CN214898426U

CN214898426U - Fluorinated liquid heat sink assembly for chip signal board assembly

Info

Publication number: CN214898426U
Application number: CN202121725890.4U
Authority: CN
Inventors: 刘星; 曾一铮; 米欣
Original assignee: Shenzhen Winboth Technology Co ltd
Current assignee: Sanming Hexafluo Chemicals Co Ltd
Priority date: 2021-07-28
Filing date: 2021-07-28
Publication date: 2021-11-26
Anticipated expiration: 2031-07-28

Abstract

The utility model discloses a chip signal board subassembly is with fluoridizing liquid fin subassembly, including casing, heating panel, heat pipe and fan, the inside of casing is equipped with the holding tank, the bottom surface subsides of holding tank are applied with the silicone grease piece, the glue groove has been seted up to the opening part of holding tank, install the chip in the holding tank of casing, the bottom surface of chip has sealed glue with gluing the packing of groove department of meeting, the outer surface welding of casing has the heat pipe, install the heating panel on the heat pipe, be equipped with the buckled plate on the heating panel, the draw-in groove has been seted up at the both ends of buckled plate, the fan is installed through the draw-in groove at buckled plate both ends to the heating panel. The utility model discloses possess the radiating efficiency of multiplicable chip signal board, and then prevent that high temperature from influencing the advantage of the performance of chip signal board.

Description

Fluorinated liquid heat sink assembly for chip signal board assembly

Technical Field

The utility model relates to a chip heat dissipation technical field specifically is a chip signal board subassembly is with fluoridizing liquid fin subassembly.

Background

The chip signal board is at daily study, work, use more and more extensively in the life, compare with desktop computer, but the chip signal board can produce a large amount of heats when using, if can not in time distribute away, high temperature will seriously influence the normal use of chip, can burn out the part and produce great loss even, the chip signal board can dip and dispel the heat in insulating fluoride liquid at present, nevertheless because the chip is limited with the area of contact who fluoridizes the liquid, the radiating effect of chip signal board is limited, and then influences the performance of chip signal board.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a chip signal board subassembly is with fluoridizing liquid fin subassembly possesses the radiating efficiency of multiplicable chip signal board, and then prevents that the high temperature from influencing the advantage of the performance of chip signal board, has solved present chip signal board and can dip and dispel the heat in insulating fluoride liquid, nevertheless because the chip is limited with the area of contact who fluoridizes the liquid, the radiating effect of chip signal board is limited, and then influences the problem of the performance of chip signal board.

In order to achieve the above object, the utility model provides a following technical scheme:

the utility model provides a chip signal board subassembly is with fluoridizing liquid fin subassembly, includes casing, heating panel, heat pipe and fan, the inside of casing is equipped with the holding tank, the bottom surface facing of holding tank is applied with the silicone grease piece, the glue groove has been seted up to the opening part of holding tank, install the chip in the holding tank of casing, the bottom surface of chip and the glue groove department of meeting fill have sealed glue, the outer surface welding of casing has the heat pipe, install the heating panel on the heat pipe, be equipped with the buckled plate on the heating panel, the draw-in groove has been seted up at the both ends of buckled plate, the fan is installed to the draw-in groove that the heating panel passes through the buckled plate both ends.

Preferably, the number of the heat pipes is eight, and the four heat pipes are symmetrically distributed on two sides of the shell in one group.

Preferably, the heat dissipation plate is uniformly distributed on the heat pipe, and the corrugated plate is located at the center of the heat dissipation plate.

Preferably, the number of the fans is two, and the two fans are symmetrically distributed at two ends of the corrugated plate.

Preferably, two fans pass through threaded rod plug-in connection, the nut is installed in the outside that the both ends of threaded rod are located the fan, and two fans pass through the nut clamp to be fixed at the both ends of buckled plate.

Preferably, the heat dissipation plate is provided with a through hole in a penetrating manner, the position and the size of the through hole correspond to those of the heat pipe, and the heat dissipation plate is welded and fixed after being sleeved on the heat pipe through the through hole.

Compared with the prior art, the beneficial effects of the utility model are that: through setting up the casing, the surface at the chip is established to the casing cover, and the top surface of chip contacts with the silicone grease piece in the casing, gap between chip and the casing is sealed through sealed glue, and then prevent that the medium from getting into between chip and the silicone grease piece, influence heat transfer efficiency, the heat that the chip sent passes through the silicone grease piece and transmits to the casing on, later conduct to the heating panel through the heat pipe on the casing, and the buckled plate through department in the middle of the heating panel increases heat radiating area, and then increase radiating efficiency, and the fan is installed at the both ends of buckled plate, the fan passes through threaded rod and nut centre gripping and installs in the draw-in groove at buckled plate both ends, and then increase the medium flow of buckled plate department, further increase radiating efficiency.

Drawings

FIG. 1 is a schematic side view of the present invention;

fig. 2 is a schematic top view of the present invention;

FIG. 3 is a schematic view of the connection state of the fan according to the present invention;

fig. 4 is a schematic bottom view of the housing of the present invention.

In the figure: 1. a housing; 2. a heat dissipation plate; 3. a heat pipe; 4. a corrugated plate; 5. accommodating grooves; 6. a silicone sheet; 7. a glue groove; 8. a threaded rod; 9. a fan; 10. a nut; 11. a card slot; 12. sealing glue; 13. and (3) a chip.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front end", "rear end", "both ends", "one end", "the other end" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element to which the reference is made must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "disposed," "connected," and the like are to be construed broadly, and for example, "connected" may be either fixedly connected or detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

Referring to fig. 1 to 4, the present invention provides an embodiment:

a fluorinated liquid radiator assembly for a chip signal board assembly comprises a shell 1, a radiator plate 2, a heat pipe 3 and a fan 9, wherein a containing groove 5 is arranged inside the shell 1, a silicone sheet 6 is pasted on the bottom end surface of the containing groove 5, heat emitted by a chip 13 is transmitted to the shell 1 through the silicone sheet 6, then the heat is transmitted to the radiator plate 2 through the heat pipe 3 on the shell 1, the radiating area is increased through a corrugated plate 4 in the middle of the radiator plate 2, and further the radiating efficiency is increased, a glue groove 7 is formed in an opening of the containing groove 5, a chip 13 is installed in the containing groove 5 of the shell 1, a joint of the bottom end surface of the chip 13 and the glue groove 7 is filled with a sealant 12, the top end surface of the chip 13 is in contact with the silicone sheet 6 in the shell 1, a gap between the chip 13 and the shell 1 is sealed through the sealant 12, and further a medium is prevented from entering between the chip 13 and the silicone sheet 6, influence heat transfer efficiency, the welding of the surface of casing 1 has heat pipe 3, and heat pipe 3 is equipped with eight altogether, and four heat pipes 3 are a set of bilateral symmetry distribution at casing 1.

The heat pipe 3 is provided with a heat dissipation plate 2, the heat dissipation plate 2 is provided with a through hole in a penetrating way, the position and the size of the through hole correspond to those of the heat pipe 3, the heat dissipation plate 2 is welded and fixed after being sleeved on the heat pipe 3 through the through hole, the heat dissipation plate 2 is uniformly distributed on the heat pipe 3, the heat dissipation plate 2 is provided with a corrugated plate 4, the corrugated plate 4 is positioned at the center of the heat dissipation plate 2, two ends of the corrugated plate 4 are provided with clamping grooves 11, the heat dissipation plate 2 is provided with fans 9 through the clamping grooves 11 at the two ends of the corrugated plate 4, the fans 9 are clamped and installed in the clamping grooves 11 at the two ends of the corrugated plate 4 through a threaded rod 8 and a nut 10, so as to increase the medium flow at the corrugated plate 4, the heat dissipation efficiency is further increased, the fans 9 are provided with two fans 9, the two fans 9 are symmetrically distributed at the two ends of the corrugated plate 4, the two ends of the threaded rod 8 are positioned outside the fans 9 and provided with the nut 10, two fans 9 are clamped and fixed at two ends of the corrugated plate 4 through nuts 10.

Casing 1's inside is equipped with holding tank 5, holding tank 5's bottom surface subsides are applied with silicone grease piece 6, the heat that chip 13 sent passes through silicone grease piece 6 and transmits to casing 1 on, later conduct to heating panel 2 through heat pipe 3 on the casing 1, and buckled plate 4 through 2 middle departments of heating panel increases heat radiating area, and then increase the radiating efficiency, chip 13's top surface contacts with silicone grease piece 6 in the casing 1, the gap between chip 13 and the casing 1 is sealed through sealed glue 12, and then prevent that the medium from getting into between chip 13 and the silicone grease piece 6, influence heat transfer efficiency, fan 9 is installed through the draw-in groove 11 at 4 both ends of buckled plate to heating panel 2, fan 9 passes through threaded rod 8 and the 10 centre gripping of nut and installs in the draw-in groove 11 at 4 both ends of buckled plate, and then increase the medium flow of 4 departments of buckled plate, further increase radiating efficiency.

It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Claims

1. The utility model provides a chip signal board subassembly is with fluoridizing liquid fin subassembly, includes casing (1), heating panel (2), heat pipe (3) and fan (9), its characterized in that: the inside of casing (1) is equipped with holding tank (5), the bottom surface facing of holding tank (5) is applied with silicone grease piece (6), glue groove (7) have been seted up to the opening part of holding tank (5), install chip (13) in holding tank (5) of casing (1), the bottom surface of chip (13) meets with glue groove (7) and locates to pack sealed glue (12), the outer surface welding of casing (1) has heat pipe (3), install heating panel (2) on heat pipe (3), be equipped with buckled plate (4) on heating panel (2), draw-in groove (11) have been seted up at the both ends of buckled plate (4), fan (9) are installed through draw-in groove (11) at buckled plate (4) both ends in heating panel (2).

2. The fluorinated liquid heat sink assembly of claim 1, wherein: the number of the heat pipes (3) is eight, and the four heat pipes (3) are symmetrically distributed on two sides of the shell (1) in a group.

3. The fluorinated liquid heat sink assembly of claim 1, wherein: the heat dissipation plate (2) is uniformly distributed on the heat pipe (3), and the corrugated plate (4) is positioned at the center of the heat dissipation plate (2).

4. The fluorinated liquid heat sink assembly of claim 1, wherein: the fan (9) are provided with two fans, and the two fans (9) are symmetrically distributed at two ends of the corrugated plate (4).

5. The fluorinated liquid heat sink assembly of claim 4, wherein: two fans (9) are connected through threaded rod (8) in an inserting mode, nuts (10) are installed on the outer sides, located on the fans (9), of the two ends of the threaded rod (8), and the two fans (9) are clamped and fixed at the two ends of the corrugated plate (4) through the nuts (10).

6. The fluorinated liquid heat sink assembly of claim 1, wherein: the heat dissipation plate (2) is provided with a through hole in a penetrating mode, the position and the size of the through hole correspond to those of the heat pipe (3), and the heat dissipation plate (2) is sleeved on the heat pipe (3) through the through hole and then is welded and fixed.