CN214845341U - Sensor with a sensor element - Google Patents

Abstract

The utility model discloses a sensor, it is including the chip module and accept the insulating casing of chip module, the chip module including insulator, install in insulator's chip subassembly with be used for right the chip subassembly carries out the location structure of fixing a position. The utility model discloses a set up location structure is right the chip subassembly is fixed a position, thereby guarantees the chip module with insulating casing's smooth combination has improved the production efficiency and the production yield of product.

Description

Sensor with a sensor element

[ technical field ] A method for producing a semiconductor device

The utility model relates to a sensor especially relates to a sensor including chip module.

[ background of the invention ]

In many fields, for example, in the field of automobiles, in order to detect the wheel speed of the automobile, a wheel speed sensor is required, and as the demand for development of automatic driving is higher, the demand for the wheel speed sensor is also higher. The traditional wheel speed sensor comprises a chip module and an insulating shell which is formed by injection molding and arranged on the outer side of the chip module, wherein the chip module comprises an insulating body and a chip assembly which is assembled on the insulating body. In the actual production and manufacturing process, on one hand, in the process of transferring the assembled chip module to the film cavity, the chip assembly is easily subjected to position deviation caused by external force, secondary adjustment is needed, and the production efficiency is influenced; on the other hand, due to the flowing pressure of the plastic liquid injected into the film cavity, the chip assembly is easily squeezed by the plastic liquid to deviate from the predetermined position, which affects the production yield of the product.

Therefore, it is desirable to design a new technical solution to solve the above technical problems.

[ Utility model ] content

The utility model discloses the technical problem that will solve lies in: provided is a sensor having high production efficiency and high production yield.

In order to solve the above problem, the utility model discloses following technical scheme can be adopted: a sensor comprises a chip module and an insulating shell for accommodating the chip module, wherein the chip module comprises an insulating body, a chip component arranged on the insulating body and a positioning structure for positioning the chip component.

In a preferred embodiment, the positioning structure is a positioning cover detachably fixed to the insulating body.

In a preferred embodiment, the chip assembly includes a chip functional module and chip terminals connected to the chip functional module; the positioning cover has a first positioning portion for positioning the chip functional module, and/or the positioning cover has a second positioning portion for positioning the chip terminal.

In a preferred embodiment, the chip assembly includes a first chip terminal and a second chip terminal disposed adjacent to each other, the insulating body has a guiding and positioning portion located between the first chip terminal and the second chip terminal, and the positioning cover has a positioning groove engaged with the guiding and positioning portion.

In a preferred embodiment, the positioning structure is a positioning member connected to the insulating body, and at least a portion of the positioning member is formed by melting an insulating material.

In a preferred embodiment, the insulating material is a protrusion extending integrally from the insulating body.

In a preferred embodiment, the chip assembly includes two chip terminals arranged side by side, the positioning member includes a connecting portion located between the two chip terminals and connected to the insulating body, and a positioning portion connected to the connecting portion and extending laterally to both sides to position the two chip terminals, and the positioning portion is formed by a melting process.

In a preferred embodiment, the chip module comprises a melting tool limiting structure arranged beside the positioning piece.

In a preferred embodiment, the insulating housing is injection molded on the outer side of the chip module.

In a preferred embodiment, the chip assembly includes a first chip assembly and a second chip assembly which are independent from each other, and the insulation body has a first receiving groove for receiving the first chip assembly and a second receiving groove for receiving the second chip assembly; the first accommodating groove comprises two first sub-accommodating grooves arranged at intervals, and/or the second accommodating groove comprises two second sub-accommodating grooves arranged at intervals.

Compared with the prior art, the utility model discloses following beneficial effect has at least: the utility model discloses a set up location structure and fix a position the chip subassembly to guarantee the smooth combination of chip module and insulating casing, improved the production efficiency and the production yield of product.

[ description of the drawings ]

Fig. 1 is a perspective view of a sensor according to a first embodiment of the present invention.

FIG. 2 is a perspective view of the sensor of FIG. 1 without the dielectric housing being injection molded, including a close-up view.

FIG. 3 is a partially exploded perspective view of the sensor of FIG. 2, including a close-up view.

FIG. 4 is a perspective view of another angle of the sensor of FIG. 3, including a close-up view.

Fig. 5 is a partially exploded, perspective view of the sensor of fig. 3, with the cables not shown.

Fig. 6 is a perspective view of a chip module of a sensor according to a second embodiment of the present invention, in which a cable terminal is further connected.

Fig. 7 is a perspective view of the chip module shown in fig. 6 before the bump structures are not melted.

[ detailed description ] embodiments

The technical solutions of the embodiments of the present invention are explained and explained below with reference to the drawings of the embodiments of the present invention, but the following embodiments are only preferred embodiments of the present invention, and not all embodiments. Based on the embodiments in the present invention, other embodiments obtained by the skilled in the art without creative work all belong to the protection scope of the present invention.

First embodiment

Referring to fig. 1 and 2, the present invention provides a sensor 100 that may be used, but is not limited to, a wheel speed sensor for an automobile. The sensor 100 includes a chip module 101, a cable 102, a cable terminal 103 connecting the chip module 101 and the cable 102, and an insulating housing 104 accommodating the chip module 101, the cable terminal 103, and a portion of the cable 102, but in other embodiments, the cable 102 and the cable terminal 103 may not be provided, that is, the cable may not be provided as a cable sensor, but may be provided as a socket sensor. The insulating housing 104 may be injection molded on the outer side of the chip module 101, or the insulating housing 104 may be injection molded first, and then the insulating housing 104 and the chip module 101 are assembled together by an assembling method.

Referring to fig. 2, the chip module 101 includes an insulating body 1, a chip assembly 2 mounted on the insulating body 1, and a positioning structure 3 for positioning the chip assembly 2. The utility model discloses a set up location structure 3 is right chip subassembly 2 advances line location, thereby guarantees chip module 2 with insulating casing 104 combines smoothly, has improved the production efficiency and the production yield of product. Referring to fig. 2 to 4, the positioning structure 3 is a positioning cover detachably fixed to the insulating body 1, in this embodiment, the positioning structure 3 and the insulating body 1 are fixed by a snap structure, but other fixing methods may be adopted in other embodiments. The chip assembly 2 includes a chip functional module 21 and a chip terminal 22 connected to the chip functional module 21, the chip functional module 21 has different setting modes according to different chip types, which may be hall type or magnetic resistance type, and generally includes a chip functional component (not shown) and an insulating housing 210 covering the outside of the chip functional component, the chip functional component includes but is not limited to a crystal source, a circuit, etc., and some chip functional components include a capacitor. The positioning structure 3 includes a first positioning portion 31 for positioning the chip functional module 21 and a second positioning portion 32 for positioning the chip terminal 22. The first positioning portion 31 preferably has lateral positioning portions 310 for positioning the chip functional module 21 in the front, rear, left, and right directions, the second positioning portion 32 preferably positions the chip terminals 22 in the vertical direction, and only one of the first positioning portion 31 and the second positioning portion 32 may be provided as long as the positioning effect can be ensured.

Referring to fig. 5, the chip assembly 2 includes a first chip assembly 23 and a second chip assembly 24 which are independent of each other, so that when the sensor 100 is applied to some specific fields, for example, as a wheel speed sensor of a vehicle, two wheel speed detection points can be provided, on one hand, the detection accuracy is higher, and on the other hand, even if one of the wheel speed detection points is damaged, the other wheel speed detection point can still work normally, so that the trend of vehicle automation development and market demands can be met, and the safety performance of the product can be improved. The insulation body 1 has a first receiving slot 12 for receiving the first chip module 23 and a second receiving slot 13 for receiving the second chip module 24, the first receiving slot 12 includes two first sub-receiving slots 120 arranged at intervals, and the second receiving slot 13 includes two second sub-receiving slots 130 arranged at intervals. Some first chip module 23 with second chip module 24 include a part, and some two parts including the interval setting, no matter which situation, the outside of every part all the cladding has insulating material, works as first chip module 23 with second chip module 24 is including two parts, has all set up chip function components and parts in the insulating material of possible two parts, does not have any chip function components and parts in the insulating material of also having, the utility model discloses a will first holding tank 12 with second holding tank 13 all sets up to the groove structure including two intervals settings, makes insulator 1 has the commonality more. With reference to fig. 4, the first chip assembly 23 includes a first chip terminal 221 and a second chip terminal 222 which are adjacently disposed, the second chip assembly 24 includes a third chip terminal 223 and a fourth chip terminal 224 which are adjacently disposed, the insulation body 1 has a first guide positioning portion 111 located between the first chip terminal 221 and the second chip terminal 222 and a second guide positioning portion 112 located between the third chip terminal 223 and the fourth chip terminal 224, and the positioning structure 3 has a first positioning groove 33 which is matched with the first guide positioning portion 111 and a second positioning groove 34 which is matched with the second guide positioning portion 112. With this arrangement, on the one hand, the first guiding and positioning portion 111 and the second guiding and positioning portion 112 can be used for guiding the installation of the chip assembly 2, and on the other hand, the first guiding and positioning portion 111 and the second guiding and positioning portion 112 cooperate with the first positioning groove 33 and the second positioning groove 34 to ensure the accuracy of the installation position of the positioning cover 3, so as to ensure the positioning effect of the chip assembly 2. Further, the upper end of the first guide positioning portion 111 is higher than the upper end of the first chip terminal 221 and higher than the upper end of the second chip terminal 222, and the upper end of the second guide positioning portion 112 is higher than the upper end of the third chip terminal 223 and higher than the upper end of the fourth chip terminal 224.

