CN214960439U

CN214960439U - Substrate integrated circuit packaging structure adopting multichannel DDS chip

Info

Publication number: CN214960439U
Application number: CN202120872780.4U
Authority: CN
Inventors: 朱仕镇
Original assignee: Shenzhen Sanliansheng Technology Co ltd
Current assignee: Shenzhen Sanliansheng Technology Co ltd
Priority date: 2021-04-26
Filing date: 2021-04-26
Publication date: 2021-11-30
Anticipated expiration: 2031-04-26

Abstract

The utility model relates to the technical field of integrated circuit, and an adopt multichannel DDS chip base plate integrated circuit packaging structure is disclosed, comprising a base plate, the last fixed surface of bottom plate is connected with the fixed column, the case is placed to the top fixedly connected with of fixed column, the top left side of placing the case is rotated and is connected with the pivot, pivot and apron fixed connection, the right side fixedly connected with handle of apron. This adopt multichannel DDS chip base plate integrated circuit packaging structure, through vertical removal lift the board, it drives the connecting plate through solid fixed ring to lift the board, thereby make the bull stick deflect, the bull stick makes movable plate horizontal migration, the distance of two sets of splint has been realized adjusting according to integrated circuit length, through promoting the baffle, the baffle drives picture peg horizontal migration, the picture peg extrudees the spring, thereby make fixed plate and picture peg separation, upwards lift the handle, open the apron, be convenient for encapsulate integrated circuit, be convenient for maintain integrated circuit.

Description

Substrate integrated circuit packaging structure adopting multichannel DDS chip

Technical Field

The utility model relates to an integrated circuit technical field specifically is an adopt multichannel DDS chip base plate integrated circuit packaging structure.

Background

The integrated circuit is a miniature electronic device or component, and adopts a certain process, and the elements of transistor, resistor, capacitor and inductor, etc. required in a circuit and wiring are interconnected together, and made on one small or several small semiconductor wafers or medium substrates, then packaged in a tube shell to obtain the miniature structure with required circuit function.

SUMMERY OF THE UTILITY MODEL

Technical problem to be solved

The utility model provides a not enough to prior art, the utility model provides an adopt multichannel DDS chip base plate integrated circuit packaging structure, it is poor to integrated circuit's packaging effect to have solved current integrated circuit packaging structure, and the practicality is not enough to current integrated circuit packaging structure is comparatively loaded down with trivial details, just too slow problem to the speed of integrated circuit encapsulation to the operation.

(II) technical scheme

In order to achieve the above object, the utility model provides a following technical scheme: a multi-channel DDS chip substrate integrated circuit packaging structure comprises a bottom plate, wherein a fixed column is fixedly connected to the upper surface of the bottom plate, a placing box is fixedly connected to the top of the fixed column, a rotating shaft is rotatably connected to the left side of the top of the placing box and fixedly connected with a cover plate, a handle is fixedly connected to the right side of the cover plate, an operating plate is fixedly connected to the inner wall of the bottom of the placing box and slidably connected with a moving plate, a clamping plate is fixedly connected to the upper surface of the moving plate, two groups of rotating rods are rotatably connected to the bottom of the moving plate, the other ends of the rotating rods are rotatably connected with a connecting plate, the connecting plate is fixedly connected with a fixed ring, the fixed ring is slidably connected with the fixed column, the connecting plate is fixedly connected with a lifting plate, the lifting plate is slidably connected with an inserting rod, and the front end of the inserting rod is fixedly connected with a hand wheel, the right side fixedly connected with fixed plate of apron, the other end and the fixed slot of fixed plate are pegged graft, the inside of fixed slot is provided with the spring, the other end and the picture peg fixed connection of spring, picture peg and baffle fixed connection.

Preferably, jacks are arranged on the front side of the fixed column, the number of the jacks is six, the six groups of jacks are uniformly arranged on the front side of the fixed column at equal intervals, the diameters of the jacks are matched with the diameter of the inserted rod, and the jacks are inserted into the rear end of the inserted rod.

Preferably, two groups of grooves are formed in the left side and the right side of the operating plate respectively, the widths of the grooves are matched with the width of the moving plate, and the grooves are in sliding connection with the moving plate.

Preferably, the fixed plate is of an L-shaped structure, a first groove is formed in one end of the fixed plate, the width of the first groove is matched with that of the inserting plate, and the first groove is inserted into the inserting plate.

Preferably, the splint are of a concave structure, the sponge layer is arranged on the inner surface of the splint, and the size of the sponge layer is matched with that of the splint.

Preferably, the equal fixedly connected with connecting plate in solid fixed ring's the left and right sides, two sets of connecting plates set up about solid fixed ring's centrosymmetry, and the rear end of inserted bar passes solid fixed ring and pegs graft with the jack.

(III) advantageous effects

Compared with the prior art, the utility model provides an adopt multichannel DDS chip base plate integrated circuit packaging structure possesses following beneficial effect:

1. this adopt multichannel DDS chip base plate integrated circuit packaging structure, through vertical removal lift the board, it drives the connecting plate through solid fixed ring to lift the board, thereby make the bull stick deflect, the bull stick makes movable plate horizontal migration, the distance of two sets of splint has been realized adjusting according to integrated circuit length, through promoting the baffle, the baffle drives picture peg horizontal migration, the picture peg extrudees the spring, thereby make fixed plate and picture peg separation, upwards lift the handle, open the apron, be convenient for encapsulate integrated circuit, be convenient for maintain integrated circuit.

2. This adopt multichannel DDS chip base plate integrated circuit packaging structure, through the cooperation of jack and inserted bar, it is fixed with the fixed ring to fixed to the movable plate, avoided the movable plate to remove at will, improved fixed stability, through setting up the handle, be convenient for opening and closing of apron, improved the practicality of device, be L shape structure through the fixed plate, the one end of fixed plate is provided with first groove, the width in first groove and the width looks adaptation of picture peg, first groove is pegged graft with the picture peg, be convenient for encapsulate integrated circuit.

3. This adopt multichannel DDS chip base plate integrated circuit packaging structure is the spill structure through splint, and the internal surface of splint is provided with the sponge layer, and the size and the splint size looks adaptation on sponge layer have prolonged integrated circuit's life, and two sets of recesses have been seted up respectively to the left and right sides of operation panel, the width of recess and the width looks adaptation of movable plate, recess and movable plate sliding connection for the movable plate moves not squint on the route of regulation.

Drawings

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is a schematic view of the structure of the fixing column of the present invention;

fig. 3 is a schematic view of the sectional structure of the fixing groove of the present invention.

In the figure: 1. a base plate; 2. fixing a column; 3. placing a box; 4. a cover plate; 5. lifting the plate; 6. a handle; 7. a fixing plate; 8. a baffle plate; 9. an operation panel; 10. a splint; 11. a rotating shaft; 12. moving the plate; 13. a rotating rod; 14. a fixing ring; 15. inserting a rod; 16. a hand wheel; 17. a connecting plate; 18. a jack; 19. a spring; 20. inserting plates; 21. and fixing the grooves.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-3, the present invention provides a technical solution: a multi-channel DDS chip substrate integrated circuit packaging structure comprises a bottom plate 1, wherein a fixed column 2 is fixedly connected to the upper surface of the bottom plate 1, a placing box 3 is fixedly connected to the top of the fixed column 2, a rotating shaft 11 is rotatably connected to the left side of the top of the placing box 3, the rotating shaft 11 is fixedly connected with a cover plate 4, the placing box 3 is in contact with the cover plate 4, the width of the placing box 3 is matched with the width of the cover plate 4, a handle 6 is fixedly connected to the right side of the cover plate 4, an operating plate 9 is fixedly connected to the inner wall of the bottom of the placing box 3, the operating plate 9 is in sliding connection with a movable plate 12, a clamping plate 10 is fixedly connected to the upper surface of the movable plate 12, two groups of rotating rods 13 are rotatably connected to the bottom of the movable plate 12, the other ends of the rotating rods 13 are rotatably connected with a connecting plate 17, the connecting plate 17 is fixedly connected with a fixed ring 14, the fixed ring 14 is in sliding connection with the fixed column 2, and the diameter of the fixed ring 14 is matched with the diameter of the fixed column 2, the connecting plate 17 is fixedly connected with the lifting plate 5, the lifting plate 5 is slidably connected with the insertion rod 15, the front end of the insertion rod 15 is fixedly connected with the hand wheel 16, the right side of the cover plate 4 is fixedly connected with the fixing plate 7, the other end of the fixing plate 7 is inserted into the fixing groove 21, a spring 19 is arranged inside the fixing groove 21, the spring 19 is made of alloy spring steel, the other end of the spring 19 is fixedly connected with the insertion plate 20, the insertion plate 20 is fixedly connected with the baffle plate 8, and the height of the baffle plate 8 is larger than that of the fixing groove 21.

