CN214800354U - A dismantlement structure and circuit board subassembly for circuit board subassembly - Google Patents
A dismantlement structure and circuit board subassembly for circuit board subassembly Download PDFInfo
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- CN214800354U CN214800354U CN202120635774.7U CN202120635774U CN214800354U CN 214800354 U CN214800354 U CN 214800354U CN 202120635774 U CN202120635774 U CN 202120635774U CN 214800354 U CN214800354 U CN 214800354U
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- heat sink
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Abstract
The utility model discloses a dismantle structure and circuit board assembly for circuit board assembly. A detachment structure for a circuit board assembly, comprising: a protrusion disposed on a first surface of the circuit board; and a receiving portion and an inclined region formed on the second surface, the receiving portion being configured to receive the protruding portion, wherein the protruding portion is received in the receiving portion in a state where the circuit board and the heat sink are adhered to each other by the heat conductive adhesive; and in a state where an external force is applied to one of the circuit board and the heat sink with respect to the other of the circuit board and the heat sink in a direction parallel to the first surface, the protruding portion is movable from the receiving portion to the inclined region in the direction parallel to the first surface so that the circuit board is detached from the heat sink against the sticking force of the heat conductive paste.
Description
Technical Field
The utility model relates to a circuit board assembly who is used for circuit board assembly's dismantlement structure and including this dismantlement structure.
Background
In the prior art, in a heat sink assembly structure of a printed circuit board, a heat sink is attached to the circuit board by a heat conductive adhesive to dissipate heat of electronic devices on the circuit board. In practice, in the process of detaching the heat sink from the circuit board, the screw needs to be firstly installed in the screw hole formed in the circuit board and screwed, and the screw is continuously screwed under the condition that the screw is abutted to the heat sink until the circuit board overcomes the adhesive force of the heat-conducting adhesive and is separated from the heat sink, so that the heat sink is detached. Finally, after the heat sink is removed, the screw needs to be turned reversely to withdraw the heat sink from the screw hole.
However, the above-mentioned disassembly process of the heat sink assembly structure has at least the following drawbacks:
1) the whole disassembly process needs to continuously screw in and screw out the screws, and is time-consuming and labor-consuming;
2) screwing the screw under the condition that the screw abuts against the heat sink can cause stress and strain to be generated in different degrees near the screw hole of the circuit board, and adverse effects are generated on the circuit board and the electronic device mounted on the circuit board;
3) the fitting area of the screws needs to be considered in the layout of the circuit board, which reduces the layout area of the electronic devices on the circuit board (especially the front surface of the circuit board).
Disclosure of Invention
The object of the present invention is to solve at least one of the above problems and drawbacks existing in the prior art.
According to an aspect of the present invention, there is provided a detachment structure for a circuit board assembly, the circuit board assembly including a circuit board and a heat sink, the circuit board having a first surface, the heat sink having a second surface facing the first surface; the disassembly structure comprises: a protrusion disposed on a first surface of the circuit board; and a receiving portion formed on the second surface, the receiving portion configured to receive the protrusion, wherein the second surface further comprises an inclined region and a flat region, the inclined region connecting the receiving portion and the flat region; wherein the protruding portion is received in the receiving portion in a state where the circuit board and the heat sink are adhered to each other by the heat conductive adhesive; and in a state where an external force is applied to one of the circuit board and the heat sink with respect to the other of the circuit board and the heat sink in a direction parallel to the first surface, the protruding portion is movable from the receiving portion to the inclined region in the direction parallel to the first surface so that the circuit board is detached from the heat sink against the sticking force of the heat conductive paste.
In an exemplary embodiment of the invention, the protrusion is soldered to the first surface of the circuit board.
In an exemplary embodiment of the invention, the protrusion is made of a metallic material or a material with a metallic coating.
In yet another exemplary embodiment of the present invention, the protrusion is glued to the first surface of the circuit board. In this embodiment, there is no particular requirement for the material of the projection.
In an exemplary embodiment of the invention, the protrusion has a hemispherical shape or an inverted conical shape.
In an exemplary embodiment of the present invention, the first surface is provided with an electronic device, and the second surface is formed with a receiving portion configured to receive the electronic device.
In an exemplary embodiment of the present invention, the receiving portion constitutes a part of the accommodating portion.
In an exemplary embodiment of the present invention, the inclined area of the receiving portion is at least one inclined wall of the accommodating portion, and an inclination of the inclined wall with respect to the flat area is 45 degrees or less.
In another exemplary embodiment of the present invention, the receiving portion is independent of the accommodating portion.
In another exemplary embodiment of the present invention, the inclined area is at least one inclined wall of the receiving portion, and an inclination of the inclined wall with respect to the flat area is 45 degrees or less.
In an exemplary embodiment of the present invention, a plurality of heat conductive glues are arranged in an array between the circuit board and the heat sink, and a protrusion is arranged in the vicinity of at least a part of the plurality of heat conductive glues.
According to an aspect of the present invention, there is also provided a circuit board assembly including the detachment structure according to any one of the above-described exemplary embodiments.
According to the present invention, the circuit board assembly and the disassembly structure for the circuit board assembly provided by the above exemplary embodiments can realize the separation of the circuit board and the heat sink by applying an external force in a direction parallel to the surface of the circuit board only when the circuit board and the heat sink are required to be disassembled from each other through the cooperation between the protrusion provided on the circuit board and the receiving portion provided on the heat sink and the inclined area. The whole process is time-saving and labor-saving, and unnecessary stress and strain of the circuit board can not be generated. In addition, the screw matching area on the circuit board can be saved, and the arrangement area of electronic devices on the circuit board can be increased.
Other objects and advantages of the present invention will become apparent from the following description of the invention, which is made with reference to the accompanying drawings, and can help to provide a thorough understanding of the present invention.
Drawings
Fig. 1 is a schematic cross-sectional view of a circuit board assembly according to an exemplary embodiment of the present invention, showing a state in which a circuit board and a heat sink are adhered to each other;
FIG. 2 is a cross-sectional schematic view of the circuit board assembly shown in FIG. 1, showing the circuit board and the heat sink detached from each other;
FIG. 3 is a schematic top view of the circuit board assembly shown in FIG. 1, showing the position relationship between the protrusion and the heat-dissipating adhesive on the circuit board;
fig. 4 is a schematic cross-sectional view of a circuit board assembly according to another exemplary embodiment of the present invention, showing a state in which the circuit board and the heat sink are adhered to each other;
FIG. 5 is a cross-sectional schematic view of the circuit board assembly shown in FIG. 4, showing the circuit board and the heat sink detached from each other;
fig. 6 and 7 are simplified schematic diagrams of a disassembly structure for a circuit board assembly according to an alternative embodiment of the present invention, in which fig. 6 shows a state in which a circuit board and a heat sink are attached to each other, and fig. 7 shows a state in which the circuit board and the heat sink are detached from each other; and
fig. 8 and 9 are simple schematic views of a disassembly structure for a circuit board assembly according to another alternative embodiment of the present invention, in which fig. 8 shows a state in which a circuit board and a heat sink are attached to each other, and fig. 9 shows a state in which the circuit board and the heat sink are detached from each other.
Detailed Description
The technical solution of the present invention is further specifically described below by way of examples and with reference to the accompanying drawings. In the specification, the same or similar reference numerals denote the same or similar components. The following description of the embodiments of the present invention with reference to the accompanying drawings is intended to explain the general inventive concept and should not be construed as limiting the invention.
Furthermore, in the following detailed description, for purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of the embodiments of the disclosure. It may be evident, however, that one or more embodiments may be practiced without these specific details. In other instances, well-known structures and devices are shown in schematic form in order to simplify the drawing.
The utility model provides a circuit board assembly who is used for circuit board assembly's dismantlement structure and including this dismantlement structure. Fig. 1 is a schematic cross-sectional view of a circuit board assembly according to an exemplary embodiment of the present invention, showing a state in which a circuit board and a heat sink are adhered to each other; FIG. 2 is a cross-sectional schematic view of the circuit board assembly shown in FIG. 1, showing the circuit board and the heat sink detached from each other; fig. 3 is a schematic top view of the circuit board in the circuit board assembly shown in fig. 1, showing the positional relationship between the protruding portion and the heat-dissipating adhesive on the circuit board.
Referring to fig. 1 to 3, according to an exemplary embodiment of the present invention, a disassembly structure for a circuit board assembly is provided. As shown in fig. 1 and 2, the circuit board assembly includes a circuit board 100 and a heat sink 200, the circuit board 100 having a first surface 110, the heat sink 200 having a second surface 210 facing the first surface 110. A detachment structure for a circuit board assembly, comprising: a protrusion 111 provided on the first surface 110 of the circuit board 100, and a receiving portion 211 formed on the second surface 210. The receiving portion 211 is configured to receive the protrusion 111. That is, the receiving portion 211 is a recessed portion that can accommodate at least the protruding portion 111. The second surface 210 further includes an inclined region 212 and a flat region 213, the inclined region 212 connecting the receiving portion 211 and the flat region 213.
According to the present invention, the circuit board 100 and the heat sink 200 can be adhered to each other by the heat conductive adhesive 300. As shown in fig. 1, the protruding portion 111 is received in the receiving portion 211 in a state where the circuit board 100 and the heat sink 200 are pasted to each other by the thermal conductive paste 300. As shown in fig. 2, in a state where one of the circuit board 100 and the heat sink 200 is applied with an external force F in a direction parallel to the first surface 110 with respect to the other of the circuit board 100 and the heat sink 200, the protrusion 111 can move from the receiving portion 211 to the inclined region 212 in the direction parallel to the first surface 110, so that the circuit board 100 is detached from the heat sink 200 against the sticking force of the thermal conductive paste 300.
According to the present invention, the detachment structure for a circuit board assembly and the circuit board assembly provided by the foregoing exemplary embodiments, through the cooperation between the protrusion 111 provided on the circuit board 100 and the receiving portion 211 and the inclined region 212 provided on the heat sink 200, when the circuit board 100 and the heat sink 200 need to be detached from each other, only an external force needs to be applied in a direction parallel to the surface of the circuit board 100, and the separation of the circuit board 100 and the heat sink 200 can be achieved. The whole process is time-saving and labor-saving, and unnecessary stress and strain can not be generated on the circuit board 100. In addition, the screw fitting area on the circuit board 100 can be saved, and the arrangement area of the electronic devices on the circuit board 100 (especially the front surface of the circuit board) can be increased.
According to an exemplary embodiment of the present invention, as shown in fig. 1 and 2, the protrusion 111 is soldered to the first surface 110 of the circuit board 100. For example, the protrusion 111 may be made of a metal material or a material with a metal plating layer, but the present invention is not limited thereto as long as the protrusion 111 can be bonded to the first surface 110 of the circuit board 100. For example, in yet another exemplary embodiment of the present invention, the protrusion is glued to the first surface of the circuit board. In this embodiment, there is no particular requirement for the material of the projection.
According to the present invention, in the illustrated embodiment, the protrusion 111 may have a hemispherical shape (e.g., as shown in fig. 1) or an inverted conical shape (e.g., as shown in fig. 7 to be described below), but the protrusion 111 may also have any other suitable shape, which is not intended to limit the present invention as long as the protrusion can protrude from the first surface 110 of the circuit board 100. Further, since the protrusion 111 is provided for the purpose of engaging with the inclined region 212 on the heat sink 200 to detach the circuit board 100 from the heat sink 200 against the adhering force of the thermal conductive paste 300, the protrusion 111 only needs to be sized to enable both the heat sink 200 and the circuit board 100 to be detached from each other. For example, in the exemplary embodiment as shown in fig. 1 and 2, the hemispherical-shaped protrusion 111 may have a radius of about 1 mm. Further, when it is necessary to detach the circuit board 100 and the heat sink 200 from each other, it is only necessary to relatively move both the circuit board 100 and the heat sink 200 by a distance of about 1mm in a direction parallel to the surface of the circuit board 100, even if the protrusion 111 is moved by a distance of about 1mm on the inclined region 212, so that the circuit board 100 can be detached from the heat sink 200 against the sticking force of the thermal conductive paste 300.
According to the present invention, as shown in fig. 1 and 2, in a state where the circuit board 100 and the heat sink 200 are adhered to each other by the thermal conductive paste 300, the height of the protrusion 111 is less than or equal to the depth of the receiving portion 211, so that the protrusion 111 is sufficiently received in the receiving portion 211.
According to the present invention, the circuit board 100 may be a circuit board with a single surface provided with electronic devices, or a circuit board with two surfaces provided with electronic devices. The embodiment of the present invention provides a first surface can be a surface of a circuit board with two sides provided with electronic devices, especially a surface opposite to the surface provided with most of electronic devices, that is, a surface attached to a heat sink generally. For example, according to the exemplary embodiment of the present invention, as shown in fig. 1 and 2, the first surface 110 of the circuit board 100 is provided with the electronic device 400, and a surface of the circuit board 100 opposite to the first surface 110 may also be provided with the electronic device (not labeled with a reference numeral). Accordingly, the second surface 210 of the heat sink 200 is formed with the receiving portion 214 configured to receive the electronic device 400. In this way, when the circuit board 100 and the heat sink 200 are pasted to each other by the thermal conductive paste 300, the electronic device 400 on the circuit board 100 is accommodated in the accommodating portion 214 of the heat sink 200.
According to an exemplary embodiment of the present invention, as shown in fig. 1 and 2, the receiving portion 211 constitutes a part of the accommodating portion 214. In the present embodiment, the inclined area 212 of the receiving portion 211 is at least one inclined wall of the accommodating portion 214, and the inclination of the inclined wall 212 with respect to the flat area 213 is 45 degrees or less. With the above configuration, the protruding portion 111 can be smoothly moved from the receiving portion 211 to the inclined region 212 in a state where one of the circuit board 100 and the heat sink 200 is applied with the external force F in a direction parallel to the first surface 110 with respect to the other of the circuit board 100 and the heat sink 200.
According to the present invention, a plurality of heat conductive adhesives 300 are arranged in an array between the circuit board 100 and the heat sink 200. For example, a plurality of the thermal conductive pastes 300 may be respectively disposed on the first surface 110 of the circuit board 100 and positionally correspond to the electronic devices disposed on the surface of the circuit board 100 opposite to the first surface 110, so as to achieve effective heat dissipation of the electronic devices. According to the present invention, the protruding portion 111 is disposed near at least a part of the heat conductive paste 300. According to an exemplary embodiment of the present invention, as shown in fig. 3, a plurality of thermal conductive glues 300 are arranged in an array on the first surface 110 of the circuit board 100, and one protrusion 111 is arranged near each thermal conductive glue 300. In an embodiment not shown in the drawings, instead of arranging one protrusion 111 near each of the heat conductive glues 300, the protrusions 111 may be arranged near a partial number of the heat conductive glues 300.
The present invention provides a detachment structure for a circuit board assembly as described above in connection with the exemplary embodiment shown in fig. 1 to 3. However, in addition to the exemplary embodiments shown in fig. 1 to 3 described above, the present invention provides other exemplary embodiments and/or alternative embodiments that may be described for the disassembly structure for a circuit board assembly. It should be noted that the present invention provides a dismounting structure for a circuit board assembly, including but not limited to the foregoing exemplary embodiments shown in fig. 1 to 3, and other exemplary embodiments and/or alternative embodiments to be described below. For the sake of brevity, only the differences between the other exemplary embodiments and/or the alternative embodiments and the aforementioned exemplary embodiments shown in fig. 1-3 are described below.
For example, fig. 4 is a schematic cross-sectional view of a circuit board assembly according to another exemplary embodiment of the present invention, showing a state in which a circuit board and a heat sink are adhered to each other; fig. 5 is a schematic sectional view of the circuit board assembly shown in fig. 4, showing a state in which the circuit board and the heat sink are detached from each other. Unlike the foregoing exemplary embodiment shown in fig. 1 to 3, in another exemplary embodiment shown in fig. 4 to 5, in the heat sink 200A, the receiving portion 211A is independent of the accommodating portion 214A. The individual receivers 211A may take the form of slots, with each individual receiver 211A in the heat sink 200A being approximately about 4mm X about 2.5mm in size. Specifically, in the present embodiment, the inclined area 212A is at least one inclined wall of the receiving portion 211A, and the inclination of the inclined wall 212A with respect to the flat area 213A is 45 degrees or less. With the above configuration, the protruding portion 111A can also be smoothly moved from the receiving portion 211A to the inclined region 212A in a state where one of the circuit board 100A and the heat sink 200A is applied with the external force F in a direction parallel to the first surface with respect to the other of the circuit board 100A and the heat sink 200A. Owing to adopted the dismantlement structure of protruding portion and receiving part, for prior art, the utility model provides a circuit board assembly, distance D between the lateral wall of electron device and holding part can increase from about 1mm to about 2.5mm, has increased electron device's accommodation space.
For another example, fig. 6 and 7 are simple schematic views of a detachment structure for a circuit board assembly according to an alternative embodiment of the present invention, in which fig. 6 shows a state in which a circuit board and a heat sink are attached to each other, and fig. 7 shows a state in which the circuit board and the heat sink are detached from each other. Unlike the exemplary embodiments shown in fig. 1 to 3 and 4 to 5 described above, in an alternative embodiment shown in fig. 6 to 7, the receiving portion 211B in the heat sink 200B takes the shape of an inverted cone and the protruding portion 111B on the circuit board 100B takes the shape of a hemisphere. With the above configuration, since both the inclined walls of the inverted conical shaped receiving portion 211B can be used as the inclined area 212B, when it is necessary to detach the circuit board 100B and the heat sink 200B from each other, an external force F can be applied in any one of two opposite directions parallel to the first surface (only one external force application direction is illustrated in the drawing), and relative movement of both can be achieved, thereby detaching the circuit board 100B and the heat sink 200B from each other.
For another example, fig. 8 and 9 are simple schematic views of a detachment structure for a circuit board assembly according to another alternative embodiment of the present invention, in which fig. 8 shows a state in which a circuit board and a heat sink are attached to each other, and fig. 9 shows a state in which the circuit board and the heat sink are detached from each other. Unlike the exemplary embodiments shown in fig. 1 to 3, 4 to 5, and 6 to 7 described above, in an alternative embodiment shown in fig. 8 to 9, the receiving portion 211C in the heat sink 200C takes the shape of an inverted cone, and the protruding portion 111C on the circuit board 100C also takes the shape of an inverted cone. Preferably, as shown, the area of the inverted conical shape of the receiving portion 211C may be greater than the area of the inverted conical shape of the protruding portion 111C, but the height of the inverted conical shape of the receiving portion 211C is substantially equal to the height of the inverted conical shape of the protruding portion 111C. With the above configuration, since both the inclined walls of the inverted conical shaped receiving portion 211C can be used as the inclined areas, when it is necessary to detach the circuit board 100C and the heat sink 200C from each other, an external force F can be applied in any one of two opposite directions parallel to the first surface (only one external force application direction is illustrated in the drawing), and relative movement of both can be achieved, thereby detaching the circuit board 100C and the heat sink 200C from each other.
Meanwhile, the utility model also provides a circuit board assembly. The circuit board assembly comprises a disassembly structure for a circuit board assembly as described in any of the previous exemplary embodiments and/or alternative embodiments.
According to the present invention, the detachment structure for a circuit board assembly and the circuit board assembly provided by the foregoing exemplary embodiments and/or optional embodiments, through the cooperation between the protruding portion provided on the circuit board and the receiving portion and the inclined region provided on the heat sink, when the circuit board and the heat sink need to be detached from each other, only an external force needs to be applied in a direction parallel to the surface of the circuit board, and thus, the circuit board and the heat sink can be separated from each other. The whole process is time-saving and labor-saving, and unnecessary stress and strain of the circuit board can not be generated. In addition, the screw matching area on the circuit board can be saved, and the arrangement area of electronic devices on the circuit board can be increased.
It will be appreciated by those skilled in the art that the embodiments described above are exemplary and can be modified by those skilled in the art, and that the structures described in the various embodiments can be freely combined without conflict in structure or principle.
Although the present invention has been described in connection with the accompanying drawings, the embodiments disclosed in the drawings are intended to exemplify preferred embodiments of the present invention, and should not be construed as limiting the present invention.
Although a few embodiments of the present invention have been shown and described, it would be appreciated by those skilled in the art that changes may be made in these embodiments without departing from the principles and spirit of the general inventive concept, the scope of which is defined in the claims and their equivalents.
It should be noted that the word "comprising" does not exclude other elements or steps, and the words "a" or "an" do not exclude a plurality. Additionally, any element numbers of the claims should not be construed as limiting the scope of the invention.
Claims (12)
1. A dismounting structure for a circuit board assembly, said circuit board assembly comprising a circuit board (100) and a heat sink (200), said circuit board (100) having a first surface (110), said heat sink (200) having a second surface (210) facing said first surface (110);
it is characterized in that the dismounting structure comprises:
a protrusion (111) provided on the first surface (110) of the circuit board (100); and
a receiving portion (211) formed at the second surface (210), the receiving portion (211) configured to receive the protrusion (111), wherein the second surface (210) further comprises an inclined region (212) and a flat region (213), the inclined region (212) connecting the receiving portion (211) and the flat region (213);
wherein the protruding portion (111) is received in the receiving portion (211) in a state where the circuit board (100) and the heat sink (200) are pasted to each other by a heat conductive paste (300); and the protruding portion (111) is movable from the receiving portion (211) to the inclined region (212) in a direction parallel to the first surface (110) in a state where one of the circuit board (100) and the heat sink (200) is applied with an external force (F) in a direction parallel to the first surface (110) with respect to the other of the circuit board (100) and the heat sink (200), so that the circuit board (100) is detached from the heat sink (200) against the attaching force of the heat conductive paste (300).
2. The disassembly structure of claim 1,
the protrusion (111) is soldered to the first surface (110) of the circuit board (100).
3. The disassembly structure of claim 2,
the projection (111) is made of a metallic material or a material with a metallic coating.
4. The disassembly structure of claim 1,
the protrusion (111) is glued to the first surface (110) of the circuit board (100).
5. The disassembly structure of claim 1,
the protrusion (111) has a hemispherical shape or an inverted conical shape.
6. The detachment structure according to any one of claims 1 to 5,
the first surface (110) is provided with an electronic device (400), and the second surface (210) is formed with a receiving portion (214) configured to receive the electronic device (400).
7. The disassembly structure of claim 6,
the receiving portion (211) constitutes a part of the accommodating portion (214).
8. The disassembly structure of claim 7,
the inclined area (212) of the receiving portion (211) is at least one inclined wall of the receiving portion (214) having an inclination of 45 degrees or less with respect to the flat area (213).
9. The disassembly structure of claim 6,
the receiving portion (211) is independent of the accommodating portion (214).
10. The disassembly structure of claim 9,
the inclined area (212) is at least one inclined wall of the receiving portion (211), and the inclination of the inclined wall relative to the flat area (213) is less than or equal to 45 degrees.
11. The detachment structure according to any one of claims 1 to 5,
a plurality of thermally conductive glues (300) are arranged in an array between the circuit board (100) and the heat sink (200), the protrusion (111) being arranged in the vicinity of at least a part of the plurality of thermally conductive glues (300).
12. A circuit board assembly, characterized in that the circuit board assembly comprises a dismounting structure according to any one of claims 1-11.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120635774.7U CN214800354U (en) | 2021-03-29 | 2021-03-29 | A dismantlement structure and circuit board subassembly for circuit board subassembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120635774.7U CN214800354U (en) | 2021-03-29 | 2021-03-29 | A dismantlement structure and circuit board subassembly for circuit board subassembly |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214800354U true CN214800354U (en) | 2021-11-19 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120635774.7U Active CN214800354U (en) | 2021-03-29 | 2021-03-29 | A dismantlement structure and circuit board subassembly for circuit board subassembly |
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| Country | Link |
|---|---|
| CN (1) | CN214800354U (en) |
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- 2021-03-29 CN CN202120635774.7U patent/CN214800354U/en active Active
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Effective date of registration: 20220729 Address after: Beijing City, Chaoyang District Lize Street No. 5 Patentee after: Ericsson (China) Communications Co.,Ltd. Address before: Stockholm, SWE Patentee before: Telefonaktiebolaget LM Ericsson (publ) |