CN214753728U - Semiconductor packaging structure - Google Patents

Abstract

The utility model discloses a semiconductor packaging structure, which comprises a bearing shell and a heat dissipation welding disc, wherein the top surface of the heat dissipation welding disc is provided with a sunk groove, the interior of the heat dissipation welding disc is provided with a driving cavity, a chip and a locking assembly, the driving cavity is arranged at the two sides of the sunk groove, the locking assembly comprises a rotating shaft and a transmission rod, and a gear is fixedly arranged at the position outside the rotating shaft and inside the driving cavity; the utility model discloses a locking subassembly of installation, when in-service use, when installing the chip fixedly, when driving the gear and carry out clockwise rotation, can pass through the transmission between gear and the rack, drive the transfer line and remove, then can drive the lock plate through the transfer line and remove to chip department, the accessible lock plate is fixed the chip on the heat dissipation dish, has replaced the fixed not enough of traditional silver thick liquid, can make things convenient for the staff to dismantle the reorganization to reduce the disability rate, it is very convenient, very good practicality has.

Description

Semiconductor packaging structure

Technical Field

The utility model relates to the field of semiconductor technology, specifically a semiconductor packaging structure.

Background

In the semiconductor manufacturing process, the packaging of the integrated circuit is one of the important steps for protecting the IC chip and providing external electrical connection, and the packaging type of the integrated circuit is various, wherein a common packaging type is to provide a heat dissipation pad, attach the chip to the chip base, and electrically connect the peripheral conductive pads through the lead wires. Then, the chip, the heat dissipation pad and a part of the conductive pad are coated by the sealant material, and at least the space near the chip and the wire is filled up to complete the packaging of the chip, and the packaged chip can be electrically connected with the external component through the conductive pad.

However, the conventional semiconductor package structure in the market has a single functionality, and the conventional chip is bonded to the heat dissipation pad by using silver paste, and the silver paste is cured by baking to fix the chip on the heat dissipation pad, so that the conventional chip has the use cost of silver paste, is time-consuming and labor-consuming, and once cured, the chip is difficult to detach the heat dissipation pad, and only the chip and the heat dissipation pad can be discarded when a chip failure occurs.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a semiconductor package structure to solve the problem that proposes among the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme: a semiconductor package structure, comprising:

a load bearing housing;

the top end surface of the heat dissipation welding disc is provided with a sinking groove, and the interior of the heat dissipation welding disc, which is positioned at two sides of the sinking groove, is provided with a driving cavity;

a chip;

the locking assembly comprises a rotating shaft and a transmission rod, a gear is fixedly mounted at the position, located inside the driving cavity, outside the rotating shaft, the top end of the rotating shaft extends to the outside of the radiating pad and is fixedly provided with an adjusting knob, a rack is fixedly mounted at the position, located inside the driving cavity, of the outer wall of the transmission rod, and one end of the transmission rod extends to the sinking groove and is fixedly provided with a locking plate;

the radiating welding disc is fixedly installed at the bottom end inside the bearing shell, the chip is embedded inside the sinking groove, and the rotating shaft and the transmission rod are respectively connected with the radiating welding disc in a rotating mode through the shaft sleeve.

Preferably, the method further comprises the following steps:

a glass plate;

the glass plate is fixedly mounted on the top end surface of the bearing shell through an adhesive.

Preferably, the bottom end of the interior of the bearing shell is fixedly provided with a plurality of conductive pads at the periphery of the heat dissipation pad, and the conductive pads are electrically connected with the chip through leads.

Preferably, one end of the transmission rod extends to the outer side of the heat dissipation welding disc and is fixedly provided with a limiting plate, and the inner wall surface of the heat dissipation welding disc is provided with a containing cavity matched with the locking plate.

Preferably, a rubber pad is adhered to the surface of one end of the locking plate.

Preferably, the gear is meshed with the rack.

Compared with the prior art, the beneficial effects of the utility model are that:

1. the utility model discloses a locking subassembly of installation, when in-service use, when installing the chip fixedly, the rotatory axis of rotation of accessible adjust knob, can drive the gear and rotate, when driving the gear and carrying out clockwise rotation, can pass through the transmission between gear and the rack, it removes to drive the transfer line, then can drive the lock plate through the transfer line and remove to chip department, the accessible lock plate is fixed the chip on the scattered hot plate, traditional silver thick liquid fixed not enough has been replaced, can make things convenient for the staff to dismantle the reorganization, with the reduction disability rate, therefore, the clothes hanger is very convenient, and has very good practicality.

Drawings

Fig. 1 is a schematic view of the overall structure of the present invention;

FIG. 2 is a schematic view of the internal structure of the present invention;

FIG. 3 is an enlarged schematic view of the structure A of the present invention;

fig. 4 is a schematic view of the gear and rack transmission structure of the present invention.

In the figure: 10-a load-bearing housing; 20-a glass plate; 30-a binder; 40-heat dissipation pads; 41-sinking a groove; 42-a drive chamber; 43-a receiving chamber; 50-chip; 60-a locking assembly; 61-a rotating shaft; 62-a transmission rod; 63-adjusting knob; 64-gear; 65-a limiting plate; 66-a locking plate; 67-rubber pad; 68-a rack; 70-a lead; 80-conductive pads.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-4, the present invention provides a technical solution: a semiconductor package structure, comprising: a carrier case 10, a heat sink 40, a chip 50, and a locking assembly 60.

In this embodiment, the bearing housing 10 is an open semi-closed structure.

The top end surface of the heat dissipation pad 40 is provided with a sinking groove 41, and the interior of the heat dissipation pad 40 at two sides of the sinking groove 41 is provided with a driving cavity 42.

The locking assembly 60 comprises a rotating shaft 61 and a transmission rod 62, a gear 64 is fixedly mounted at the position, located inside the driving chamber 42, outside the rotating shaft 61, the top end of the rotating shaft 61 extends to the outside of the heat dissipation pad 40 and is fixedly provided with an adjusting knob 63, a rack 68 is fixedly mounted at the position, located inside the driving chamber 42, on the outer wall of the transmission rod 62, and one end of the transmission rod 62 extends to the position of the sinking groove 41 and is fixedly provided with a locking plate 66.

In this embodiment, the gear 64 is engaged with the rack 68.

Further, when installing fixedly chip 50, accessible adjust knob 63 rotates axis of rotation 61, can drive gear 64 and rotate, when driving gear 64 and carry out clockwise rotation, can pass through the transmission between gear 64 and the rack 68, drive transfer line 62 and remove, then can drive locking plate 66 through transfer line 62 and locate to remove to chip 50, accessible locking plate 66 fixes chip 50 on heat dissipation pad 40, replaced the fixed not enough of traditional silver thick liquid, can make things convenient for the staff to dismantle the reorganization.

The heat dissipation pad 40 is fixedly installed at the bottom end inside the bearing housing 10, the chip 50 is embedded inside the sinking groove 41, and the rotating shaft 61 and the transmission rod 62 are respectively connected with the heat dissipation pad 40 through a shaft sleeve in a rotating manner.

Wherein, still include: a glass plate 20.

Further, the glass plate 20 can protect the chip 50.

Wherein, the glass plate 20 is fixedly mounted on the top surface of the bearing shell 10 by an adhesive 30.

In this embodiment, specifically, the adhesive 30 is epoxy resin.

The bottom end of the inside of the bearing shell 10 is fixedly provided with a plurality of conductive pads 80 at the periphery of the heat dissipation pad 40, and the conductive pads 80 are electrically connected with the chip 50 through leads 70.

One end of the transmission rod 62 extends to the outside of the heat dissipation pad 40 and is fixedly provided with a limit plate 65.

Further, the limit plate 65 prevents the driving rod 62 from coming off the discrete hot pad 40, ensuring the safety of the use of the device.

The inner wall surface of the heat dissipation pad 40 is provided with a receiving chamber 43 adapted to the locking plate 66.

Further, the latch plate 66 can be hidden within the receiving cavity 43 without affecting the normal mounting of the chip 50.

Wherein, a rubber pad 67 is adhered to one end surface of the locking plate 66.

Further, the rubber pad 67 can increase the frictional force between the lock plate 66 and the chip 50, thereby improving the locking effect of the lock plate 66.

The working principle is as follows: when installing fixedly to chip 50, accessible adjust knob 63 rotates axis of rotation 61, can drive gear 64 and rotate, when driving gear 64 and carry out clockwise rotation, can pass through the transmission between gear 64 and the rack 68, drive transfer line 62 and remove, then can drive locking plate 66 through transfer line 62 and remove to chip 50 department, accessible locking plate 66 fixes chip 50 on radiating pad 40, replaced the fixed not enough of traditional silver thick liquid, can make things convenient for the staff to dismantle the reorganization.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims (6)

1. A semiconductor package structure, comprising:

a load-bearing housing (10);

the heat dissipation welding disc (40) is provided with a sunk groove (41) on the top end surface of the heat dissipation welding disc (40), and a driving cavity (42) is formed in the heat dissipation welding disc (40) and is positioned on two sides of the sunk groove (41);

a chip (50);

the locking assembly (60) comprises a rotating shaft (61) and a transmission rod (62), a gear (64) is fixedly mounted at the position, located inside the driving chamber (42), outside the rotating shaft (61), the top end of the rotating shaft (61) extends to the outside of the heat dissipation disk (40) and is fixedly provided with an adjusting knob (63), a rack (68) is fixedly mounted at the position, located inside the driving chamber (42), on the outer wall of the transmission rod (62), one end of the transmission rod (62) extends to the position of the sinking groove (41) and is fixedly provided with a locking plate (66);

the radiating pad (40) is fixedly arranged at the bottom end inside the bearing shell (10), the chip (50) is embedded inside the sinking groove (41), and the rotating shaft (61) and the transmission rod (62) are respectively in rotating connection with the radiating pad (40) through shaft sleeves.

2. The semiconductor package structure of claim 1, wherein: further comprising:

a glass plate (20);

wherein the glass plate (20) is fixedly arranged on the top end surface of the bearing shell (10) through an adhesive (30).

3. The semiconductor package structure of claim 1, wherein: the bottom end in the bearing shell (10) is fixedly provided with a conductive pad (80) at the periphery of the radiating pad (40), the conductive pads (80) are provided with a plurality of conductive pads, and the conductive pads (80) are electrically connected with the chip (50) through leads (70).

4. The semiconductor package structure of claim 1, wherein: the driving rod (62) is connected with the heat dissipation welding disc (40) through a connecting rod, one end of the driving rod (62) extends to the outer side of the heat dissipation welding disc (40) and is fixedly provided with a limiting plate (65), and the inner wall surface of the heat dissipation welding disc (40) is provided with a containing cavity (43) matched with the locking plate (66).

5. The semiconductor package structure of claim 1, wherein: a rubber pad (67) is adhered to one end surface of the locking plate (66).

6. The semiconductor package structure of claim 1, wherein: the gear (64) is meshed with the rack (68).

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