CN214866189U

CN214866189U - Calendering processing device for preparing semiconductor high-purity metal material

Info

Publication number: CN214866189U
Application number: CN202121665526.3U
Authority: CN
Inventors: 蔡东旭
Original assignee: Shenzhen Linglei Industrial Co ltd
Current assignee: Shenzhen Linglei Industrial Co ltd
Priority date: 2021-07-21
Filing date: 2021-07-21
Publication date: 2021-11-26
Anticipated expiration: 2031-07-21

Abstract

The utility model discloses a preparation of semiconductor high-purity metal material is with calendering processingequipment, which comprises a housin, the dump bin, bending component and installing frame, the base is installed to the bottom of casing, three installing frames of group are installed to the both sides of casing, the mounting disc is installed to inside one side of installing frame, the inside movable mounting of installing frame has the adjusting disk, the squeeze roll is installed to the inboard of adjusting disk, the dump bin is installed to top one side of base, bending component is installed to one side of dump bin, install the mount pad in the bending component, the mounting bracket is installed to top one side of mount pad. The utility model discloses a mounting bracket is installed at the top of mount pad, can remove to top one side of mount pad after buckling through the metal material atress that the mounting bracket guide fell to can make the waste residue on metal material surface drop naturally after receiving external force, and then be convenient for collect the waste residue and concentrate the clearance, reduce operating personnel's work load, promote the machining efficiency of device.

Description

Calendering processing device for preparing semiconductor high-purity metal material

Technical Field

The utility model relates to a calender technical field specifically is preparation of semiconductor high-purity metal material is with calendering processingequipment.

Background

The semiconductor metal material is a material with the conductivity between a conductor and an insulator in a normal temperature environment, and due to excellent conductivity controllability, the semiconductor material is widely applied to the fields of electronics, integrated circuits, communication and the like, and the semiconductor metal material needs to be processed by a calender during production and processing, so that the structural strength of the metal material is improved, and therefore, in order to facilitate the calendering processing of the semiconductor metal material, a calendering processing device for preparing the semiconductor high-purity metal material is provided.

The existing calendering processing device has the defects that:

1. when the existing calendaring device is used for calendaring semiconductor metal materials, waste residues appear on the surfaces of the metal materials due to the fact that the metal materials are gradually heated after being extruded, the traditional calendaring machine can only be used for calendaring the semiconductor metal materials, cannot collect and process the waste residues falling from the metal materials and the waste residues not completely falling from the surfaces of the metal materials, and needs to be manually cleaned, so that the workload of workers is increased;

2. when the existing calendering device is used for continuously calendering and processing a metal material, the driving roller and the squeeze roller can be gradually heated up due to the high temperature of the metal material, so that the structural strength of the driving roller and the squeeze roller is influenced, the device is caused to gradually reduce the calendering effect of the metal material under the condition of continuous work, and the processing efficiency of the metal material is further influenced.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a preparation of semiconductor high-purity metal material is with calendering processingequipment to solve the problem that proposes in the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme: the calendering processing device for preparing the semiconductor high-purity metal material comprises a shell, a waste bin, a bending assembly and an installation frame, wherein a base is installed at the bottom of the shell, supporting seats are installed on two sides of the bottom of the base, three groups of installation frames are installed on two sides of the shell, an installation disc is installed on one side of the inner portion of the installation frame, an adjusting disc is movably installed on the inner portion of the installation frame, a threaded rod extending out of the shell is installed on one side of the adjusting disc, a wheel disc is installed at one end of the threaded rod, an extrusion roller is installed on the inner side of the adjusting disc, three groups of copper cores are installed on the inner portion of the adjusting disc, a baffle is installed on two sides of the top of the installation frame, the waste bin is installed on one side of the top of the base, a feeding port is formed in one side of the inner portion of the waste bin, the bending assembly is installed on one side of the waste bin, and an installation seat is installed in the bending assembly, the mounting bracket is installed to top one side of mount pad, inside one side of mount pad is equipped with row material groove, the draw-in groove seat is installed to one side of mount pad, the install bin is installed at the top of draw-in groove seat.

