CN214815542U - Large-scale multi-temperature-zone circuit board mounting reflow soldering material conveying guide rail - Google Patents
Large-scale multi-temperature-zone circuit board mounting reflow soldering material conveying guide rail Download PDFInfo
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- CN214815542U CN214815542U CN202120107817.4U CN202120107817U CN214815542U CN 214815542 U CN214815542 U CN 214815542U CN 202120107817 U CN202120107817 U CN 202120107817U CN 214815542 U CN214815542 U CN 214815542U
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- guide rail
- circuit board
- reflow soldering
- frame
- temperature
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Abstract
The utility model discloses a defeated material guide rail of large-scale multi-temperature-zone circuit board subsides dress reflow soldering includes the organism, be equipped with defeated material guide rail in the organism, defeated material guide rail is including setting up the support frame on the organism, the top of support frame is equipped with decides the guide rail, be equipped with the locating rack that sets up relatively with the support frame on the organism, be equipped with a plurality of spacing polished rods between locating rack and the support frame, be equipped with between a plurality of spacing polished rods and remove the frame, the top of removing the frame is equipped with and decides guide rail matched with mobile rail, be equipped with the lead screw with spacing polished rod parallel arrangement between support frame and the locating rack, be equipped with the slider that removes along the lead screw on the lead screw, the both ends tip of shifting chute all is equipped with first drive sprocket, is equipped with the conveyer belt between the first drive sprocket. The utility model discloses can adjust the interval between deciding the guide rail and the moving guide, and be convenient for carry the circuit board of different specification models to have the advantage of carrying stable and anti-sticking board.
Description
Technical Field
The utility model relates to a circuit board production technical field specifically is the defeated material guide rail of large-scale multi-temperature-zone circuit board subsides dress reflow soldering.
Background
The reflow soldering technology is not unknown in the field of electronic manufacturing, components on various board cards used in computers are all soldered on a circuit board through the process, a heating circuit is arranged in the equipment, air or nitrogen is heated to a high enough temperature and then blown to the circuit board on which the components are stuck, and solder on two sides of the components is melted and then bonded with a mainboard. The process has the advantages that the temperature is easy to control, oxidation can be avoided in the welding process, the manufacturing cost is easy to control, when the circuit board is subjected to reflow soldering, the circuit board is conveyed into corresponding equipment by utilizing the conveying guide rail, and the existing conveying guide rail is fixed in structure and cannot be adjusted, so that the circuit boards with different specifications cannot be conveyed. Therefore, the reflow soldering material conveying guide rail for the large-scale multi-temperature-zone circuit board mounting is provided.
SUMMERY OF THE UTILITY MODEL
For solving the defect that prior art exists, the utility model provides a defeated material guide rail of large-scale multi-temperature-zone circuit board subsides dress reflow soldering.
In order to solve the technical problem, the utility model provides a following technical scheme:
the utility model discloses defeated material guide rail of large-scale multi-temperature-zone circuit board subsides dress reflow soldering, including the organism, its characterized in that: the machine body is internally provided with a material conveying guide rail, the material conveying guide rail comprises a support frame arranged on the machine body, the top of the support frame is provided with a fixed guide rail, the machine body is provided with a positioning frame arranged opposite to the support frame, a plurality of limiting polished rods are arranged between the positioning frame and the support frame, a moving frame is arranged between the limiting polished rods, the top of the moving frame is provided with a moving guide rail matched with the fixed guide rail, a lead screw arranged in parallel with the limiting polished rods is arranged between the support frame and the positioning frame, a sliding block moving along the lead screw is arranged on the lead screw, the sliding block is fixed with the moving frame through screws, the fixed guide rail and the moving guide rail are provided with moving grooves, the end parts of two ends of each moving groove are respectively provided with a first transmission chain wheel, a conveying chain belt is arranged between the first transmission chain wheels, one side of the conveying chain belt is embedded into the moving grooves, the bottom sides of the moving grooves are provided with anti-off limiting grooves, and the bottom of the conveying chain belt is provided with a limiting strip embedded into the anti-falling limiting groove.
As a preferred technical solution of the present invention, the conveying chain belt is driven by a synchronous driving mechanism, the synchronous driving mechanism includes a rotating shaft disposed between the supporting frame and the positioning frame, the rotating shaft is provided with a spline shaft, the spline shaft is provided with second transmission sprockets which move along the spline shaft and are respectively matched with the conveying chain belt, and the two second transmission sprockets are respectively fixed on the moving frame and the supporting frame; and a first driving motor in transmission connection with the rotating shaft is arranged on the machine body.
As an optimal technical scheme of the utility model, all be equipped with on first drive sprocket and second drive sprocket's the wheel face with spacing matched with recess.
As an optimized technical scheme of the utility model, be equipped with the second driving motor who is connected with the screw drive on the organism.
As a preferred technical proposal of the utility model, the side of the conveying chain belt is provided with a convex anti-jamming slat.
As an optimal technical scheme of the utility model, decide guide rail and movable guide and all form by a plurality of monomer guide splices.
As an optimized technical proposal of the utility model, a spacing cavity for embedding the end part of the circuit board is respectively formed between the fixed guide rail and the conveying chain belt and between the movable guide rail and the conveying chain belt.
The utility model has the advantages that: 1. the large-scale multi-temperature-zone circuit board mounting reflow soldering material conveying guide rail can adjust the distance between the fixed guide rail and the movable guide rail, so that circuit boards of different specifications and models can be conveniently conveyed, in the process of conveying the circuit boards, the end parts of the circuit boards are respectively embedded between the fixed guide rail and the conveying chain belt and between the movable guide rail and the conveying chain belt to form limiting cavities, and along with the movement of the conveying chain belt, the limiting conveying work of the circuit boards is realized, and the phenomenon of moving and welding of the circuit boards is avoided; wherein the bottom side of shifting chute is equipped with the anticreep spacing groove, the bottom of conveying chain belt is equipped with the spacing of embedding the anticreep spacing inslot, and in the transportation process that the conveying chain belt moved, the spacing of conveying chain belt bottom was all the time embedded into the anticreep spacing inslot, had played spacing anticreep effect, has effectively avoided the conveying chain belt to appear fluctuation from top to bottom by a wide margin at the in-process of transportation for the circuit board is carried in what the conveying chain belt can be steady, thereby has the transport effect of preferred to the circuit board.
2. This kind of defeated material guide rail of large-scale multi-temperature-zone circuit board subsides dress reflow soldering carries out synchronous motion through setting up synchronous drive mechanism to two conveyor chain belts of synchronous drive carry out synchronous motion to ensure to carry out steady transport to the circuit board, and when adjusting the interval between deciding guide rail and the movable guide rail, do not influence synchronous drive mechanism's normal operating.
3. The lateral side of the conveying chain belt is provided with the convex anti-blocking strip plate, so that the phenomenon of blocking caused by collision between the end part of the circuit board and the side walls of the fixed guide rail and the movable guide rail is effectively avoided.
4. The fixed guide rail and the movable guide rail in the large-scale multi-temperature-zone circuit board mounting reflow soldering material conveying guide rail are formed by splicing a plurality of single guide rails, the stress effect of expansion with heat and contraction with cold on the fixed guide rail and the movable guide rail is reduced, the damaged part is easily replaced, and the use cost is reduced.
Drawings
The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention, and together with the description serve to explain the invention and not to limit the invention. In the drawings:
FIG. 1 is a schematic structural view of a reflow soldering material conveying rail for mounting a large-sized multi-temperature-zone circuit board according to the present invention;
FIG. 2 is a schematic view of a partial structure of a reflow soldering material delivery guide rail for mounting a large-sized multi-temperature-zone circuit board according to the present invention;
FIG. 3 is a schematic structural view of a conveyor belt of a reflow soldering material conveying rail for mounting a large-sized multi-temperature-zone circuit board according to the present invention;
FIG. 4 is a schematic structural view of an anti-drop limiting groove of a reflow soldering material conveying guide rail for mounting a large-scale multi-temperature-zone circuit board;
fig. 5 is a schematic structural view of the lead screw of the reflow soldering feeding guide rail for mounting the circuit board with multiple temperature zones of the utility model.
In the figure: 1. a body; 2. a material conveying guide rail; 3. a support frame; 4. fixing a guide rail; 5. a positioning frame; 6. a limit polished rod; 7. a movable frame; 8. a moving guide rail; 9. a screw rod; 10. a slider; 11. a moving groove; 12. a first drive sprocket; 13. a conveyor belt; 14. an anti-drop limiting groove; 15. a limiting strip; 16. a rotating shaft; 17. a spline shaft; 18. a second drive sprocket; 19. an anti-jamming plate.
Detailed Description
The preferred embodiments of the present invention will be described in conjunction with the accompanying drawings, and it will be understood that they are presented herein only to illustrate and explain the present invention, and not to limit the present invention.
