CN214956777U - Semiconductor device with a plurality of semiconductor chips - Google Patents

Semiconductor device with a plurality of semiconductor chips Download PDF

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Publication number
CN214956777U
CN214956777U CN202120950919.2U CN202120950919U CN214956777U CN 214956777 U CN214956777 U CN 214956777U CN 202120950919 U CN202120950919 U CN 202120950919U CN 214956777 U CN214956777 U CN 214956777U
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China
Prior art keywords
piece
connecting plate
semiconductor device
plate
support
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CN202120950919.2U
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Chinese (zh)
Inventor
张龙
黄有为
陈鲁
张嵩
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Skyverse Ltd
Shenzhen Zhongke Feice Technology Co Ltd
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Shenzhen Zhongke Feice Technology Co Ltd
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Priority to CN202120950919.2U priority Critical patent/CN214956777U/en
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Abstract

The application discloses a semiconductor device. The semiconductor device comprises a shell, a plurality of first supporting pieces, a drawing piece and a second supporting piece. The housing includes a substrate including a mounting surface. The first supporting piece is arranged on the shell to support the shell, and the distance between the first supporting piece and the mounting surface is adjustable. The drawer is movably arranged on the mounting surface. And the second support piece is connected with the drawing piece, the drawing piece can drive the second support piece to move, so that the second support piece moves between the two ends of the shell, and the distance between the second support piece and the mounting surface is adjustable. In the semiconductor device according to the embodiment of the present application, when the semiconductor device needs to be height-adjusted, if there is a first supporting member located at a dead angle, the second supporting member can be pulled out by the pulling member to adjust the distance between the second supporting member and the mounting surface, and the second supporting member is moved to the position near the first supporting member located at the dead angle to replace the first supporting member, so that the height adjustment of the semiconductor device is completed, and the work efficiency is improved.

Description

Semiconductor device with a plurality of semiconductor chips
Technical Field
The present application relates to the field of semiconductor device technology, and more particularly, to a semiconductor device.
Background
When processing a workpiece, in order to ensure the efficiency of processing the workpiece, the heights of a plurality of machine stations need to be adjusted to be the same. In the process of adjusting the machine, the height of the casters around the machine needs to be adjusted to adjust the height of the machine. However, when the machine is placed at a corner, it takes a lot of time to change the placement position of the machine to adjust the height of the caster at the corner, resulting in a reduction in work efficiency.
SUMMERY OF THE UTILITY MODEL
The embodiment of the application provides a semiconductor device.
The semiconductor device of the embodiment of the application comprises a shell, a plurality of first supporting pieces, a drawing piece and a second supporting piece. The housing includes a substrate including a mounting surface. The first supporting piece is arranged on the shell to support the shell, and the distance between the first supporting piece and the mounting surface is adjustable. The drawer is movably arranged on the mounting surface. And the second support piece is connected with the drawing piece, the drawing piece can drive the second support piece to move, so that the second support piece moves between the two ends of the shell, and the distance between the second support piece and the mounting surface is adjustable.
In the semiconductor device according to the embodiment of the present application, since the pulling member can drive the second supporting member to move between the two ends of the housing, the distance between the second supporting member and the mounting surface is adjustable, and the distances between the plurality of first supporting members and the mounting surface are also adjustable, when the semiconductor device needs to be height-adjusted, if there is a first supporting member located at a dead angle, the second supporting member can be pulled out through the pulling member to adjust the distance between the second supporting member and the mounting surface, and the second supporting member is moved to the position near the first supporting member located at the dead angle to replace the first supporting member, thereby completing height adjustment of the semiconductor device, and improving the working efficiency.
Additional aspects and advantages of embodiments of the present application will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of embodiments of the present application.
Drawings
The above and/or additional aspects and advantages of the present application will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
FIG. 1 is a schematic block diagram of a semiconductor device according to some embodiments of the present application;
FIG. 2 is a schematic block diagram of another perspective of a semiconductor device according to some embodiments of the present application;
fig. 3 is a schematic structural view of a first support of a semiconductor device according to some embodiments of the present disclosure;
FIG. 4 is a schematic view of a first rotating plate of a first support according to some embodiments of the present disclosure;
FIG. 5 is a schematic diagram of a portion of a semiconductor device according to some embodiments of the present application;
FIG. 6 is an exploded schematic view of a portion of a semiconductor device according to certain embodiments of the present application;
FIG. 7 is a schematic structural view of a first connecting plate of a second support member according to certain embodiments of the present application;
FIG. 8 is a schematic cross-sectional view of a portion of a semiconductor device according to certain embodiments of the present application;
FIG. 9 is a schematic structural view of a mounting member of a semiconductor device according to some embodiments of the present application;
fig. 10 is a schematic view of the drawer of the semiconductor device according to some embodiments of the present application.
Detailed Description
Reference will now be made in detail to embodiments of the present application, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative and are only for the purpose of explaining the present application and are not to be construed as limiting the present application.
The following disclosure provides many different embodiments or examples for implementing different features of the application. In order to simplify the disclosure of the present application, specific example components and arrangements are described below. Of course, they are merely examples and are not intended to limit the present application. Moreover, the present application may repeat reference numerals and/or letters in the various examples, such repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed. In addition, examples of various specific processes and materials are provided herein, but one of ordinary skill in the art may recognize applications of other processes and/or use of other materials.
The embodiment provides a semiconductor device 100. The semiconductor apparatus 100 includes a housing 10, a plurality of first supports 20, a drawer 30, and a second support 40. The housing 10 includes a substrate 11, and the substrate 11 includes a mounting surface 12. The first supporter 20 is disposed at the housing 10 to support the housing 10, and a distance between the first supporter 20 and the mounting surface 12 is adjustable. The drawer 30 is movably disposed on the mounting surface 12. And the second supporting member 40 is connected with the pulling member 30, the pulling member 30 can drive the second supporting member 40 to move, so that the second supporting member 40 moves between the two ends of the casing 10, and the distance between the second supporting member 40 and the mounting surface 12 can be adjusted.
In the semiconductor device 100 according to the embodiment of the present invention, since the drawer 30 can drive the second supporting member 40 to move between the two ends of the housing 10, the distance between the second supporting member 40 and the mounting surface 12 can be adjusted, and the distances between the plurality of first supporting members 20 and the mounting surface 12 can also be adjusted, when the semiconductor device 100 needs to be height-adjusted, if there is a first supporting member 20 located in a dead angle, the second supporting member 40 can be pulled out through the drawer 30 to adjust the distance between the second supporting member 40 and the mounting surface 12, and the second supporting member 40 is moved to the vicinity of the first supporting member 20 located in the dead angle to replace the first supporting member 20, so that the height adjustment of the semiconductor device 100 is completed, and the working efficiency is improved.
The following is further described with reference to the accompanying drawings.
Referring to fig. 1, a semiconductor device 100 includes a housing 10, a plurality of first supporting members 20, a drawer 30, and a second supporting member 40. The housing 10 includes a substrate 11, the substrate 11 includes a mounting surface 12, and the mounting surface 12 is a surface of the substrate 11 close to the ground. The drawer 30 is disposed on the base plate 11, and the second supporting member 40 is connected to the drawer 30.
Since the first support 20 is used to support the case 10, the base plate 11 does not directly contact the ground. The base plate 11, the ground and the first support 20 together form a receiving space for receiving the drawer 30 and the second support 40. The size of the receiving space is related to the distance between the first support 20 and the mounting surface 12, the larger the distance between the first support 20 and the mounting surface 12 is, the larger the receiving space is, and the smaller the distance between the first support 20 and the mounting surface 12 is, the smaller the receiving space is.
The substrate 11 may be a bottom wall of the housing 10, and the substrate 11 may also be disposed on the bottom wall of the housing 10. When the base plate 11 is the bottom wall of the housing 10, the drawer 30 can move on the bottom wall to drive the second supporting member 40 to move, and the base plate 11 is the bottom wall of the housing 10, so that the height of the accommodating space can be ensured to be the distance between the bottom wall and the ground, and thus, when the sufficient height is ensured to adjust the distance between the second supporting member 40 and the mounting surface 12. When the substrate 11 is disposed on the bottom wall of the housing 10, the drawer 30 moves on the mounting surface 12 of the substrate 11 to drive the second supporting member 40 to move, so as to prevent the drawer 30 from directly contacting the bottom wall, thereby preventing the bottom wall from being damaged.
