CN214878420U

CN214878420U - Manipulator conveying equipment of semiconductor chip production equipment

Info

Publication number: CN214878420U
Application number: CN202022280528.2U
Authority: CN
Inventors: 占方耀
Original assignee: Shenzhen Yong Er Jia Electronic Co ltd
Current assignee: Shandong Yongerjia Electronic Technology Co ltd
Priority date: 2020-10-14
Filing date: 2020-10-14
Publication date: 2021-11-26
Anticipated expiration: 2030-10-14

Abstract

The utility model discloses a manipulator transfer apparatus of semiconductor chip production facility, including robotic arm, the inside cavity that is equipped with of robotic arm, the inside slide bar that is equipped with of cavity, be fixed with two limiting plates in the cavity, the slide bar is through running through two the limiting plate slides from top to bottom in the cavity is inside, the robotic arm outer wall is fixed with the telescopic machanism with slide bar outer wall connection, the robotic arm top is equipped with the fixture that is used for the centre gripping chip, fixture passes through moving mechanism and slide bar swing joint, the robotic arm below is equipped with convex unable adjustment base, the robotic arm lower extreme be equipped with convex unable adjustment base complex notch, robotic arm passes through second pivot and convex unable adjustment base swing joint. The utility model discloses rational in infrastructure, be convenient for fix the semiconductor chip of different length, the chip is difficult impaired when fixed, and more traditional manipulator mobility is stronger.

Description

Manipulator conveying equipment of semiconductor chip production equipment

Technical Field

The utility model relates to a manipulator technical field especially relates to a manipulator conveying equipment of semiconductor chip production facility.

Background

The semiconductor refers to a material having a conductivity between a conductor and an insulator at normal temperature. The semiconductor has wide application in radio, television and temperature measurement. Such as diodes, are devices fabricated using semiconductors. Semiconductor refers to a material whose conductivity can be controlled, ranging from an insulator to a conductor. The importance of semiconductors is enormous, both from a technological and economic point of view. Most of today's electronic products, such as computers, mobile phones or digital audio recorders, have a core unit closely related to semiconductors. Common semiconductor materials are silicon, germanium, gallium arsenide, etc., and silicon is the most influential of various semiconductor materials in commercial applications.

The manipulator conveyer of current semiconductor chip production facility is not convenient for fix the semiconductor chip of different length when processing semiconductor chip, and conveyer mostly is fixed and can't remove about.

SUMMERY OF THE UTILITY MODEL

The utility model aims at solving the defects existing in the prior art and providing a manipulator conveying device of semiconductor chip production equipment.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

a manipulator conveying device of semiconductor chip production equipment comprises a mechanical arm, wherein a cavity is arranged inside the mechanical arm, a slide rod is arranged inside the cavity, two limiting plates are fixed in the cavity, the slide rod slides up and down in the cavity by penetrating through the two limiting plates, a telescopic mechanism connected with the outer wall of the slide rod is fixed on the outer wall of the mechanical arm, a clamping mechanism used for clamping a chip is arranged at the top of the mechanical arm and movably connected with the slide rod through a movable mechanism, a convex fixing base is arranged below the mechanical arm, a notch matched with the convex fixing base is arranged at the lower end of the mechanical arm, the mechanical arm is movably connected with the convex fixing base through a second rotating shaft, a placing plate is arranged below the mechanical arm and fixedly connected with the placing plate, a chassis is arranged below the placing plate, and the mechanical arm is in sliding connection with the placing plate through a transmission mechanism.

Preferably, telescopic machanism is including fixing the first cylinder at the robotic arm outer wall, the flexible end of first cylinder is fixed with the L type support arm perpendicular with first cylinder, robotic arm is equipped with the bar mouth that corresponds with the wall body, L type support arm end pass the bar mouth and with slide bar outer wall fixed connection.

Preferably, fixture is including setting up the tong of two symmetries in the robotic arm top, two the end all is equipped with the rubber pad on the tong, two end all is through first pivot and robotic arm swing joint under the tong, first pivot outer wall cover is equipped with torsion spring.

Preferably, the movable mechanism comprises first movable blocks symmetrically fixed on side walls on two sides of the sliding rod, the first movable blocks are movably connected with the second movable blocks through connecting rods, and windows for the connecting rods to move are arranged on the side walls on two sides of the mechanical arm.

Preferably, the transmission mechanism comprises a gear fixed on the outer wall of the rotating shaft, a rack meshed with the gear is arranged below the gear, the rack is connected to the placing plate in a sliding mode through a sliding rail, a second cylinder is fixed above the placing plate, and the telescopic end of the second cylinder is fixedly connected to the side wall of the rack.

Preferably, the placing plate is rotatably connected to the chassis by a bearing.

The utility model has the advantages that:

1. the distance between the upper ends of the two clamping hands can be adjusted by arranging the telescopic mechanism, the clamping mechanism and the movable mechanism so as to adapt to semiconductor chips with different sizes, the first air cylinder contracts to drive the sliding rod to move upwards, and the connecting rod connected with the side wall of the sliding rod drives the angle between the two clamping hands to be enlarged so as to adapt to the semiconductor chips with large sizes.

2. Can be that robotic arm home range is wider through setting up slewing mechanism, bearing, the second cylinder shrink can drive the rack and move right on the slide rail, drives robotic arm and rotate to the left with rack toothing's gear, otherwise the second cylinder extension can drive robotic arm and rotate right, places board and chassis and passes through the bearing rotation and be connected rotatory robotic arm, and robotic arm can be forward, rotate backward after rotatory 90 degrees.

Drawings

Fig. 1 is a schematic structural view of a robot transferring apparatus of a semiconductor chip manufacturing apparatus according to the present invention;

fig. 2 is a schematic side view of a robot transferring apparatus of a semiconductor chip manufacturing apparatus according to the present invention;

fig. 3 is a schematic view of a rotation state of the manipulator conveying device of the semiconductor chip production device according to the present invention.

In the figure: the device comprises a mechanical arm 1, a first rotating shaft 2, a gripper 3, a rubber pad 4, a first movable block 5, a connecting rod 6, a first cylinder 7, an L-shaped support arm 8, a limiting plate 9, a sliding rod 10, a gear 11, a rack 12, a second cylinder 13, a second rotating shaft 14, a convex fixing base 15, a window 16, a placing plate 17, a second movable block 18 and a chassis 19.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.

In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.

Referring to fig. 1-3, a manipulator conveying device of a semiconductor chip production device includes a mechanical arm 1, a cavity is arranged inside the mechanical arm 1, a slide rod 10 is arranged inside the cavity, two limiting plates 9 are fixed inside the cavity, the slide rod 10 slides up and down inside the cavity by penetrating through the two limiting plates 9, a telescopic mechanism connected with the outer wall of the slide rod 10 is fixed on the outer wall of the mechanical arm 1, the telescopic mechanism includes a first cylinder 7 fixed on the outer wall of the mechanical arm 1, an L-shaped support arm 8 perpendicular to the first cylinder 7 is fixed on the telescopic end of the first cylinder 7, the mechanical arm 1 is provided with a bar-shaped opening corresponding to a wall, the tail end of the L-shaped support arm 8 penetrates through the bar-shaped opening and is fixedly connected with the outer wall of the slide rod 10, the slide rod 10 can be driven to slide upwards by contraction of the first cylinder 7, a gripper 3 expands outwards under the drive of a connecting rod 6, and the opposite first cylinder 7 extends, and the gripper 3 can contract inwards.

The top of the mechanical arm 1 is provided with a clamping mechanism for clamping a chip, the clamping mechanism comprises two symmetrical clamping hands 3 arranged above the mechanical arm 1, the upper ends of the two clamping hands 3 are respectively provided with a rubber pad 4, the lower ends of the two clamping hands 3 are respectively movably connected with the mechanical arm 1 through a first rotating shaft 2, the outer wall of the first rotating shaft 2 is sleeved with a torque spring, the chip can be clamped between the two clamping hands 3, the rubber pad 4 can play a role in protection, and the clamping force is prevented from damaging the chip.

The clamping mechanism is movably connected with the sliding rod 10 through a movable mechanism, the movable mechanism comprises first movable blocks 5 which are fixed on the side walls of two sides of the sliding rod 10 and are symmetrical, second movable blocks 18 are arranged on the outer walls of the bottoms of the two clamping hands 3, the first movable blocks 5 and the second movable blocks 18 are movably connected through connecting rods 6, windows 16 for the connecting rods 6 to move are arranged on the side walls of two sides of the mechanical arm 1, and the two clamping hands 3 can be adjusted to be opposite to the sliding rod 10 through the connecting rods 6.

A convex fixing base 15 is arranged below the mechanical arm 1, a notch matched with the convex fixing base 15 is arranged at the lower end of the mechanical arm 1, the mechanical arm 1 is movably connected with the convex fixing base 15 through a second rotating shaft 14, a placing plate 17 is arranged below the mechanical arm 1, the convex fixing base 15 is fixedly connected with the placing plate 17, a chassis 19 is arranged below the placing plate 17, the mechanical arm 1 is slidably connected with the placing plate 17 through a transmission mechanism, the transmission mechanism comprises a gear 11 fixed on the outer wall of the second rotating shaft 14, a rack 12 meshed with the gear 11 is arranged below the gear 11, the rack 12 is slidably connected with the placing plate 17 through a sliding rail, a second air cylinder 13 is fixed above the placing plate 17, the telescopic end of the second air cylinder 13 is fixedly connected to the side wall of the rack 12, the second air cylinder 13 can contract to drive the rack 12 to move, the rack 12 drives the gear 11 to rotate so as to enable the mechanical arm 1 to rotate to the left, similarly, the second cylinder 13 is extended to rotate the robot arm 1 to the right.

The utility model discloses during the use, shrink first cylinder 7 can make slide bar 10 lapse, slide bar 10 drives two tong 3 through two connecting rods 6 and outwards expands, place the chip between two tong 3 afterwards, later extend first cylinder 7 again and make two tong 3 internal contraction fix the chip and begin processing, start second cylinder 13 when processing equipment is located robotic arm 1 left, second cylinder 13 shrink drives rack 12 right side and removes, rotate and drive robotic arm 1 to the left-hand rotation with gear 11 of rack 12 meshing, the same reason only need extend second cylinder 13 when processing equipment is located robotic arm 1 right side can, it can to rotate when needs adjustment chip angle place board 17.

The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.

Claims

1. The utility model provides a manipulator transfer apparatus of semiconductor chip production facility, includes robotic arm (1), its characterized in that, the inside cavity that is equipped with of robotic arm (1), the inside slide bar (10) that is equipped with of cavity, the cavity internal fixation has two limiting plates (9), slide bar (10) is through running through two limiting plates (9) slide from top to bottom in the cavity is inside, robotic arm (1) outer wall is fixed with the telescopic machanism with slide bar (10) outer wall connection, robotic arm (1) top is equipped with the fixture that is used for the centre gripping chip, fixture passes through movable mechanism and slide bar (10) swing joint, robotic arm (1) below is equipped with convex unable adjustment base (15), robotic arm (1) lower extreme is equipped with the notch with convex unable adjustment base (15) complex, robotic arm (1) is through second pivot (14) and convex unable adjustment base (15) swing joint, the improved mechanical arm is characterized in that a placing plate (17) is arranged below the mechanical arm (1), the convex fixing base (15) is fixedly connected with the placing plate (17), a chassis (19) is arranged below the placing plate (17), and the mechanical arm (1) is connected with the placing plate (17) through a transmission mechanism.

2. The manipulator transmission device of the semiconductor chip production equipment according to claim 1, wherein the telescopic mechanism comprises a first cylinder (7) fixed on the outer wall of the mechanical arm (1), an L-shaped support arm (8) perpendicular to the first cylinder (7) is fixed on the telescopic end of the first cylinder (7), the mechanical arm (1) is provided with a strip-shaped opening corresponding to the wall, and the tail end of the L-shaped support arm (8) penetrates through the strip-shaped opening and is fixedly connected with the outer wall of the sliding rod (10).

3. The manipulator conveying device of the semiconductor chip production equipment according to claim 1, wherein the clamping mechanism comprises two symmetrical clamping hands (3) arranged above the mechanical arm (1), rubber pads (4) are arranged at the upper ends of the two clamping hands (3), the lower ends of the two clamping hands (3) are movably connected with the mechanical arm (1) through a first rotating shaft (2), and a torsion spring is sleeved on the outer wall of the first rotating shaft (2).

4. The manipulator transmission device of the semiconductor chip production equipment according to claim 3, wherein the movable mechanism comprises symmetrical first movable blocks (5) fixed on the side walls of two sides of the sliding rod (10), the outer walls of the bottoms of the two clamping hands (3) are respectively provided with a second movable block (18), the first movable blocks (5) and the second movable blocks (18) are respectively movably connected through connecting rods (6), and the side walls of two sides of the mechanical arm (1) are respectively provided with a window (16) for the connecting rods (6) to move.

5. The manipulator transmission device of a semiconductor chip production device according to claim 1, wherein the transmission mechanism comprises a gear (11) fixed on the outer wall of the second rotating shaft (14), a rack (12) meshed with the gear (11) is arranged below the gear (11), the rack (12) is connected to a placing plate (17) in a sliding mode through a sliding rail, a second cylinder (13) is fixed above the placing plate (17), and the telescopic end of the second cylinder (13) is fixedly connected to the side wall of the rack (12).

6. The robot transferring apparatus of a semiconductor chip manufacturing apparatus according to claim 5, wherein the placing plate (17) is rotatably connected to the base plate (19) through a bearing.