CN214895643U - Semiconductor device tests frock fast - Google Patents
Semiconductor device tests frock fast Download PDFInfo
- Publication number
- CN214895643U CN214895643U CN202120909740.2U CN202120909740U CN214895643U CN 214895643 U CN214895643 U CN 214895643U CN 202120909740 U CN202120909740 U CN 202120909740U CN 214895643 U CN214895643 U CN 214895643U
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- CN
- China
- Prior art keywords
- semiconductor device
- telescopic
- baffle
- conductive contact
- positioning baffle
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- Expired - Fee Related
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Abstract
The utility model discloses a semiconductor device tests frock fast, including baffle box, telescopic machanism, conductive contact and positioning baffle, the slope of baffle box height sets up, the low distolateral top of baffle box is provided with telescopic machanism, the guide direction of telescopic machanism's flexible direction perpendicular to baffle box, telescopic machanism's flexible serving is provided with conductive contact, positioning baffle sets up the end at the low distolateral of baffle box, positioning baffle blocks the semiconductor device of being surveyed in the positioning baffle box, can be quick detect semiconductor device, guarantees its qualification rate.
Description
Technical Field
The utility model belongs to the semiconductor field, in particular to quick test fixture of semiconductor device.
Background
Along with the increasingly strong market competition of semiconductor components and parts, the product stability is also higher and higher. As a parameter testing process, all the power-on tests must be performed on each semiconductor device to ensure that the semiconductor device can be used normally, thereby reducing the defective rate.
Disclosure of Invention
The purpose of the invention is as follows: in order to overcome the not enough of existence among the prior art, the utility model provides a semiconductor device tests frock fast, can be quick detect semiconductor device, guarantee its qualification rate.
The technical scheme is as follows: in order to achieve the above purpose, the technical scheme of the utility model is as follows:
the utility model provides a semiconductor device tests frock fast, includes baffle box, telescopic machanism, conductive contact and positioning baffle, the slope of baffle box height sets up, the low distolateral top of low of baffle box is provided with telescopic machanism, telescopic machanism's flexible direction perpendicular to baffle box's guide direction, telescopic machanism's flexible serving is provided with conductive contact, positioning baffle sets up the end at the low distolateral of baffle box, positioning baffle blocks the semiconductor device of being surveyed in the positioning baffle box.
Further, the conductive contact is elastically arranged relative to the telescopic end of the telescopic mechanism.
Furthermore, a supporting plate is arranged at the telescopic end of the telescopic mechanism, the conductive contact is connected to the supporting plate through an elastic mechanism, and the elastic direction of the elastic mechanism is perpendicular to the material guide groove.
Furthermore, the elastic mechanism comprises a guide rod and a return spring sleeved on the guide rod, one end of the guide rod is connected to the conductive contact, the other end of the guide rod is movably arranged on the supporting plate in a penetrating mode in a clearance mode, and the conductive contact is connected to the supporting plate through the return spring.
Furthermore, the positioning baffle is arranged at the telescopic end of the telescopic mechanism, the positioning baffle is arranged along the telescopic direction of the telescopic mechanism, and the bottom end of the positioning baffle is lower than the height of the conductive contact in a free state.
Furthermore, a movable groove is formed in the guide groove corresponding to the positioning baffle in a penetrating mode.
Furthermore, a pressing plate is arranged at the telescopic end of the telescopic mechanism and is pressed on the body of the tested semiconductor device.
Further, the guide chute is a U-shaped chute body with an upward opening.
Has the advantages that: the utility model discloses a semiconductor device of locating baffle gliding in to the baffle box blocks the location, contacts in the electrode terminal of being surveyed semiconductor device through the electrically conductive contact of telescopic machanism drive to in being used for inserting detecting system with semiconductor device, whole test procedure is simple high-efficient.
Drawings
FIG. 1 is a front view of the overall structure of the present invention;
FIG. 2 is an enlarged view of the structure of part A of the present invention;
fig. 3 is a schematic perspective view of a part a of the present invention.
Detailed Description
The present invention will be further described with reference to the accompanying drawings.
As shown in fig. 1 to 3, the quick test tool for the semiconductor device comprises a material guide chute 1, a telescopic mechanism 2, a conductive contact 3 and a positioning baffle 4, wherein the material guide chute 1 is inclined in height, the material guide chute 1 is a U-shaped trough body with an upward opening, the telescopic mechanism 2 is arranged above the lower end side of the material guide chute 1 through a support 11, the telescopic mechanism 2 is a telescopic cylinder, the telescopic direction of the telescopic mechanism 2 is perpendicular to the material guide direction of the material guide chute 1, the conductive contact 3 is arranged on the telescopic end of the telescopic mechanism 2, the conductive contact 3 is a conductive block and is connected to a test system, the positioning baffle 4 is arranged at the end of the lower end side of the material guide chute 1, and the positioning baffle 4 blocks a tested semiconductor device 5 in the positioning material guide chute. The semiconductor device that slides down in the baffle box is blocked and positioned through the positioning baffle, the conductive contact is driven to contact with the electrode terminal of the tested semiconductor device through the telescopic mechanism, so that the semiconductor device is connected into the detection system, after the test is completed, the positioning baffle moves upwards, the conductive contact is separated from the tested semiconductor device 5, the tested semiconductor device after the test is completed moves downwards to the outside of the baffle box, then the positioning baffle 4 moves downwards, the next tested semiconductor device is blocked and positioned, the sequential circulation is realized, and the whole test process is simple and efficient.
The conductive contact 3 is elastically arranged relative to the telescopic end of the telescopic mechanism 2 so as to ensure that the conductive contact 3 is fully contacted with the electrode terminal 5a of the tested semiconductor device 5 and prevent the virtual connection phenomenon such as poor contact. The telescopic end of the telescopic mechanism 2 is provided with a supporting plate 6, the conductive contact 3 is connected to the supporting plate 6 through an elastic mechanism, and the elastic direction of the elastic mechanism is perpendicular to the material guide groove 1.
Elastic mechanism includes guide bar 7 and cover and establishes reset spring 8 on the guide bar 7, the one end of guide bar 7 is connected in conductive contact 3, and the other end clearance activity wears to establish in backup pad 6, conductive contact 3 passes through reset spring 8 to be connected in backup pad 6.
The utility model discloses a motor terminal, including telescopic mechanism 2, positioning baffle 4, guide way 1, positioning baffle 4, locating baffle 4 sets up on telescopic mechanism 2's flexible end, positioning baffle 4 sets up along telescopic mechanism's flexible direction, just positioning baffle 4's bottom is less than the height of conductive contact 3 under the free state, the movable groove 9 has been seted up corresponding to positioning baffle 4 to link up on the guide way 1, and when fixing a position motor terminal, positioning baffle 4 is less than conductive contact's height, and after the positioning baffle location, conductive contact elastic pressure covered on being surveyed semiconductor device under telescopic mechanism's continuation displacement.
The telescopic end of the telescopic mechanism 2 is further provided with a pressing plate 10, the pressing plate 10 presses and covers the body of the tested semiconductor device 5, and the body part of the tested semiconductor device 5 is further pressed and covered by the pressing plate, so that the stability is improved.
A cover plate 12 is arranged above the guide chute 1 and used for guiding the tested semiconductor device in the guide chute and preventing the tested semiconductor device from bouncing.
The above description is only a preferred embodiment of the present invention, and it should be noted that: for those skilled in the art, without departing from the principle of the present invention, several improvements and modifications can be made, and these improvements and modifications should also be considered as the protection scope of the present invention.
Claims (8)
1. The utility model provides a semiconductor device tests frock fast which characterized in that: including baffle box (1), telescopic machanism (2), conductive contact (3) and positioning baffle (4), baffle box (1) height slope sets up, the top of the low side of baffle box (1) is provided with telescopic machanism (2), the flexible direction perpendicular to guide direction of baffle box (1) of telescopic machanism (2), the flexible end of telescopic machanism (2) is provided with conductive contact (3), positioning baffle (4) set up the end in the low side of baffle box (1), positioning baffle (4) block the location baffle in the baffle box by survey semiconductor device (5).
2. The quick test fixture of semiconductor device according to claim 1, characterized in that: the conductive contact (3) is elastically arranged relative to the telescopic end of the telescopic mechanism (2).
3. The quick test fixture of semiconductor device according to claim 2, characterized in that: the telescopic end of the telescopic mechanism (2) is provided with a supporting plate (6), the conductive contact (3) is connected to the supporting plate (6) through an elastic mechanism, and the elastic direction of the elastic mechanism is perpendicular to the material guide groove (1).
4. The quick test fixture of semiconductor device according to claim 3, characterized in that: elastic mechanism includes guide bar (7) and cover and establishes reset spring (8) on guide bar (7), the one end of guide bar (7) is connected in conductive contact (3), and the activity of other end clearance wears to establish on backup pad (6), conductive contact (3) are connected on backup pad (6) through reset spring (8).
5. The quick test fixture of semiconductor device according to claim 1, characterized in that: the positioning baffle (4) is arranged at the telescopic end of the telescopic mechanism (2), the positioning baffle (4) is arranged along the telescopic direction of the telescopic mechanism, and the bottom end of the positioning baffle (4) is lower than the height of the conductive contact (3) in a free state.
6. The quick test fixture of semiconductor device according to claim 5, characterized in that: the guide chute (1) is provided with a movable chute (9) corresponding to the positioning baffle (4) in a through way.
7. The quick test fixture of semiconductor device according to claim 1, characterized in that: the telescopic end of the telescopic mechanism (2) is further provided with a pressing plate (10), and the pressing plate (10) is pressed on the body of the tested semiconductor device (5).
8. The quick test fixture of semiconductor device according to claim 1, characterized in that: the guide chute (1) is a U-shaped chute body with an upward opening.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120909740.2U CN214895643U (en) | 2021-04-29 | 2021-04-29 | Semiconductor device tests frock fast |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120909740.2U CN214895643U (en) | 2021-04-29 | 2021-04-29 | Semiconductor device tests frock fast |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214895643U true CN214895643U (en) | 2021-11-26 |
Family
ID=78889228
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120909740.2U Expired - Fee Related CN214895643U (en) | 2021-04-29 | 2021-04-29 | Semiconductor device tests frock fast |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214895643U (en) |
-
2021
- 2021-04-29 CN CN202120909740.2U patent/CN214895643U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20211126 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |