CN114895767B - Water-cooling plate assembly and bracket thereof - Google Patents
Water-cooling plate assembly and bracket thereof Download PDFInfo
- Publication number
- CN114895767B CN114895767B CN202210679440.9A CN202210679440A CN114895767B CN 114895767 B CN114895767 B CN 114895767B CN 202210679440 A CN202210679440 A CN 202210679440A CN 114895767 B CN114895767 B CN 114895767B
- Authority
- CN
- China
- Prior art keywords
- bracket
- water
- frame body
- main board
- cooling plates
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000001816 cooling Methods 0.000 title claims abstract description 114
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 67
- 125000006850 spacer group Chemical group 0.000 description 16
- 238000000034 method Methods 0.000 description 8
- 239000007788 liquid Substances 0.000 description 6
- 239000000969 carrier Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000012986 modification Methods 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 238000000926 separation method Methods 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
Landscapes
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention provides a water cooling plate assembly and a bracket thereof. The water cooling plate assembly comprises a bracket, a plurality of first water cooling plates and a plurality of first locking pieces. The bracket comprises a first bracket body, wherein the first bracket body is provided with a first upper surface, a first lower surface and a plurality of first through grooves. The first lower surface is opposite to the first upper surface and is used for facing the main board, and the first through grooves penetrate through the first upper surface and the first lower surface. The first water cooling plates are overlapped on the first upper surface of the first frame body and are respectively thermally coupled with the first heat sources through the first through grooves. The first locking pieces penetrate through the first water cooling plates and are combined with the first frame body of the bracket so as to combine the first water cooling plates with the first frame body.
Description
Technical Field
The invention relates to a water cooling plate assembly and a bracket thereof.
Background
In order to improve the operation and processing performance of the server, the server is currently provided with a plurality of graphics processing modules (GPU modules) and a plurality of switching modules (NVswitch) collocated with the graphics processing modules. The modules generate a large amount of heat during operation, so each module is provided with a liquid cooling plate to dissipate heat of the module.
However, in the process of disassembling or assembling these liquid cooling plates, the liquid cooling plates need to be disassembled or assembled one by one, which results in excessively long time required for disassembling and assembling these liquid cooling plates, and thus the efficiency of the disassembling and assembling operation is poor. Accordingly, researchers in this field are currently working to solve the aforementioned problems.
Disclosure of Invention
In view of the above-mentioned drawbacks of the prior art, an object of the present invention is to provide a water cooling plate assembly and a bracket thereof, which are used for solving the problems that in the process of disassembling or assembling the liquid cooling plates in the prior art, the time consumed for disassembling and assembling the liquid cooling plates is too long, and the efficiency of the disassembling and assembling operation is poor.
To achieve the above and other objects, the present invention provides a water cooling plate assembly and a bracket thereof, which can enable the water cooling plate to be quickly assembled and disassembled.
One embodiment of the invention discloses a water cooling plate assembly, which is arranged on a main board and thermally contacts with a plurality of first heat sources on the main board. The water cooling plate assembly comprises a bracket, a plurality of first water cooling plates and a plurality of first locking pieces. The bracket comprises a first bracket body, wherein the first bracket body is provided with a first upper surface, a first lower surface and a plurality of first through grooves. The first lower surface is opposite to the first upper surface and is used for facing the main board, and the first through grooves penetrate through the first upper surface and the first lower surface. The first water cooling plates are overlapped on the first upper surface of the first frame body and are respectively thermally coupled with the first heat sources through the first through grooves. The first locking pieces penetrate through the first water cooling plates and are combined with the first frame body of the bracket so as to combine the first water cooling plates with the first frame body.
In another embodiment of the present invention, a bracket for a water-cooled panel assembly is provided for being disposed on a main board and for assembling a plurality of water-cooled panels. The bracket comprises a bracket body, wherein the bracket body is provided with an upper surface, a lower surface and a plurality of through grooves. The upper surface is used for the overlapping of the water cooling plates, the lower surface is opposite to the upper surface and is used for facing the main board, and the penetrating grooves penetrate through the upper surface and the lower surface and are used for the heat sources of the water cooling plates thermally coupled to the main board.
According to the water-cooling plate assembly and the bracket thereof disclosed in the above embodiments, the first water-cooling plates are combined with the first frame body of the bracket through the first locking members, so that all the first water-cooling plates can be aligned with the first heat sources respectively through the bracket at one time in the process of installing the bracket on the main board, or all the first water-cooling plates can be removed from the first heat sources respectively through the bracket at one time in the process of disassembling the bracket from the main board, and therefore, the first water-cooling plates can be disassembled and assembled quickly.
The foregoing description of the invention and the following description of embodiments are provided to illustrate and explain the principles of the invention and to provide further explanation of the invention as claimed.
Drawings
Fig. 1 is a schematic top view of a water-cooled panel assembly and a main panel according to a first embodiment of the invention.