As shown in fig. 2, the plurality of first supports 20 are respectively disposed at different sidewalls of the housing 10. The semiconductor device 100 includes 4 first supporting members 20, two of the first supporting members 20 are disposed at two ends of a first sidewall 101 of the housing 10, and the other two first supporting members 20 are disposed at a second sidewall 102 and a fourth sidewall 104, respectively, at this time, the first supporting member 20 is not disposed on the third sidewall 103, so that the outer surface of the third sidewall 103 is in a flat state, so that the semiconductor device 100 can be connected to other semiconductor devices 100 through the flat third sidewall 103, or directly contact with a wall surface.
Referring to fig. 3, the first support 20 includes a mounting member 21, a first connecting member 22 and a first caster 23.
The mounting member 21 is provided on a side wall of the housing 10 and extends from the side wall in a direction away from the side wall. Wherein, the part of the mounting member 21 far away from the side wall is provided with a first connection hole 212, the first connection member 22 is movably disposed in the first connection hole 212, the first caster 23 is connected with the first connection member 22, and then the first connection member 22 and the first caster 23 are far away from the side wall, so as to adjust the distance between the first caster 23 and the mounting surface 12, that is, adjust the distance between the first supporting member 20 and the mounting surface 12 by moving the first connection member 22.
Specifically, the inner surface of the first connection hole 212 is provided with an internal thread, the surface of the first connection member 22 is provided with an external thread, the first connection member 22 can be screwed in the first connection hole 212, and the user can control the moving direction of the first connection member 22 by controlling the rotating direction of the first connection member 22. For example, when the first link 22 rotates clockwise within the first connection hole 212, the first end of the first link 22 moves in a direction away from the mount 21; when the first connector 22 rotates counterclockwise in the first connection hole 212, the first end of the first connector 22 moves toward the direction approaching the mounting member 21, thereby achieving the movement of the first connector 22 in the first connection hole 212.
The first connecting member 22 is provided with a nut 221, when the first connecting member 22 is moved to a proper position, the nut 221 can be screwed with the first connecting member 22 to contact with the first surface 212 of the mounting member 21, so as to lock the first connecting member 22, at this time, the first connecting member 22 cannot move in the first connecting hole 212 continuously, and when the nut 221 is far away from the first surface 212 of the mounting member 21, the first connecting member 22 can move in the first connecting hole 212 continuously. Since the first caster 23 is connected to the first link 22, when the first link 22 is moved, the distance between the first caster 23 and the mounting surface 12 of the base plate 11 can be adjusted, and thus the distance between the first supporter 20 and the mounting surface 12 can be adjusted. The nut 221 can control whether the first connecting member 22 can move in the first connecting hole 212, so as to ensure that the distance between the first caster 23 and the mounting member 21 can not change after the distance between the first caster 23 and the mounting member 21 is fixed, thereby ensuring the stability of the semiconductor device 100.
For example, when the first connecting member 22 rotates clockwise in the first connecting hole 212, the first end of the first connecting member 22 moves away from the mounting member 21, and the first connecting member 22 drives the first caster 23 to move away from the mounting surface 12, i.e. the distance between the first support 20 and the mounting surface 12 gradually increases. For another example, when the first connecting member 22 rotates counterclockwise in the first connecting hole 212, the first end of the first connecting member 22 moves toward the direction approaching the mounting member 21, and the first connecting member 22 drives the first caster 23 to approach the mounting surface 12. I.e., the distance between the first support 20 and the mounting surface 12 gradually decreases.
The first caster 23 includes a first mounting plate 231, a first rotating plate 232, and a first pulley 233, and the first caster 23 is used to move the semiconductor apparatus 100.
Specifically, the first face 2310 of the first mounting plate 231 is provided with a first mounting groove 2311, the first caster 23 may be coupled with the first link 22 through the first mounting groove 2311, and the first rotation plate 232 is disposed at the second face 2312 of the first mounting plate 231. A first connecting groove 2321 (as shown in fig. 4) is formed on a surface of the first rotating plate 232 connected to the first pulley 233, the first pulley 233 can be connected to the first rotating plate 232 through the first connecting groove 2321, and the first pulley 233 can rotate in the first connecting groove 2321, so that the first pulley 233 rotates relative to the first rotating plate 232 and the first mounting plate 231, and the rolling direction of the first pulley 233 can be changed, thereby enabling the semiconductor device 100 to move to any position through the first pulley 233.
Referring to fig. 5 and 6, in some embodiments, the semiconductor device 100 further includes a supporting plate 50.
Referring to fig. 1 and 2, two ends of the supporting plate 50 are respectively disposed on the two opposite side walls 13 and 14 of the housing 10, that is, two ends of the supporting plate 50 are respectively disposed on the first side wall 101 and the third side wall 103 of the housing 10, and since the substrate 11 is disposed inside the housing 10, a distance is left between the supporting plate 50 and the substrate 10 to prevent the supporting plate 50 from directly contacting the substrate 10. When the semiconductor apparatus 100 includes the support plate 50, the drawer 30 and the second support 40 are disposed on the support plate 50.
The surface of the supporting plate 50 away from the substrate 11 is provided with a sliding slot 51, the extending direction of the sliding slot 51 is arranged along a first direction or a second direction, the first direction is perpendicular to the second direction, and the drawer 30 is movably arranged in the sliding slot 51. Wherein the first direction is parallel to the short side direction or the long side direction of the substrate 11.
For example, when the substrate 11 is rectangular, the short side direction is the direction in which the short side of the substrate 11 is located, and the long side direction is the direction in which the long side of the substrate 11 is located. When the first direction is parallel to the short side direction of the substrate 11, the second direction is parallel to the long side direction of the substrate 11. When the first direction is parallel to the long side direction of the substrate 11, the second direction is parallel to the short side direction of the substrate 11. In one embodiment, when the sliding slot 51 extends along the short side direction of the base plate 11, the drawer 30 can move along the short side direction of the base plate 11 to drive the second supporting member 40 to move between two ends of the short side direction of the base plate 11. In another embodiment, when the sliding slot 51 extends along the long side direction of the substrate 11, the drawer 30 can move along the long plate direction of the substrate 11 to drive the second supporting member 40 to move between two ends of the substrate 11 in the long side direction. In another embodiment, the sliding slot 51 may also extend along a diagonal direction of the base plate 11, and the drawer 30 may move along the diagonal direction of the base plate 11, so as to drive the second support 40 to move between two opposite corners of the base plate 11.
A plurality of openings 511 are opened on the surface of the slide groove 51, and the extending direction of the plurality of openings 511 coincides with the extending direction of the slide groove 51. The number of the openings 511 may be one or more, for example, 2, 3, 4, or more. For example, when the number of the openings 511 is 2, the 2 openings 511 are symmetrical about the center of the slide groove 51; when the number of the openings 511 is 3 or more, the plurality of openings 511 are equally spaced in the slide groove 51.
Referring to fig. 6, the second supporting member 40 includes a first connecting plate 41, a second connecting plate 42 and a second caster 43.
The first connecting plate 41 is movably disposed in the sliding slot 51, the first connecting plate 41 includes a connecting surface 410, a surface of the first connecting plate 41 away from the sliding slot 51 is the connecting surface 410, the second connecting plate 42 is disposed on the connecting surface 410, and the second caster 43 is connected to the second connecting plate 42. In some embodiments, balls may be fixedly installed on both sidewalls of the sliding groove 51, both sidewalls of the first connecting plate 41 may simultaneously contact with the balls, thereby realizing rolling friction, and the balls may engage the first connecting plate 41 in the sliding groove 51 to prevent the first connecting plate 41 from falling off from the sliding groove 51.
In some embodiments, the first connection plate 41 may be provided with a first threaded hole, the second connection plate 42 may be provided with a second threaded hole corresponding to the first threaded hole, and a screw may simultaneously penetrate through the first threaded hole and the second threaded hole and be screwed with a nut, so that the second connection plate 42 is disposed on the connection surface 410. Wherein, on the first connecting plate 41, the surface opposite to the connecting surface 410, that is, the surface of the first connecting plate 41 contacting with the sliding slot 51, is provided with a groove, the groove corresponds to the position of the first threaded hole, when the screw is completely screwed in the first threaded hole, the head of the screw is completely sunk in the groove, so that the surface of the first connecting plate 41 opposite to the connecting surface 410 is in a flat state, thereby ensuring that the first connecting plate 41 can be flatly arranged in the sliding slot 51.
Referring to fig. 7, the first connecting plate 41 further includes a main body 411 and a protrusion 412, the main body 411 is disposed in the sliding slot 51, the protrusion 412 is disposed on a surface of the main body 411 contacting the second connecting plate 42 or a side wall of the main body 411, and the protrusion 412 extends from the main body 411 in a direction away from the supporting plate 50. When the protruding portion 412 is provided on the surface of the body portion 411 that contacts the second connecting plate 42, the protruding portion 412 is provided on the connecting face 410 of the first connecting plate 41. The protrusion 412 is provided with a plurality of first holes 4121, a portion of the drawer 30 connected to the protrusion 412 is provided with a plurality of second holes 323 (as shown in fig. 9), the number of the first holes 4121 is the same as the number of the second holes 323, and the position of the first holes 4121 corresponds to the position of the second holes 323. For example, when the number of the first holes 4121 is one, the number of the second holes 323 is one; when the number of the first holes 4121 is two, the number of the second holes 323 is two.
