CN214873282U - Electronic product rear cover with flame retardant effect - Google Patents

Abstract

The utility model discloses a lid behind electronic product with flame retardant efficiency, including the substrate layer, compound in offset printing layer on the substrate layer compounds in rendition layer on the offset printing layer, compound in PVD cladding material on the rendition layer compounds in the adhesive linkage on the PVD cladding material, compound in the fire-retardant PC rete of adhesive linkage, the substrate layer is the plastic material. This lid behind electronic product includes the substrate layer in proper order, the offset printing layer, the rendition layer, the PVD cladding material, adhesive linkage and fire-retardant PC rete, compared prior art, the fire behaviour of lid behind the electronic product is realized through the fire-retardant PC rete of adhesive linkage laminating, avoid adding the fire retardant in silk screen printing ink or spraying paint and realize fire-retardant performance, improve the quality of lid behind the electronic product, moreover, the steam generator is simple in structure, help the improvement of production efficiency and yield, and avoid the use of volatile solvent, more green. In addition, the substrate layer is made of plastic materials, so that the cost is reduced and the production efficiency is improved.

Description

Electronic product rear cover with flame retardant effect

Technical Field

The utility model relates to a lid technical field behind the electronic product, more specifically relate to a lid behind electronic product, especially lid behind the cell-phone with flame retardant efficiency.

Background

With the popularization of the 5G communication technology, the metal shell is prone to generating signal interference on WIFI, NFC and LIFI, while the rear cover of the 3D structure made of non-metal materials such as glass or plastic does not generate interference signals on the one hand, and on the other hand, the aesthetic degree and hand feeling of the mobile phone can be greatly improved by numerous CMF means, so that the current development trend is that the material of the rear cover of the mobile phone is gradually changed from the metal shell to the glass or plastic material.

At present, the non-metal solution of the rear shell of the mobile phone mainly comprises three main materials: the first type is glass, the most advantages of the glass are mature process, abundant productivity and low cost, and the glass is also a non-metal material with the fastest permeability improvement at present. However, the glass material has inherent defects and is easy to scratch even if only dust or small sand grains are formed. Meanwhile, the mobile phone with the glass cover plate is easy to slide when placed on the inclined plane due to small friction force. The second type is ceramic, the core advantages of which are higher hardness, wear resistance, warm and moist feeling like jade and beautiful and exquisite appearance, which are very ideal materials for mobile phone shells. However, one of the important problems faced by ceramics is the difficulty of processing, resulting in high cost and insufficient productivity. In addition, the brittleness of the ceramic needs to be greatly improved. The third kind of material is plastic, which has various kinds and can meet various requirements, and the plastic has mature process, abundant productivity and lowest cost, so that the plastic material is widely used in the 5G communication era, and at present, two kinds of materials are mainly used, one is a PC/PMMA composite board, and the other is extrusion injection molding of a modified PC material.

The PC/PMMA composite board widely adopted at present can realize rich surface decoration effect through offset printing, UV transfer printing, PVD, silk-screen printing or spraying and other process means due to the optical transparency characteristic (the light transmittance is more than 85%), but the plastic material is flammable, and certain potential safety hazards exist when the PC/PMMA composite board is attached to the surface of a battery, so that the back cover of a plastic mobile phone with certain flame retardant performance is developed and cannot be etched slowly. The scheme that adopts at present is that add the fire retardant in the silk screen printing ink or the spraying paint after the PVD technology and realize, but in order to reach certain flame retardant effect (needle flame test more than 80 s) the addition of fire retardant is big, on the one hand the addition of materials such as fire retardant can lead to printing ink/paint mechanical properties to reduce, especially become fragile, on the other hand because add a large amount of fire retardant can lead to the viscosity reinforcing of printing ink or paint, the workability worsens, the storage stability of product also worsens, thereby lead to in the production process defective rate to rise greatly, the cost is showing and is promoting.

Therefore, it is necessary to provide a rear cover of an electronic product with a flame retardant effect to solve the above-mentioned deficiencies of the prior art.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing a lid behind electronic product with flame retardant efficiency avoids realizing adding the fire retardant and realizing flame retardant ability in silk screen printing ink or spraying paint, improves the quality of lid behind the electronic product, and simple structure helps the improvement of production efficiency and yield, and avoids the use of volatile solvent, more green.

In order to realize the above-mentioned purpose, the utility model discloses a lid behind electronic product with flame retardant efficiency, including the substrate layer, compound in offset printing layer on the substrate layer is compound in rendition layer on the offset printing layer is compound in PVD cladding material on the rendition layer is compound in the adhesive linkage on the PVD cladding material is compound in the fire-retardant PC rete of adhesive linkage, the substrate layer is the plastic material.

Compared with the prior art, lid behind the electronic product with flame retardant efficiency of this application, include the substrate layer in proper order, the offset printing layer, the rendition layer, the PVD cladding material, adhesive linkage and fire-retardant PC rete, compared prior art, the fire behaviour of lid behind the electronic product is realized through the fire-retardant PC rete of adhesive linkage laminating, avoid adding the fire retardant in silk screen printing ink or spraying paint and realize fire-retardant properties, improve the quality of lid behind the electronic product, moreover, the steam generator is simple in structure, help the improvement of production efficiency and yield, and avoid the use of volatile solvent, more green. In addition, the substrate layer is made of plastic materials, so that the cost is reduced and the production efficiency is improved.

Preferably, the substrate layer comprises a body layer and a PC layer compounded on the body layer, and the offset printing layer is arranged on the surface of the PC layer.

Preferably, the body layer is selected from a PMMA layer or a PET layer.

Preferably, the thickness of the body layer is 20-80 μm.

Preferably, the offset layer has a thickness of 3 to 12 μm.

Preferably, the thickness of the PVD coating is 60-600 nm.

Preferably, the thickness of the flame-retardant PC film layer is 0.025-0.25 mm.

Preferably, a hardening layer is arranged on the other side of the base material layer.

Preferably, the flame-retardant PC film layer is a halogen-free flame-retardant PC film layer.

Preferably, the thickness of the base material layer is 0.5-2 mm.

Drawings

Fig. 1 is a schematic structural diagram of the rear cover of the electronic product with flame retardant effect of the present invention.

Description of the symbols:

lid 100 behind the electronic product, substrate layer 10, body layer 11, PC layer 13, offset printing layer 20, transfer printing layer 30, PVD cladding material 40, adhesive linkage 50, fire-retardant PC rete 60, sclerosis layer 70.

Detailed Description

In order to explain technical contents, structural features, and objects and effects of the present invention in detail, the following description is given in conjunction with the embodiments and the accompanying drawings.

Referring to fig. 1, the present application discloses a rear cover 100 of an electronic product with a flame retardant effect, which includes a substrate layer 10, an offset printing layer 20 compounded on the substrate layer 10, a transfer printing layer 30 compounded on the offset printing layer 20, a PVD plating layer 40 compounded on the transfer printing layer 30, an adhesive layer 50 compounded on the PVD plating layer 40, a flame retardant PC film layer 60 compounded on the adhesive layer 50, and the substrate layer 10 is made of a plastic material. The flame retardant performance of the electronic product rear cover 100 is realized by attaching the adhesive layer 50 to the flame retardant PC film layer 60, and the flame retardant performance is prevented from being realized by adding a flame retardant into silk-screen printing ink or spray paint, so that the performance is improved, and the specific description is as follows:

further, the substrate layer 10 is made of plastic materials, the preparation process is mature, the production cost can be reduced, and the production efficiency can be improved. The substrate layer 10 includes a body layer 11 and a PC layer 13 compounded on the body layer 11. Preferably, the body layer 11 is selected from a PMMA layer or a PET layer. Namely, the substrate layer 10 is made of PMMA/PC composite board or PET/PC composite board. Among them, PMMA (polymethyl methacrylate) is a high molecular polymer, also called as acryl, acryl or organic glass, and has the advantages of high transparency, low price, easy machining, etc. The body layer 11 is used in the form of a sheet. Further, the thickness of the substrate layer 10 is 0.5-2mm, such as but not limited to 0.5mm, 1mm, 1.5mm, 2mm for the thickness of the substrate layer 10. The thickness of the bulk layer 11 is 20-80 μm, for example, the thickness of the bulk layer 11 can be, but is not limited to, 28 μm, 35 μm, 45 μm, 55 μm, 65 μm, 70 μm, 80 μm.

Further, the offset layer 20 may be a solid color or a gradient color, and the offset layer 20 is generally formed by coloring the surface of the base layer 10 by offset printing or coating. In this embodiment, the offset layer 20 is formed by coloring the surface of the PC layer 13. Wherein the thickness of the offset layer 20 is 3-12 μm, such as but not limited to 3 μm, 4 μm, 5 μm, 6 μm, 7 μm, 8 μm, 9 μm, 10 μm, 11 μm, 12 μm.

Further, an optical texture is formed on the surface of the offset layer 20 by a UV transfer process, resulting in a transfer layer 30. Of course, in some embodiments, the transfer layer 30 may be formed by forming an optical texture directly on the surface of the PC layer 13 by a UV transfer process.

