CN214937951U - Automatic liquid feeding device for PCB electroplating - Google Patents
Automatic liquid feeding device for PCB electroplating Download PDFInfo
- Publication number
- CN214937951U CN214937951U CN202120857461.6U CN202120857461U CN214937951U CN 214937951 U CN214937951 U CN 214937951U CN 202120857461 U CN202120857461 U CN 202120857461U CN 214937951 U CN214937951 U CN 214937951U
- Authority
- CN
- China
- Prior art keywords
- electroplating
- liquid
- bath body
- electroplating bath
- fluororubber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Electroplating Methods And Accessories (AREA)
Abstract
The utility model discloses an automatic liquid feeding device of PCB electroplating, including the plating bath body, plating bath body one side is provided with the accumulator, the bottom lateral wall of accumulator is provided with the drain pipe, the drain pipe is connected with the water inlet of constant delivery pump, the delivery port intercommunication of constant delivery pump has the one end of fluid-discharge tube, the other end of fluid-discharge tube with the plating bath body communicates mutually, is located the plating bath is originally internal be provided with the liquid level inductor on the lateral wall of fluid-discharge tube, the lateral wall of accumulator is provided with the controller, the controller with constant delivery pump, liquid level inductor electricity are connected. The utility model discloses replace the manpower labour with power motion, reduced workman's operation, more effectual operating time that has utilized has improved operating quality and efficiency.
Description
Technical Field
The utility model relates to an electroplating bath field especially relates to an automatic liquid feeding device of PCB electroplating.
Background
Electroplating is a process of plating a thin layer of other metals or alloys on the surface of some metals by using the principle of electrolysis, and is a process of attaching a layer of metal film on the surface of a metal or other material workpiece by using the action of electrolysis so as to prevent metal oxidation (such as corrosion), improve wear resistance, conductivity, light reflection, corrosion resistance (such as copper sulfate) and beautify appearance, the outer layer of a plurality of coins is also electroplated, and electroplating solution contacts with air in the electroplating process to cause evaporation loss and resource loss, and the reduction of the electroplating solution can cause incomplete electroplating on the surface of the plated workpiece due to insufficient and uniform electroplating, thereby reducing the electroplating quality.
SUMMERY OF THE UTILITY MODEL
In order to solve the technical problem, the utility model provides a following technical scheme:
the utility model provides an automatic liquid adding device for PCB electroplating,
the electroplating bath comprises an electroplating bath body, wherein a liquid storage tank is arranged on one side of the electroplating bath body, electroplating liquid can be stored in the liquid storage tank, when the electroplating liquid in the electroplating bath body is reduced, the electroplating liquid in the electroplating bath body can be added through the liquid storage tank, a liquid outlet pipe is arranged on the side wall of the bottom of the liquid storage tank and is connected with a water inlet of a dosing pump, a water outlet of the dosing pump is communicated with one end of a liquid discharge pipe, the other end of the liquid discharge pipe is communicated with the electroplating bath body, a liquid level sensor is arranged on the side wall of the liquid discharge pipe in the electroplating bath body, a controller is arranged on the side wall of the liquid storage tank and is electrically connected with the dosing pump and the liquid level sensor, when the liquid level sensor senses that the liquid level of the electroplating liquid in the electroplating bath body is reduced, the liquid level sensor is transmitted into the controller in an electric signal mode, and the controller controls the dosing pump to convey the electroplating solution in the liquid storage tank into the electroplating tank body through the liquid discharge pipe.
Preferably, a carbon dioxide generator is arranged on one side of the plating bath body, and an air outlet of the carbon dioxide generator is communicated with the bottom of the plating bath body.
Preferably, the upper end of the electroplating bath body is hinged with a top cover, and in order to improve the sealing performance between the top cover and the electroplating bath body, a sealing layer is arranged at the joint of the top cover and the electroplating bath body.