In one embodiment, screws may be simultaneously inserted through the first hole 4121 and the second hole 323 and screwed with nuts to detachably couple the first coupling plate 41 with the drawer 30. In another embodiment, the first hole 4121 and the second hole 323 are threaded and screws can be simultaneously screwed into the first hole 4121 and the second hole 323 to removably couple the first connector plate 41 to the drawer 30. Furthermore, the first connecting plate 41 is detachably connected to the drawer 30, so as to facilitate later cleaning, maintenance or replacement of the drawer 30. Since the first connecting plate 41 is connected to the second connecting plate 42 and the second caster 43 is connected to the second connecting plate 42, when the drawer 30 moves in the sliding slot 51, the drawer 30 drives the first connecting plate 41 to move, so as to drive the second connecting plate 42 and the second caster 43 to move.
In the embodiment of the present application, the protrusion 412 is used to connect the drawer 30, so that the drawer 30 is connected to the body 411, and the protrusion 412 extends from the body 411 to a direction away from the supporting plate 50, so that when the drawer 30 is pulled to move in the sliding slot 51, only the portion of the drawer 30 connected to the protrusion 412 will rub against the sliding slot 51, and the other portion of the drawer 30 will also move away from the supporting plate 50, thereby reducing the friction between the drawer 30 and the sliding slot 51.
The distance between the second connecting plate 42 and the first connecting plate 41 is adjustable, and the second caster 43 is connected to the second connecting plate 42, so that when the second connecting plate 42 is far away from the first connecting plate 41, the second connecting plate 42 can drive the second caster 43 to be far away from the first connecting plate 41, and when the second connecting plate 42 is close to the first connecting plate 41, the second connecting plate 42 can drive the second caster 43 to be close to the first connecting plate 41.
Specifically, referring to fig. 6, the second supporting member 40 further includes a second connecting member 44, the first connecting plate 41 is provided with a second connecting hole 413, specifically, the second connecting hole 413 is provided on the main body 411, and the second connecting plate 42 is provided with a third connecting hole 421. The second connecting member 44 is inserted through the second connecting hole 413 and the third connecting hole 421, and the second connecting member 44 can move relative to the mounting surface, so as to change the distance between the second connecting plate 42 and the first connecting plate 41. The positions of the second connection hole 413 and the third connection hole 421 correspond to each other, and the number of the second connection hole 413 and the number of the third connection hole 421 may be multiple and the numbers are the same. For example, when the number of the second connection holes 413 is one, the number of the third connection holes 421 is one; when the number of the second connection holes 413 is two, the number of the third connection holes 421 is two. When the number of the second connection holes 413 and the third connection holes 421 is plural, the number of the second connection members 44 is plural.
As shown in fig. 8, when the second connecting member 44 is inserted into the second connecting hole 413 and the third connecting hole 421, the first end 441 of the second connecting member 44 is also inserted into the opening 511 on the surface of the sliding slot 51, and the number of the second connecting members 44 is equal to the number of the openings 511. The distance between the supporting plate 50 and the substrate 10 is the maximum distance that the second connecting member 44 can move after penetrating the opening 511. When the drawer 30 moves in the sliding slot 51 to drive the second supporting element 40 to move in the sliding slot 51, the second connecting element 44 also moves in the opening 511 along the extending direction of the sliding slot 51, and the plurality of second connecting elements 44 can limit the second supporting element 40 to move on the sliding slot 51 without shaking. When it is necessary to adjust the distance between the first connecting plate 41 and the second connecting plate 42, at this time, the second connecting member 44 can move in the height direction relative to the opening 511, so as to drive the second connecting plate 42 to move away from or close to the first connecting plate 41, thereby adjusting the distance between the first connecting plate 41 and the second connecting plate 42.
