CN214757080U - Grounding windowing structure of FPC board, camera module and mobile terminal - Google Patents

Abstract

The utility model discloses a ground connection windowing structure, FPC board, camera module and mobile terminal of FPC board, including FPC body and the ground connection windowing structure of setting on the FPC body, the FPC body includes substrate PI, covers the copper foil layer in substrate PI tow sides respectively to and set up the cover rete outside the copper foil layer respectively; when the grounding windowing structure is arranged on the non-edge of the FPC body, an air guide groove is formed in the copper foil layer corresponding to the grounding windowing structure, one end of the air guide groove is connected with the grounding windowing structure, and the other end of the air guide groove extends to the position where the cover film is arranged; when the grounding windowing structure is arranged at the edge of the FPC body, one part of the grounding windowing structure is arranged on the copper foil layer at the edge of the FPC body, and the other part of the grounding windowing structure is arranged on the substrate PI at the edge of the FPC body. The utility model provides an use electrically conductive splice product to press not really to cause the steel sheet resistance grow to and unevenness and the problem of back temperature explosion board.

Description

Grounding windowing structure of FPC board, camera module and mobile terminal

Technical Field

The utility model belongs to the technical field of FPC, concretely relates to ground connection windowing structure, FPC board, camera module and mobile terminal of FPC board.

Background

The method has the advantages that a large number of FPC products are needed in the electronic field, because the FPC products are ultra-thin and flexible, most of the FPC products can be reinforced by adding the steel sheet on the back of the electronic component to increase the rigidity and the thickness of the FPC products and protect the electronic component, in order to reduce interference sources, the steel sheet needs to be subjected to grounding treatment, the grounding resistance value is less than or equal to 1 ohm, the protective film on the surface of the FPC needs to be windowed to leak out of the bottom copper position, and the steel sheet is communicated with the ground wire of the FPC through the conductive adhesive. Thereby eliminating the problems of stray and accumulated charges.

The existing FPC grounding windowing is to open a cover film in a copper area inside the FPC, and two common modes are as follows:

(1) the ground fenestration is completely within the FPC profile, see E in fig. 1;

(2) the ground fenestration is cut on the bottom copper near the FPC outline, see F in fig. 1.

After the steel sheet is attached, the steel sheet and the FPC board are bonded together through the conductive adhesive by using a vacuum press, and then the conductive adhesive is cured completely to ensure that the steel sheet and the FPC board are tightly and firmly connected. However, the above two designs of the ground windowing structure have the following defects:

(1) because the surface of the steel sheet is not provided with the air holes, a cavity is formed after the covering film is windowed, and when the vacuum press is pressed, air in the area cannot be led out and can be smoothly discharged out of the area of the steel sheet. Because the steel sheet material is harder than the FPC board, the gas expands when compressed to cause that the FPC board and the adhesive at the position and the FPC board can not be completely combined, thereby influencing the stripping force;

(2) during baking and curing, due to the fact that air and thermal expansion coefficients are inconsistent, the flatness of the FPC board at the position is not enough during high-temperature baking, and if the flatness is serious, the steel sheet and the FPC board are separated;

(3) for long-time storage products, the FPC board is wetted and absorbs moisture due to moisture in the air, and the moisture is gathered in the area due to the hydrophilicity of the air, so that the problem of board explosion is easily caused during SMT reflow soldering.

Therefore, it is necessary to develop a new ground opening structure of the FPC board, the camera module, and the mobile terminal.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing a ground connection windowing structure, FPC board, camera module and mobile terminal of FPC board to solve and use the conductive bonding ground product to press and not really cause the steel sheet resistance grow, and unevenness and the problem of back temperature explosion board.

In a first aspect, the ground windowing structure of the FPC board, according to the present invention, comprises an FPC body and a ground windowing structure arranged on the FPC body, wherein the FPC body comprises a substrate PI, copper foil layers respectively covering the front and back sides of the substrate PI, and covering film layers respectively arranged outside the copper foil layers;

when the grounding windowing structure is arranged on the non-edge of the FPC body, an air guide groove is formed in the copper foil layer corresponding to the grounding windowing structure, one end of the air guide groove is connected with the grounding windowing structure, and the other end of the air guide groove extends to the position where the cover film is arranged;

when the grounding windowing structure is arranged at the edge of the FPC body, one part of the grounding windowing structure is arranged on the copper foil layer at the edge of the FPC body, and the other part of the grounding windowing structure is arranged on the substrate PI at the edge of the FPC body.

Optionally, the width of the air guide groove is 0.8 mm-1.2 mm.

In a second aspect, a FPC board, adopt like the utility model discloses a ground connection structure of windowing of FPC board.

Third aspect, the utility model discloses a camera module, adopt true and false novel FPC board.

In a fourth aspect, a mobile terminal, include if the utility model discloses a camera module.

The utility model has the advantages of it is following:

(1) the problem of large contact resistance caused by unstable pressing of the conventional conductive adhesive and the steel sheet in grounding is solved; because the problem cannot be reversed and repaired, hidden danger is caused to the product;

(2) the potential risks of plate baking and reflow soldering during steel sheet lamination are effectively improved;

(3) in consideration of the FPC board processing technology, the steel sheet grounding test procedure and labor cost, test fixture and other additional costs are directly saved;

to sum up, the utility model provides a conventional use electrically conductive splice product pressure not real to and unevenness and temperature rise again and explode the board phenomenon, have improvement steel sheet ground connection effect, reduction in production cost's characteristics, product quality yield has obtained great promotion simultaneously, is adapted to all FPC flexible circuit board manufacturer's demand.

Drawings

FIG. 1 is a schematic diagram of a prior art structure;

FIG. 2 is a cross-sectional view taken along line A-A of FIG. 1;

FIG. 3 is a cross-sectional view taken along line B-B of FIG. 1;

FIG. 4 is a schematic structural diagram of the present embodiment;

FIG. 5 is a cross-sectional view taken along line C-C of FIG. 4;

FIG. 6 is a cross-sectional view taken along line D-D of FIG. 4;

in the figure: 1-substrate PI, 2-copper foil layer, 3-covering film layer, 4-air guide groove and 5-grounding windowing structure.

Detailed Description

The present invention will be further explained with reference to the accompanying drawings.

As shown in fig. 4 to 6, in the present embodiment, a grounding windowing structure of an FPC board includes an FPC body and a grounding windowing structure 5 disposed on the FPC body, the FPC body includes a substrate PI1, copper foil layers 2 respectively covering front and back surfaces of the substrate PI1, and cover film layers 3 respectively disposed outside the copper foil layers 2.

As shown in fig. 4 and 5, when the ground windowing structure 5 is disposed at the non-edge of the FPC body, an air guiding groove 4 is formed in the copper foil layer 2 corresponding to the ground windowing structure 5, one end of the air guiding groove 4 is connected to the ground windowing structure 5, and the other end of the air guiding groove 4 extends to a position where the cover film is disposed. Compared with the prior art, in the embodiment, for the grounding windowing structure 5 at the position E, the air guide groove 4 is added in the windowing area, and during pressing, air can escape from the air guide groove 4 to the outside of the steel sheet area.

As shown in fig. 4 and 6, when the ground windowing structure 5 is disposed at the edge of the FPC body, a portion of the ground windowing structure 5 is disposed on the copper foil layer 2 at the edge of the FPC body, and another portion of the ground windowing structure 5 is disposed on the substrate PI1 at the edge of the FPC body. Compared with the prior art, the windowing area of the grounding windowing structure 5 at the F position is enlarged, partial windowing is guaranteed to be outside the appearance of the FPC board, and due to the thickness of the copper foil layer 2, gas can escape from the difference between the copper foil layer 2 and the substrate PI1 layer during pressing.

Therefore, the problems that products are not compacted due to the conventional conductive glue, and the phenomena of unevenness and board explosion due to temperature rising are solved, the steel sheet grounding effect is improved, the production cost is reduced, the product quality yield is greatly improved, and the requirements of all FPC flexible circuit board manufacturers are met.

In this embodiment, the width of the air guide groove 4 is 0.8mm, or 1mm, or 1.2 mm.

In this embodiment, an FPC board adopts the ground windowing structure 5 of the FPC board as described in this embodiment.

In this embodiment, the camera module is an FPC board as described in the embodiments.

In this embodiment, a mobile terminal includes the camera module described in this embodiment.

Claims (5)

1. A grounding windowing structure of an FPC board comprises an FPC body and a grounding windowing structure (5) arranged on the FPC body, wherein the FPC body comprises a base material PI (1), copper foil layers (2) respectively covering the front side and the back side of the base material PI (1), and covering film layers (3) respectively arranged outside the copper foil layers (2); the method is characterized in that:

when the grounding windowing structure (5) is arranged on the non-edge of the FPC body, an air guide groove (4) is formed in the copper foil layer (2) corresponding to the grounding windowing structure (5), one end of the air guide groove (4) is connected with the grounding windowing structure (5), and the other end of the air guide groove (4) extends to the position where the cover film is arranged;

when the grounding windowing structure (5) is arranged at the edge of the FPC body, one part of the grounding windowing structure (5) is arranged on the copper foil layer (2) at the edge of the FPC body, and the other part of the grounding windowing structure (5) is arranged on the substrate PI (1) at the edge of the FPC body.

2. The ground windowing structure of an FPC board according to claim 1, wherein: the width of the air guide groove (4) is 0.8 mm-1.2 mm.

3. An FPC board, its characterized in that: a ground windowing structure (5) of an FPC board as claimed in claim 1 or 2 is employed.

4. The utility model provides a camera module which characterized in that: the FPC board as claimed in claim 3 is used.

5. A mobile terminal, characterized by: the camera module according to claim 4 is used.

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