Specifically, in order to fix fixed ring 14, the front face provided with fixed column 2 is provided with jacks 18, the number of jacks 18 is six, six groups of jacks 18 are equidistantly and uniformly arranged on the front face of fixed column 2, the diameters of jacks 18 are matched with the diameter of inserted bar 15, jacks 18 are inserted into the rear end of inserted bar 15, the height of fixed ring 14 is limited, and the use convenience is improved.

Specifically, in order to ensure the stable movement of the moving plate 12, two sets of grooves are respectively formed on the left side and the right side of the operating plate 9, the widths of the grooves are matched with the width of the moving plate 12, and the grooves are slidably connected with the moving plate 12, so that the moving plate 12 does not move on a specified route.

Specifically, in order to fix the fixing plate 7, the fixing plate 7 is provided with an L-shaped structure, one end of the fixing plate 7 is provided with a first groove, the width of the first groove is matched with the width of the inserting plate 20, and the first groove is inserted into the inserting plate 20, so that the integrated circuit is conveniently packaged.

Specifically, in order to protect the integrated circuit, the clamping plate 10 is arranged to be of a concave structure, the sponge layer is arranged on the inner surface of the clamping plate 10, and the size of the sponge layer is matched with that of the clamping plate 10, so that the service life of the integrated circuit is prolonged.

Specifically, in order to improve the practicality of the device, the left and right sides of the fixing ring 14 are fixedly connected with connecting plates 17, the two groups of connecting plates 17 are symmetrically arranged about the center of the fixing ring 14, and the rear end of the inserting rod 15 penetrates through the fixing ring 14 to be inserted into the inserting hole 18.

When the integrated circuit packaging box is used, the baffle plate 8 is pushed to one side close to the placing box 3, the baffle plate 8 drives the inserting plate 20 to move horizontally, the inserting plate 20 extrudes the spring 19 and is separated from the fixing plate 7, the handle 6 is lifted to the left upper side, the handle 6 drives the right end of the cover plate 4 to deflect by taking the connecting end of the cover plate 4 and the rotating shaft 11 as a supporting point, so that the cover plate 4 is opened, otherwise, the integrated circuit packaging is realized, the integrated circuit is convenient to disassemble and assemble, the integrated circuit board is placed on the upper surface of the operating plate 9, the lifting plate 5 is moved in the vertical direction, the lifting plate 5 drives the connecting plate 17 and the fixing ring 14 to simultaneously lift, the fixing ring 14 slides under the limit of the fixing column 2, the rotating rod 13 deflects at the moment, the other end of the rotating rod 13 pushes the moving plate 12 to move horizontally under the limit of the operating plate 9, so that the distance between the two groups of clamping plates 10 is adjusted according to the length of the integrated circuit board, therefore, the integrated circuit board is fixed, the hand wheel 16 is held by hand, the inserting rod 15 is pushed to one side close to the inserting hole 18, the inserting rod 15 is inserted into the inserting hole 18, the fixing ring 14 is fixed, and the instability of the clamping plate 10 is avoided.

In conclusion, in the multichannel DDS chip substrate integrated circuit packaging structure, the lifting plate 5 is vertically moved, the lifting plate 5 drives the connecting plate 17 to lift through the fixing ring 14, so that the rotating rod 13 deflects, the rotating rod 13 horizontally moves the moving plate 12, the distance between the two groups of clamping plates 10 is adjusted according to the length of an integrated circuit, the baffle 8 drives the inserting plate 20 to horizontally move by pushing the baffle 8, the inserting plate 20 extrudes the spring 19, so that the fixing plate 7 is separated from the inserting plate 20, the handle 6 is lifted upwards, the cover plate 4 is opened, the integrated circuit is conveniently packaged, the integrated circuit is conveniently maintained, the fixing ring 14 is fixed through the matching of the inserting hole 18 and the inserting rod 15, so that the moving plate 12 is fixed, the moving plate 12 is prevented from moving randomly, the fixing stability is improved, the opening and closing of the cover plate 4 are facilitated through the arrangement of the handle 6, and the practicability of the device is improved, it is L shape structure to be through fixed plate 7, the one end of fixed plate 7 is provided with first groove, the width in first groove and the width looks adaptation of picture peg 20, first groove is pegged graft with picture peg 20, be convenient for encapsulate integrated circuit, splint 10 is the spill structure, splint 10's internal surface is provided with the sponge layer, the size on sponge layer and splint 10's size looks adaptation, integrated circuit's life has been prolonged, two sets of recesses have been seted up respectively to the left and right sides of operation panel 9, the width of recess and the width looks adaptation of movable plate 12, recess and movable plate 12 sliding connection, make movable plate 12 move on the route of regulation and do not squint.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides an adopt multichannel DDS chip base plate integrated circuit packaging structure, includes bottom plate (1), its characterized in that: the upper surface of the bottom plate (1) is fixedly connected with a fixed column (2), the top of the fixed column (2) is fixedly connected with a placing box (3), the left side of the top of the placing box (3) is rotatably connected with a rotating shaft (11), the rotating shaft (11) is fixedly connected with a cover plate (4), the right side of the cover plate (4) is fixedly connected with a handle (6), the inner wall of the bottom of the placing box (3) is fixedly connected with an operating plate (9), the operating plate (9) is in sliding connection with a movable plate (12), the upper surface of the movable plate (12) is fixedly connected with a clamping plate (10), the bottom of the movable plate (12) is rotatably connected with two groups of rotating rods (13), the other end of each rotating rod (13) is rotatably connected with a connecting plate (17), the connecting plate (17) is fixedly connected with a fixed ring (14), the fixed ring (14) is in sliding connection with the fixed column (2), connecting plate (17) and lift board (5) fixed connection, lift board (5) and inserted bar (15) sliding connection, the front end and hand wheel (16) fixed connection of inserted bar (15), the right side fixedly connected with fixed plate (7) of apron (4), the other end and fixed slot (21) of fixed plate (7) are pegged graft, the inside of fixed slot (21) is provided with spring (19), the other end and picture peg (20) fixed connection of spring (19), picture peg (20) and baffle (8) fixed connection.

2. The integrated circuit package structure adopting the multichannel DDS chip substrate as recited in claim 1, wherein: the front of the fixed column (2) is provided with jacks (18), the number of the jacks (18) is six, the six groups of jacks (18) are uniformly arranged on the front of the fixed column (2) at equal intervals, the diameters of the jacks (18) are matched with the diameter of the inserted rod (15), and the jacks (18) are inserted into the rear end of the inserted rod (15).

3. The integrated circuit package structure adopting the multichannel DDS chip substrate as recited in claim 1, wherein: two groups of grooves are formed in the left side and the right side of the operating plate (9) respectively, the width of each groove is matched with that of the moving plate (12), and the grooves are connected with the moving plate (12) in a sliding mode.

4. The integrated circuit package structure adopting the multichannel DDS chip substrate as recited in claim 1, wherein: the fixing plate (7) is of an L-shaped structure, a first groove is formed in one end of the fixing plate (7), the width of the first groove is matched with that of the inserting plate (20), and the first groove is inserted into the inserting plate (20).

5. The integrated circuit package structure adopting the multichannel DDS chip substrate as recited in claim 1, wherein: the splint (10) is of a concave structure, the inner surface of the splint (10) is provided with a sponge layer, and the size of the sponge layer is matched with that of the splint (10).

6. The integrated circuit package structure adopting the multichannel DDS chip substrate as recited in claim 1, wherein: the equal fixedly connected with connecting plate (17) in the left and right sides of solid fixed ring (14), two sets of connecting plates (17) set up about the central symmetry of solid fixed ring (14), and the rear end of inserted bar (15) passes solid fixed ring (14) and pegs graft with jack (18).