Preferably, the sealing layer is a fluororubber layer, the fluororubber layer comprises an upper fluororubber layer and a lower fluororubber layer, the upper fluororubber layer is arranged on the top cover, the lower fluororubber layer is arranged on the electroplating bath body, fluororubber protrusions are arranged on the upper fluororubber layer, and fluororubber grooves matched with the fluororubber protrusions are formed in the lower fluororubber layer.
Preferably, in order to facilitate the real-time monitoring of the conditions in the plating bath body by an operator, a window is arranged on the side wall of the plating bath body.
Preferably, a handle is arranged on the top cover to facilitate the opening and closing of the top cover.
The utility model has the advantages that
(1) The utility model discloses can add this internal plating solution of plating bath automatically regulated and control, when the liquid level inductor responds out this internal plating solution liquid level of plating bath and descends, the mode transmission of liquid level inductor through the signal of telecommunication to the controller in, the controller will hold the interior plating solution of liquid tank through control constant delivery pump and carry extremely through the fluid-discharge tube the plating bath is originally internal to the realization is to the automatic purpose that adds of this internal plating solution of plating bath, the utility model discloses replace the human labor with the electric power motion, reduced workman's operation, more effectual operating time that has utilized has improved work quality and efficiency.
(2) The utility model discloses carbon dioxide generator is inputed carbon dioxide to the plating bath originally internally for form the carbon dioxide isolation layer at the upper surface of plating solution, thereby reduce volatilizing of plating solution, reduce the pollution to the environment, reduced the influence healthy to the staff simultaneously.
Drawings
Fig. 1 is a schematic structural diagram of the present invention.
Fig. 2 is a schematic structural diagram of the fluororubber layer of the present invention.
Fig. 3 is a top view of the top cover structure of the present invention.
Description of reference numerals: 1-plating bath body, 2-liquid storage tank, 3-liquid outlet pipe, 4-quantitative pump, 5-liquid discharge pipe, 6-liquid level sensor, 7-controller, 8-carbon dioxide generator, 9-top cover, 10-sealing layer, 11-upper fluororubber layer, 12-lower fluororubber layer, 13-fluororubber bulge, 14-fluororubber groove, 15-window and 16-handle.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Examples
As shown in fig. 1-3, the utility model provides an automatic liquid feeding device for PCB electroplating,
the electroplating bath comprises an electroplating bath body 1, wherein a liquid storage tank 2 is arranged on one side of the electroplating bath body 1, electroplating liquid can be stored in the liquid storage tank 2, when the electroplating liquid in the electroplating bath body 1 is reduced, the electroplating liquid in the electroplating bath body 1 can be added through the liquid storage tank 2, a liquid outlet pipe 3 is arranged on the side wall of the bottom of the liquid storage tank 2, the liquid outlet pipe 3 is connected with a water inlet of a dosing pump 4, a water outlet of the dosing pump 4 is communicated with one end of a liquid discharge pipe 5, the other end of the liquid discharge pipe 5 is communicated with the electroplating bath body 1, a liquid level sensor 6 is arranged on the side wall of the liquid discharge pipe 5 in the electroplating bath body 1, a controller 7 is arranged on the side wall of the liquid storage tank 2, the controller 7 is electrically connected with the dosing pump 4 and the liquid level sensor 6, when the liquid level sensor 6 senses that the electroplating liquid in the electroplating bath body 1 is reduced, the liquid level sensor 6 is transmitted to the controller 7 by means of an electric signal, the controller 7 controls the constant delivery pump 4 to deliver the plating solution in the liquid storage tank 2 to the plating tank body 1 through the liquid discharge pipe 5,
the utility model discloses the plating solution to plating bath body 1 that can regulate and control automatically adds, when the plating solution liquid level in plating bath body 1 is descended in the response of liquid level inductor 6, liquid level inductor 6 transmits to controller 7 in through the mode of electric signal, and controller 7 carries the plating solution in holding reservoir 2 to through discharge tube 5 to the plating bath body 1 in through controlling constant delivery pump 4 in order to realize the purpose of the automatic interpolation of the plating solution in plating bath body 1, the utility model discloses replace the manpower labour with electric power motion, reduced workman's operation, more effectively utilized operating time, improved operating mass and efficiency;
a carbon dioxide generator 8 is arranged on one side of the plating bath body 1, the gas outlet of the carbon dioxide generator 8 is communicated with the bottom of the plating bath body 1, and carbon dioxide is input into the plating bath body 1 by the carbon dioxide generator 8, so that a carbon dioxide isolation layer is formed on the upper surface of the plating solution, thereby reducing volatilization of the plating solution, reducing pollution to the environment and simultaneously reducing influence on health of workers;
a top cover 9 is hinged to the upper end of the electroplating bath body 1, in order to improve the sealing performance between the top cover 9 and the electroplating bath body 1, a sealing layer 10 is arranged at the joint of the top cover 9 and the electroplating bath body, the sealing layer 10 is a fluororubber layer, the fluororubber layer comprises an upper fluororubber layer 11 and a lower fluororubber layer 12, the upper fluororubber layer 11 is arranged on the top cover 9, the lower fluororubber layer 12 is arranged on the electroplating bath body 1, fluororubber protrusions 13 are arranged on the upper fluororubber layer 11, and fluororubber grooves 14 matched with the fluororubber protrusions 13 are arranged on the lower fluororubber layer 12;
in order to facilitate the operators to monitor the conditions in the electroplating bath body 1 in real time, a window 15 is arranged on the side wall of the electroplating bath body 1;
to facilitate opening and closing of the lid 9, a handle 16 is provided on the lid 9.
Principle of operation
The utility model relates to an automatic liquid adding device for PCB electroplating, which is distributed as shown in figures 1-3, when in use,
the utility model discloses the plating solution to plating bath body 1 that can regulate and control automatically adds, when the plating solution liquid level in the plating bath body 1 descends is responded to out to liquid level inductor 6, and liquid level inductor 6 transmits to controller 7 in through the mode of signal of telecommunication, and controller 7 will hold the plating solution in the liquid tank 2 through control constant delivery pump 4 and carry extremely through fluid-discharge tube 5 in the plating bath body 1 to the realization is to the automatic purpose that adds of plating solution in the plating bath body 1, the utility model discloses replace the manpower labour with electric power motion, reduced workman's operation, more effectual operating time that has utilized has improved operating mass and efficiency.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications and variations can be made in the embodiments or in part of the technical features of the embodiments without departing from the spirit and the scope of the invention.
Claims (6)
1. An automatic liquid adding device for PCB electroplating is characterized in that,
the electroplating bath comprises an electroplating bath body, wherein a liquid storage tank is arranged on one side of the electroplating bath body, electroplating liquid can be stored in the liquid storage tank, when the electroplating liquid in the electroplating bath body is reduced, the electroplating liquid in the electroplating bath body can be added through the liquid storage tank, a liquid outlet pipe is arranged on the side wall of the bottom of the liquid storage tank and is connected with a water inlet of a dosing pump, a water outlet of the dosing pump is communicated with one end of a liquid discharge pipe, the other end of the liquid discharge pipe is communicated with the electroplating bath body, a liquid level sensor is arranged on the side wall of the liquid discharge pipe in the electroplating bath body, a controller is arranged on the side wall of the liquid storage tank and is electrically connected with the dosing pump and the liquid level sensor, when the liquid level sensor senses that the liquid level of the electroplating liquid in the electroplating bath body is reduced, the liquid level sensor is transmitted into the controller in an electric signal mode, and the controller controls the dosing pump to convey the electroplating solution in the liquid storage tank into the electroplating tank body through the liquid discharge pipe.
2. The automatic liquid adding device for PCB electroplating according to claim 1,
and a carbon dioxide generator is arranged on one side of the electroplating bath body, and an air outlet of the carbon dioxide generator is communicated with the bottom of the electroplating bath body.
3. The automatic liquid adding device for PCB electroplating according to claim 1,
the electroplating bath is characterized in that the upper end of the electroplating bath body is hinged with a top cover, and a sealing layer is arranged at the joint of the top cover and the electroplating bath body for improving the sealing performance between the top cover and the electroplating bath body.
4. The automatic liquid adding device for PCB electroplating according to claim 3,
the sealing layer is arranged to be a fluororubber layer, the fluororubber layer comprises an upper fluororubber layer and a lower fluororubber layer, the upper fluororubber layer is arranged on the top cover, the lower fluororubber layer is arranged on the electroplating bath body, fluororubber protrusions are arranged on the upper fluororubber layer, and fluororubber grooves matched with the fluororubber protrusions are formed in the lower fluororubber layer.
5. The automatic liquid adding device for PCB electroplating according to claim 1,
in order to facilitate the real-time monitoring of the conditions in the electroplating bath body by operators, a window is arranged on the side wall of the electroplating bath body.
6. The automatic liquid adding device for PCB electroplating according to claim 3,
in order to facilitate the opening and closing of the top cover, a handle is arranged on the top cover.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120857461.6U CN214937951U (en) | 2021-04-25 | 2021-04-25 | Automatic liquid feeding device for PCB electroplating |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120857461.6U CN214937951U (en) | 2021-04-25 | 2021-04-25 | Automatic liquid feeding device for PCB electroplating |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214937951U true CN214937951U (en) | 2021-11-30 |
Family
ID=79067028
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120857461.6U Active CN214937951U (en) | 2021-04-25 | 2021-04-25 | Automatic liquid feeding device for PCB electroplating |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214937951U (en) |
-
2021
- 2021-04-25 CN CN202120857461.6U patent/CN214937951U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2021046604A (en) | Metal-coating device | |
| CN214937951U (en) | Automatic liquid feeding device for PCB electroplating | |
| CN215976101U (en) | Welding wire electroplating production line | |
| CN201121216Y (en) | Apparatus for continuous production of electrolytic copper powder | |
| CN208151518U (en) | A kind of electroplate liquid automatic control system | |
| CN210001948U (en) | Cyanide-free gold plating equipment for single-layer capacitor | |
| CN214327939U (en) | Pliers pipe processing is with electroplating device | |
| CN109825856A (en) | Dendrite nickel catalyst electrode preparation facilities and method based on 3D printing | |
| CN206015107U (en) | A kind of electrolysis unit of special electrolytic oxidation organic matter | |
| CN214361696U (en) | Novel anti-oxidation tank device for electrolytic copper foil | |
| CN210796687U (en) | Plating bath with temperature control function | |
| CN115233241A (en) | Method and device for preparing ferrate by using double-anode in-situ electrolysis of waste hydroxide | |
| CN214937876U (en) | Electrolytic tank for silver electrolysis | |
| CN209741293U (en) | Electrolyte agitating unit for micro-arc oxidation | |
| CN218175145U (en) | Automatic liquid feeding device of lithium electrolytic copper foil crude foil machine | |
| CN208949434U (en) | A kind of coloring treatment device for metal pan manufacture | |
| CN202323064U (en) | Equipment for removing metal impurities in chromeplate solution | |
| CN205803613U (en) | A kind of auto feed and the electrolysis bath of controlled concentration | |
| CN211199429U (en) | Device for low-temperature electrolytic separation of silicon-aluminum alloy | |
| CN217895719U (en) | Automatic liquid supplementing hot galvanizing bath | |
| CN214244642U (en) | Liquid level adjusting device of electrolytic tank | |
| CN215366027U (en) | Electroplating device for high-strength bolt | |
| CN210916292U (en) | Fluoroplastic metal band electroplating processing device | |
| CN218580107U (en) | Electroplating device for metal surface treatment | |
| KR20080079799A (en) | Electro polishing apparatus and method for metal pipe |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |