CN214901421U - Multilayer printed circuit board - Google Patents

Multilayer printed circuit board Download PDF

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Publication number
CN214901421U
CN214901421U CN202120551961.7U CN202120551961U CN214901421U CN 214901421 U CN214901421 U CN 214901421U CN 202120551961 U CN202120551961 U CN 202120551961U CN 214901421 U CN214901421 U CN 214901421U
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China
Prior art keywords
plate
protective frame
circuit board
frame
multilayer printed
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Active
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CN202120551961.7U
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Chinese (zh)
Inventor
万锦青
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Hangzhou Lieban Technology Co ltd
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Hangzhou Lieban Technology Co ltd
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Priority to CN202120551961.7U priority Critical patent/CN214901421U/en
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Abstract

The utility model discloses a multilayer printed circuit board, which comprises a protective frame and a sealing component; a protective frame: the surface of the protective frame is uniformly provided with wire grooves, the side surface of the protective frame is symmetrically provided with mounting plates, screws penetrate through the mounting plates, the inner side of the protective frame is detachably connected with a circuit board body, and two sides of the protective frame are symmetrically provided with connecting components; a sealing component: including square tube, guide arm, apron and briquetting, the side of protective frame is located to the square tube symmetry, guide arm sliding fit is in the square tube, the top of guide arm is located to the apron, the bottom surface edge of apron is evenly located to the briquetting, and the briquetting corresponds the cooperation with the wire casing, and the surface of apron is equipped with radiator unit, still includes control switch, control switch locates the side of protective frame, and this multilayer printed circuit board can carry out effective protection to the circuit board, avoids outside dust impurity and circuit board contact, can avoid the contact of outside liquid and circuit board simultaneously, and the practicality is stronger.

