell is arranged between the heat storage layer and the heat insulation layer, and an outer shell is arranged outside the heat insulation layer; the heat storage layer, the inner shell, the heat insulation layer and the outer shell are provided with openings for leading out a power line of the chip box, and heat insulation materials are filled in gaps between the openings and the power line.
2. The thermal protection device of a flight data recorder according to claim 1, wherein: the heat insulation layer is formed by laminating a ming material and a plurality of layers of heat insulation materials, and the plurality of layers of heat insulation materials are formed by alternately laminating a reflection layer and a spacing layer.
3. The thermal protection device of a flight data recorder according to claim 2, wherein: the reflecting layer is any one of molybdenum foil, gold foil, copper foil, aluminum foil and stainless steel foil, and the spacing layer is any one of glass fiber paper, high silica fiber cloth, woven quartz cloth and boron nitride fiber paper.
4. The thermal protection device of a flight data recorder according to claim 3, wherein: the multilayer heat insulation material is formed by alternately laminating a reflection layer and a spacing layer, wherein the reflection layer is made of molybdenum foil, and the spacing layer is made of high silica cloth.
5. The thermal protection device of a flight data recorder according to claim 2, wherein: the heat insulation layer is sequentially composed of a first ming material layer, a plurality of heat insulation material layers and a second ming material layer from inside to outside in a stacking mode, an opening is formed in one side of each heat insulation material layer and used for leading out a chip box power line, and a ming material is filled in a gap between the opening and the power line.
6. The thermal protection device of a flight data recorder according to claim 2, wherein: the heat insulation layer is sequentially provided with a first plurality of heat insulation material layers, a first ming ke material layer, a second plurality of heat insulation material layers and a second ming ke material layer from inside to outside in a stacking mode, the first plurality of heat insulation material layers and the second plurality of heat insulation material layers are respectively provided with an opening for leading out a power line of the chip box, a gap between the opening and the power line is filled with the ming ke material, and the openings of the first plurality of heat insulation material layers and the second plurality of heat insulation material layers are arranged on wall surfaces in different directions.
7. The thermal protection device of a flight data recorder according to any one of claims 1-6, wherein: the multi-layer heat insulation material is coated on the outer part of the cladding, the cladding is made of titanium alloy or stainless steel, a cavity is formed inside the cladding, and the multi-layer heat insulation material is filled in the cavity of the cladding.
8. The thermal protection device of a flight data recorder according to claim 1, wherein: the heat storage layer is paraffin.
9. The thermal protection device of a flight data recorder according to claim 1, wherein: the inner shell and the outer shell are made of stainless steel.
10. The thermal protection device of a flight data recorder according to claim 1, wherein: the outer shell is provided with a heat reflection coating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121305878.8U CN214960749U (en) | 2021-06-11 | 2021-06-11 | Thermal protection device of flight data recorder |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121305878.8U CN214960749U (en) | 2021-06-11 | 2021-06-11 | Thermal protection device of flight data recorder |
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| CN214960749U true CN214960749U (en) | 2021-11-30 |
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| CN202121305878.8U Active CN214960749U (en) | 2021-06-11 | 2021-06-11 | Thermal protection device of flight data recorder |
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