Second embodiment

Referring to fig. 6 and 7, the present invention further provides a chip module 101 'and a cable terminal 103' of another sensor (not fully shown), the sensor of the present embodiment has substantially the same structure as the sensor 100 of the first embodiment, and the difference is mainly the positioning structure 3 'for positioning the chip assembly 2'. The positioning structure 3 ' is a positioning member connected to the insulating body 1 ', and at least a portion of the positioning member 3 ' is formed by melting an insulating material. In this embodiment, the insulating material is a protrusion 301 'integrally extending outward from the insulating body 1', but in other embodiments, a single insulating block material may be melted in a melting process and dropped around the chip terminal 22 'to form at least part of the positioning member 3'. The first chip terminal 221 ', the second chip terminal 222', the third chip terminal 223 'and the fourth chip terminal 224' are arranged side by side, the positioning member 3 ' includes a first connection portion 302 ' connected to the insulating body 1 ' and located between the first chip terminal 221 ' and the second chip terminal 222 ', a first positioning portion 303 ' connected to the first connection portion 302 ' and extending laterally to position the first chip terminal 221 ' and the second chip terminal 222 ', a second connection portion 304 ' connected to the insulating body 1 ' and located between the third chip terminal 223 ' and the fourth chip terminal 224 ', and a second positioning portion 305 ' connected to the second connection portion 304 ' and extending laterally to position the third chip terminal 223 ' and the fourth chip terminal 224 ', the first positioning portion 303 'and the second positioning portion 304' are formed through a melting process. Further, the chip module 101 ' further includes a melting tool limiting structure 4 ' arranged beside the positioning element 3 ', and the melting tool limiting structure 4 ' is used for cooperating with a melting tool to prevent excessive melting of the material on the insulating body 1 '.

It is to be understood that the above-described embodiments of the present invention can be combined with each other to obtain further embodiments, without conflict. The various features described in the foregoing detailed description may be combined in any suitable manner without departing from the scope of the invention.

In the description of the present invention, it is to be understood that the terms "center", "upper", "lower", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like are used in the orientation or positional relationship indicated in the drawings, which is only for convenience of description and simplification of description, and do not indicate or imply that the device or component in question must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.

In the present invention, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "fixed" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; the two components can be directly connected or indirectly connected through an intermediate medium, and the two components can be communicated with each other. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

Claims (10)

1. The utility model provides a sensor, its is including chip module and accept the insulating casing of chip module, its characterized in that: the chip module comprises an insulating body, a chip assembly arranged on the insulating body and a positioning structure used for positioning the chip assembly.

2. The sensor of claim 1, wherein: the positioning structure is a positioning cover detachably fixed on the insulating body.

3. The sensor of claim 2, wherein: the chip assembly comprises a chip functional module and a chip terminal connected with the chip functional module; the positioning cover has a first positioning portion for positioning the chip functional module, and/or the positioning cover has a second positioning portion for positioning the chip terminal.

4. The sensor of claim 2, wherein: the chip assembly comprises a first chip terminal and a second chip terminal which are adjacently arranged, the insulation body is provided with a guide positioning part which is positioned between the first chip terminal and the second chip terminal, and the positioning cover is provided with a positioning groove matched with the guide positioning part.

5. The sensor of claim 1, wherein: the positioning structure is a positioning piece connected with the insulating body, and at least part of the positioning piece is formed by processing an insulating material by adopting a melting process.

6. The sensor of claim 5, wherein: the insulating material is a protruding structure integrally extending outward from the insulating body.

7. The sensor of claim 5, wherein: the chip assembly comprises two chip terminals arranged side by side, the positioning piece comprises a connecting part and a positioning part, the connecting part is located between the two chip terminals and connected with the insulating body, the positioning part is connected with the connecting part and extends towards two transverse sides to position the two chip terminals, and the positioning part is formed by melting process treatment.

8. The sensor of any one of claims 5 to 7, wherein: the chip module is in including setting up melt frock limit structure of the side of setting element.

9. The sensor of any one of claims 1 to 7, wherein: the insulating shell is formed on the outer side of the chip module in an injection molding mode.

10. The sensor of any one of claims 1 to 7, wherein: the chip assembly comprises a first chip assembly and a second chip assembly which are arranged independently, and the insulation body is provided with a first accommodating groove for accommodating the first chip assembly and a second accommodating groove for accommodating the second chip assembly; the first accommodating groove comprises two first sub-accommodating grooves arranged at intervals, and/or the second accommodating groove comprises two second sub-accommodating grooves arranged at intervals.

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