Further, a PVD coating 40 is obtained by performing physical vapor deposition on the surface of the transfer layer 30, specifically, a PVD optical plating layer of metal oxide is performed on the surface of the transfer layer 30 to form the PVD coating 40. The thickness of the PVD coating 40 is 60-600nm, such as but not limited to 60nm, 100nm, 200nm, 300nm, 400nm, 500nm, 600nm for the PVD coating 40.

Further, the flame-retardant PC film layer 60 is attached to the PVD coating 40 by the action of the adhesive layer 50. Preferably, the adhesive layer 50 is a UV glue layer, and the fixation is convenient and reliable. The flame retardant PC film layer 60 has good flame retardancy and friction resistance to improve the flame retardancy of the electronic product rear cover 100. Preferably, the flame retardant PC film layer 60 is a black PC film layer. More preferably, the flame-retardant PC film layer 60 is a halogen-free flame-retardant PC film layer 60, so that the UL94 fire-retardant grade reaches V0 grade, and the flame-retardant PC film layer is green and environment-friendly. It is noted that the flame retardant PC film layer 60 is made of a PC material containing a flame retardant and is commercially available. The thickness of the flame retardant PC film layer 60 is 0.025-0.25mm, for example, the thickness of the flame retardant PC film layer 60 can be, but is not limited to, 0.025mm, 0.05mm, 0.1mm, 0.15mm, 0.20mm, 0.25 mm.

Further, the opposite side of substrate layer 10 is provided with sclerosis layer 70, specifically is provided with sclerosis layer 70 at the opposite side of body layer 11, and in an embodiment, one side on PMMA layer sets up PC layer 13, and the opposite side spraying of PMMA layer adds hard coating, and the solidification forms sclerosis layer 70 to reduce the fish tail unfavorable condition that appears in the course of working, can effectively improve the product yield.

Compared with the prior art, lid 100 behind the electronic product with flame retardant efficiency of this application, include the substrate layer 10 in proper order, offset printing layer 20, rendition layer 30, PVD cladding material 40, adhesive linkage 50 and fire-retardant PC rete 60, compared with prior art, the fire behaviour of lid 100 behind the electronic product is realized through the fire-retardant PC rete 60 of adhesive linkage 50 laminating, avoid adding the fire retardant in silk screen printing ink or spraying paint and realize fire behaviour, improve the quality of lid 100 behind the electronic product, moreover, the steam generator is simple in structure, help the improvement of production efficiency and yield, and avoid the use of volatile solvent, more green. In addition, the substrate layer 10 is made of plastic material, so that the cost is reduced and the production efficiency is improved.

The above disclosure is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the scope of the invention, therefore, the invention is not limited thereto.

Claims (10)

1. The rear cover with the flame-retardant effect for the electronic product is characterized by comprising a base material layer, an offset printing layer compounded on the base material layer, a transfer printing layer compounded on the offset printing layer, a PVD (physical vapor deposition) coating compounded on the transfer printing layer, an adhesive layer compounded on the PVD coating, and a flame-retardant PC (polycarbonate) film layer compounded on the adhesive layer, wherein the base material layer is made of a plastic material.

2. The electronic product rear cover with flame retardant effect of claim 1, wherein the substrate layer includes a body layer and a PC layer compounded on the body layer, and the offset layer is disposed on the PC layer.

3. The electronic product rear cover with flame retardant effect as claimed in claim 2, characterized in that the body layer is selected from a PMMA layer or a PET layer.

4. The electronic product rear cover with flame retardant effect of claim 2, characterized in that the thickness of the body layer is 20-80 μm.

5. The electronic product rear cover with flame retardant effect as claimed in claim 1, wherein the offset print layer has a thickness of 3-12 μm.

6. The electronic product rear cover with flame retardant effect as claimed in claim 1, wherein the thickness of the PVD coating is 60-600 nm.

7. The electronic product rear cover with flame retardant effect of claim 1, characterized in that the thickness of the flame retardant PC film layer is 0.025-0.25 mm.

8. The electronic product rear cover with flame retardant effect as claimed in claim 1, characterized in that the other side of the substrate layer is provided with a hardened layer.

9. The electronic product rear cover with flame retardant effect of claim 1, characterized in that the flame retardant PC film layer is a halogen-free flame retardant PC film layer.

10. The electronic product rear cover with flame retardant effect as claimed in claim 1, wherein the thickness of the substrate layer is 0.5-2 mm.

Images