More specifically, the surface of the second connecting member 44 is provided with a screw thread, the second connecting hole 413 is a screw hole, the third connecting hole 421 is a fixing hole, and the second connecting member 44 is screwed into the second connecting hole 413 and is fixed in the third connecting hole 421. At this time, since the first connection plate 41 and the second connection plate 42 are fixed by the screw and nut engagement, it is necessary to first loosen the nut so that the distance between the first connection plate 41 and the second connection plate 42 can be adjusted, and by rotating the second connection member 44, the screw of the second connection member 44 and the screw hole of the second connection hole 413 are engaged with each other so that the second connection member 44 can be moved in the height direction, thereby adjusting the distance between the second connection member 44 and the mounting surface. The third connecting hole 421 is a fixing hole, and therefore, the second connecting member 44 is fixedly connected to the second connecting plate 42, and when the second connecting member 44 moves in the height direction, the second connecting plate 42 is driven to move in the height direction, so that the distance between the second connecting plate 42 and the mounting surface is adjustable, and the first connecting plate 41 is located between the mounting surface and the second connecting plate 42, that is, the distance between the first connecting plate 41 and the second connecting plate 42 is adjustable. The second connecting member 44 may be a fastener such as a jackscrew, a screw, or a screw.
For example, when the second connecting element 44 is rotated clockwise, the first end 441 of the second connecting element 44 is close to the first connecting plate 41, the second connecting element 44 drives the second connecting plate 42 to move away from the first connecting plate, and when the first end 441 of the second connecting element 44 is completely located in the second connecting hole 413, the first end 441 of the second connecting element 44 cannot be close to the first connecting plate 41. For another example, when the second connecting member 44 is rotated counterclockwise, the first end 441 of the second connecting member 44 is far from the first connecting plate 41, the second connecting plate 42 is gradually close to the first connecting plate 41, and when the first connecting plate 41 and the second connecting plate 42 are in contact, the first end 441 of the second connecting member 44 can no longer be far from the first connecting plate 41.
Wherein, after adjusting the distance between first connecting plate 41 and the second connecting plate 42 for suitable distance, then can lock again with screw complex nut, at this moment, the distance between first connecting plate 41 and the second connecting plate 42 can not readjust, thereby guarantee after fixing the distance between first connecting plate 41 and the second connecting plate 42, the distance between first connecting plate 41 and the second connecting plate 42 can not change again, namely the distance between second truckle 43 and backup pad 50 can not change again, thereby guarantee semiconductor device 100's stability. With continued reference to fig. 6, the second caster 43 includes a second rotating plate 431 and a second pulley 432.
Specifically, the second rotating plate 431 is disposed on the second connecting plate 42, that is, the second caster 43 is connected to the second connecting plate 42 through the second rotating plate 431, a second connecting groove 4311 is formed on a surface of the second rotating plate 431 connected to the second pulley 432, the second pulley 432 is connected to the second rotating plate 431 through the second connecting groove 4311, and the second pulley 432 is rotatable in the second connecting groove 4311, so that the second pulley 432 rotates relative to the second rotating plate 431, and the rolling direction of the second pulley 432 can be changed, thereby enabling the semiconductor device 100 to move to any position through the cooperation of the first pulley 233 and the second pulley 432.
Referring to fig. 5 and 6, in some embodiments, the semiconductor apparatus 100 includes two platens 60. The pressing plate 60 is disposed on the supporting plate 50 and is used for bearing the first connecting plate 41, the second connecting plate 42 is located between the two pressing plates 60, and the first connecting plate 41 and the second connecting plate 42 can move between the two pressing plates 60 along the extending direction in the sliding groove 51.
When the second supporting member 40 is disposed in the sliding slot 51, the second supporting member 40 tends to move away from the sliding slot 51 under the influence of gravity, however, the second supporting member 40 needs to adjust the distance between the second caster 43 and the supporting plate 50 by adjusting the distance between the second connecting plate 42 and the first connecting plate 41, so as to adjust the height of the second caster 43. Therefore, in order to satisfy the requirement that the second supporting member 40 does not fall off from the sliding slot 51, the distance between the second caster 43 and the supporting plate 50 in the second supporting member 40 is adjustable, and the second supporting member 40 can be driven by the drawer 30 to move in the sliding slot 51, it is necessary to ensure that the first connecting plate 41 can move in the sliding slot 51 while shielding the first connecting plate 41 in the sliding slot 51.