FIG. 2 is a partially exploded view of the water cooled panel assembly and main panel of FIG. 1.
Fig. 3 is a perspective view showing a bracket of the water cooling plate assembly of fig. 2.
Fig. 4 shows a partial side view of fig. 1.
Fig. 5 shows a schematic side view of another portion of fig. 1.
FIG. 6 is a schematic diagram showing the separation of the first water-cooled plate from the first heat source in FIG. 4.
FIG. 7 is a schematic diagram showing the separation of the second water-cooled plate from the second heat source in FIG. 5.
Description of element reference numerals
1. Main board
1A through hole
2. First heat source
3. Second heat source
4. Carrier base
10. Water-cooled plate assembly
11. Support frame
111. First frame body
1111. A first upper surface
1112. A first lower surface
1113. First through groove
1114. First assembly hole
1114A internal thread structure
1115. First perforation
1116. Positioning hole
1117. Through hole
112. Second frame body
1121. A second upper surface
1122. A second lower surface
1123. Second through groove
1124. Second assembly hole
1124A internal thread structure
1125. Second perforation
113. Connecting sheet
114. Handle for carrying
12. First water cooling plate
13. First locking piece
131. First stud
1311. Head part
1312. Body part
1312A external thread structure
132. First elastic piece
133. First gasket
14. First abutting piece
15. Second water cooling plate
16. Second locking piece
161. Second stud
1611. Head part
1612. Body part
1612A external thread structure
162. Second elastic piece
163. Second gasket
17. Second abutting piece
18. Third locking piece
181. Third stud
1811. Head part
1812. Body part
182. Third elastic piece
183. Third gasket
19. Third abutting piece
20. Fourth locking piece
201. Fourth stud
2011. Head part
2012. Body part
202. Fourth elastic piece
203. Fourth gasket
21. Fourth abutting piece
Detailed Description
Further advantages and effects of the present invention will become apparent to those skilled in the art from the disclosure of the present invention, which is described by the following specific examples.
It should be understood that the structures, proportions, sizes, etc. shown in the drawings are for illustration purposes only and should not be construed as limiting the invention to the extent that it can be practiced, since modifications, changes in the proportions, or otherwise, used in the practice of the invention, are not intended to be critical to the essential characteristics of the invention, but are intended to fall within the spirit and scope of the invention. Also, the terms such as "upper," "lower," "left," "right," "middle," and "a" and the like recited in the present specification are merely for descriptive purposes and are not intended to limit the scope of the invention, but are intended to provide relative positional changes or modifications without materially altering the technical context in which the invention may be practiced.
Please refer to fig. 1 to 3. FIG. 1 is a schematic top view of a water cooling plate assembly and a main board according to a first embodiment of the present invention. FIG. 2 is a partially exploded view of the water cooled panel assembly and main panel of FIG. 1. FIG. 3 is a schematic perspective view of a bracket of the water cooled panel assembly of FIG. 2.
In the present embodiment, the water-cooled plate assembly 10 is disposed on a motherboard 1 and is in thermal contact with a plurality of first heat sources 2 and a plurality of second heat sources 3 on the motherboard 1. The main board 1 has a plurality of carriers 4, the carriers 4 respectively carry the first heat sources 2, and the second heat sources 3 are directly disposed on the main board 1, so that the height of the first heat sources 2 on the main board 1 is higher than the height of the second heat sources 3. The first heat sources 2 are, for example, GPUs and their number is 8, and the second heat sources 3 are, for example, NVswitch and their number is 6.
The water-cooled panel assembly 10 comprises a bracket 11, a plurality of first water-cooled panels 12 and a plurality of first locking members 13. In addition, the water-cooling plate assembly 10 may further include a plurality of first abutting members 14, a plurality of second water-cooling plates 15, a plurality of second locking members 16, a plurality of second abutting members 17, a plurality of third locking members 18, a plurality of third abutting members 19, a plurality of fourth locking members 20, and a plurality of fourth abutting members 21.
Next, referring to fig. 2 to 5, fig. 4 is a partial side view of fig. 1. Fig. 5 is a schematic side view of another portion of fig. 1.
The bracket 11 comprises a first bracket 111, a second bracket 112, a connecting piece 113 and two handles 114. The first frame 111 has a first upper surface 1111, a first lower surface 1112, and a plurality of first through slots 1113. The first lower surface 1112 is opposite to the first upper surface 1111 and faces the motherboard 1, and the first through slots 1113 penetrate the first upper surface 1111 and the first lower surface 1112. The number of the first through slots 1113 is, for example, 8 and arranged in a4×2 array.
In the present embodiment, the first frame 111 further has a plurality of first assembling holes 1114, a plurality of first through holes 1115, and a plurality of positioning holes 1116. Around each first through slot 1113, there are, for example, four first assembly holes 1114, four first through holes 1115, and four positioning holes 1116. Two of the first assembly holes 1114, two of the first through holes 1115, and two of the positioning holes 1116 are located on one side of the first through slot 1113, and the other two of the first assembly holes 1114, the other two of the first through holes 1115, and the other two of the positioning holes 1116 are located on the other side of the first through slot 1113. Of the two first assembly holes 1114, the two first through holes 1115 and the two positioning holes 1116 on the same side of the first through slot 1113, the two first through holes 1115 are located between the two first assembly holes 1114, and the two first through holes 1115 and the two first assembly holes 1114 are located between the two positioning holes 1116. The first assembling hole 1114 is used for the first locking piece 13 to be locked, the first through hole 1115 is used for the third locking piece 18 to pass through, and the positioning hole 1116 is used for a positioning column (not shown) on the carrier 4 to pass through.
The second frame 112 is connected to the first frame 111 through the connecting piece 113, and the first frame 111, the second frame 112 and the connecting piece 113 are integrally connected with each other, but not limited thereto. In other embodiments, the first frame, the second frame and the connecting piece may be fixed by welding or bonding.
The second frame 112 has a second upper surface 1121, a second lower surface 1122 and a plurality of second through slots 1123. The second lower surface 1122 faces away from the second upper surface 1121 and faces the motherboard 1, and the second upper surface 1121 of the second frame 112 is between the second lower surface 1122 of the second frame 112 and the first lower surface 1112 of the first frame 111. In other words, the first frame 111, the second frame 112 and the connecting piece 113 are in a step shape. The second through grooves 1123 penetrate the second upper surface 1121 and the second lower surface 1122. The number of the second through slots 1123 is, for example, 6 and is arranged in a6×1 array.
In the present embodiment, the second frame 112 further has a plurality of second assembly holes 1124 and a plurality of second through holes 1125. Around each second through slot 1123, there are two second assembly holes 1124 and four second through holes 1125, where the second through slot 1123 is a square slot, two second assembly holes 1124 are located on two opposite sides of the second through slot 1123, and four second through holes 1125 are located on two other opposite sides of the second through slot 1123. The second assembly hole 1124 is used for the second locking member 16 to be locked, and the second through hole 1125 is used for the fourth locking member 20 to pass through.
Two handles 114 are fixed to opposite sides of the first frame 111 to facilitate the movement of the integral bracket 11 by a user. It should be noted that the number of handles 114 is not limited to two. In other embodiments, the stand may contain only one handle. In another embodiment, the stand may be free of a handle.
The assembled relationship among the first water-cooling plate 12, the first locking member 13, the first abutting member 14, and the first frame body 111 of the bracket 11 will be described below. For convenience of description and presentation of drawings, the following description and the corresponding drawings only describe and show one of the first water-cooling plates 12, one of the first locking members 13, one of the first abutting members 14 and one of the first assembly holes 1114 of the first frame 111 in detail.
The first water-cooling plate 12 is stacked on the first upper surface 1111 of the first frame 111 and is used for being thermally coupled to the first heat source 2 through the first through groove 1113, wherein the first water-cooling plate 12 and the first heat source 2 are bonded together, for example, by a heat-conducting adhesive (not shown).
The first locking member 13 includes a first stud 131, a first elastic member 132, and a first spacer 133. First stud 131 includes a head 1311 and a body 1312 connected, wherein the width of head 1311 is greater than the width of body 1312. The first elastic member 132 is sleeved on the body 1312 of the first stud 131, and the first spacer 133 is mounted on the body 1312 of the first stud 131, so that the first elastic member 132 is located between the head 1311 of the first stud 131 and the first spacer 133. The body 1312 of the first stud 131 passes through the first water-cooling plate 12, and the first spacer 133 is located at one side of the first water-cooling plate 12. The first elastic member 132 is used to apply a force to move the head 1311 of the first stud 131 away from the first water-cooled plate 12. The first abutting piece 14 is fixed on the body 1312 of the first stud 131 and abuts against the other side of the first water cooling plate 12, and at least part of the first water cooling plate 12 is located between the first gasket 133 and the first abutting piece 14.
The end of the body 1312 of the first stud 131 remote from the head 1311 has an external thread formation 1312a. The external screw structures 1312a of the body 1312 of the first stud 131 are respectively combined with the internal screw structures 1114a of the first assembling hole 1114, so that the first water-cooled plate 12 is combined with the first frame 111 of the bracket 11, and the first abutting piece 14 is interposed between at least part of the first water-cooled plate 12 and the first frame 111 of the bracket 11.
It should be noted that the structure of the first locking member 13 is not limited to the present invention, and the first locking member may be any suitable structure as long as the first water cooling plate can be combined with the first frame body of the bracket.
The assembled relationship among the second water-cooling plate 15, the second locking member 16, the second abutting member 17, and the second frame body 112 of the bracket 11 will be described below. For convenience of description and presentation of drawings, the following description and corresponding drawings only describe and show one of the second water-cooling plates 15, one of the second locking members 16, one of the second abutting members 17 and one of the second assembly holes 1124 of the second frame 112 in detail.
The second water-cooling plate 15 is stacked on the second upper surface 1121 of the second frame 112 and is used for being thermally coupled to the second heat source 3 through the second through-slot 1123, wherein the second water-cooling plate 15 and the second heat source 3 are bonded together, for example, by a heat-conducting adhesive (not shown).
The second locking member 16 includes a second stud 161, a second elastic member 162 and a second spacer 163. Second stud 161 includes a head 1611 and a body 1612 connected, wherein head 1611 has a width greater than a width of body 1612. The second elastic member 162 is sleeved on the body 1612 of the second stud 161, and the second spacer 163 is mounted on the body 1612 of the second stud 161, so that the second elastic member 162 is located between the head 1611 of the second stud 161 and the second spacer 163. The body 1612 of the second stud 161 passes through the second water-cooling plate 15, and the second spacer 163 is positioned on one side of the second water-cooling plate 15. The second elastic member 162 is used for applying a force to move the head portion 1611 of the second stud 161 in a direction away from the second water cooling plate 15. The second abutting piece 17 is fixed to the body 1612 of the second stud 161 and abuts against the other side of the second water cooling plate 15, and at least part of the second water cooling plate 15 is located between the second spacer 163 and the second abutting piece 17.
The end of the body 1612 of the second stud 161 far from the head 1611 has an external thread 1612a, and the external thread 1612a of the body 1612 of the second stud 161 is combined with an internal thread 1124a of the second assembly hole 1124, so as to combine the second water-cooling plate 15 with the second frame 112 of the bracket 11, and the second abutting member 17 is interposed between at least part of the second water-cooling plate 15 and the second frame 112 of the bracket 11.
It should be noted that the structure of the second locking member 16 is not limited to the present invention, and the second locking member may be any suitable structure as long as the second water cooling plate can be coupled to the second frame body of the bracket.
In the present embodiment, the first frame 111 of the bracket 11 is used for being stacked on the carriers 4 on the motherboard 1, and the second frame 112 of the bracket 11 is used for being stacked on the motherboard 1.
The following describes the assembly relationship of the third locking member 18, the first water-cooled plate 12, the first frame 111 of the bracket 11, the third abutting member 19, and the carrier 4 on the main board 1. For convenience of description and presentation of drawings, the following description and the corresponding drawings only describe and show one of the third locking members 18, one of the first water cooling plates 12, part of the first frame 111, one of the third abutting members 19 and one of the carriers 4 on the main board 1 in detail.
The third locking element 18 comprises a third stud 181, a third elastic member 182 and a third spacer 183. The third stud 181 comprises a head 1811 and a body 1812 connected, wherein the width of the head 1811 is greater than the width of the body 1812. The third elastic member 182 is sleeved on the body 1812 of the third stud 181, and the third spacer 183 is mounted on the body 1812 of the third stud 181, so that the third elastic member 182 is located between the head 1811 of the third stud 181 and the third spacer 183. The body 1812 of the third stud 181 passes through the first water-cooling plate 12 and the first through hole 1115 of the first frame 111 of the bracket 11, so that the third gasket 183 abuts against the first water-cooling plate 12. The third elastic member 182 is used for applying a force to move the head 1811 of the third stud 181 in a direction away from the first water cooling plate 12. The third abutting piece 19 is fixed to the body 1812 of the third stud 181, and at least part of the first water cooling plate 12 is located between the third spacer 183 and the third abutting piece 19. The end of the body 1812 of the third stud 181, which is far away from the head 1811, is locked to the carrier 4 on the main board 1, so that the third abutting member 19 abuts against the first frame 111 of the bracket 11.
The assembly relationship of the fourth locking member 20, the second water cooling plate 15, the second frame body 112 of the bracket 11, the fourth abutting member 21, and the main plate 1 will be described below. For convenience of description and presentation of drawings, the following description and the corresponding drawings only describe and show one of the fourth locking members 20, one of the second water cooling plates 15, part of the second frame 112 of the bracket 11, one of the fourth abutting members 21 and part of the main board 1 in detail.
The fourth locking element 20 comprises a fourth stud 201, a fourth elastic member 202 and a fourth spacer 203. The fourth stud 201 comprises a head 2011 and a body 2012 connected thereto, wherein the width of the head 2011 is greater than the width of the body 2012. The fourth elastic member 202 is sleeved on the body 2012 of the fourth stud 201, and the fourth spacer 203 is mounted on the body 2012 of the fourth stud 201, so that the fourth elastic member 202 is located between the head 2011 of the fourth stud 201 and the fourth spacer 203. The body 2012 of the fourth stud 201 passes through the second water-cooling plate 15 and the second through hole 1125 of the second frame 112 of the bracket 11, so that the fourth gasket 203 abuts against the second water-cooling plate 15. The fourth elastic member 202 is used for applying a force to the head 2011 of the fourth stud 201 moving away from the second water-cooled plate 15. The fourth abutting piece 21 is fixed to the body 2012 of the fourth stud 201, and at least part of the second water cooling plate 15 is located between the fourth gasket 203 and the fourth abutting piece 21. The end of the body 2012 of the fourth stud 201, which is far from the head 2011, is locked to the main board 1, so that the fourth abutting piece 21 abuts against the second frame 112 of the bracket 11.
It should be noted that the third locking member 18, the third abutment member 19, the fourth locking member 20 and the fourth abutment member 21 are optional components. In other embodiments, the water cooling plate assembly may have no third locking member, no third abutting member, no fourth locking member, and no fourth abutting member, and the bracket may be positioned on the main board in other manners, such as by means of a snap-fit manner.
In this embodiment, the first frame 111 of the bracket 11 further has at least one through hole 1117. The through hole 1117 of the first frame 111 corresponds to the through hole 1a of the main board 1. The through hole 1117 of the first frame 111 and the through hole 1a of the motherboard 1 are used for passing screws (not shown), so as to fix the bracket 11 and the motherboard 1 to a housing (not shown). In this way, by removing the screws, the fixing relationship between the main board 1 and the chassis can be released, so that the water-cooled board assembly 10 positioned thereon can be taken out of the chassis together when the main board 1 is taken out of the chassis. It should be noted that the through hole 1117 of the first frame body 111 of the bracket 11 is an optional structure. In other embodiments, the first frame body of the bracket may not have a through hole. The screws can only pass through the main board to fix the main board on the shell.
Next, a process of attaching and detaching the water-cooled panel assembly 10 from the main panel 1 will be described. Please refer to fig. 6 and 7. FIG. 6 is a schematic diagram illustrating the separation of the first water-cooling plate from the first heat source in FIG. 4. FIG. 7 is a schematic diagram illustrating the separation of the second water-cooling plate from the second heat source in FIG. 5.
First, the locking relationship between the third stud 181 of the third locking member 18 and the carrier 4 is released, and the locking relationship between the fourth stud 201 of the fourth locking member 20 and the main board 1 is released. Then, the first stud 131 of the first locking member 13 and the second stud 161 of the second locking member 16 are unscrewed, so that the first stud 131 and the second stud 161 move upwards. During the upward movement of the first stud 131, the first abutting element 14 will be lifted a distance from the first water-cooling plate 12, so as to separate the first water-cooling plate 12 and the first heat source 2 flexibly, thereby ensuring that the first heat source 2 will not be damaged. Similarly, during the upward movement of the second stud 161, the second abutting member 17 will push up the second water-cooling plate 15a distance, so as to separate the bonded second water-cooling plate 15 and the second heat source 3 flexibly, so as to ensure that the second heat source 3 will not be damaged.
It should be noted that the first abutment 14 and the second abutment 17 are optional components. In other embodiments, the water cooled plate assembly may be devoid of the first abutment and the second abutment.
After the first water-cooling plate 12 and the second water-cooling plate 15 are separated from the first heat source 2 and the second heat source 3, respectively, the first stud 131 of the first locking member 13 is still screwed into the first assembling hole 1114 of the first frame 111 of the bracket 11, and the second stud 161 of the second locking member 16 is still screwed into the second assembling hole 1124 of the second frame 112 of the bracket 11, so that the bracket 11 can be directly lifted by the lifting handle 114, so that all the first water-cooling plates 12 and all the second water-cooling plates 15 are simultaneously removed from the first heat source 2 and the second heat source 3, respectively.
In contrast, in the process of installing the first water-cooling plate 12 and the second water-cooling plate 15, the water-cooling plate assembly 10 may be prepared first, that is, the first water-cooling plate 12 and the second water-cooling plate 15 are combined with the first frame 111 and the second frame 112 of the bracket 11 in advance. Next, the bracket 11 is placed on the main board 1, and the first water-cooling plate 12 and the second water-cooling plate 15 are respectively aligned with the first heat source 2 and the second heat source 3 accurately by matching the positioning hole 1116 of the first frame 111 with the positioning column (not shown) on the carrier 4, and the third stud 181 of the third locking member 18 and the fourth stud 201 of the fourth locking member 20 are respectively aligned with the corresponding hole sites of the carrier 4 and the main board 1. Then, the third stud 181 of the third locking member 18 and the fourth stud 201 of the fourth locking member 20 are locked into the corresponding hole sites of the carrier 4 and the main board 1, and then the first stud 131 of the first locking member 13 and the second stud 161 of the second locking member 16 are screwed, so as to ensure that the first water-cooled plate 12 and the second water-cooled plate 15 are properly adhered to the first heat source 2 and the second heat source 3, respectively.
In the present embodiment, by the arrangement that the first water-cooling plates 12 are coupled to the first frame 111 of the bracket 11 through the first locking members 13 and the second water-cooling plates 15 are coupled to the second frame 112 of the bracket 11 through the second locking members 16, all the first water-cooling plates 12 and all the second water-cooling plates 15 are aligned with the first heat sources 2 and the second heat sources 3 respectively at one time through the bracket 11 during the installation of the bracket 11 on the motherboard 1, or all the first water-cooling plates 12 and all the second water-cooling plates 15 are removed from the first heat sources 2 and the second heat sources 3 respectively at one time through the bracket 11 during the detachment of the motherboard 1, so that the first water-cooling plates 12 and the second water-cooling plates 15 can be quickly assembled and disassembled.
It should be noted that the positioning hole 1116 of the first frame 111 of the bracket 11 is a selected structure. In other embodiments, the first frame body of the frame may be free of locating holes.
In the present embodiment, the heights of the first heat source 2 and the second heat source 3 on the motherboard 1 are different, so the first frame 111, the second frame 112 and the connecting piece 113 of the bracket 11 are in a step shape, but not limited thereto. In other embodiments, when the first heat source and the second heat source on the motherboard have the same height, the bracket may have no connection piece, and the first frame body and the second frame body may be directly connected and form a flat plate together. In another embodiment, the first and second frames of the bracket may be two-piece assemblies. In yet another embodiment, the first frame may comprise a plurality of sub-frames separated from each other. For example, each of the sub-frames has four first through slots, and the four first through slots may be arranged in a 2×2 or 4×1 array.
The configuration of the bracket 11 of the present embodiment corresponds to the first heat source 2 and the second heat source 3 on the motherboard 1. It should be noted, however, that the number and positions of the first heat sources 2 and the second heat sources 3 on the motherboard 1 of the present embodiment are merely examples, and are not intended to limit the present invention. When the number and the positions of the heat sources on the main board are different, the structural configuration of the bracket is correspondingly adjusted. For example, when only the first heat sources are arranged on the motherboard and the first heat sources are not arranged in a plurality of groups, the bracket can be provided with no second frame body, the water cooling plate component can be provided with no related components such as a second water cooling plate and a second locking piece, and the arrangement mode of the first through grooves of the first frame body of the bracket is adjusted to be corresponding to the arrangement mode of the first heat sources.
According to the water cooling plate assembly and the bracket thereof disclosed in the above embodiments, the first water cooling plates are combined with the first frame body of the bracket through the first locking members, so that all the first water cooling plates can be aligned with the first heat sources respectively through the bracket at one time in the process of installing the bracket on the main board, or the first water cooling plates can be removed from the first heat sources respectively through the bracket at one time in the process of disassembling the bracket from the main board, and therefore, the first water cooling plates can be disassembled and assembled quickly.
The above embodiments are merely illustrative of the principles of the present invention and its effectiveness, and are not intended to limit the invention. Modifications and variations may be made to the above-described embodiments by those skilled in the art without departing from the spirit and scope of the invention. Accordingly, it is intended that all equivalent modifications and variations of the invention be covered by the claims, which are within the ordinary skill of the art, be within the spirit and scope of the present disclosure.
Claims (9)
1. A water cooled panel assembly for positioning on a motherboard and in thermal contact with a plurality of first heat sources on the motherboard, the water cooled panel assembly comprising:
the bracket comprises a first bracket body, a second bracket body and a first bracket body, wherein the first bracket body is provided with a first upper surface, a first lower surface and a plurality of first through grooves, the first lower surface is opposite to the first upper surface and is used for facing the main board, and the first through grooves penetrate through the first upper surface and the first lower surface;
the first water cooling plates are overlapped on the first upper surface of the first frame body and are respectively thermally coupled with the first heat sources through the first through grooves; and
The first locking pieces penetrate through the first water cooling plates and are fixed on the first frame body of the bracket so as to combine the first water cooling plates with the first frame body;
Wherein the bracket further comprises at least one handle, and the at least one handle is fixed on the first bracket body.
2. The water cooled panel assembly of claim 1, wherein: the support comprises a plurality of first locking parts, wherein the first locking parts are respectively fixed on the plurality of support parts, the support parts are respectively arranged between at least part of one first water cooling plate and one first frame body of the support and are abutted against one first water cooling plate, the first frame body is provided with a plurality of assembly holes, each assembly hole is provided with an internal thread structure, each first locking part is provided with an external thread structure, and the external thread structures of the first locking parts are respectively combined with the internal thread structures of the assembly holes.