Example (b): as shown in fig. 1-5, the reflow soldering material feeding guide rail for circuit board mounting in large multi-temperature area of the present invention comprises a machine body 1, wherein a material feeding guide rail 2 is arranged in the machine body 1, the material feeding guide rail 2 comprises a support frame 3 arranged on the machine body 1, a fixed guide rail 4 is arranged on the top of the support frame 3, a positioning frame 5 arranged opposite to the support frame 3 is arranged on the machine body 1, a plurality of limiting polish rods 6 are arranged between the positioning frame 5 and the support frame 3, a moving frame 7 is arranged between the limiting polish rods 6, a moving guide rail 8 matched with the fixed guide rail 4 is arranged on the top of the moving frame 7, a lead screw 9 arranged in parallel with the limiting polish rods 6 is arranged between the support frame 3 and the positioning frame 5, a slider 10 moving along the lead screw 9 is arranged on the lead screw 9, the slider 10 is fixed with the moving frame 7 by a screw, a moving groove 11 is arranged on the fixed guide rail 4 and the moving guide rail 8, both ends tip of shifting chute 11 all is equipped with first drive sprocket 12, is equipped with conveying chain 13 between first drive sprocket 12, and one side of conveying chain 13 is embedded into shifting chute 11, the bottom side of shifting chute 11 is equipped with anticreep spacing groove 14, the bottom of conveying chain 13 is equipped with embedding the spacing strip 15 in the anticreep spacing groove 14. The spacing between the fixed guide rail 4 and the movable guide rail 8 can be adjusted, so that circuit boards of different specifications and models can be conveniently conveyed, in the process of conveying the circuit boards, the end parts of the circuit boards are respectively embedded between the fixed guide rail 4 and the conveying chain belt 13 and between the movable guide rail 8 and the conveying chain belt 13 to form spacing cavities, and along with the movement of the conveying chain belt 13, spacing conveying work of the circuit boards is realized, and the phenomenon of dislocation and welding of the circuit boards is avoided; wherein the bottom side of shifting chute 11 is equipped with anticreep spacing groove 14, the bottom of conveying chain belt 13 is equipped with the spacing 15 of embedding in anticreep spacing groove 14, in the transportation process that conveying chain belt 13 carries out the motion, spacing 15 of conveying chain belt 13 bottom is embedded into the anticreep spacing groove 14 all the time, spacing anticreep effect has been played, conveying chain belt 13 has effectively been avoided the vertical fluctuation of appearance by a wide margin at the in-process of transportation, make conveying chain belt 13 can be steady carry the circuit board, thereby have the transport effect of preferred to the circuit board.
The conveying chain belt 13 is driven by a synchronous driving mechanism, the synchronous driving mechanism comprises a rotating shaft 16 arranged between the support frame 3 and the positioning frame 5, a spline shaft 17 is arranged on the rotating shaft 16, a second transmission chain wheel 18 which moves along the spline shaft 17 and is respectively matched with the conveying chain belt 13 and connected with the spline shaft 17 is arranged on the spline shaft 17, and the two second transmission chain wheels 18 are respectively fixed on the moving frame 7 and the support frame 3; the machine body 1 is provided with a first driving motor in transmission connection with the rotating shaft 16, and the two conveying chain belts 13 are synchronously driven to move synchronously by the synchronous driving mechanism, so that stable conveying of the circuit board can be ensured, and the normal operation of the synchronous driving mechanism is not influenced when the distance between the fixed guide rail 4 and the movable guide rail 8 is adjusted.
All be equipped with on the wheel face of first drive sprocket 12 and second drive sprocket 18 with spacing strip 15 matched with recess for the setting of spacing strip 15 can not drive the rotation of conveying chain belt 13 and cause the influence to first drive sprocket 12 and second drive sprocket 18.
And a second driving motor in transmission connection with the screw rod 9 is arranged on the machine body 1.
The side of the conveying chain belt 13 is provided with a convex anti-blocking strip plate 19, so that the phenomenon of blocking caused by collision between the end part of the circuit board and the side walls of the fixed guide rail 4 and the movable guide rail 8 is effectively avoided.
Decide guide rail 4 and movable guide rail 8 and all form by a plurality of monomer guide rail concatenations, reduce expend with heat and contract with cold to decide guide rail 4 and movable guide rail 8's stress to easily change the part of damage, reduced use cost.
And a limiting cavity for embedding the end part of the circuit board is formed between the fixed guide rail 4 and the conveying chain belt 13 and between the movable guide rail 8 and the conveying chain belt 13 respectively.
The working principle is as follows: the spacing between the fixed guide rail 4 and the movable guide rail 8 can be adjusted, so that circuit boards of different specifications and models can be conveniently conveyed, in the process of conveying the circuit boards, the end parts of the circuit boards are respectively embedded between the fixed guide rail 4 and the conveying chain belt 13 and between the movable guide rail 8 and the conveying chain belt 13 to form spacing cavities, and along with the movement of the conveying chain belt 13, spacing conveying work of the circuit boards is realized, and the phenomenon of dislocation and welding of the circuit boards is avoided; wherein the bottom side of shifting chute 11 is equipped with anticreep spacing groove 14, the bottom of conveying chain belt 13 is equipped with the spacing 15 of embedding in anticreep spacing groove 14, in the transportation process that conveying chain belt 13 carries out the motion, spacing 15 of conveying chain belt 13 bottom is embedded into the anticreep spacing groove 14 all the time, spacing anticreep effect has been played, conveying chain belt 13 has effectively been avoided the vertical fluctuation of appearance by a wide margin at the in-process of transportation, make conveying chain belt 13 can be steady carry the circuit board, thereby have the transport effect of preferred to the circuit board.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described in the foregoing embodiments, or equivalents may be substituted for elements thereof. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (7)
1. Defeated material guide rail of large-scale multi-temperature-zone circuit board subsides dress reflow soldering, including organism (1), its characterized in that: the automatic feeding machine is characterized in that a feeding guide rail (2) is arranged in the machine body (1), the feeding guide rail (2) comprises a support frame (3) arranged on the machine body (1), a fixed guide rail (4) is arranged at the top of the support frame (3), a positioning frame (5) arranged opposite to the support frame (3) is arranged on the machine body (1), a plurality of limiting polish rods (6) are arranged between the positioning frame (5) and the support frame (3), a moving frame (7) is arranged between the limiting polish rods (6), a moving guide rail (8) matched with the fixed guide rail (4) is arranged at the top of the moving frame (7), a lead screw (9) arranged in parallel with the limiting polish rods (6) is arranged between the support frame (3) and the positioning frame (5), a slide block (10) moving along the lead screw (9) is arranged on the lead screw (9), and the slide block (10) is fixed with the moving frame (7) through screws, decide and be equipped with shifting chute (11) on guide rail (4) and moving guide (8), the both ends tip of shifting chute (11) all is equipped with first drive sprocket (12), is equipped with between first drive sprocket (12) and carries chain belt (13), and one side of carrying chain belt (13) is embedded into shifting chute (11), the bottom side of shifting chute (11) is equipped with anticreep spacing groove (14), the bottom of carrying chain belt (13) is equipped with spacing (15) of embedding in anticreep spacing groove (14).
2. The large-scale multi-temperature-zone circuit board mounting reflow soldering material conveying guide rail as claimed in claim 1, wherein the conveying chain belt (13) is driven by a synchronous driving mechanism, the synchronous driving mechanism comprises a rotating shaft (16) arranged between the supporting frame (3) and the positioning frame (5), a spline shaft (17) is arranged on the rotating shaft (16), a second driving chain wheel (18) which moves along the spline shaft (17) and is respectively matched with the conveying chain belt (13) is arranged on the spline shaft (17), and the two second driving chain wheels (18) are respectively fixed on the moving frame (7) and the supporting frame (3); the machine body (1) is provided with a first driving motor in transmission connection with the rotating shaft (16).
3. The large-scale multi-temperature-zone circuit board mounting reflow soldering material conveying guide rail as claimed in claim 2, wherein the wheel surfaces of the first transmission chain wheel (12) and the second transmission chain wheel (18) are provided with grooves matched with the limiting strips (15).
4. The feeding rail for reflow soldering attachment for large-scale multi-temperature-zone circuit board mounting according to claim 1, wherein the machine body (1) is provided with a second driving motor in transmission connection with the screw rod (9).
5. The feeding rail for reflow soldering attachment for large-scale multi-temperature-zone circuit board mounting according to claim 1, wherein the side of the conveyor belt (13) is provided with an anti-sticking strip plate (19) protruding upwards.
6. The large-scale multi-temperature-zone circuit board mounting reflow soldering material conveying guide rail as claimed in claim 1, wherein the fixed guide rail (4) and the movable guide rail (8) are formed by splicing a plurality of single guide rails.
7. The feeding rail for reflow soldering attachment for large-scale multi-temperature-zone circuit board mounting according to claim 1, wherein a limiting cavity for embedding the end of the circuit board is formed between the fixed rail (4) and the conveyor chain belt (13) and between the movable rail (8) and the conveyor chain belt (13).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN202120107817.4U CN214815542U (en) | 2021-01-15 | 2021-01-15 | Large-scale multi-temperature-zone circuit board mounting reflow soldering material conveying guide rail |
Applications Claiming Priority (1)
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CN202120107817.4U CN214815542U (en) | 2021-01-15 | 2021-01-15 | Large-scale multi-temperature-zone circuit board mounting reflow soldering material conveying guide rail |
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CN214815542U true CN214815542U (en) | 2021-11-23 |
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CN202120107817.4U Active CN214815542U (en) | 2021-01-15 | 2021-01-15 | Large-scale multi-temperature-zone circuit board mounting reflow soldering material conveying guide rail |
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2021
- 2021-01-15 CN CN202120107817.4U patent/CN214815542U/en active Active
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