Specifically, after the first connecting plate 41 is disposed in the sliding slot 51, the two pressing plates 60 are disposed on the two top walls 52 of the supporting plate 50, respectively, and the width of the pressing plates 60 is greater than that of the top walls 52 to block a portion of the sliding slot 51, so as to form a receiving cavity with the sliding slot 51, and the first connecting plate 41 is received in the receiving cavity. And the width of second connecting plate 42 is less than the distance between two clamp plates 60 to when guaranteeing that second connecting plate 42 sets up on first connecting plate 41, second connecting plate 42 can not be sheltered from by clamp plate 60, thereby satisfy simultaneously that the distance between first connecting plate 41 and the second connecting plate 42 is adjustable, and first connecting plate 41 can move in spout 51 in order to drive and remove with second connecting plate 42, thereby realize that the distance between second support piece 40 and backup pad 50 is adjustable while, second support piece 40 can also move in spout 51.
Referring to fig. 5, 6 and 9, in some embodiments, the semiconductor apparatus 100 further includes a fixing member 70.
The fixing member 70 is provided with a fixing hole 71, and the drawer 30 penetrates through the fixing hole 71 and is connected with the second supporting member 40. Specifically, the fixing member 70 is disposed at the first end 53 of the supporting plate 50 and covers the drawer 30 such that the drawer 30 penetrates the fixing hole 71. Because the fixing piece 70 is fixedly connected with the supporting plate 50, after the drawer 30 is arranged in the fixing hole 71 in a penetrating manner, the fixing piece 70 can bear the drawer 30, on one hand, the drawer 30 can be prevented from being directly contacted with the ground, so that the tidiness of the drawer 30 is ensured, the service life of the drawer 30 is prolonged, on the other hand, when the drawer 30 moves in the sliding groove 51, the drawer 30 is constantly in a horizontal state, so that the drawer 30 can be pulled, and the use experience of a user is improved.
Referring to fig. 5, 6 and 10, the drawer 30 includes a drawer body 31 and a connecting portion 32.
The drawing body 31 is connected with the first end 321 of the connecting portion 32 and fixed by the fixing member 70, and the second end 322 of the connecting portion 32 is connected with the second supporting member 40. When the pulling body 31 is pulled, the pulling body 31 can drive the connecting portion 32 to move in the sliding slot 51, so as to drive the second supporting member 40 to move in the sliding slot 51. Since the third sidewall 103 of the case 10 is not mounted with the first support 20, the semiconductor device 100 may be connected to other semiconductor devices 100 through the third sidewall 103 or may be in contact with a wall surface. However, when the semiconductor device 100 is located in a position where the semiconductor device 100 is simultaneously connected to a plurality of semiconductor devices 100 or in a corner, the first support 20 located in the center of the connection of the plurality of semiconductor devices 100 or the first support 20 located in the corner cannot adjust the height of the semiconductor device 100 without moving the semiconductor device 100. At this time, the other 3 first support members 20 capable of adjusting the distance between the first support member and the mounting surface 12 of the substrate 11 may be adjusted, and then the drawer 30 is pulled to drive the second support member 40 to extend from the third side wall 103 to the first side wall 101, so as to adjust the distance between the second support member 40 and the mounting surface 12, and after the distance is matched with the other 3 first support members 20, the second support member 40 may be pushed back to the third side wall 103 through the drawer 30, and at this time, the second support member 40 may replace the first support member 20 that cannot be adjusted, so as to complete the adjustment of the height of the semiconductor device 100.
As shown in fig. 10, the slot 311 is disposed on the drawer body 31, when the drawer body 31 is pulled, a user can pull the drawer body 31 to move in the sliding slot 51 by grasping the slot 311, so as to drive the second support member 40 to move in the sliding slot 51, thereby improving the convenience of pulling the drawer 30.
The second end 322 of the connecting portion 32 is opened with a second hole 323, and the second end 322 of the connecting portion 32 is matched with the first hole 4121 of the protrusion 412 of the first connecting plate 41 through the second hole 323, so as to be connected with the protrusion 412 of the first connecting plate 41, thereby realizing the connection between the connecting portion 32 and the second supporting member 40. The connecting portion 32 extends from the drawing body 31 toward the supporting plate 50, so that the distance between the connecting portion 32 and the supporting plate 50 is smaller than the distance between the drawing body 31 and the supporting plate 50, the end of the drawing body 31 connected to the connecting portion 32 is supported by the connecting portion 32, the end of the drawing body 31 connected to the fixing member 70 is supported in the fixing hole 71 by the fixing member 70, so that the drawing body 31 does not directly contact with the sliding slot 51, only a part of the connecting portion 32 of the drawing member 30 directly contacts with the sliding slot 51, and friction generated between the drawing member 30 and the sliding slot 51 is reduced.