Preferably, the two sides of the inside of the shell are welded with the supporting rods, and the inside of the shell is provided with the turnover cover.

Preferably, the top of the waste bin is provided with an air outlet, and the bottom of the air outlet is provided with a filter screen.

Preferably, the installation box is internally provided with a hydraulic telescopic rod extending out of the bottom, and the bottom of the hydraulic telescopic rod is provided with a blade.

Preferably, the gyro wheel is installed to the top equidistance of mount pad, and the inside equidistance of mount pad installs the refrigeration pipe.

Preferably, a servo motor is installed on the front surface of the installation disc, and a driving roller is installed on one side of the installation disc.

Compared with the prior art, the beneficial effects of the utility model are that:

1. the utility model discloses a mounting bracket is installed at the top of mount pad, can remove to top one side of mount pad after buckling through the metal material atress that the mounting bracket guide fell to can make the waste residue on metal material surface drop naturally after receiving external force, and then be convenient for collect the waste residue and concentrate the clearance, reduce operating personnel's work load, promote the machining efficiency of device.

2. The utility model discloses an internally mounted at the squeeze roll has the copper core, can strengthen the structural strength and the compressive property of squeeze roll through the copper core to can make the air current run through the copper core, so that accelerate the natural heat dissipation of squeeze roll, guarantee the stability of squeeze roll under the continuous working condition, thereby can hoisting device to metal material's processing effect.

Drawings

Fig. 1 is a schematic view of a three-dimensional structure of the present invention;

fig. 2 is a schematic front sectional structure of the present invention;

FIG. 3 is a schematic view of the front external structure of the present invention;

fig. 4 is a schematic view of a local structure of the bending assembly of the present invention.

In the figure: 1. a housing; 101. a support bar; 102. a cover is turned; 103. a base; 104. a supporting seat; 2. a waste bin; 201. an air outlet; 202. a filtering net cover; 203. a feeding port; 3. a slot clamping seat; 301. a blade; 302. a hydraulic telescopic rod; 303. installing a box; 4. a bending assembly; 401. a mounting seat; 402. a mounting frame; 403. a discharge chute; 404. a roller; 405. a refrigeration pipe; 5. installing a frame; 501. a wheel disc; 502. a threaded rod; 503. a copper core; 504. a squeeze roll; 505. a baffle plate; 506. a drive roller; 507. mounting a disc; 508. a servo motor; 509. and (4) adjusting a disc.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front end", "rear end", "both ends", "one end", "the other end" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element to which the reference is made must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "disposed," "connected," and the like are to be construed broadly, and for example, "connected" may be either fixedly connected or detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

Referring to fig. 1-4, the present invention provides an embodiment: a calendering processing device for preparing a semiconductor high-purity metal material comprises a shell 1, a waste bin 2, a bending component 4 and a mounting frame 5, wherein a base 103 is installed at the bottom of the shell 1, the shell 1 can provide an installation position for surrounding components, the base 103 can provide an installation position for the components at the top, supporting seats 104 are installed on two sides of the bottom of the base 103, the supporting seats 104 can provide vertical supports for the base 103, so that the overall stability of the device can be ensured, three groups of mounting frames 5 are installed on two sides of the shell 1, the mounting frames 5 can provide installation positions for the components inside, a mounting disc 507 is installed on one side inside the mounting frame 5, the mounting disc 507 can provide installation positions for the surrounding components, an adjusting disc 509 is movably installed inside the mounting frame 5, the adjusting disc 509 can horizontally move inside the mounting frame 5, so that the distance between a driving roller 506 and an extrusion roller 504 can be adjusted, a threaded rod 502 extending out of the shell 1 is installed on one side of the adjusting disk 509, the threaded rod 502 can rotate through the rotating wheel disk 501 so as to adjust the horizontal position of the adjusting disk 509, the wheel disk 501 is installed at one end of the threaded rod 502, the wheel disk 501 can facilitate rotation of the threaded rod 502, an extrusion roller 504 is installed on the inner side of the adjusting disk 509, the extrusion roller 504 can be matched with a driving roller 506 to extrude a semiconductor metal material, so that metal materials are rolled, three groups of copper cores 503 are installed inside the adjusting disk 509, the copper cores 503 are in a hollow cylindrical design, heat dissipation of the extrusion roller 504 can be accelerated by installing the copper cores 503 inside the extrusion roller 504, the compression resistance of the extrusion roller 504 can be enhanced, the stability of the extrusion roller 504 in a continuous working state is ensured, baffles 505 are installed on two sides of the top of the mounting frame 5, and the baffles 505 can guide the metal materials to fall into a gap between the driving roller 506 and the extrusion roller 504 for rolling, the waste bin 2 is installed on one side of the top of the base 103, the waste bin 2 can collect waste residues falling from the metal surface, so that the waste residues can be cleaned in a centralized manner, a feeding port 203 is formed in one side of the interior of the waste bin 2 and can be in butt joint with a discharging groove 403, so that the waste residues falling from the interior of the mounting seat 401 can enter the interior of the waste bin 2, a bending component 4 is installed on one side of the waste bin 2, the bending component 4 can guide metal materials subjected to calendering processing to bend, so that residual metal residues on the metal surface can be peeled off, the mounting seat 401 is installed in the bending component 4, the mounting seat 401 can provide mounting positions for surrounding components, the mounting frame 402 is installed on one side of the top of the mounting seat 401, the mounting frame 402 can guide metal materials to bend, so that the metal materials can be deformed, and the waste residues on the metal surface can be separated, the inside one side of mount pad 401 is equipped with row material groove 403, arranges material groove 403 and can guide the metal waste residue to fall into the inside of dump bin 2, and draw-in groove seat 3 is installed to one side of mount pad 401, and draw-in groove seat 3 can provide the position of installation for the subassembly at top to can segment the cutting to metal material with the cooperation of blade 301, install bin 303 is installed at the top of draw-in groove seat 3, and install bin 303 can provide the position of installation for the subassembly of inside.

Further, the welding of the inside both sides of casing 1 has bracing piece 101, and bracing piece 101 can carry out the support of horizontal direction to the inner wall of casing 1 to can promote casing 1's structural strength, and casing 1's internally mounted has flip 102, and flip 102 can manual switch, so that carry out the dismouting to dump bin 2.

Further, the top of waste bin 2 is equipped with venthole 201, and venthole 201 can make the inside waste gas of waste bin 2 discharge, and the bottom of venthole 201 installs filter screen panel 202, and filter screen panel 202 can carry out simple and easy filtration to exhaust waste gas to can prevent that the waste residue from passing through venthole 201 and discharging.

Further, the internally mounted of install bin 303 has hydraulic telescoping rod 302 who extends the bottom, and hydraulic telescoping rod 302 can reciprocate to stretch out and draw back through the hydraulic controller control of one side to promote blade 301 and carry out the removal of vertical direction, and blade 301 is installed to hydraulic telescoping rod 302's bottom, and blade 301 can apply pressure through hydraulic telescoping rod 302 and carry out vertical lift, so that cut the metal material after processing.

Further, gyro wheel 404 is installed to the top equidistance of mount pad 401, gyro wheel 404 can reduce the frictional force between metal material and the mount pad 401, so that guide metal material is at the top horizontal migration of mount pad 401, and the inside equidistance of mount pad 401 installs refrigeration pipe 405, refrigeration pipe 405's inside adopts semiconductor metal material to make, can make refrigeration pipe 405 cool down rapidly through circular telegram to refrigeration pipe 405, thereby make the holistic temperature of mount pad 401 descend, so that cool down to metal material, make the waste residue on metal material surface cracked rapidly, conveniently peel off metal waste residue.

Further, servo motor 508 is installed on the front of mounting disc 507, servo motor 508 can adopt YE3-200KW type, servo motor 508 can rotate after the circular telegram, thereby can drive roller 506 and rotate, and drive roller 506 is installed to one side of mounting disc 507, the one end of drive roller 506 and servo motor 508's output fixed connection, it can drive roller 506 and rotate to rotate through servo motor 508 circular telegram back-rotation, so that exert drive power to metal material, make metal material can remove processing between drive roller 506 and squeeze roller 504.

The working principle is as follows: the threaded rod 502 is driven to rotate through the rotary wheel disc 501, the adjusting disc 509 drives the squeeze roller 504 to horizontally move in the installation frame 5, after the gap between the squeeze roller 504 and the driving roller 506 is adjusted, the semiconductor metal material to be processed is placed in the gap between the driving roller 506 and the squeeze roller 504, the driving roller 506 is driven to rotate after the servo motor 508 is electrified, the semiconductor metal material is driven by the driving roller 506 to move in the vertical direction, meanwhile, the temperature is rapidly raised after being squeezed through the squeeze roller 504, further, the semiconductor metal material is rolled and bent through the guide of the installation frame 402, so that waste residues on the surface of the metal material are separated by external force, the waste residues are guided to enter the waste material box 2 through the discharge groove 403 for storage, the metal material is transmitted to the position under the blade 301 through the roller 404, and the telescopic rod is pushed to vertically lift through the hydraulic pressure 302, the device cuts the metal material in sections, thereby completing the production and processing of the semiconductor metal material.

It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Claims

1. Semiconductor high purity metal material preparation is with calendering processingequipment, including casing (1), dump bin (2), subassembly (4) and installing frame (5) buckle, its characterized in that: base (103) is installed to the bottom of casing (1), supporting seat (104) is installed to the bottom both sides of base (103), three mounting frame of group (5) are installed to the both sides of casing (1), mounting disc (507) is installed to inside one side of mounting frame (5), the inside movable mounting of mounting frame (5) has adjusting disk (509), threaded rod (502) that extend casing (1) are installed to one side of adjusting disk (509), rim plate (501) is installed to the one end of threaded rod (502), squeeze roller (504) are installed to the inboard of adjusting disk (509), the internally mounted of adjusting disk (509) has three copper core of group (503), baffle (505) are installed to the top both sides of mounting frame (5), dump box (2) is installed to top one side of base (103), inside one side of dump box (2) is equipped with pan feeding mouth (203), install bending assembly (4) in one side of dump bin (2), install mount pad (401) in bending assembly (4), mounting bracket (402) are installed to top one side of mount pad (401), inside one side of mount pad (401) is equipped with row material groove (403), draw-in groove seat (3) are installed to one side of mount pad (401), install bin (303) at the top of draw-in groove seat (3).

2. The rolling processing apparatus for producing a semiconductor high-purity metal material according to claim 1, characterized in that: the support rods (101) are welded on two sides of the interior of the shell (1), and the flip cover (102) is installed inside the shell (1).

3. The rolling processing apparatus for producing a semiconductor high-purity metal material according to claim 1, characterized in that: the top of waste bin (2) is equipped with venthole (201), and filters screen panel (202) is installed to the bottom of venthole (201).

4. The rolling processing apparatus for producing a semiconductor high-purity metal material according to claim 1, characterized in that: the inside of install bin (303) is installed and is extended hydraulic telescoping rod (302) of bottom, and blade (301) are installed to the bottom of hydraulic telescoping rod (302).

5. The rolling processing apparatus for producing a semiconductor high-purity metal material according to claim 1, characterized in that: gyro wheel (404) are installed to the top equidistance of mount pad (401), and the inside equidistance of mount pad (401) installs refrigeration pipe (405).

6. The rolling processing apparatus for producing a semiconductor high-purity metal material according to claim 1, characterized in that: a servo motor (508) is installed on the front face of the installation disc (507), and a driving roller (506) is installed on one side of the installation disc (507).