CN214773769U - Cell-phone medium plate frame mould - Google Patents

Abstract

The utility model discloses a mobile phone medium plate frame die, which comprises an upper die base, a lower die base, an upper die core, a lower die core, an upper die base and a lower die base, wherein the upper die core is arranged on the lower surface of the upper die base, the lower die core is arranged on the upper surface of the lower die base, and the upper die core and the lower die core form a die cavity; the lower die base is provided with an ejector plate, a main ejector pin and an auxiliary ejector pin, the main ejector pin and the auxiliary ejector pin are mounted on the ejector plate, the bottom of the main ejector pin is connected to the ejector plate, and the top of the main ejector pin extends upwards through the lower die core and extends into the die cavity; the auxiliary ejector pins comprise lower ejector pins and upper ejector pins, the lower ejector pins are connected to the ejector plate, the upper ejector pins extend into the cavity through the lower die core, and the lower ejector pins are connected with the upper ejector pins in a buckling mode. A lower ejector rod and an upper ejector rod which are connected in a two-section mode are adopted; the main ejector pin and the lower ejector pin are of two-section structures, so that the clamping stagnation between the main ejector pin and the auxiliary ejector pin due to different moving directions is reduced, the moving smoothness between the main ejector pin and the auxiliary ejector pin is improved, and the use reliability of the die is improved.

Description

Cell-phone medium plate frame mould

Technical Field

The utility model belongs to the technical field of the mould technique and specifically relates to indicate a cell-phone medium plate frame mould.

Background

The mobile phone is an indispensable portable electronic product in life, along with the continuous development of the mobile phone and the popularization of the smart phone, the smart phone is more and more popular and fills the mobile phone market, and the mobile phone occupies a large market share; however, in the injection molding process of the middle plate frame of the existing mobile phone, a mold for molding the middle plate frame of the mobile phone can be demoulded after the injection molding of the mobile phone only by arranging corresponding thimbles according to the specific structure matched with the middle plate frame; however, the frames of the mobile phone middle plates have different shapes, and the assembly can be completed only by adapting to a plurality of vertically and obliquely moving thimbles, and the vertically and obliquely moving thimbles are driven by one thimble plate; after long-time use, the thimble just appears the jamming easily, and the unable smooth and easy transmission thimble is ejecting cell-phone medium plate frame, and it is obviously not good enough to its reliability.

SUMMERY OF THE UTILITY MODEL

In view of this, the utility model discloses to the disappearance that prior art exists, its main objective provides a cell-phone medium plate frame mould, and it can solve present cell-phone medium plate frame mould effectively and appear the thimble and appear the jamming and can't smooth ejecting problem of cell-phone medium plate frame easily.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

a mobile phone middle plate frame die comprises an upper die holder, a lower die holder, an upper die core and a lower die core, wherein the upper die holder and the lower die holder are movably arranged, the upper die core is arranged on the lower surface of the upper die holder, the lower die core is arranged on the upper surface of the lower die holder, and the upper die core and the lower die core can be closed by moving the upper die holder and the lower die holder to form a cavity for forming a mobile phone middle plate; wherein

The bottom of the main thimble is connected with the thimble plate, and the top of the main thimble extends upwards through the lower die core and extends into the die cavity;

the auxiliary ejector pin comprises a lower ejector rod and an upper ejector rod, the bottom of the lower ejector rod is connected to the ejector plate, the top of the upper ejector rod extends into the cavity through the lower die core, and the lower ejector rod and the upper ejector rod are connected in a buckled mode.

As a preferred embodiment: between the top of the lower ejector rod and the bottom of the upper ejector rod, one of the two is provided with a buckling convex part, and the other is provided with a buckling concave part.

As a preferred embodiment: the side of the lower ejector rod is provided with a first notch, and the first notch is arranged close to the top of the lower ejector rod to form a buckling convex part.

As a preferred embodiment: and a second notch matched with the buckling convex part for connection is arranged at the bottom of the upper ejector rod.

As a preferred embodiment: the ejector pin fixing device further comprises a fixing plate, wherein the fixing plate is provided with a through hole for the main ejector pin and the auxiliary ejector pin to pass through;

the rod body of the main ejector pin and the rod body of the lower ejector pin can be movably inserted into the through hole.

As a preferred embodiment: the fixing plate is mounted on the lower die base.

Compared with the prior art, the utility model obvious advantage and beneficial effect have, particularly, can know by above-mentioned technical scheme: the structure of the auxiliary thimble is improved, and a lower ejector rod and an upper ejector rod which are connected in a two-section mode are adopted; due to the adoption of a two-section structure, the main ejector pin and the lower ejector pin are connected to the ejector plate and are driven to move vertically, so that the clamping stagnation condition between the main ejector pin and the auxiliary ejector pin due to different moving directions is reduced, the moving smoothness between the main ejector pin and the auxiliary ejector pin is improved, and the use reliability of the die is improved; meanwhile, the auxiliary ejector pin arranged in the two-section structure is beneficial to the arrangement of the upper ejector pin for the angle which is in line with the frame of the mobile phone middle plate, so that the convenience in assembling the auxiliary ejector pin is improved; moreover, the main thimble and the auxiliary thimble can use the same thimble plate, so that the structure of the mould is simplified;

and the lower ejector rod and the upper ejector rod are connected in a buckled mode, so that the lower ejector rod and the upper ejector rod can be assembled more simply and conveniently, and the assembly is easy.

To illustrate the structural features and functions of the present invention more clearly, the present invention will be described in detail with reference to the accompanying drawings and specific embodiments.

Drawings

Fig. 1 is a schematic perspective view of a mobile phone middle plate frame mold according to a preferred embodiment of the present invention;

fig. 2 is an exploded view of a mobile phone middle plate frame mold according to a preferred embodiment of the present invention;

fig. 3 is a partial exploded view of the cell phone middle plate frame mold according to the preferred embodiment of the present invention;

fig. 4 is a schematic partial structural view of a mobile phone middle plate frame mold according to a preferred embodiment of the present invention;

fig. 5 is a schematic partial structural view of a mobile phone middle plate frame mold according to a preferred embodiment of the present invention.

The attached drawings indicate the following:

10. upper die holder 20 and lower die holder

21. Ejector plate 22, main ejector pin

23. Auxiliary thimble 231 and lower ejector rod

232. Upper stem 233, engaging projection

234. Buckling concave position 24 and fixing plate

30. An upper mold core 40 and a lower mold core.

Detailed Description

Referring to fig. 1 to 5, a specific structure of a mobile phone middle plate frame mold according to a preferred embodiment of the present invention is shown, which includes an upper mold base 10, a lower mold base 20, an upper mold core 30 and a lower mold core 40.

The upper die holder 10 and the lower die holder 20 are movably arranged, the upper die core 30 is mounted on the lower surface of the upper die holder 10, the lower die core 40 is mounted on the upper surface of the lower die holder 20, and the upper die core 30 and the lower die core 40 can be closed by moving the upper die holder 10 and the lower die holder 20 to form a die cavity for forming a middle plate of a mobile phone. In the examples of the present application. The lower die holder 20 is provided with an ejector plate 21, a main ejector pin 22 and an auxiliary ejector pin 23 which are arranged on the ejector plate 21, the bottom of the main ejector pin 22 is connected with the ejector plate 21, and the top of the main ejector pin extends upwards to extend through the lower die core 40 and extend into the die cavity; the auxiliary ejector 23 includes a lower ejector rod 231 and an upper ejector rod 232, the bottom of the lower ejector rod 231 is connected to the ejector plate 21, the top of the upper ejector rod 232 extends into the cavity through the lower mold core 40, and the lower ejector rod 231 and the upper ejector rod 232 are connected in a buckling manner.

As mentioned above, the main thimble 22 generally vertically passes through the lower mold core 40 and extends into the mold cavity, and the auxiliary thimble 23 obliquely passes through the lower mold core 40 and extends into the mold cavity; therefore, the auxiliary ejector 23 with a two-section structure is provided, the lower ejector rod 231 of the auxiliary ejector 23 is connected with the ejector plate 21 and vertically and upwardly extends like the main ejector pin 22, so that the same ejector plate 21 can be used for driving, and the structure of the mold is simplified; the upper ejector rod 232 is obliquely arranged according to the shape of the middle plate frame of the mobile phone and then connected with the corresponding lower ejector rod 231, so that the assembly is very simple; meanwhile, compared with the ejector pin structure of the traditional mold, the mold in which at least two ejector pins in different moving directions adopt the same ejector pin plate 21 can improve the smoothness of the ejector pins during moving, the phenomenon of clamping stagnation is not easy to occur, and the service life and the reliability of the ejector pins are improved.

Between the top of the lower top bar 231 and the bottom of the upper top bar 232, one is provided with a buckling convex part 233, and the other is provided with a buckling concave part 234; in the embodiment of the present application, the side surface of the lower lift bar 231 is provided with a first notch, and the first notch is disposed near the top of the lower lift bar 231 to form a fastening protrusion 233. The bottom of the upper rod 232 is provided with a second notch matched with the engaging protrusion 233 for connection, and the second notch is the engaging recess 234.

Further comprises a fixing plate 24, the fixing plate 24 is provided with a through hole for the main thimble 22 and the auxiliary thimble 23 to pass through; the shank of the main thimble 22 and the shank of the lower thimble 231 are movably inserted into the through-holes. The holding plate 24 is mounted to the lower die holder 20.

The utility model discloses a design focus lies in: the structure of the auxiliary thimble 23 is improved, and a lower ejector rod 231 and an upper ejector rod 232 which are connected in a two-section mode are adopted; due to the adoption of a two-section structure, the main ejector pin 22 and the lower ejector pin 231 are connected to the ejector plate 21 and are driven to move vertically, so that the clamping stagnation between the main ejector pin 22 and the auxiliary ejector pin 23 due to different moving directions is reduced, the moving smoothness between the main ejector pin 22 and the auxiliary ejector pin 23 is improved, and the use reliability of the die is improved; meanwhile, the auxiliary ejector pin 23 arranged in the two-section structure is beneficial to the arrangement of the upper ejector pin 232 at an angle which is in accordance with the frame of the mobile phone middle plate, so that the convenience in assembling the auxiliary ejector pin 23 is improved; moreover, the same ejector plate 21 can be used for the main ejector 22 and the auxiliary ejector 23, so that the mold structure is simplified;

and, adopt buckled to connect between lower ejector pin 231 and the last ejector pin 232, can make the assembly of lower ejector pin 231 and last ejector pin 232 simpler, convenient, easily the equipment.

The above description is only a preferred embodiment of the present invention, and is not intended to limit the technical scope of the present invention, so that any slight modifications, equivalent changes and modifications made by the technical spirit of the present invention to the above embodiments are all within the scope of the technical solution of the present invention.

Claims (6)

1. The utility model provides a cell-phone medium plate frame mould which characterized in that: the mobile phone middle plate forming die comprises an upper die holder, a lower die holder, an upper die core and a lower die core, wherein the upper die holder and the lower die holder are movably arranged, the upper die core is arranged on the lower surface of the upper die holder, the lower die core is arranged on the upper surface of the lower die holder, and the upper die core and the lower die core can be closed by moving the upper die holder and the lower die holder to form a cavity for forming a middle plate of a mobile phone; wherein

The lower die base is provided with an ejector plate, a main ejector pin and an auxiliary ejector pin, the main ejector pin and the auxiliary ejector pin are mounted on the ejector plate, the bottom of the main ejector pin is connected to the ejector plate, and the top of the main ejector pin extends upwards through the lower die core and extends into the die cavity;

the auxiliary ejector pin comprises a lower ejector rod and an upper ejector rod, the bottom of the lower ejector rod is connected to the ejector plate, the top of the upper ejector rod extends into the cavity through the lower die core, and the lower ejector rod and the upper ejector rod are connected in a buckled mode.

2. The bezel die for mobile phone middle plate according to claim 1, wherein: between the top of the lower ejector rod and the bottom of the upper ejector rod, one of the two is provided with a buckling convex part, and the other is provided with a buckling concave part.

3. The bezel die for mobile phone middle plate according to claim 2, wherein: the side of the lower ejector rod is provided with a first notch, and the first notch is arranged close to the top of the lower ejector rod to form a buckling convex part.

4. The bezel die for mobile phone middle plate according to claim 3, wherein: and a second notch matched with the buckling convex part for connection is arranged at the bottom of the upper ejector rod.

5. The bezel die for mobile phone middle plate according to claim 1, wherein: the ejector pin fixing device further comprises a fixing plate, wherein the fixing plate is provided with a through hole for the main ejector pin and the auxiliary ejector pin to pass through;

the rod body of the main ejector pin and the rod body of the lower ejector pin can be movably inserted into the through hole.

6. The bezel die for mobile phone middle plate according to claim 5, wherein: the fixing plate is mounted on the lower die base.

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