CN214753666U - 部件取放贴合系统 - Google Patents
部件取放贴合系统 Download PDFInfo
- Publication number
- CN214753666U CN214753666U CN202120768313.7U CN202120768313U CN214753666U CN 214753666 U CN214753666 U CN 214753666U CN 202120768313 U CN202120768313 U CN 202120768313U CN 214753666 U CN214753666 U CN 214753666U
- Authority
- CN
- China
- Prior art keywords
- substrate
- component
- pick
- observation
- unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000012545 processing Methods 0.000 claims abstract description 17
- 239000000758 substrate Substances 0.000 claims description 159
- 230000003044 adaptive effect Effects 0.000 claims description 4
- 230000007246 mechanism Effects 0.000 claims description 2
- 238000010030 laminating Methods 0.000 abstract description 10
- 101100480513 Caenorhabditis elegans tag-52 gene Proteins 0.000 description 8
- 101100480514 Caenorhabditis elegans tag-53 gene Proteins 0.000 description 8
- 238000010586 diagram Methods 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- 239000004065 semiconductor Substances 0.000 description 5
- 101100108293 Caenorhabditis elegans aex-4 gene Proteins 0.000 description 4
- 239000000470 constituent Substances 0.000 description 3
- 238000013459 approach Methods 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 238000012858 packaging process Methods 0.000 description 2
- 230000008859 change Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000005693 optoelectronics Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Images
Landscapes
- Supply And Installment Of Electrical Components (AREA)
Abstract
Description
Claims (7)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202120768313.7U CN214753666U (zh) | 2021-04-15 | 2021-04-15 | 部件取放贴合系统 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202120768313.7U CN214753666U (zh) | 2021-04-15 | 2021-04-15 | 部件取放贴合系统 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN214753666U true CN214753666U (zh) | 2021-11-16 |
Family
ID=78603271
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202120768313.7U Active CN214753666U (zh) | 2021-04-15 | 2021-04-15 | 部件取放贴合系统 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN214753666U (zh) |
-
2021
- 2021-04-15 CN CN202120768313.7U patent/CN214753666U/zh active Active
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP3425661B1 (en) | Chip bonding apparatus and method | |
CN108807224B (zh) | 用于将部件安装在基板上的设备和方法 | |
KR101353685B1 (ko) | 다이 본더 및 반도체 제조 방법 | |
KR101503556B1 (ko) | 웨이퍼 테이블로부터 반도체 칩을 픽업하는 방법 및 반도체 칩을 기판에 장착하는 방법 | |
KR102132094B1 (ko) | 전자 부품 실장 장치 및 전자 부품 실장 방법 | |
CN210429751U (zh) | 半导体器件贴片装置及用于对准多个半导体器件的机构 | |
WO2009047214A2 (en) | Method for picking up semiconductor chips from a wafer table and mounting the removed semiconductor chips on a substrate | |
CN115036250A (zh) | 一种多功能贴片装置及其贴片方法 | |
CN214753666U (zh) | 部件取放贴合系统 | |
US6892447B1 (en) | Chip mounting device | |
US20100314050A1 (en) | Die bonder providing a large bonding force | |
KR20190110026A (ko) | 다이 본딩 장치 및 반도체 장치의 제조 방법 | |
CN212461620U (zh) | 高精度智能共晶贴装设备 | |
TWM615965U (zh) | 部件取放貼合系統 | |
JPH06510639A (ja) | ボンディングによって結合される基板をスタックする方法及び装置 | |
US20040245319A1 (en) | Substrate alignment method and apparatus | |
CN115223885A (zh) | 部件取放贴合系统及其方法 | |
TWI807304B (zh) | 部件取放貼合系統及其方法 | |
US20220181181A1 (en) | Semiconductor manufacturing apparatus, method of reading position of carrier, and method of attaching semiconductor die on carrier using semiconductor manufacturing apparatus | |
CN113199135B (zh) | 一种sic晶圆隐形加工方法 | |
CN112867386B (zh) | 自动贴片装置及其吸嘴和自动贴片方法 | |
KR20070047575A (ko) | 다이 본딩 장치 | |
US20020198610A1 (en) | Apparatus for picking and placing small objects | |
CN110176411B (zh) | 安装装置及半导体器件的制造方法 | |
CN112992704A (zh) | 具有芯片固持器运动台的芯片键合头设备 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
GR01 | Patent grant | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20230116 Address after: 1-2 Zhongshan Road, Tucheng District, Xinbei City, Taiwan, China, China Patentee after: Gaoke Jingjie Automation Co.,Ltd. Address before: Taiwan, Taipei, China Patentee before: Yifu Co.,Ltd. |
|
CP01 | Change in the name or title of a patent holder | ||
CP01 | Change in the name or title of a patent holder |
Address after: 1-2 Zhongshan Road, Tucheng District, Xinbei City, Taiwan, China, China Patentee after: Kulisuofa High Tech Co.,Ltd. Address before: 1-2 Zhongshan Road, Tucheng District, Xinbei City, Taiwan, China, China Patentee before: Gaoke Jingjie Automation Co.,Ltd. |