Description

Multilayer printed circuit board
Technical Field
The utility model relates to a circuit board technical field specifically is a multilayer printed circuit board.
Background
The multilayer printed circuit board is provided with a plurality of routing layers, a medium layer is arranged between every two layers, the medium layer can be made to be very thin, the multilayer printed circuit board is provided with at least three conductive layers, two layers are arranged on the outer surface, the rest layer is combined in an insulating plate, the electrical connection between the two layers is usually realized through a plated through hole on the cross section of the circuit board, the existing part of the multilayer printed circuit board is directly exposed in the air for installation, a protection structure is lacked, external dust and impurities are easily attached to the circuit board to influence the heat dissipation of the circuit board, and external liquid is also easily dripped on the circuit board to cause the short circuit of the circuit board.
SUMMERY OF THE UTILITY MODEL
The to-be-solved technical problem of the utility model is to overcome current defect, provide a multilayer printed circuit board, can effectively protect the circuit board, avoid outside dust impurity and circuit board contact, can avoid the contact of outside liquid and circuit board simultaneously, the practicality is stronger, can effectively solve the problem in the background art.
In order to achieve the above object, the utility model provides a following technical scheme: a multilayer printed circuit board includes a protective frame and a sealing assembly;
a protective frame: the surface of the protective frame is uniformly provided with wire grooves, the side surface of the protective frame is symmetrically provided with mounting plates, screws penetrate through the mounting plates, the inner side of the protective frame is detachably connected with a circuit board body, and two sides of the protective frame are symmetrically provided with connecting components;
a sealing component: the protective frame comprises a square cylinder, a guide rod, a cover plate and a pressing block, wherein the square cylinder is symmetrically arranged on the side surface of the protective frame, the guide rod is in sliding fit with the square cylinder, the cover plate is arranged at the top end of the guide rod, the pressing block is uniformly arranged at the edge of the bottom surface of the cover plate and is correspondingly matched with a wire slot, and a heat dissipation assembly is arranged on the surface of the cover plate;
wherein: the protection frame is characterized by further comprising a control switch, the control switch is arranged on the side face of the protection frame, and the input end of the control switch is electrically connected with the output end of an external power supply.
Further, still include locating component, locating component includes locating plate, curb plate, spacing groove and clamp plate, the both ends middle part of circuit board body is located to the locating plate symmetry, the curb plate symmetry is located on two relative medial surfaces of protection frame, the surperficial middle part of curb plate is located to the spacing groove, and the spacing groove corresponds the cooperation with the locating plate, the bottom surface both sides of apron are located to the clamp plate symmetry, and the clamp plate of both sides corresponds with the locating plate of both sides respectively, and locating component can be in the bottom surface of apron and the surperficial laminating back of protection frame, and at this moment, the clamp plate just in time sticiss the locating plate downwards, can realize then compressing tightly fixedly to circuit board body.
Further, radiator unit includes circle frame, fixed plate, heat dissipation fan and dust screen, the surperficial middle part of apron is located to the circle frame, the medial surface of circle frame is located to the fixed plate, the heat dissipation fan is located on the fixed plate, the inboard bottom of circle frame is located to the dust screen, and the input of heat dissipation fan is connected with control switch's output electricity, and the usable heat dissipation fan of radiator unit dispels the heat to the surface of circuit board body, and the dust screen can block in outside dust impurity gets into the protective frame.
Further, coupling assembling includes connection frame, cooperation groove, guide slot, fly leaf, cardboard and spring, the medial surface of connection frame is located to the cooperation groove, the both sides of connection frame are located to the guide slot symmetry, sliding connection is in the guide slot of both sides respectively at the both ends of fly leaf, the side middle part of fly leaf is located to the cardboard, the opposite side of fly leaf is located to the one end of spring, and the other end fixed connection of spring is at the medial surface of connection frame.
Further, coupling assembling still includes extension board and skewed tooth board, the both ends of apron are located to the extension board symmetry, the bottom surface of extension board is located to the skewed tooth board, and skewed tooth board's side evenly is equipped with the ascending tooth in direction slant, and the skewed tooth board corresponds the cooperation with the cooperation groove, and the apron is moved to the pressure downwards of coupling assembling accessible, makes the skewed tooth board correspond the cooperation with the cooperation groove, under the effect of cardboard and spring, can realize spacing to the skewed tooth board, then can realize spacing of apron, realizes the sealing to the protection frame.
Compared with the prior art, the beneficial effects of the utility model are that: the multilayer printed circuit board has the following advantages:
1. this multilayer printed circuit board's locating component can be in the bottom surface of apron and the surperficial laminating back of protection frame, and at this moment, the clamp plate just in time sticiss the locating plate downwards, can realize then compressing tightly fixedly to circuit board body.
2. The surface of the circuit board body is cooled by the heat dissipation fan, and the dustproof net can prevent external dust impurities from entering the protective frame.
3. This coupling assembling accessible of multilayer printed circuit board pushes down the apron, makes the skewed tooth board correspond the cooperation with the cooperation groove, under the effect of cardboard and spring, through the corresponding cooperation of cardboard and skewed tooth, can realize spacing to the skewed tooth board, can realize then that the apron is spacing, realizes sealed to the protective frame.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is an enlarged schematic view of the structure at A of the present invention;
fig. 3 is a schematic view of the cross-sectional structure of the present invention.
In the figure: the structure comprises a protective frame 1, a control switch 11, a wire groove 12, a mounting plate 13, screws 14, a circuit board body 15, a sealing assembly 2, a square cylinder 21, a guide rod 22, a cover plate 23, a pressing block 24, a positioning assembly 3, a positioning plate 31, a side plate 32, a limiting groove 33, a pressing plate 34, a heat dissipation assembly 4, a round frame 41, a fixing plate 42, a heat dissipation fan 43, a dust screen 44, a connecting assembly 5, a connecting frame 51, a matching groove 52, a guide groove 53, a movable plate 54, a clamping plate 55, a spring 56, a supporting plate 57 and an oblique toothed plate 58.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-3, the present invention provides a technical solution: a multilayer printed circuit board includes a protection frame 1 and a sealing member 2;
a protection frame 1: the surface is uniformly provided with wire grooves 12, the side surface of the protective frame 1 is symmetrically provided with mounting plates 13, screws 14 penetrate through the mounting plates 13, the inner side of the protective frame 1 is detachably connected with a circuit board body 15, the two sides of the protective frame 1 are symmetrically provided with connecting components 5, each connecting component 5 comprises a connecting frame 51, a matching groove 52, a guide groove 53, a movable plate 54, a clamping plate 55 and a spring 56, the matching groove 52 is arranged on the inner side surface of the connecting frame 51, the guide grooves 53 are symmetrically arranged on the two sides of the connecting frame 51, the two ends of the movable plate 54 are respectively and slidably connected in the guide grooves 53 on the two sides, the clamping plate 55 is arranged in the middle of the side surface of the movable plate 54, one end of the spring 56 is arranged on the other side of the movable plate 54, the other end of the spring 56 is fixedly connected on the inner side surface of the connecting frame 51, the protective frame further comprises supporting plates 57 and oblique tooth plates 58, the supporting plates 57 are symmetrically arranged on the two ends of the cover plate 23, the oblique tooth plates 58 are arranged on the bottom surfaces of the supporting plates 57, the oblique tooth plates 58, and the oblique teeth are uniformly arranged in oblique directions, and the helical toothed plate 58 is correspondingly matched with the matching groove 52;
the sealing component 2: the heat dissipation device comprises a square tube 21, a guide rod 22, a cover plate 23 and a pressing block 24, wherein the square tube 21 is symmetrically arranged on the side surface of a protection frame 1, the guide rod 22 is in sliding fit in the square tube 21, the cover plate 23 is arranged at the top end of the guide rod 22, the pressing block 24 is uniformly arranged at the edge of the bottom surface of the cover plate 23, the pressing block 24 is correspondingly matched with a wire slot 12, a heat dissipation assembly 4 is arranged on the surface of the cover plate 23, the heat dissipation assembly 4 comprises a round frame 41, a fixing plate 42, a heat dissipation fan 43 and a dust screen 44, the round frame 41 is arranged in the middle of the surface of the cover plate 23, the fixing plate 42 is arranged on the inner side surface of the round frame 41, the heat dissipation fan 43 is arranged on the fixing plate 42, the dust screen 44 is arranged at the bottom of the inner side of the round frame 41, and the input end of the heat dissipation fan 43 is electrically connected with the output end of a control switch 11;
wherein: still include control switch 11, control switch 11 locates the side of protective frame 1, and control switch 11's input is connected with external power source's output electricity.
Wherein: still include locating component 3, locating component 3 includes locating plate 31, curb plate 32, spacing groove 33 and clamp plate 34, the both ends middle part of circuit board body 15 is located to locating plate 31 symmetry, curb plate 32 symmetry is located on two relative medial surfaces of protective frame 1, the surperficial middle part of curb plate 32 is located to spacing groove 33, and spacing groove 33 corresponds the cooperation with locating plate 31, the bottom surface both sides of apron 23 are located to clamp plate 34 symmetry, and the clamp plate 34 of both sides corresponds with the locating plate 31 of both sides respectively.
The positioning assembly 3 can press the cover plate 23 downwards to enable the pressing block 24 to be correspondingly matched with the wire slot 12, when the bottom surface of the cover plate 23 is attached to the surface of the protection frame 1, the pressing plate 34 just presses the positioning plate 31 downwards, and then the circuit board body 15 can be pressed and fixed.
When in use:
firstly, place circuit board body 15 in protective frame 1, and make locating plate 31 and spacing groove 33 correspond the cooperation, cover plate 23 is moved to the lapse, make briquetting 24 and wire casing 12 correspond the cooperation, when the bottom surface of cover plate 23 and protective frame 1's surface laminating, clamp plate 34 just in time sticiss locating plate 31 downwards, then can realize compressing tightly fixedly to circuit board body 15, simultaneously, skewed tooth board 58 corresponds the cooperation with cooperation groove 52, under the effect of cardboard 55 and spring 56, through the corresponding cooperation of the skewed tooth on cardboard 55 and the skewed tooth board 58, can realize spacing to skewed tooth board 58, then can realize the spacing of cover plate 23, realize the sealing to protective frame 1, then can avoid outside liquid and impurity to get into in protective frame 1, utilize heat dissipation fan 43 to dispel the heat to the surface of circuit board body 15, dust screen 44 can block outside dust impurity and get into in protective frame 1.
It should be noted that the control switch 11 disclosed in the present embodiment is provided with a control button corresponding to the heat dissipation fan 43, and the heat dissipation fan 43 can be freely configured according to the actual application scenario. The control switch controls the induced draft fan 2 and the motor 31 to work by adopting a common method in the prior art.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims (5)

