CN203065624U - Novel electrochemical rack plating device for small plated part - Google Patents
Novel electrochemical rack plating device for small plated part Download PDFInfo
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- CN203065624U CN203065624U CN 201320027634 CN201320027634U CN203065624U CN 203065624 U CN203065624 U CN 203065624U CN 201320027634 CN201320027634 CN 201320027634 CN 201320027634 U CN201320027634 U CN 201320027634U CN 203065624 U CN203065624 U CN 203065624U
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- porous
- flat plate
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- rack
- copper mesh
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Abstract
The utility model relates to a novel electrochemical rack plating device for a small plated part, belonging to the technical field of electroplating equipment. The novel electrochemical rack plating device is characterized by being provided with a rack, and a porous groove plate, a copper screen and a porous flat plate which are arranged on the rack, wherein the copper screen is flatly pressed and fixed on the porous flat plate; the porous flat plate pressing the copper screen is covered and clamped on the porous groove plate; the side of the porous flat plate pressing the copper screen is arranged towards the porous groove plate; the copper screen is provided with a lead connected with a power supply; and the rack is provided with a left and right sliding mechanism. The novel electrochemical rack plating device has the beneficial effects that the device is simple in structure, low in price and easy to obtain, and solves a series of problems caused in the barrel plating process of the small part; a point of the small part to be plated can be well contacted with a cathode during electroplating; large-scale electroplating production of the small parts can be realized; and the point of the small part to be plated can be well plated, and the plating layer is even.
Description
Technical field
The present invention relates to a kind of electroplating device, the electrochemistry rack plating device of particularly little plating piece belongs to technical field of plating equipment.
Background technology
At present, mainly adopt traditional drum-type barrel plating method in the plating of industrial gadget.In the rolling process of cylinder, the little steel ball in the cylinder contacts with point to be plated in the gadget by cathode conductor, electroplates.But this drum-type electro electroplating method; very easily damage gadget upper layer to be plated or surperficial paint, writing, thin layer point to be plated etc.; gadget and little steel ball collide continuously, rub in the process of rolling; make gadget upper layer to be plated breakage; surface paint, writing etc. present polishing scratch or come off, breakage; also usually can cause the former thin layer point to be plated on gadget surface to come off, can't continue next step plating or weld rack of fusion, reduce the yield of product.
Because the special construction of chip gadget (as has very thin thickness, the point to be plated that has only account for chip gadget surface 1/12), so adopt general rack plating device sometimes, as the rotary swing type cathode hang-plating machine of mentioning on the CN200920035908.0 patent No., but after putting into the chip gadget, negative electrode usually can't be preferably with point to be plated and contacts, and the antenna number of a rack plating of this hang-plating machine seldom, be difficult to realize industrial outputization, the patent No. is a kind of rack plating device of 200920168255.3, for the chip gadget, the hooklet of negative electrode also can't hang the chip gadget, can't electroplate, the patent No. is that a kind of negative electrode rotation rack plating device with center anode of CN200820046995.5 connects workpiece to be plated by the center conductive rotating shaft and carries out rack plating for another example, this rack plating is applicable to big workpiece rack plating, and can't carry out the rack plating of gadget.
Summary of the invention
The technical problems to be solved in the utility model is, the medium and small steel ball of barrel plating process will damage gadget upper layer to be plated now, or surface paint, writing, thin layer point to be plated etc., and adopt the rotary swing type cathode hang-plating machine negative electrode well to contact with point to be plated, and the antenna number problem seldom of a rack plating of this hang-plating machine, for the defective that overcomes existing electrochemistry electroplanting device to the chip gadget and the problem of existence, a kind of electrochemistry rack plating device of novel chip gadget is provided, this apparatus structure is simple, cheap and easy to get, can solve a series of problems that gadget occurs when barrel plating, gadget point to be plated can well contact with negative electrode during plating, and can realize a large amount of Electroplating Production of gadget, can be well the point to be plated of gadget be plated, make coating even.
The purpose of this utility model is to realize like this, a kind of electrochemistry rack plating device of novel little plating piece, it is characterized in that, be provided with porous concave-board, copper mesh, the porous flat plate placed on shelf and the shelf, described copper mesh is entirely pressed attached being fixed on the porous flat plate, presses the porous flat plate covering of attached copper mesh to be clamped on the described porous concave-board, and porous flat plate presses the one side of attached copper mesh towards the porous concave-board, copper mesh is provided with the lead that is connected with power supply, and described shelf is provided with the mechanism that horizontally slips.
Described porous concave-board by one be equipped with the porous plank around fence up with plastic sheet and to constitute, the degree of depth of groove greater than the thickness of a gadget to be plated less than the thickness of two gadgets to be plated.
The described mechanism that horizontally slips is provided with motor, axle, soft rubber ball projection and gear, and four soft rubber ball projectioies and two gears are installed in respectively on two axles, and two gears are meshing with each other, and electric motor driving connects gear.
Described porous concave-board is identical with the porous flat plate size.
The periphery of described shelf is provided with four vertically thin rods.
The beneficial effects of the utility model are, apparatus structure is simple, cheap and easy to get, can solve a series of problems that gadget occurs when barrel plating, gadget point to be plated can well contact with negative electrode during plating, and can realize a large amount of Electroplating Production of gadget, can be well the point to be plated of gadget be plated, make coating even.
Description of drawings
Fig. 1 is structural representation of the present utility model.
Fig. 2 is shelf structural representation of the present utility model.
Fig. 3 is the porous concave-board structural representation of band edge frame of the present utility model.
Fig. 4 is porous flat plate structural representation of the present utility model.
Fig. 5 is copper mesh structural representation of the present utility model.
Among the figure: 1 shelf, 2 gears, 3,4 porous concave-boards, 5 porous flat plates, 6 copper mesh, 7 soft rubber ball projectioies, 8 vertically thin rods.
Embodiment
A kind of electrochemistry rack plating device of novel little plating piece, constituted by the porous concave-board of placing on shelf and the shelf, copper mesh, porous flat plate etc., described copper mesh is entirely pressed attached being fixed on the porous flat plate, press the porous flat plate covering of attached copper mesh to be clamped on the described porous concave-board, porous flat plate presses the one side of attached copper mesh towards the porous concave-board, copper mesh is provided with the lead that is connected with power supply, and described shelf is provided with the mechanism that horizontally slips.
Described porous concave-board by one be equipped with the porous plank around fence up with plastic sheet and to constitute, the degree of depth of groove greater than the thickness of a gadget to be plated less than the thickness of two gadgets to be plated.
The described mechanism that horizontally slips is provided with motor, axle, soft rubber ball projection and gear, and four soft rubber ball projectioies and two gears are installed in respectively on two axles, and two gears are meshing with each other, and electric motor driving connects gear.
Described porous concave-board is identical with the porous flat plate size.
The periphery of described shelf is provided with four vertically thin rods.
The utility model is used for the process that gadget is electroplated:
1. gadget is put in the groove of porous concave-board, white point is conduction point to be plated in the gadget, and the point to be plated of gadget is placed up, (degree of depth degree of groove greater than the thickness of a product less than the thickness of two products).
2. attached being fixed on the porous flat plate of pressure that copper mesh is smooth, make copper mesh contact and keep smooth with dull and stereotyped, one jiao with copper mesh picks out with lead, then, to cover with the one side of copper mesh on the groove of porous concave-board (the porous concave-board is the same big with the porous flat plate of attached copper mesh), with clip the two-layer plank (porous flat plate of porous concave-board and attached copper mesh) after making up is clamped at two ends up and down, because the restriction of groove thickness, so a pile phenomenon of getting up can not appear in gadget in rack plating rocks, at last, 180 ° (point to be plated has like this had good the contact with copper mesh with the upset of the plank after the combination, by the copper mesh conduction gadget is electroplated), from four vertically thin rods of Fig. 2, put on the shelf, and a, b, c, four soft rubber ball projectioies of d are pressed under the plank, obtain device as shown in Figure 1.
3. device shown in Figure 1 is put into bath solution, the lead that connects copper mesh is received the negative electrode of power supply.When the gadget in the groove is immersed in the electroplate liquid, because be placed on gadget density in the groove much larger than water, so still can sinking on the copper mesh, gadget can not float.
4. according to shown in Figure 1, a gear on the right of driven by motor rotates counterclockwise.Work as a, after being rotated counterclockwise 90 °, the d projection contacts with plank, be rotated further, owing to projection and plank rubbing effect stop after plank is slided left, work as a, after the d projection continues to rotate counterclockwise 180 °, this moment b, the c projection forwards to clockwise and contacts with plank and plank is slided to the right, motor just can realize that in driven gear plank horizontally slips like this, thereby the plated product for the treatment of that is pressed on the copper mesh has relatively sliding with copper mesh in electroplating process, can avoid product and copper mesh to stick together like this or inhomogeneous situation occurs electroplating.
Claims (3)
1. the electrochemistry rack plating device of a novel little plating piece, it is characterized in that, be provided with porous concave-board, copper mesh, the porous flat plate placed on shelf and the shelf, described copper mesh is entirely pressed attached being fixed on the porous flat plate, press the porous flat plate covering of attached copper mesh to be clamped on the described porous concave-board, porous flat plate presses the one side of attached copper mesh towards the porous concave-board, and copper mesh is provided with the lead that is connected with power supply, and described shelf is provided with the mechanism that horizontally slips.
2. the electrochemistry rack plating device of a kind of novel little plating piece according to claim 1, it is characterized in that, described porous concave-board by one be equipped with the porous plank around fence up with plastic sheet and to constitute, the degree of depth of groove greater than the thickness of a gadget to be plated less than the thickness of two gadgets to be plated.
3. the electrochemistry rack plating device of a kind of novel little plating piece according to claim 1, it is characterized in that, the described mechanism that horizontally slips is provided with motor, axle, soft rubber ball projection and gear, four soft rubber ball projectioies and two gears are installed in respectively on two axles, two gears are meshing with each other, and electric motor driving connects gear.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320027634 CN203065624U (en) | 2013-01-20 | 2013-01-20 | Novel electrochemical rack plating device for small plated part |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320027634 CN203065624U (en) | 2013-01-20 | 2013-01-20 | Novel electrochemical rack plating device for small plated part |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203065624U true CN203065624U (en) | 2013-07-17 |
Family
ID=48764436
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201320027634 Expired - Fee Related CN203065624U (en) | 2013-01-20 | 2013-01-20 | Novel electrochemical rack plating device for small plated part |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203065624U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105088323A (en) * | 2015-08-12 | 2015-11-25 | 深圳市环翔精饰工业有限公司 | Plate type electroplating hanger |
-
2013
- 2013-01-20 CN CN 201320027634 patent/CN203065624U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105088323A (en) * | 2015-08-12 | 2015-11-25 | 深圳市环翔精饰工业有限公司 | Plate type electroplating hanger |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130717 Termination date: 20160120 |
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| EXPY | Termination of patent right or utility model |