CN214881905U

CN214881905U - Roller type conductive device of semiconductor lead frame

Info

Publication number: CN214881905U
Application number: CN202121236740.7U
Authority: CN
Inventors: 温淏钦; 黄炜; 谢苏徽; 周爱和
Original assignee: Kunshan A Tripod Plating Equipment Co ltd
Current assignee: Kunshan A Tripod Plating Equipment Co ltd
Priority date: 2021-06-03
Filing date: 2021-06-03
Publication date: 2021-11-26
Anticipated expiration: 2031-06-03

Abstract

The utility model discloses a semiconductor lead frame rolls roll formula electric installation has upper and lower parallel interval distribution's lower conducting rod and last conducting rod, be provided with two conductive wheels down on conducting rod and the last conducting rod respectively, two conductive wheels on lower conducting rod and two conductive wheel one-to-ones on the last conducting rod, but between two conductive wheels on lower conducting rod and the last conducting rod the feed area product passes through, and two conductive wheels on the upper surface of material area product and the last conducting rod contact, and the lower surface of material area product contacts with two conductive wheels on the conducting rod down. This semiconductor lead frame rolls formula electric installation all has electrically conductive wheel from top to bottom, adopts two-sided electrically conductive, and the material area product is between the electrically conductive wheel from top to bottom, and electrically conductive wheel always can contact the material area product, and electrically conductive wheel and material area product contact are good, and the material area product is electroplated well.

Description

Roller type conductive device of semiconductor lead frame

Technical Field

The utility model belongs to the technical field of the technique of continuous semiconductor lead frame surface treatment production line and specifically relates to a semiconductor lead frame rolls formula electrically conductive device.

Background

The precise integrated circuit is an important core electronic material belt product in the modern electronic information industry and is formed by packaging a high-precision chip and a lead frame. The lead frame is a key material in the integrated circuit, and plays an important role in supporting the chip, protecting internal components and connecting external circuits. With the rapid development of high and new electronic information technology, material belt products develop towards miniaturization, multiple functions and intellectualization. Therefore, the lead frame material is being developed to have a finer lead pitch and a higher density.

In a continuous semiconductor lead frame surface treatment production line, a conductive device is required to be applied, the conventional conductive device adopts single-side wheel conduction, and the single-side conduction is easy to not contact a material belt product, namely the conductive wheel is in poor contact with the material belt product, so that the material belt product is poor in electroplating.

SUMMERY OF THE UTILITY MODEL

The to-be-solved technical problem of the utility model is: in order to overcome the defects in the prior art, the roll type conductive device of the semiconductor lead frame is provided, the conductive wheels are arranged at the upper part and the lower part, double-sided conduction is adopted, a material belt product is arranged between the upper conductive wheel and the lower conductive wheel, the conductive wheels can always contact the material belt product, the conductive wheels are in good contact with the material belt product, and the material belt product is well electroplated.

The utility model provides a technical scheme that its technical problem adopted is: the utility model provides a semiconductor lead frame rolls roll formula electric installation, has upper and lower parallel interval distribution's lower conducting rod and last conducting rod, be provided with two conductive wheels on conducting rod and the last conducting rod down respectively, two conductive wheels on conducting rod and the last conducting rod on down are one-to-one, but the feed area product passes through between two conductive wheels on conducting rod and the last conducting rod on two conductive wheels on conducting rod down, and the upper surface of material area product contacts with two conductive wheels on the conducting rod on, and the lower surface of material area product contacts with two conductive wheels on the conducting rod down.

Further specifically, in the above technical scheme, the left and right ends of the lower conducting rod are provided with the plug-in units for fixing the whole conducting device on the electroplating container groove body.

Further specifically, in the above technical solution, the left end of the lower conducting rod and the right end of the upper conducting rod are both provided with a mercury slip ring having a conducting effect.

Further specifically inject, among the above-mentioned technical scheme, the driving gear is installed to the right-hand member of conducting rod down, and driven gear is down installed to the left end of conducting rod down, goes up driven gear and installs at the left end of conducting rod, and the driving gear is rotatory to be driven gear rotation down, and driven gear meshing transmission is gone up in the rotatory drive of driven gear down.

Further specifically, in the above technical solution, when the tape product passes through, a distance between the lower conductive rod and the upper conductive rod is 25.154mm to 25.203 mm.

The utility model has the advantages that: the utility model discloses a semiconductor lead frame roll-type electric installation, all have conductive wheel from top to bottom, adopt two-sided electrically conductive, the material area product is between upper and lower conductive wheel, and conductive wheel always can contact the material area product, and conductive wheel and material area product contact well, and the material area product electroplates well; use the utility model discloses a semiconductor lead frame compression roller formula electric installation carries out the continuous surface treatment production of lead frame material area product, conducts electricity through compression roller formula electric installation, has not only improved the stability of continuous lead frame production, has improved the homogeneity that the material area product membrane distributes, can guarantee moreover that lead frame material area product quality, improves the production efficiency of continuous lead frame surface treatment production line.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments described in the present application, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.

Fig. 1 is a schematic structural diagram of the present invention;

FIG. 2 is an enlarged view of a portion of FIG. 1;

FIG. 3 is a diagram illustrating the usage status of the present invention;

FIG. 4 is a schematic view of the construction of the insert;

fig. 5 is an installation schematic diagram of the present invention.

The reference numbers in the figures are: 1. a lower conductive rod; 2. an upper conductive rod; 3. a conductive wheel; 4. a plug-in; 4-1, circular through holes; 4-2, U-shaped through holes; 4-3, a clamping groove; 5. a mercury slip ring; 6. a driving gear; 7. a lower driven gear; 8. an upper driven gear; A. a tape product; B. electroplating a container tank body.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

In the description of the present invention, it is to be understood that the terms "one side", "the other side", "both sides", "between", "middle part", "upper end", "lower end", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "disposed" and "connected" are to be interpreted broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; may be directly connected or indirectly connected through an intermediate. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

See fig. 1, fig. 2, fig. 3, fig. 4 and fig. 5, the utility model discloses a semiconductor lead frame rolls roll-type electric installation, have upper and lower parallel interval distribution's lower conducting rod 1 and last conducting rod 2, be provided with two conducting wheels 3 on lower conducting rod 1 and the last conducting rod 2 respectively, two conducting wheels 3 on the lower conducting rod 1 and two conducting wheels 3 one-to-one on the last conducting rod 2, but between two conducting wheels 3 on the lower conducting rod 1 and the two conducting wheels 3 on the last conducting rod 2 feed area product A passes through, and the upper surface of material area product A contacts with two conducting wheels 3 on the last conducting rod 2, the lower surface of material area product A contacts with two conducting wheels 3 on the lower conducting rod 1. Specifically, the left edge of the tape product a is located between the two vertically-distributed conductive wheels 3 located on the left side, and the right edge of the tape product a is located between the two vertically-distributed conductive wheels 3 located on the right side. The material belt product A is QFN series, DFN series or PDFN series of IC semiconductor lead frame.

The material belt product A is clamped in the middle of the conductive wheel 3, and the conductive wheel 3 is fixed on the conductive rod and can move along the axial direction of the conductive rod to complete the conduction. Specifically, in the axial direction of the lower conductive rod 1, the distance between the two conductive wheels 3 on the lower conductive rod 1 varies with the width of the tape product a, the width of the tape product a ranges from 250mm to 330mm, and thus the distance between the two conductive wheels 3 on the corresponding lower conductive rod 1 ranges from 244mm to 324 mm. Similarly, along the axial direction of the upper conductive rod 2, the distance between the two conductive wheels 3 on the upper conductive rod 2 varies with the width of the tape product a, and the width range of the tape product a is 250mm to 330mm, so the distance between the two conductive wheels 3 on the corresponding upper conductive rod 2 is 244mm to 324 mm.

Wherein, the left and right ends of the lower conducting rod 1 are provided with plug-in components 4 for fixing the whole conducting device on the electroplating container body B. The left end of the lower conducting rod 1 and the right end of the upper conducting rod 2 are both provided with a mercury slip ring 5 playing a role in conducting electricity, and the mercury slip ring 5 consists of a stator part and a rotor part. The lower conducting rod 1 and the upper conducting rod 2 are meshed and driven with each other through a transmission gear. A driving gear 6 is installed at the right end of the lower conducting rod 1, a lower driven gear 7 is installed at the left end of the lower conducting rod 1, an upper driven gear 8 is installed at the left end of the upper conducting rod 2, the driving gear 6 rotates to drive the lower driven gear 7 to rotate, and the lower driven gear 7 rotates to drive the upper driven gear 8 to be in meshing transmission. When the gear drives the lower conducting rod 1 and the upper conducting rod 2 to rotate, current is conducted to the material belt product A through the mercury slip ring 5. Under the condition that no material belt product A passes through, the distance between the lower conducting rod 1 and the upper conducting rod 2 is 25mm, and the thickness range of the material belt product A is 0.154 mm-0.203 mm, so that under the condition that the material belt product A passes through, the distance between the lower conducting rod 1 and the upper conducting rod 2 is 25.154 mm-25.203 mm, and the gap between the two conducting wheels 3 which are correspondingly distributed up and down is the thickness of the material belt product A, namely the gap between the two conducting wheels 3 which are correspondingly distributed up and down is 0.154 mm-0.203 mm.

The driving gear 6 is sleeved on the right end of the lower conducting rod 1, a gear hole of the driving gear 6 is a semicircular hole, a flat position is milled in advance at a gear installation position at the right end of the lower conducting rod 1, and the gear hole of the driving gear 6 and the gear installation position at the right end of the lower conducting rod 1 are installed in an interference fit mode. Similarly, the lower driven gear 7 is sleeved on the left end of the lower conducting rod 1, the gear hole of the lower driven gear 7 is a semicircular hole, the gear installation position of the left end of the lower conducting rod 1 is milled into a flat position in advance, and the gear hole of the lower driven gear 7 is installed in interference fit with the gear installation position of the left end of the lower conducting rod 1. In a similar way, the upper driven gear 8 is sleeved on the left end of the upper conducting rod 2, the gear hole of the upper driven gear 8 is a semicircular hole, the gear installation position of the left end of the upper conducting rod 2 is milled into a flat position in advance, and the gear hole of the upper driven gear 8 is in interference fit with the gear installation position of the left end of the upper conducting rod 2. The conductive wheel 3 is provided with a threaded hole which is tightly locked on the lower conductive rod 1 or the upper conductive rod 2 by an inner hexagonal flat end set screw of M5 x 10.

The material of the lower conducting rod 1, the material of the upper conducting rod 2 and the material of the conducting wheel 3 are SUS316, the plasticity, toughness, cold deformation and welding process performance of SUS316 stainless steel are good, and meanwhile, the high-temperature strength is good. The plug-in 4 is made of PVDF which is a corrosion-resistant, acid-resistant and alkali-resistant plastic. The material of the shell of the mercury slip ring 5 is SUS304, mercury is filled in the shell of the mercury slip ring 5, the SUS304 has good corrosion resistance, heat resistance, low-temperature strength and mechanical property, good hot workability such as stamping bending and the like, no heat treatment hardening phenomenon and no magnetism. The mercury slip ring 5 is a conductive rotary joint using mercury as a fluid medium, and is the biggest difference from the traditional carbon brush slip ring in that the mercury slip ring mainly uses liquid mercury as a conductive medium, a fixed end and a rotating end are integrated together, and the mercury slip ring does not need to use a carbon brush to conduct electricity and transmit electricity during rotation but directly uses mercury to conduct electricity and transmit electricity.

The plug-in 4 is a U-shaped structure with a certain thickness, a circular through hole 4-1 for the lower conducting rod 1 to penetrate into is arranged in the thickness direction of the bottom of the U-shaped structure, and the lower conducting rod 1 penetrates into the circular through hole 4-1, namely the position of the lower conducting rod 1 is fixed. An upper conducting rod 2 is placed in a U-shaped through hole 4-2 of the U-shaped structure, the upper conducting rod 2 compresses the material belt product A under the action of gravity, the upper conducting rod 2 freely moves up and down at any time along with the difference of the thickness of the material belt product A, namely, the center distance between the upper conducting rod 2 and the lower conducting rod 1 is changed along with the difference of the thickness of the material belt product A. The clamping groove 4-3 is arranged along the whole outer wall of the U-shaped structure, the left side and the right side of the clamping groove 4-3 are respectively provided with a blocking strip for preventing the plug-in 4 from shifting left and right, and the plug-in 4 is clamped on the electroplating container groove body B through the clamping groove 4-3, namely the whole semiconductor lead frame rolling type conducting device is clamped on the electroplating container groove body B through the plug-in 4. A whole set of electric installation has a lower conducting rod 1, a last conducting rod 2, a driving gear 6, a lower driven gear 7, an go up driven gear 8, four conducting wheels 3, two plug-in components 4 and two mercury sliding rings 5, wherein four conducting wheels 3's specification is the same, two plug-in components 4's specification is the same, two mercury sliding rings 5's specification is the same, the length of lower conducting rod 1 is the same with the length of last conducting rod 2, the diameter of lower conducting rod 1 is the same with the diameter of last conducting rod 2, driving gear 6 is conical gear, lower driven gear 7 and last driven gear 8 are the spur gear.

In the axial direction of the lower conductor bar 1 and in the left end region of the lower conductor bar 1, the mercury slip ring 5 is located on the left side, the lower driven gear 7 is located in the middle, and the plug 4 is located on the right side. In the axial direction of the lower conductor bar 1, and in the right end region of the lower conductor bar 1, the card 4 is located on the left side, and the drive gear 6 is located on the right side. In the axial direction of the upper conductor bar 2, and in the left end region of the upper conductor bar 2, the upper driven gear 8 is located on the left side, and the card 4 is located on the right side. In the axial direction of the upper conductor bar 2 and in the region of the right end of the upper conductor bar 2, the insert 4 is located on the left side and the mercury slip ring 5 on the right side.

The roll-type conductive device of the semiconductor lead frame is provided with conductive wheels 3 at the upper part and the lower part, double-sided conduction is adopted, a material belt product A is arranged between the upper conductive wheel and the lower conductive wheel 3, the conductive wheels 3 always contact the material belt product A, the conductive wheels 3 are in good contact with the material belt product A, and the material belt product A is well electroplated; use the utility model discloses a semiconductor lead frame compression roller formula electric installation carries out the continuous surface treatment production of lead frame material area product, conducts electricity through compression roller formula electric installation, has not only improved the stability of continuous lead frame production, has improved the homogeneity that material area product A membrane distributes, can guarantee moreover that lead frame material area product quality, improves the production efficiency of continuous lead frame surface treatment production line.

The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.

Claims

1. A roll type conductive device of a semiconductor lead frame is characterized in that: lower conducting rod (1) and last conducting rod (2) with parallel interval distribution from top to bottom, be provided with two conducting wheels (3) on conducting rod (1) and the last conducting rod (2) down respectively, two conducting wheels (3) on conducting rod (1) down and two conducting wheels (3) one-to-one on conducting rod (2), but between two conducting wheels (3) on conducting rod (1) down and two conducting wheels (3) on conducting rod (2) the feed area product (A) passes through, and the upper surface of material area product (A) and two conducting wheels (3) on conducting rod (2) contact, the lower surface of material area product (A) and two conducting wheels (3) on conducting rod (1) down contact.

2. The roll-type conductive apparatus for semiconductor lead frames according to claim 1, wherein: plug-in components (4) which are used for fixing the whole conductive device on the electroplating container groove body (B) are arranged at the left end and the right end of the lower conductive rod (1).

3. The roll type conductive apparatus for semiconductor lead frames according to claim 1 or 2, wherein: and mercury slip rings (5) with a conductive effect are mounted at the left end of the lower conducting rod (1) and the right end of the upper conducting rod (2).

4. The roll-type conductive apparatus for semiconductor lead frames according to claim 3, wherein: the right-hand member of conducting rod (1) installs driving gear (6) down, and driven gear (7) down are installed to the left end of lower conducting rod (1), go up driven gear (8) and are installed to the left end of conducting rod (2), and driven gear (7) are rotatory under driving gear (6) rotatory drive, and driven gear (8) meshing transmission is gone up in lower driven gear (7) rotatory drive.

5. The roll-type conductive apparatus for semiconductor lead frames according to claim 1, wherein: and under the state that the material belt product (A) passes through, the distance between the lower conducting rod (1) and the upper conducting rod (2) is 25.154-25.203 mm.