In the description herein, reference to the terms "certain embodiments," "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples" means that a particular feature, structure, material, or characteristic described in connection with the embodiments or examples is included in at least one embodiment or example of the application. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one feature. In the description of the present application, "a plurality" means at least two, e.g., two, three, unless specifically limited otherwise.
Although embodiments of the present application have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present application, and that variations, modifications, substitutions and alterations of the above embodiments may be made by those of ordinary skill in the art within the scope of the present application, which is defined by the claims and their equivalents.

Claims (11)

1. A semiconductor device, comprising:
a housing comprising a substrate comprising a mounting surface;
a plurality of first supports provided at the housing to support the housing, a distance between the first supports and the mounting surface being adjustable;
the drawing piece is movably arranged on the mounting surface; and
the second support piece is connected with the drawing piece, the drawing piece can drive the second support piece to move, so that the second support piece moves between the two ends of the shell, and the distance between the second support piece and the mounting surface is adjustable.
2. The semiconductor apparatus of claim 1, wherein the first support comprises:
the mounting piece is arranged on the side wall of the shell and provided with a first connecting hole;
the first connecting piece is movably arranged in the first connecting hole;
the first caster is connected with the first connecting piece, the first caster is used for moving the semiconductor equipment, and the first connecting piece can drive the first caster to be close to or far away from the mounting piece when moving.
3. The semiconductor device of claim 1, comprising a support plate disposed on a side wall of the housing, wherein the support plate defines a sliding slot, and the drawer is movably disposed in the sliding slot.
4. The semiconductor apparatus according to claim 3, wherein the chute extends in a first direction or a second direction, the first direction and the second direction being perpendicular, the first direction being parallel to a short side direction or a long side direction of the substrate.
5. The semiconductor device according to claim 3 or 4, wherein a plurality of openings are formed in the chute, and the direction of extension of the openings coincides with the direction of extension of the chute.
6. The semiconductor device according to claim 3 or 4, wherein the second support member comprises:
the first connecting plate is movably arranged in the sliding groove and comprises a connecting surface, and the first connecting plate is connected with the pull-out piece;
the second connecting plate is arranged on the connecting surface; and
and the second caster is connected with the second connecting plate.
7. The semiconductor device according to claim 6, wherein the first connecting plate includes a body portion and a projection portion provided on a surface of the body portion in contact with the second connecting plate or a side wall of the body portion, the projection portion extending from the body portion in a direction away from the support plate, the projection portion being connected to the drawer.
8. The semiconductor device as claimed in claim 6, wherein the first connecting plate has a second connecting hole, the second connecting plate has a third connecting hole, the second connecting hole and the third connecting hole correspond to each other in position, the second support further comprises a second connecting member, the second connecting member is inserted through the second connecting hole and the third connecting hole, and the second connecting member is movable relative to the mounting surface to change a distance between the second connecting plate and the first connecting plate.
9. The semiconductor device according to claim 6, characterized in that the semiconductor device comprises:
the two pressing plates are arranged on the supporting plate and used for bearing the first connecting plate, the second connecting plate is located between the two pressing plates, and the first connecting plate and the second connecting plate can move between the two pressing plates along the extending direction of the sliding groove.
10. The semiconductor device according to claim 3, further comprising:
the fixing piece is provided with a fixing hole, and the pull-out piece penetrates through the fixing hole and is connected with the second supporting piece.
11. The semiconductor device of claim 10, wherein the drawer comprises:
the drawing body penetrates through the fixing hole;
the connecting portion is connected with the drawing body, extends towards the supporting plate from the drawing body, and is connected with the second supporting piece.
CN202120950919.2U 2021-05-06 2021-05-06 Semiconductor device with a plurality of semiconductor chips Active CN214956777U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202120950919.2U CN214956777U (en) 2021-05-06 2021-05-06 Semiconductor device with a plurality of semiconductor chips

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202120950919.2U CN214956777U (en) 2021-05-06 2021-05-06 Semiconductor device with a plurality of semiconductor chips

Publications (1)

Publication Number Publication Date
CN214956777U true CN214956777U (en) 2021-11-30

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Family Applications (1)

Application Number Title Priority Date Filing Date
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Country Status (1)

Country Link
CN (1) CN214956777U (en)

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