CN214956354U - Novel paster inductance pin - Google Patents

Abstract

The utility model relates to a novel paster inductance pin belongs to inductance application technical field, its including the connecting elements who is fixed in the magnetic core with be used for connecting external circuit's soldering tin portion, and be used for the wire winding component of fixed enameled wire terminal, soldering tin portion both ends respectively with connecting elements and wire winding component fixed connection, the wire winding component includes butt portion and wire winding portion, butt portion and soldering tin portion fixed connection, wire winding portion is fixed in the one end that butt portion kept away from soldering tin portion, and wire winding portion inwards caves in along pin width direction's both sides, the middle part of wire winding portion is buckled along pin thickness direction, the enameled wire terminal is around locating in wire winding portion. This application has the effect that improves enameled wire and metal pin fastness of being connected.

Description

Novel paster inductance pin

Technical Field

The application relates to the field of inductor application, in particular to a novel patch inductor pin.

Background

The chip inductor is an inductance element in a common packaging form, and has the functions of conducting direct current and flowing resistance alternating current in a circuit structure, isolating and filtering alternating current signals or forming a resonant circuit with a capacitor, a resistor and the like. Because of its small volume, it is favorable to miniaturization of circuit, does not interfere with other electronic components and has stable performance.

Present current chip inductor comprises magnetic core and enameled wire usually, and the magnetic core is provided with two recesses including winding portion and the connecting portion that is used for twining the enameled wire on the connecting portion, is provided with a plurality of pins that are used for electric connection external circuit in the recess, and the terminal of enameled wire twines respectively and welds on each metal pin.

To the above-mentioned correlation technique, the inventor thinks that the enameled wire in this kind of chip inductor twines in the metal pin in-process, takes place to become flexible easily, in welding process, leads to phenomenon such as rosin joint easily, can influence the quality of chip inductor, has the defect that enameled wire and metal pin are connected insecurely promptly.

SUMMERY OF THE UTILITY MODEL

In order to improve the fastness that enameled wire and metal pin are connected, this application provides a novel paster inductance pin.

The application provides a novel SMD inductor pin adopts following technical scheme:

the utility model provides a novel paster inductance pin, including the connecting elements who is fixed in the magnetic core with be used for connecting external circuit's soldering tin portion to and be used for the wire winding component of fixed enameled wire terminal, soldering tin portion both ends respectively with connecting elements and wire winding component fixed connection, the wire winding component includes butt portion and wire winding portion, butt portion and soldering tin portion fixed connection, wire winding portion is fixed in the one end that butt portion kept away from soldering tin portion, just wire winding portion inwards caves in along pin width direction's both sides, the middle part of wire winding portion is buckled along pin thickness direction, and the enameled wire terminal is around locating in the wire winding portion.

Through adopting above-mentioned technical scheme, connecting elements respectively with magnetic core and soldering tin portion fixed connection, can realize the fixed to the pin, soldering tin portion is used for spot welding to realize the electric external circuit of connecting, and be fixed in circuit structure with the paster inductance. On the enameled wire was around locating winding portion, through winding portion along the inside sunken setting of pin width direction and the setting of buckling along pin thickness direction middle part, realize spacing to the enameled wire to improved the fastness that enameled wire and pin are connected, be convenient for follow-up with enameled wire terminal soldering tin on the pin, reduced the condition emergence of influence paster inductive property such as rosin joint.

Optionally, the winding portion is provided with a concave surface and a limiting wall along both sides of the pin width direction, the enameled wire is wound along the concave surface, and the limiting wall can be abutted against the enameled wire.

Through adopting above-mentioned technical scheme, winding portion both sides all are formed with concave surface and spacing wall, and the formation of concave surface and spacing wall realizes carrying on spacingly when establishing the enameled wire, and then realizes improving the performance of chip inductor.

Optionally, the bending angle of the middle of the winding portion along the thickness direction of the pin is an obtuse angle.

Through adopting above-mentioned technical scheme, through being obtuse angle setting to the winding part, increased the area of establishing around of enameled wire, the degree of deformation of pin has been reduced in the buckling of obtuse angle degree simultaneously, prevents that the pin from leading to the fracture because excessively buckling.

Optionally, a soldering tin surface is arranged on one side of the soldering tin portion, which is far away from the magnetic core, and the middle bending direction of the winding portion is towards one side of the soldering tin surface.