3. The water cooled panel assembly of claim 1, wherein: the bracket further comprises a second bracket body integrally connected to the first bracket body, the second bracket body is provided with a second upper surface, a second lower surface and a plurality of second through grooves, the second lower surface is opposite to the second upper surface and is used for facing the main board, the second through grooves penetrate through the second upper surface and the second lower surface, the second water-cooling plates are overlapped on the second upper surface of the second bracket body and are used for being respectively thermally coupled with a plurality of second heat sources on the main board through the second through grooves, and the second locking pieces penetrate through the first water-cooling plates and are fixed on the second bracket body of the bracket so as to combine the second water-cooling plates with the second bracket body.
4. A water cooled panel assembly according to claim 3, wherein: the second support body is provided with a plurality of assembly holes, each assembly hole is provided with an internal thread structure, each second locking piece is provided with an external thread structure, and the external thread structures of the second locking pieces are respectively combined with the internal thread structures of the assembly holes.
5. A water cooled panel assembly according to claim 3, wherein: the second frame body is integrally connected to the first frame body through the connecting sheet, and the second upper surface of the second frame body is arranged between the second lower surface of the second frame body and the first lower surface of the first frame body.
6. A water cooled panel assembly according to claim 3, wherein: the third locking pieces penetrate through the first water cooling plates and the first frame body of the support and are used for being fixed on the main board and respectively bearing the plurality of carrying seats of the first heat sources, and the fourth locking pieces penetrate through the second water cooling plates and the second frame body of the support and are used for being fixed on the main board.
7. A water cooled panel assembly according to claim 3, wherein: the number of the first through slots is 8 and the first through slots are arranged in a4 multiplied by 2 array, and the number of the second through slots is 6 and the second through slots are arranged in a 6 multiplied by 1 array.
8. The water cooled panel assembly of claim 1, wherein: the first frame body of the bracket is further provided with at least one through hole, and the at least one through hole is used for being aligned with the through hole of the main board.
9. A bracket for a water cooled panel assembly, comprising: the bracket is arranged on a main board and used for assembling a plurality of water cooling boards, and comprises:
the frame body is provided with an upper surface, a lower surface and a plurality of through grooves, the upper surface is used for the water cooling plates to be overlapped, the lower surface is opposite to the upper surface and is used for facing the main board, and the through grooves penetrate through the upper surface and the lower surface and are used for the water cooling plates to be thermally coupled with a plurality of heat sources on the main board;
wherein, the bracket further comprises at least one handle, and the at least one handle is fixed on the bracket body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210679440.9A CN114895767B (en) | 2022-06-15 | 2022-06-15 | Water-cooling plate assembly and bracket thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210679440.9A CN114895767B (en) | 2022-06-15 | 2022-06-15 | Water-cooling plate assembly and bracket thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114895767A CN114895767A (en) | 2022-08-12 |
| CN114895767B true CN114895767B (en) | 2024-04-26 |
Family
ID=82728857
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210679440.9A Active CN114895767B (en) | 2022-06-15 | 2022-06-15 | Water-cooling plate assembly and bracket thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114895767B (en) |
Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200834292A (en) * | 2007-02-14 | 2008-08-16 | Asustek Comp Inc | Connection assembly |
| CN102478931A (en) * | 2010-11-23 | 2012-05-30 | 英业达股份有限公司 | Detachable liquid cooling heat dissipation module |
| CN204272577U (en) * | 2014-12-14 | 2015-04-15 | 天津芯之铠热管理技术研发有限公司 | A kind of two-way laminating cooled plate |
| CN106714517A (en) * | 2016-12-30 | 2017-05-24 | 上海航天科工电器研究院有限公司 | Liquid-cooled board card module for multipoint temperature monitoring |
| CN106774740A (en) * | 2016-12-20 | 2017-05-31 | 深圳市迅凌科技有限公司 | Board-like water-cooled graphic card radiator |
| CN109382571A (en) * | 2018-10-24 | 2019-02-26 | 宁波敏实汽车零部件技术研发有限公司 | A kind of aluminium alloy CMT arc-welding turntable class jig |
| CN109521860A (en) * | 2018-11-06 | 2019-03-26 | 郑州云海信息技术有限公司 | A kind of water-cooling system detected for GPU server with leakage |
| CN109743869A (en) * | 2019-01-30 | 2019-05-10 | 全亿大科技（佛山）有限公司 | Liquid cooling heat radiator and server system |
| CN111156843A (en) * | 2020-02-28 | 2020-05-15 | 西南电子技术研究所（中国电子科技集团公司第十研究所） | Sheet type stacked liquid cooling heat exchanger |
| CN212487063U (en) * | 2020-01-19 | 2021-02-05 | 讯凯国际股份有限公司 | Water cooling head and automotive electronic control unit water cooling head |
| CN113377180A (en) * | 2021-06-16 | 2021-09-10 | 英业达科技有限公司 | Liquid cooling type radiator |
| CN114564094A (en) * | 2022-02-28 | 2022-05-31 | 上海顺诠科技有限公司 | Server, water cooling assembly and water cooling plate assembly |
| CN114594844A (en) * | 2022-03-07 | 2022-06-07 | 英业达科技有限公司 | Water cooling plate assembly |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7967062B2 (en) * | 2006-06-16 | 2011-06-28 | International Business Machines Corporation | Thermally conductive composite interface, cooled electronic assemblies employing the same, and methods of fabrication thereof |
| US20090219687A1 (en) * | 2008-03-03 | 2009-09-03 | Jui-Nan Lin | Memory heat-dissipating mechanism |
| TWI632650B (en) * | 2017-09-28 | 2018-08-11 | 雙鴻科技股份有限公司 | Liquid cooling system and liquid cooling sink |
-
2022
- 2022-06-15 CN CN202210679440.9A patent/CN114895767B/en active Active
Patent Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200834292A (en) * | 2007-02-14 | 2008-08-16 | Asustek Comp Inc | Connection assembly |
| CN102478931A (en) * | 2010-11-23 | 2012-05-30 | 英业达股份有限公司 | Detachable liquid cooling heat dissipation module |
| CN204272577U (en) * | 2014-12-14 | 2015-04-15 | 天津芯之铠热管理技术研发有限公司 | A kind of two-way laminating cooled plate |
| CN106774740A (en) * | 2016-12-20 | 2017-05-31 | 深圳市迅凌科技有限公司 | Board-like water-cooled graphic card radiator |
| CN106714517A (en) * | 2016-12-30 | 2017-05-24 | 上海航天科工电器研究院有限公司 | Liquid-cooled board card module for multipoint temperature monitoring |
| CN109382571A (en) * | 2018-10-24 | 2019-02-26 | 宁波敏实汽车零部件技术研发有限公司 | A kind of aluminium alloy CMT arc-welding turntable class jig |
| CN109521860A (en) * | 2018-11-06 | 2019-03-26 | 郑州云海信息技术有限公司 | A kind of water-cooling system detected for GPU server with leakage |
| CN109743869A (en) * | 2019-01-30 | 2019-05-10 | 全亿大科技（佛山）有限公司 | Liquid cooling heat radiator and server system |
| CN212487063U (en) * | 2020-01-19 | 2021-02-05 | 讯凯国际股份有限公司 | Water cooling head and automotive electronic control unit water cooling head |
| CN111156843A (en) * | 2020-02-28 | 2020-05-15 | 西南电子技术研究所（中国电子科技集团公司第十研究所） | Sheet type stacked liquid cooling heat exchanger |
| CN113377180A (en) * | 2021-06-16 | 2021-09-10 | 英业达科技有限公司 | Liquid cooling type radiator |
| CN114564094A (en) * | 2022-02-28 | 2022-05-31 | 上海顺诠科技有限公司 | Server, water cooling assembly and water cooling plate assembly |
| CN114594844A (en) * | 2022-03-07 | 2022-06-07 | 英业达科技有限公司 | Water cooling plate assembly |
Also Published As
| Publication number | Publication date |
|---|---|
| CN114895767A (en) | 2022-08-12 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6449162B1 (en) | Removable land grid array cooling solution | |
| US7352574B2 (en) | Assembly and heat-dissipating device having the same assembly | |
| US20110013356A1 (en) | Hard disk drive mounting structure and computer incorporating the same | |
| CN213123600U (en) | Spliced display screen | |
| GB2350480A (en) | A mount with heatsink for a central processing unit | |
| WO2012151774A1 (en) | Backlight module and liquid crystal display | |
| WO2008044487A1 (en) | Control device | |
| US20180284852A1 (en) | Systems and structures for positioning heat sinks and/or other devices in relation to processors and/or other components on printed circuit boards and other structures | |
| US9022734B2 (en) | Case structure and fan frame fixing module | |
| KR20100136804A (en) | Board connecting bracket and electronic instrument having the same | |
| CN108255271B (en) | Heat dissipation assembly and electronic device using same | |
| CN114594844B (en) | Water-cooled plate assembly | |
| US20120195069A1 (en) | Clamp structure for fixing a light bar on a base and backlight module having clamp structure | |
| EP2716968B1 (en) | Lighting device | |
| CN114895767B (en) | Water-cooling plate assembly and bracket thereof | |
| JPH1165484A (en) | Video display device | |
| US7950446B2 (en) | Heat dissipation device with clip for mounting a fan to a heat sink thereof | |
| US7372147B2 (en) | Supporting a circuit package including a substrate having a solder column array | |
| US8649172B2 (en) | Fixing assembly for fan module | |
| US11564338B2 (en) | Support assembly and display device | |
| TWI810974B (en) | Water cooling plate assembly and bracket thereof | |
| US20130115502A1 (en) | Mounting device for battery | |
| CN113990818B (en) | Penetrating type heat dissipation device for card chip of tested board | |
| JP2008071830A (en) | Fan supporting device and video display | |
| KR102520714B1 (en) | Display apparatus |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |