CN111483108A - A LED module integrated molding mold - Google Patents

Abstract

The invention discloses an L ED module integrated forming mold, which comprises an upper mold and a lower mold, wherein an injection top mold is arranged at the bottom of the upper mold, an injection bottom mold corresponding to the injection top mold is arranged at the top of the lower mold, a pouring shuttle strip and a sealing shuttle strip are arranged at the two sides of the injection bottom mold at the top of the lower mold, a pouring alignment groove and a sealing alignment groove which are matched with the pouring shuttle strip and the sealing shuttle strip in shape are formed at the bottom of the upper mold, a pouring runner communicated with the injection bottom mold is arranged at the inner side of the pouring shuttle strip, a pouring port communicated between the top of the upper mold and the pouring runner is arranged on the pouring alignment groove, a wire guide groove is arranged between the bottom of the pouring shuttle strip and the sealing shuttle strip and the top of the lower mold, and a mold cavity is formed between the injection fixed mold and the injection bottom mold during mold closing, so that the mode of secondary injection is replaced, the continuous production capacity is improved in process production, the design requirement of the mold.

Description

A LED module integrated molding mold

technical field

The invention relates to the technical field of LED module production, in particular to an LED module integrated mold.

Background technique

LED SMD module is a kind of LED module. Compared with other types of modules, it has the characteristics of large luminous angle, high brightness and low light decay, so it is more widely used. In the current production mode of LED chip modules, the method of secondary injection molding is generally adopted, that is, the injection molding of the substrate is performed in a mold first, and then the injection molding of the plastic outer skin is completed in the mold. It is inconvenient to maintain and maintain, and the injection molding cycle is long, which is not conducive to continuous production in the process.

SUMMARY OF THE INVENTION

In order to overcome the above-mentioned shortcomings, the present invention aims to provide a technical solution that can solve the above-mentioned problems.

An LED module integral molding mold includes an upper mold and a lower mold, the bottom of the upper mold is provided with an injection top mold, the top of the lower mold is provided with an injection bottom mold corresponding to the injection top mold, and the top of the lower mold is located at two sides of the injection bottom mold. The pouring shuttle and the sealing shuttle are installed on the side, and the bottom of the upper mold is formed with a pouring alignment groove and a sealing alignment groove which are matched with the shapes of the casting shuttle and the sealing shuttle. The pouring runner, the pouring alignment groove has a pouring port connected between the top of the upper mold and the pouring runner, and there is a wire groove between the bottom of the pouring shuttle, the bottom of the sealing shuttle and the top of the lower mold. A mold cavity is formed between the fixed mold and the injection bottom mold.

Further, the top of the lower mold is located on both sides of the injection bottom mold with shuttle positioning blocks, and the bottoms of the casting shuttle and the sealing shuttle are provided with shuttle positioning grooves corresponding to the shuttle positioning blocks. Through the shuttle positioning groove and the shuttle positioning block, it is correspondingly fitted and installed on the top of the lower mold.

Further, the top of the lower mold is located on both sides of the injection bottom mold, and there are lower wire grooves arranged and distributed corresponding to the injection bottom mold. The groove and the lower wire groove are correspondingly matched to form a wire groove.

Further, a thimble bracket is fixedly installed at the bottom of the lower mold, an ejector pin support plate is installed in the ejector pin bracket, and a discharge ejector pin which passes through the lower mold and whose top is flush with the bottom of the injection bottom mold is fixedly installed on the ejector pin support plate.

Further, the inner bottom of the thimble bracket is fixedly installed with a guide column, the thimble support plate is sleeved on the guide column and slidably matched with it, the inner bottom of the thimble bracket is hinged with a lifting plate located below the thimble support plate, and the middle section of the lifting plate is hinged. The top has spherical protrusions that are in contact with the bottom surface of the thimble carrier.

Further, the inner bottom of the ejector pin bracket has a limiting groove for limiting the position of the lifting plate, and the bottom of the ejector pin bracket is located on one side of the limiting groove and has a hole for exposing the lifting plate.

Compared with the prior art, the beneficial effects obtained by the present invention are as follows: the present invention has a novel structure, adopts the method of insert injection molding, separates the injection molding process of the substrate of the LED module and the plastic outer skin, and replaces the method of secondary injection molding. In production, the continuous production capacity is improved, and the mold design requirements are simplified at the same time, which is convenient for maintenance, saves design costs, and has a compact structure, which is convenient for mass production of LED modules.

Additional aspects and advantages of the present invention will be set forth, in part, from the following description, and in part will be apparent from the following description, or may be learned by practice of the invention.

Description of drawings

In order to explain the embodiments of the present invention or the technical solutions in the prior art more clearly, the following briefly introduces the accompanying drawings that need to be used in the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description are only These are some embodiments of the present invention, and for those of ordinary skill in the art, other drawings can also be obtained from these drawings without any creative effort.

FIG. 1 is a schematic structural diagram of the present invention.

FIG. 2 is another structural schematic diagram of the present invention.

3 is a schematic structural diagram of an upper die in the present invention.

FIG. 4 is a schematic structural diagram of a lower die in the present invention.

FIG. 5 is a partial enlarged view of A in FIG. 3 .

FIG. 6 is a partial enlarged view of B in FIG. 4 .

Detailed ways

The technical solutions in the embodiments of the present invention will be described clearly and completely below. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

Please refer to FIGS. 1-6 . An LED module integral molding mold includes an upper mold 1 and a lower mold 2 . The bottom of the upper mold 1 has an injection top mold 11 , and the top of the lower mold 2 has an injection mold corresponding to the injection top mold 11 . The bottom mold 21, the top of the lower mold 2 is located on both sides of the injection bottom mold 21, and the pouring shuttle 3 and the sealing shuttle 4 are installed, and the bottom of the upper mold 1 is formed with the casting shuttle 3 and the sealing shuttle 4. The pouring alignment groove 13, the sealing alignment groove 14, the inner side of the pouring shuttle 3 has a pouring runner 31 that communicates with the injection bottom mold 21, and the pouring alignment groove 13 has a connection between the top of the upper mold 1 and the pouring runner 31. There is a wire slot 5 between the bottom of the casting shuttle 3 and the sealing shuttle 4 and the top of the lower mold 2, and a cavity is formed between the injection fixed mold and the injection bottom mold 21 when the mold is closed. The prepared LED module substrate is placed in the mold cavity, and its lead pins are pierced through the wire groove 5. After the mold is closed, one injection molding of the plastic outer skin is performed.

Further, the top of the lower mold 2 is located on both sides of the injection bottom mold 21 with shuttle positioning blocks, and the bottoms of the casting shuttle 3 and the sealing shuttle 4 have shuttle positioning grooves corresponding to the shuttle positioning blocks. 3. The sealing shuttle 4 is fitted and installed on the top of the lower mold 2 through the shuttle positioning groove and the shuttle positioning block.

Further, the top of the lower mold 2 is located on both sides of the injection bottom mold, and there are lower wire grooves 51 arranged and distributed corresponding to the injection bottom mold 21. The slot 52, the upper wire slot 52 and the lower wire slot 51 are matched to form the wire slot 5 during mold clamping.

Further, the bottom of the lower mold 2 is fixedly installed with a thimble bracket 6, and a thimble support plate 61 is installed in the ejector pin bracket 6, and the ejector pin support plate 61 is fixedly installed through the lower mold 2 and the top is flush with the bottom of the injection bottom mold 21. The discharge thimble 62.

Further, the inner bottom of the thimble bracket 6 is fixedly installed with a guide column 63, the thimble support plate 61 is sleeved on the guide column 63 and slidably matched with it, and the inner bottom of the thimble bracket 6 is hinged with a lift located below the thimble support plate 61. For the plate 64 , the top of the middle section of the lifting plate 64 has a spherical protrusion 641 which is in contact with the bottom surface of the ejector pin support plate 61 .

Further, the inner bottom of the ejector pin bracket 6 has a limiting groove for limiting the position of the lift plate 64, and the bottom of the ejector pin bracket 6 has a hole 65 on one side of the limiting slot for exposing the lift plate.

It will be apparent to those skilled in the art that the present invention is not limited to the details of the above-described exemplary embodiments, but that the present invention may be embodied in other specific forms without departing from the spirit or essential characteristics of the invention. Therefore, the embodiments are to be regarded in all respects as illustrative and not restrictive, and the scope of the invention is to be defined by the appended claims rather than the foregoing description, which are therefore intended to fall within the scope of the claims. All changes within the meaning and scope of the equivalents of , are included in the present invention.

Claims (6)

1. The utility model provides an L ED module integrated into one piece mould, which comprises an upper die, the lower mould, a serial communication port, the bottom of going up the mould has the top mould of moulding plastics, the top of lower mould has the die block of moulding plastics that corresponds with the top mould of moulding plastics, the top of lower mould is located the both sides of the die block of moulding plastics and installs the pouring shuttle, seal the shuttle, the bottom shaping of going up the mould has with the pouring shuttle, seal the shape complex pouring counterpoint groove of shuttle, seal the counterpoint groove, the inboard of pouring shuttle has the pouring runner that the intercommunication moulded plastics the die block, have the sprue gate that feeds through between the top of last mould and pouring runner on the pouring counterpoint groove, the pouring shuttle, the bottom of sealing the shuttle has the wire guide groove between the top of lower mould, mould plastics during the compound die and mould.

2. The L ED module integrated molding die of claim 1, wherein the top of the lower die is located at two sides of the injection bottom die and has a shuttle bar positioning block, the bottoms of the pouring shuttle bar and the sealing shuttle bar have shuttle bar positioning grooves corresponding to the shuttle bar positioning block, and the pouring shuttle bar and the sealing shuttle bar are correspondingly embedded and installed at the top of the lower die through the shuttle bar positioning grooves and the shuttle bar positioning block.

3. The L ED module integrated forming mold of claim 1, wherein the lower mold has lower slots on the top thereof on both sides of the injection bottom mold, the lower slots corresponding to the lower slots, the lower portions of the pouring and sealing shuttling strips have upper slots corresponding to the lower slots, and the upper and lower slots are correspondingly engaged to form the wire guide slots when the mold is closed.

4. The L ED module integrated die of claim 1, wherein a thimble support is fixedly mounted at the bottom of the lower die, a thimble support plate is mounted in the thimble support, and a discharge thimble passing through the lower die and having a top end flush with the bottom of the injection bottom die is fixedly mounted on the thimble support plate.

5. The L ED module integrated-forming die of claim 4, wherein the thimble support has a guide post fixedly installed at an inner bottom thereof, the thimble supporting plate is sleeved on the guide post and slidably fitted thereto, the inner bottom of the thimble support is hinged with a lifting plate located below the thimble supporting plate, and a spherical protrusion contacting with a bottom surface of the thimble supporting plate is provided at a top of a middle section of the lifting plate.

6. The L ED module integrally forming mold of claim 5, wherein the inner bottom of the thimble holder has a limiting groove for limiting the falling position of the lifting plate, and the bottom of the thimble holder has a hole for exposing the lifting plate at a side of the limiting groove.

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