Through adopting above-mentioned technical scheme, the soldering tin face is used for spot welding and external circuit to be connected, because soldering tin portion is used for with the external circuit welding, and the middle part of wire winding portion direction of buckling is for towards one side of soldering tin face, is convenient for be towards external circuit one side promptly, and the setting of this orientation is convenient for set up in the circuit in the paster inductance, has reduced the space that the paster inductance occupy, has improved the practicality of this paster inductance, has played the promotion effect to the overall arrangement in external circuit.

Optionally, the connecting member includes flanges, and the flanges are disposed on two sides of one end of the connecting member away from the solder part along the width direction of the pin.

Through adopting above-mentioned technical scheme, the pin passes through adhesive bonding with the magnetic core, glues on the lateral wall of pin thickness direction, solidifies the back at glue, and the setting of flange can play further limiting displacement to the pin, prevents that the pin from breaking away from in the magnetic core. The service life of the surface mounted inductor is prolonged.

Optionally, the connecting member is provided with relief portions on both sides in the pin width direction, one end of each relief portion is connected to the solder portion, and the other end of each relief portion is connected to the flange.

Through adopting above-mentioned technical scheme, because pin and magnetic core are through adhesive bonding, in order to put just some glue, set up the position of stepping down portion on the connecting elements, respectively formed the region of stepping down in connecting elements both sides for some glue, when pin and magnetic core cooperation set up, the glue in the region of stepping down simultaneously with pin, magnetic core fixed bonding, realize promptly being fixed in the pin on the magnetic core.

Optionally, the middle of the relief portion is bent along the thickness direction of the pin, and the bending direction of the relief portion is a right-angle bending towards the side away from the soldering tin surface.

Through adopting above-mentioned technical scheme, be the right angle and buckle let a position portion one end and magnetic core cooperation peg graft, when the other end and magnetic core surface complex, do not influence soldering tin face and external circuit's welding. And the glue dispensing area is not limited to one end matched with and spliced with the magnetic core, and also has one end matched with the surface of the magnetic core, so that the angle and the area of glue dispensing are increased, and the pin is convenient to fix on the magnetic core without influencing the installation of the chip inductor.

Optionally, the abutting portion is perpendicular to the soldering tin portion, the abutting portion is arranged at one end far away from the soldering tin surface, and the abutting portion is matched with the corresponding parallel yielding portion and used for being clamped with the magnetic core.

Through adopting above-mentioned technical scheme, butt portion and the parallel part of joint magnetic core of stepping down between the portion of correspondence for the terminal surface conflict of welding part and magnetic core is more firm, is difficult for breaking away from, further realizes the firm connection of pin on the magnetic core.

In summary, the present application includes at least one of the following beneficial technical effects:

1. the enameled wire wound on the pins can be limited on the winding part by arranging the winding part, particularly the bending of the winding part is limited, the enameled wire is further limited, and the effect of improving the firmness of the connection of the enameled wire and the pins is achieved;

2. through the arrangement of the abdicating part, the glue can be bonded with the pins while being bonded with the magnetic core, and the glue can be conveniently dispensed, so that the effect of firmly mounting the pins on the magnetic core is achieved;

3. through the setting to the flange, can increase the spacing area of pin and magnetic core after the point is glued, produced further to pin and the reinforced effect of magnetic core.

Drawings

FIG. 1 is a schematic diagram of a structure in which pins are disposed on a core according to an embodiment of the present application;

fig. 2 is a schematic diagram of an overall structure of a pin according to an embodiment of the present application.

Description of reference numerals: 1. a magnetic core; 2. a connecting member; 21. a flange; 22. a relief portion; 3. a solder portion; 31. soldering tin surface; 4. enamelled wires; 5. a winding member; 51. an abutting portion; 52. a winding part; 521. a concave surface; 522. and a limiting wall.

Detailed Description

The present application is described in further detail below with reference to figures 1-2.

The embodiment of the application discloses novel paster inductance pin. Referring to fig. 1, the novel chip inductor pin includes a connection member 2 fixed to a magnetic core 1, a soldering tin portion 3 for connecting an external circuit, and a winding member 5 for fixing a terminal of an enameled wire 4, wherein two ends of the soldering tin portion 3 are respectively fixedly connected with the connection member 2 and the winding member 5. The winding member 5 includes an abutting portion 51 and a winding portion 52, the abutting portion 51 is fixedly connected to the soldering portion 3, the winding portion 52 is fixed to one end of the abutting portion 51 far away from the soldering portion 3, the winding portion 52 is recessed inwards along two sides of the pin width direction, the winding portion 52 is bent along the middle of the pin thickness direction, and the terminal of the enameled wire 4 is wound on the winding portion 52.

Referring to fig. 1 and 2, the connecting member 2 is fixedly connected to the core 1 and the solder portion 3, respectively, so as to fix the lead; in this application, the mode that the paster inductance is connected in external circuit is soldering tin connection, and consequently soldering tin portion 3 is used for spot welding and is fixed in on the external circuit to realize the electric external circuit of connecting, and be fixed in circuit structure with the paster inductance. Enameled wire 4 is around locating winding portion 52, through winding portion 52 along the inside sunken setting of pin width direction and the setting of buckling along pin thickness direction middle part, realizes spacingly to enameled wire 4 to improved the fastness of enameled wire 4 and pin connection, be convenient for follow-up with enameled wire 4 terminal soldering tin on the pin, reduced the condition emergence of influence paster inductive property such as rosin joint.

Referring to fig. 1 and 2, because the formation of wire winding portion 52 is inwards sunken along pin width direction's both sides, consequently wire winding portion 52 all is formed with concave surface 521 and spacing wall 522 along pin width direction's both sides, enameled wire 4 winds along concave surface 521, when enameled wire 4 takes place to remove on concave surface 521, spacing wall 522 can contradict in enameled wire 4, it is spacing to carrying out around enameled wire 4 who establishes, when enameled wire 4 and pin spot welding have been reduced promptly, the condition of rosin joint appears, and then realize improving chip inductor's performance.

Referring to fig. 1 and 2, in order to prevent damage to the lead due to excessive bending of the winding portion 52, the middle portion of the winding portion 52 is bent at an obtuse angle in the thickness direction of the lead. This setting has increased enameled wire 4 around establishing the area, has played limiting displacement to enameled wire 4, and the buckling of obtuse angle degree has reduced the deformation degree of pin simultaneously, prevents that the pin from leading to the fracture or reducing its intensity because excessively buckling.

Referring to fig. 1 and 2, since the chip inductor is connected to an external circuit by using a soldering method, in order to provide a solder joint, a soldering surface 31 is disposed on a side of the soldering portion 3 away from the magnetic core 1, the soldering surface 31 is used for connecting with the external circuit by using spot welding, and the connection method has a fixing effect on the chip inductor.

Referring to fig. 1 and 2, since the soldering portion 3 is used for being connected with an external circuit, in order to prevent the chip inductor from affecting the layout of the external circuit, the winding portion 52 is toward one side of the soldering tin surface 31 along the bending direction of the middle part of the pin thickness direction, so that the occupied volume of the whole pin is reduced, and the pin cannot protrude out of the external circuit, thereby being convenient for arranging the chip inductor in the circuit, reducing the occupied space of the chip inductor, improving the practicability of the chip inductor, and promoting the layout of the external circuit.

Referring to fig. 1 and 2, in the present application, the pin and the magnetic core 1 are connected by gluing, and the gluing is performed on the sidewall of the pin in the thickness direction, so as to further fix and limit the pin, a flange 21 is provided on the connecting member 2, and the flange 21 is provided on both sides of the connecting member 2 away from one end of the soldering portion 3 along the pin width direction. After the glue is solidified, the flanges 21 on the two sides of the pin in the width direction are matched with the glue surface, so that the contact area is increased, and the pin is further limited. When external circuit condition such as bump, the cooperation of flange 21 sets up the effectual pin of having avoided and breaks away from in magnetic core 1 to promote paster inductance life, maintain the stable effect of external circuit.

Referring to fig. 1 and 2, the pins are inserted into the housing of the magnetic core 1 and then connected by gluing. In order to facilitate the connection of the pins and the magnetic core 1 in a manner of matching with glue, without affecting the connection between the chip inductor and an external circuit, the connection member 2 is provided with the yielding portions 22 along both sides of the width direction of the pins, so that the connection member 2 forms a yielding area along both sides of the width direction of the pins respectively for dispensing. The positioning portion 22 has one end connected to the solder portion 3 and the other end connected to the flange 21. When pin and magnetic core 1 cooperation set up, the glue in the region of stepping down simultaneously with pin, 1 fixed bonding of magnetic core, realize promptly being fixed in the pin on the magnetic core 1.

Referring to fig. 1 and 2, in order to increase the connection strength between the lead and the core 1, the middle portion of the relief portion 22 is bent along the thickness direction of the lead, and the bending direction is perpendicular to the side away from the solder surface 31. One end of the rectangular bent position-giving part 22 is inserted into the magnetic core 1, and the soldering of the soldering tin surface 31 and the external circuit is not affected. And, let the middle part of position portion 22 buckle for the pin is provided with let position portion 22 with the position outside the magnetic core 1 cooperation grafting department, let the one end that position portion 22 kept away from flange 21 promptly and magnetic core 1 surface cooperation, make the point glue region not be restricted to the one end of pegging graft with the magnetic core 1 cooperation, have increased the angle and the area of some glue in addition with magnetic core 1 surface cooperation one end, when being convenient for the pin to be fixed in on the magnetic core 1, do not influence the installation of chip inductor.

Referring to fig. 1 and 2, in order to further make the stability that pin and magnetic core 1 are connected, butt portion 51 is perpendicular to soldering tin portion 3 and sets up, and butt portion 51 sets up in the one end of keeping away from soldering tin face 31, butt portion 51 and the parallel portion of stepping down 22 cooperation that corresponds for with magnetic core 1 joint, make the terminal surface conflict of weld portion and magnetic core 1 more firm, be difficult for breaking away from, prevent to set up the paster electricity in circuit structure and take place to rock, further realize the firm connection of pin on magnetic core 1.

The implementation principle of this application embodiment a novel paster inductance pin does: the flange 21 and the abdication part 22 are inserted into the magnetic core 1, and the flange 21 is limited in the magnetic core 1 through dispensing, so that the pins are fixed on the magnetic core 1; the soldering tin part 3 is used for spot welding, so that an external circuit is electrically connected, and the chip inductor is fixed in a circuit structure; the terminal of enameled wire 4 is around locating along the inside sunken wire winding portion 52 of pin width direction, buckles along pin thickness direction middle part through wire winding portion 52 simultaneously to the realization is spacing to enameled wire 4. The terminal soldering tin of the enameled wire 4 on the pin is convenient to follow-up, the firmness of the connection of the enameled wire 4 and the pin is improved, and the occurrence of the condition that the induction performance of the chip is influenced by insufficient soldering and the like is reduced.

The above embodiments are preferred embodiments of the present application, and the protection scope of the present application is not limited by the above embodiments, so: all equivalent changes made according to the structure, shape and principle of the present application shall be covered by the protection scope of the present application.

Claims (8)

1. The utility model provides a novel paster inductance pin which characterized in that: including connecting elements (2) that are fixed in magnetic core (1) and soldering portion (3) that are used for connecting external circuit to and be used for wire winding component (5) of fixed enameled wire (4) terminal, soldering portion (3) both ends respectively with connecting elements (2) and wire winding component (5) fixed connection, wire winding component (5) are including butt portion (51) and wire winding portion (52), butt portion (51) and soldering portion (3) fixed connection, wire winding portion (52) are fixed in butt portion (51) and keep away from the one end of soldering portion (3), just wire winding portion (52) are inwards sunken along pin width direction's both sides, the middle part of wire winding portion (52) is buckled along pin thickness direction, and enameled wire (4) terminal is around locating on wire winding portion (52).

2. The novel chip inductor pin according to claim 1, wherein: wire winding portion (52) all are provided with concave surface (521) and spacing wall (522) along pin width direction's both sides, and enameled wire (4) are followed concave surface (521) winding, spacing wall (522) can contradict in enameled wire (4).

3. The novel chip inductor pin according to claim 1, wherein: the bending angle of the middle part of the winding part (52) along the thickness direction of the pin is an obtuse angle.

4. The novel chip inductor pin according to claim 1, wherein: one side of the soldering tin part (3) far away from the magnetic core (1) is provided with a soldering tin surface (31), and the middle bending direction of the winding part (52) faces one side of the soldering tin surface (31).

5. The novel chip inductor pin according to claim 4, wherein: the connecting component (2) comprises flanges (21), and the flanges (21) are arranged on two sides of one end, far away from the tin soldering part (3), of the connecting component (2) in the width direction of the pin.

6. The novel chip inductor pin according to claim 5, wherein: the connecting component (2) is provided with a relief part (22) along both sides of the width direction of the pin, one end of the relief part (22) is connected with the soldering tin part (3), and the other end is connected with the flange (21).

7. The novel chip inductor pin according to claim 6, wherein: the middle part of the position yielding part (22) is bent along the thickness direction of the pin, and the bending direction is that one side far away from the soldering tin surface (31) is bent at a right angle.

8. The novel chip inductor pin according to claim 7, wherein: the abutting part (51) is perpendicular to the soldering tin part (3), the abutting part (51) is arranged at one end far away from the soldering tin surface (31), and the abutting part (51) is matched with the corresponding parallel position yielding part (22) and is used for being clamped with the magnetic core (1).

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