CN214895759U - Low-temperature coil cooling device and low-temperature coil testing device - Google Patents
Low-temperature coil cooling device and low-temperature coil testing device Download PDFInfo
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- CN214895759U CN214895759U CN202120567407.8U CN202120567407U CN214895759U CN 214895759 U CN214895759 U CN 214895759U CN 202120567407 U CN202120567407 U CN 202120567407U CN 214895759 U CN214895759 U CN 214895759U
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Abstract
The application relates to a low-temperature coil cooling device and scanning equipment. The low-temperature coil cooling device comprises a cold fluid cavity and a cold guide plate. The cold fluid cavity is used for containing cold fluid. The cold guide plate part is arranged inside the cold fluid cavity and penetrates to the outside of the cold fluid cavity. Wherein the cold guide plate located outside the cold fluid chamber has a coil mounting portion. And part of the cold conduction plate arranged in the cold fluid cavity is cooled by the cold fluid and transmits cold energy to the coil mounting part. The low-temperature coil cooling device is simple in structure, only utilizes low-price cold fluid to cool the low-temperature coil, avoids the use of a refrigeration system, a vacuum system and a circulating system, reduces the testing difficulty of the low-temperature coil, is convenient to replace the low-temperature coil, and greatly improves the testing efficiency.
Description
Technical Field
The application relates to the technical field of medical imaging, in particular to a low-temperature coil cooling device and a low-temperature coil testing device.
Background
Compared with other detection techniques, the signal-to-noise ratio of Magnetic Resonance Imaging (MRI) technology is low, and therefore how to improve the signal-to-noise ratio of the MRI technology is a permanent proposition. The magnetic resonance signal is a very weak induced current detected by the coil, and either reducing the thermal noise of the background current or increasing the induced current increases the signal-to-noise ratio. Under the guidance of the theory, the low-temperature coil is developed, so that the signal-to-noise ratio is improved to a certain extent.
In order to test the performance of the coil under low temperature, scanning test needs to be carried out in a low-temperature environment, but a complete low-temperature coil cooling system needs a refrigerating system, a vacuum system and a circulating system, the cost is high and complex, a waiting system for cooling is needed for carrying out an experiment once, the coil needs to be debugged and the system needs to be waited for returning to the temperature, the installation of the coil is very inconvenient, and the difficulty in testing the coil is greatly increased.
SUMMERY OF THE UTILITY MODEL
Based on this, to the great problem of traditional coil test degree of difficulty, this application provides a low temperature coil cooling device and low temperature coil testing arrangement.
A cryogenic coil cooling apparatus comprising:
the cold fluid cavity is used for containing cold fluid; and
and the cold conduction plate is partially arranged in the cold fluid cavity and penetrates through the cold fluid cavity, wherein the cold conduction plate is provided with a coil installation part positioned outside the cold fluid cavity.
In one embodiment, the cold fluid chamber comprises:
a housing enclosing a receiving chamber having an opening; and
and the cover plate is covered on the shell.
In one embodiment, the cover plate is provided with a funnel-shaped flare opening.
In one embodiment, the flare is integrally formed with the cover plate.
In one embodiment, the material of the cold conducting plate is a high-thermal-conductivity material; the low-temperature coil cooling device further has a heat retaining portion located outside the cold fluid chamber, and the low-temperature coil cooling device further includes:
and the heat insulation layer is arranged on the heat preservation part.
In one embodiment, the method further comprises the following steps:
and the clamping piece is arranged at the edge of the coil mounting part and used for fixing the coil on the coil mounting part.
In one embodiment, the method further comprises the following steps:
and the handheld part is arranged on the outer surface of the cold fluid cavity.
A cryogenic coil testing apparatus comprising a cryogenic coil cooling apparatus as claimed in any one of the preceding embodiments.
In one embodiment, the cryogenic coil testing device comprises a cryogenic coil, and the cryogenic coil is detachably mounted on the coil mounting part.
In one embodiment, the low-temperature coil is fixed on the coil mounting part through heat-conducting glue.
The low-temperature coil cooling device comprises a cold fluid cavity and a cold guide plate. The cold fluid cavity is used for containing cold fluid. The cold guide plate part is arranged inside the cold fluid cavity and penetrates to the outside of the cold fluid cavity. Wherein the cold plate has a coil mounting portion located outside the cold fluid chamber. And part of the cold conduction plate arranged in the cold fluid cavity is cooled by the cold fluid and transmits cold energy to the coil mounting part. The low-temperature coil cooling device is simple in structure, only utilizes the cold fluid with low price to cool the coil, avoids the use of a refrigeration system, a vacuum system and a circulating system, reduces the difficulty of coil testing, is convenient to replace, and greatly improves the testing efficiency.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments or the conventional technologies of the present application, the drawings used in the descriptions of the embodiments or the conventional technologies will be briefly introduced below, it is obvious that the drawings in the following descriptions are only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a schematic perspective view of a cryogenic coil cooling apparatus according to an embodiment of the present application;
fig. 2 is a schematic perspective view of a cryogenic coil cooling apparatus according to another embodiment of the present application;
fig. 3 is a cross-sectional view of a cryogenic coil cooling apparatus provided in accordance with an embodiment of the present application;
FIG. 4 is a cross-sectional view of a cover plate provided in accordance with one embodiment of the present application;
FIG. 5 is a front view of a cover plate provided in accordance with an embodiment of the present application;
FIG. 6 is a schematic structural diagram of a cold plate according to an embodiment of the present application;
fig. 7 is a schematic structural diagram of a cryogenic coil cooling apparatus in a scanning chamber according to an embodiment of the present application.
Description of the main element reference numerals
10. A cold fluid chamber; 11. a housing; 12. a cover plate; 20. a cold conducting plate; 30. a sealing strip; 40. a heat insulating layer; 50. a clamping member; 60. a hand-held component; 101. a coil mounting portion; 102. a heat-insulating part; 103. a first groove; 104. a second groove; 105. a bell mouth; 100. a low-temperature coil cooling device; 200. a scanning chamber.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present application more comprehensible, embodiments accompanying the present application are described in detail below with reference to the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. This application is capable of embodiments in many different forms than those described herein and those skilled in the art will be able to make similar modifications without departing from the spirit of the application and it is therefore not intended to be limited to the embodiments disclosed below.
It will be understood that, as used herein, the terms "first," "second," and the like may be used herein to describe various elements, but these elements are not limited by these terms. These terms are only used to distinguish one element from another. For example, a first acquisition module may be referred to as a second acquisition module, and similarly, a second acquisition module may be referred to as a first acquisition module, without departing from the scope of the present application. The first acquisition module and the second acquisition module are both acquisition modules, but are not the same acquisition module.
It will be understood that when an element is referred to as being "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
Magnetic Resonance Imaging (MRI) technology can directly make cross-sectional, sagittal and coronal slice images, and has become one of the important tools for medical clinical diagnosis and research, especially for the localization of tumors in patients during radiotherapy. The MRI system excites human tissues by emitting electromagnetic waves through the radio frequency coil, generates resonance signals in the human tissues, is received by the receiving coil, and then is sent to the computer system for presentation after signal amplification, filtering and other processing are carried out by the receiving circuit.
In the prior art, especially in a preclinical ultrahigh field animal magnetic resonance imaging device, a low-temperature coil is used for improving the signal-to-noise ratio of a magnetic resonance signal. The low-temperature coil needs to be subjected to scanning test in a low-temperature environment to complete the test of the performance of the coil at low temperature. However, the complete low-temperature coil cooling system needs a refrigeration system, a vacuum system and a circulation system, is expensive and complex, needs to wait for the cooling of the system when an experiment is performed once, needs to wait for the return temperature of the system when the coil is debugged, and is very inconvenient to install due to the complex structure of the cooling system, thereby greatly increasing the difficulty in testing the coil. This application provides a low temperature coil cooling device and scanning apparatus in order to overcome the great problem of traditional coil test degree of difficulty.
Referring to fig. 1 and 2, a cryogenic coil cooling apparatus 100 is provided. The cryogenic coil cooling apparatus 100 includes a cryogenic fluid chamber 10 and a cold conduction plate 20. The cold fluid chamber 10 is used for containing cold fluid. The cold conducting plate 20 is partially arranged inside the cold fluid chamber 10 and penetrates through the cold fluid chamber 10. Wherein the cold conductive plate 20 has a coil mounting portion 101 located outside the cold fluid chamber 10. A part of the cold conductive plate 20 disposed inside the cold fluid chamber 10 is cooled by the cold fluid and transmits cold to the coil mounting portion 101.
It is understood that the structure, material and size of the cold fluid chamber 10 are not limited to specific ones, as long as they can function to contain cold fluid. In one embodiment, the cold fluid may be liquid cold nitrogen or helium, or the like.
In one embodiment, the cold fluid chamber 10 is formed by bending a low thermal conductivity non-metallic material to form a housing 11 having an open receiving chamber. The low thermal conductivity non-metallic material may be PTFE. At this time, the cold fluid is a liquid cold fluid, and a portion of the cold guide plate 20 is placed in the liquid cold fluid and cooled by the liquid cold fluid. Another portion of the cold conducting plate 20 penetrates to the outside of the cold fluid chamber 10 for installing a coil. It is to be understood that the manner of mounting the coil is not particularly limited, and in one embodiment, the coil may be directly fixed to the coil mounting part 101 using an adhesive.
Referring to fig. 3 and 4, in another embodiment, the cold fluid chamber 10 further includes a cover plate 12 to reduce heat exchange with air, reduce volatilization of the cold fluid, and improve safety, thereby preventing the cold fluid from spilling out and causing safety accidents. Optionally, in order to realize the sealing between the cover plate 12 and the housing 11, a first groove 103 may be provided on an end surface surrounding the opening, and a second groove 104 is provided on the cover plate 12, after the cover plate 12 and the housing 11 are closed, the first groove 103 and the second groove 104 are butted to form a sealing strip 30 accommodating space, and a sealing strip 30 is provided in the sealing strip 30 accommodating space. The sealing strip 30 may be a flexible sealing strip 30.
In one embodiment, the cover plate 12 and the cold fluid chamber 10 are integrally formed. The sealing structure is not required to be separately arranged between the cover plate 12 and the cold fluid cavity 10, and the cover plate 12 and the cold fluid cavity 10 are non-detachable parts and are integrated into a whole through integral forming, so that sealing is completely formed around the cold fluid cavity 10.
Referring to fig. 5, in an embodiment of the present application, the cover plate 12 has a funnel-shaped flare opening 105, and a lower opening of the flare opening 105 is communicated with the cover plate 12 to form a through hole. The bell mouth 105 is communicated with the cold fluid cavity 10, the bell mouth 105 can be integrally formed with the cover plate, the same material is adopted, and the low-heat-conduction non-metallic material is preferably adopted. On one hand, the bell mouth 105 makes the cold fluid chamber 10 communicate with the outside, and avoids completely sealing the cold fluid to volatilize and damage the cold fluid chamber. Meanwhile, the bell mouth 105 can directly inject cold fluid into the cold fluid cavity under the condition that the cover plate is not detached, and the method is simple and convenient. On the other hand, the cover plate can be conveniently detached by arranging the bell mouth 105, and the cover plate can be conveniently mounted/detached by holding the bell mouth 105 by hand. In one embodiment, the flare 105 has a heat insulating layer around its periphery to facilitate handling.
It is understood that the structure, the material and the size of the cold conducting plate 20 are not particularly limited, and the cold conducting plate 20 is made of a material having high thermal conductivity as long as it can transfer cold to the coil mounting portion 101. In one embodiment, the cold plate 20 is formed by bending a high thermal conductivity non-metallic material. The high thermal conductivity non-metallic material may be Al2O3. The forming manner of the cold conducting plate 20 and the cold fluid chamber 10 is not particularly limited as long as the sealing between the cold conducting plate 20 and the cold fluid chamber 10 can be ensured. In one embodiment, the cold fluid chamber 10 and the cold conduction plate 20 are integrally formed.
The cryogenic coil cooling apparatus 100 includes a cryogenic fluid chamber 10 and a cold guide plate 20. The cold fluid chamber 10 is used for containing cold fluid. The cold conducting plate 20 is partially arranged inside the cold fluid chamber 10 and penetrates through the cold fluid chamber 10. Wherein the cold conductive plate 20 located outside the cold fluid chamber 10 has a coil mounting portion 101. A part of the cold conductive plate 20 disposed inside the cold fluid chamber 10 is cooled by the cold fluid and transmits cold to the coil mounting portion 101. The low-temperature coil cooling device 100 is simple in structure, only uses cold fluid with low price to cool the coil, avoids the use of a refrigeration system, a vacuum system and a circulating system, reduces the difficulty of coil testing, is convenient to replace, and greatly improves the testing efficiency.
In one embodiment, the cold conducting plate 20 located outside the cold fluid chamber 10 further has a thermal insulation portion 102, and the low-temperature coil cooling device 100 further includes a thermal insulation layer 40. The heat insulating layer 40 is provided in the heat retaining portion 102. The cold conducting plate 20 located outside the cold fluid chamber 10 includes a coil mounting portion 101 and a heat preservation portion 102 for cooling the coil. The heat insulation layer 40 arranged on the heat insulation part 102 can ensure that the cold quantity has good heat insulation effect in the transmission process, reduce the heat leakage of the cold guide plate 20 and improve the cooling effect of the coil.
In one embodiment, the thermal insulation layer 40 includes aluminum-plated sheets and fiber spacers, which are alternately arranged. The number of the heat insulating layer 40 is not particularly limited.
Referring to fig. 6, in one embodiment, the cryogenic coil cooling apparatus 100 further includes a clamping member 50. The clamping member 50 is disposed at an edge of the coil mounting portion 101, and is used for fixing the coil to the coil mounting portion 101.
It is to be understood that the structure of the clip 50 is not particularly limited as long as it can ensure that the coil can be directly contacted and fixed with the coil mounting part 101. When the coil needs to be subjected to low-temperature test, the coil is fixed on the coil mounting part 101 by utilizing the clamping piece 50, part of the cold conducting plate 20 arranged in the cold fluid cavity 10 is cooled by the cold fluid, cold energy is transferred to the coil mounting part 101, and then the coil is cooled. When the next coil needs to be cryogenically tested, only the clamps 50 need to be pressed to effect coil replacement.
In one embodiment, the cryogenic coil cooling apparatus 100 further comprises a hand piece 60. The hand-held part 60 is disposed on an outer surface of the cold fluid chamber 10.
It is to be understood that the structure of the hand-held unit 60 is not particularly limited as long as it is convenient for a user to move the cryogenic coil cooling device 100 using the hand-held unit 60. In one embodiment, a handle may be disposed on each of two sides of the outer surface of the cryogenic fluid chamber 10 to prevent the cryogenic coil cooling apparatus 100 from being frozen and burned when directly touching the outer surface.
Referring to fig. 7, the present application provides a cryogenic coil testing apparatus including a cryogenic coil cooling apparatus 100 according to any one of the above embodiments.
The cryogenic coil cooling apparatus 100 includes a cryogenic fluid chamber 10 and a cold conduction plate 20. The cold fluid chamber 10 is used for containing cold fluid. The cold conducting plate 20 is partially arranged inside the cold fluid chamber 10 and penetrates through the cold fluid chamber 10. Wherein the cold conductive plate 20 located outside the cold fluid chamber 10 has a coil mounting portion 101. A part of the cold conductive plate 20 disposed inside the cold fluid chamber 10 is cooled by the cold fluid and transmits cold to the coil mounting portion 101.
It is understood that the structure, material and size of the cold fluid chamber 10 are not limited to specific ones, as long as they can function to contain cold fluid. In one embodiment, the cold fluid may be liquid cold nitrogen or helium, or the like.
In one embodiment, the cold fluid chamber 10 is formed by bending a low thermal conductivity non-metallic material to form a housing 11 having an open receiving chamber. The low thermal conductivity non-metallic material may be PTFE. At this time, the cold fluid is a liquid cold fluid, and a portion of the cold guide plate 20 is placed in the liquid cold fluid and cooled by the liquid cold fluid. Another part of the cold conducting plate 20 penetrates to the outside of the cold fluid chamber 10 for mounting a low-temperature coil. It is to be understood that the manner of mounting the low-temperature coil is not particularly limited, and the low-temperature coil is detachably mounted to the coil mounting portion 101. In one embodiment, the low-temperature coil is fixed on the coil mounting part through heat-conducting glue.
Referring to fig. 3 and 4, in another embodiment, the cold fluid chamber 10 further includes a cover plate 12 to reduce heat exchange with air, reduce volatilization of the cold fluid, and improve safety, thereby preventing the cold fluid from spilling out and causing safety accidents. Optionally, in order to realize the sealing between the cover plate 12 and the housing 11, a first groove 103 may be provided on an end surface surrounding the opening, and a second groove 104 is provided on the cover plate 12, after the cover plate 12 and the housing 11 are closed, the first groove 103 and the second groove 104 are butted to form a sealing strip 30 accommodating space, and a sealing strip 30 is provided in the sealing strip 30 accommodating space. The sealing strip 30 may be a flexible sealing strip 30.
In one embodiment, the cover plate 12 and the cold fluid chamber 10 are integrally formed. The sealing structure is not required to be separately arranged between the cover plate 12 and the cold fluid cavity 10, and the cover plate 12 and the cold fluid cavity 10 are non-detachable parts and are integrated into a whole through integral forming, so that sealing is completely formed around the cold fluid cavity 10.
Referring to fig. 5, in an embodiment of the present application, the cover plate 12 has a funnel-shaped flare opening 105, and a lower opening of the flare opening 105 is communicated with the cover plate 12 to form a through hole. The bell mouth 105 is communicated with the cold fluid cavity 10, the bell mouth 105 can be integrally formed with the cover plate, the same material is adopted, and the low-heat-conduction non-metallic material is preferably adopted. On one hand, the bell mouth 105 makes the cold fluid chamber 10 communicate with the outside, and avoids completely sealing the cold fluid to volatilize and damage the cold fluid chamber. Meanwhile, the bell mouth 105 can directly inject cold fluid into the cold fluid cavity under the condition that the cover plate is not detached, and the method is simple and convenient. On the other hand, the cover plate can be conveniently detached by arranging the bell mouth 105, and the cover plate can be conveniently mounted/detached by holding the bell mouth 105 by hand. In one embodiment, the outer periphery of the bell-mouth 105 is provided with a heat insulating layer for convenient hand holding, and the bell-mouth 105 itself can also be used as a hand holding component.
It is to be understood that the structure, the material and the size of the cold conducting plate 20 are not particularly limited as long as the cold conducting plate can transfer the cold to the coil mounting portion 101. In one embodiment, the cold plate 20 is formed by bending a high thermal conductivity non-metallic material. The high thermal conductivity non-metallic material may be Al2O3. The forming manner of the cold conducting plate 20 and the cold fluid chamber 10 is not particularly limited as long as the sealing between the cold conducting plate 20 and the cold fluid chamber 10 can be ensured. In one embodiment, the cold fluid chamber 10 and the cold conduction plate 20 are integrally formed.
The scanning apparatus includes a scanning bed and a scanning chamber 200. In the test, the low-temperature coil is fixed to the coil mounting portion 101 of the low-temperature coil cooling device 100. The cryogenic coil cooling apparatus 100 can be placed on the scan bed and a test sample placed on the scan bed, with the test sample placed near the cryogenic coil. The scan bed is then moved so that the test specimen and the cryogenic coil cooling device 100 enter the scan chamber 200 for scan testing.
The cryogenic coil testing apparatus includes a cryogenic fluid chamber 10 and a cold conduction plate 20. The cold fluid chamber 10 is used for containing cold fluid. The cold conducting plate 20 is partially arranged inside the cold fluid chamber 10 and penetrates through the cold fluid chamber 10. Wherein the cold conductive plate 20 located outside the cold fluid chamber 10 has a coil mounting portion 101. A part of the cold conductive plate 20 disposed inside the cold fluid chamber 10 is cooled by the cold fluid and transmits cold to the coil mounting portion 101. The low-temperature coil cooling device 100 is simple in structure, only utilizes low-price cold fluid to cool the low-temperature coil, avoids the use of a refrigeration system, a vacuum system and a circulating system, reduces the testing difficulty of the low-temperature coil, is convenient to replace the low-temperature coil, and greatly improves the testing efficiency.
In one embodiment, the cold conducting plate 20 located outside the cold fluid chamber 10 further has a thermal insulation portion 102, and the low-temperature coil cooling device 100 further includes a thermal insulation layer 40. The heat insulating layer 40 is provided in the heat retaining portion 102. The cold conducting plate 20 located outside the cold fluid chamber 10 includes a coil mounting portion 101 and a heat preservation portion 102 for cooling the low temperature coil. The heat insulation layer 40 is arranged on the heat preservation part 102, so that the cold energy can be well insulated in the transmission process, the heat leakage of the cold guide plate 20 is reduced, and the cooling effect of the low-temperature coil is improved.
In one embodiment, the thermal insulation layer 40 includes aluminum-plated sheets and fiber spacers, which are alternately arranged. The number of the heat insulating layer 40 is not particularly limited.
Referring to fig. 5, in one embodiment, the cryogenic coil cooling apparatus 100 further includes a clamping member 50. The clip 50 is provided at an edge of the coil mounting portion 101, and is used to fix the low-temperature coil to the coil mounting portion 101.
It is to be understood that the structure of the holder 50 is not particularly limited as long as it can ensure that the low-temperature coil can be directly contacted and fixed with the coil mounting portion 101. When a low-temperature coil needs to be subjected to a low-temperature test, the low-temperature coil is fixed on the coil mounting portion 101 by using the clamping piece 50, part of the cold guide plate 20 arranged in the cold fluid cavity 10 is cooled by the cold fluid, cold energy is transmitted to the coil mounting portion 101, and then the low-temperature coil is cooled. When the next cryogenic coil needs to be cryogenically tested, only the clamps 50 need to be pressed to effect replacement of the cryogenic coil.
In one embodiment, the cryogenic coil cooling apparatus 100 further comprises a hand piece 60. The hand-held part 60 is disposed on an outer surface of the cold fluid chamber 10.
It is to be understood that the structure of the hand-held unit 60 is not particularly limited as long as it is convenient for a user to move the cryogenic coil cooling device 100 using the hand-held unit 60. In one embodiment, a handle may be disposed on each of two sides of the outer surface of the cryogenic fluid chamber 10 to prevent the cryogenic coil cooling apparatus 100 from being frozen and burned when directly touching the outer surface.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present application, and the description thereof is more specific and detailed, but not construed as limiting the claims. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, which falls within the scope of protection of the present application. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. A cryogenic coil cooling apparatus, comprising:
the cold fluid cavity is used for containing cold fluid; and
and the cold conduction plate is partially arranged in the cold fluid cavity and penetrates through the cold fluid cavity, wherein the cold conduction plate is provided with a coil installation part positioned outside the cold fluid cavity.
2. The cryogenic coil cooling device of claim 1, wherein the cryogenic fluid chamber comprises:
a housing enclosing a receiving chamber having an opening; and
and the cover plate is covered on the shell.
3. The cryogenic coil cooling device of claim 2 wherein the cover plate has a funnel flare.
4. The cryogenic coil cooling device of claim 3 wherein the flare is integrally formed with the cover plate.
5. The cryogenic coil cooling device of claim 1 wherein the material of the cold conducting plate is a high thermal conductivity material; the low-temperature coil cooling device further has a heat retaining portion located outside the cold fluid chamber, and the low-temperature coil cooling device further includes:
and the heat insulation layer is arranged on the heat preservation part.
6. The cryogenic coil cooling device of claim 1 further comprising:
and the clamping piece is arranged at the edge of the coil mounting part and used for fixing the coil on the coil mounting part.
7. The cryogenic coil cooling device of claim 1 further comprising:
and the handheld part is arranged on the outer surface of the cold fluid cavity.
8. A cryogenic coil testing apparatus comprising the cryogenic coil cooling apparatus as claimed in any one of claims 1 to 7.
9. The cryogenic coil testing device of claim 8, comprising a cryogenic coil, the cryogenic coil being removably mounted to the coil mounting portion.
10. The cryogenic coil testing device as defined in claim 9, wherein the cryogenic coil is fixed to the coil mounting portion by a thermally conductive adhesive.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120567407.8U CN214895759U (en) | 2021-03-19 | 2021-03-19 | Low-temperature coil cooling device and low-temperature coil testing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120567407.8U CN214895759U (en) | 2021-03-19 | 2021-03-19 | Low-temperature coil cooling device and low-temperature coil testing device |
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| Publication Number | Publication Date |
|---|---|
| CN214895759U true CN214895759U (en) | 2021-11-26 |
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| CN202120567407.8U Active CN214895759U (en) | 2021-03-19 | 2021-03-19 | Low-temperature coil cooling device and low-temperature coil testing device |
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