1. A multilayer printed circuit board characterized by: comprises a protective frame (1) and a sealing component (2);
protective frame (1): the surface of the protective frame is uniformly provided with wire grooves (12), the side surfaces of the protective frame (1) are symmetrically provided with mounting plates (13), screws (14) penetrate through the mounting plates (13), the inner side of the protective frame (1) is detachably connected with a circuit board body (15), and the two sides of the protective frame (1) are symmetrically provided with connecting components (5);
seal assembly (2): the protective frame comprises a square tube (21), a guide rod (22), a cover plate (23) and a pressing block (24), wherein the square tube (21) is symmetrically arranged on the side surface of the protective frame (1), the guide rod (22) is in sliding fit with the square tube (21), the cover plate (23) is arranged at the top end of the guide rod (22), the pressing block (24) is uniformly arranged at the edge of the bottom surface of the cover plate (23), the pressing block (24) is correspondingly matched with a wire slot (12), and a heat dissipation assembly (4) is arranged on the surface of the cover plate (23);
wherein: the protective frame is characterized by further comprising a control switch (11), the control switch (11) is arranged on the side face of the protective frame (1), and the input end of the control switch (11) is electrically connected with the output end of an external power supply.
2. A multilayer printed circuit board according to claim 1, wherein: still include locating component (3), locating component (3) are including locating plate (31), curb plate (32), spacing groove (33) and clamp plate (34), the both ends middle part of circuit board body (15) is located to locating plate (31) symmetry, curb plate (32) symmetry are located on two relative medial surfaces of protective frame (1), the surperficial middle part of curb plate (32) is located in spacing groove (33), and spacing groove (33) correspond the cooperation with locating plate (31), the bottom surface both sides of apron (23) are located to clamp plate (34) symmetry, and clamp plate (34) of both sides correspond with locating plate (31) of both sides respectively.
3. A multilayer printed circuit board according to claim 1, wherein: radiator unit (4) are including circle frame (41), fixed plate (42), heat dissipation fan (43) and dust screen (44), the surperficial middle part of apron (23) is located in circle frame (41), the medial surface of circle frame (41) is located in fixed plate (42), on fixed plate (42) is located in heat dissipation fan (43), the inboard bottom of circle frame (41) is located in dust screen (44), and the input of heat dissipation fan (43) is connected with the output electricity of control switch (11).
4. A multilayer printed circuit board according to claim 1, wherein: coupling assembling (5) are including connecting frame (51), cooperation groove (52), guide slot (53), fly leaf (54), cardboard (55) and spring (56), the medial surface of connecting frame (51) is located in cooperation groove (52), the both sides of connecting frame (51) are located to guide slot (53) symmetry, sliding connection is in guide slot (53) of both sides respectively at the both ends of fly leaf (54), the side middle part of fly leaf (54) is located in cardboard (55), the opposite side of fly leaf (54) is located to the one end of spring (56), and the other end fixed connection of spring (56) is at the medial surface of connecting frame (51).
5. A multilayer printed circuit board according to claim 4, wherein: the connecting assembly (5) further comprises a support plate (57) and a skewed tooth plate (58), the support plate (57) is symmetrically arranged at two ends of the cover plate (23), the skewed tooth plate (58) is arranged on the bottom surface of the support plate (57), obliquely upward teeth are uniformly arranged on the side surface of the skewed tooth plate (58), and the skewed tooth plate (58) is correspondingly matched with the matching groove (52).
CN202120551961.7U 2021-03-17 2021-03-17 Multilayer printed circuit board Active CN214901421U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202120551961.7U CN214901421U (en) 2021-03-17 2021-03-17 Multilayer printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202120551961.7U CN214901421U (en) 2021-03-17 2021-03-17 Multilayer printed circuit board

Publications (1)

Publication Number Publication Date
CN214901421U true CN214901421U (en) 2021-11-26

Family

ID=79037075

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202120551961.7U Active CN214901421U (en) 2021-03-17 2021-03-17 Multilayer printed circuit board

Country Status (1)

Country Link
CN (1) CN214901421U (en)

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Date Code Title Description
GR01 Patent grant
GR01 Patent grant
PE01 Entry into force of the registration of the contract for pledge of patent right

Denomination of utility model: A multilayer printed circuit board

Effective date of registration: 20221212

Granted publication date: 20211126

Pledgee: Hangzhou High-tech Financing Guarantee Co.,Ltd.

Pledgor: Hangzhou lieban Technology Co.,Ltd.

Registration number: Y2022330003635

PE01 Entry into force of the registration of the contract for pledge of patent right