CN214735541U - High-temperature-resistant hot-melt pressure-sensitive adhesive - Google Patents
High-temperature-resistant hot-melt pressure-sensitive adhesive Download PDFInfo
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- CN214735541U CN214735541U CN202022558093.3U CN202022558093U CN214735541U CN 214735541 U CN214735541 U CN 214735541U CN 202022558093 U CN202022558093 U CN 202022558093U CN 214735541 U CN214735541 U CN 214735541U
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Abstract
The utility model discloses a high temperature resistant hot melt pressure sensitive adhesive, include from the type layer, outwards be equipped with first gluing layer, second gluing layer and third gluing layer in proper order from the type layer. The first adhesive layer and the third adhesive layer are rubber adhesive layers, the second adhesive layer is a polyurethane adhesive layer, and the release layer is silicon-based release paper. The high-temperature-resistant hot-melt pressure-sensitive adhesive is preferably prepared from a rubber adhesive layer, a polyurethane adhesive layer, silicon release paper and the like, and the rubber adhesive and the polyurethane adhesive are mixed for use, so that the compatibility of the two adhesives enables the two adhesives to have good removability.
Description
Technical Field
The utility model belongs to the technical field of the sticky tape technique and specifically relates to a high temperature resistant hot melt pressure sensitive adhesive is related to.
Background
In the prior art, most of electronic products, such as batteries and screens in notebook computers and mobile phones, are fixed by removable adhesive tapes. Most of the existing removable adhesive tapes are mainly solvent-based, so that the performance cannot be improved more, and the environment pollution is larger. The existing removable adhesive tapes are mostly solvent type adhesive tapes and a small part of hot melt adhesive tapes, and the use of the products has the following defects:
1. the pollution is large, the environment is not protected, a large amount of polluted waste gas can be generated in the production process of the solvent-based adhesive tape, and the finished product also contains volatile gas.
2. The temperature resistance is poor, and the existing solvent adhesive tape and hot melt adhesive tape can not meet the requirements of the existing new technology on the temperature resistance.
3. The reworkability is poor, and after the battery or the screen is fixed, if the screen needs to be disassembled, the screen is easy to break when the adhesive tape is removed.
Therefore, a product which can meet the requirements of environmental protection and use requirements is needed.
SUMMERY OF THE UTILITY MODEL
The utility model discloses not enough to among the prior art, this high temperature resistant hot melt pressure sensitive adhesive is preferred adopts rubber adhesive layer, polyurethane adhesive layer, silicon system to form from preparation such as type paper, and two kinds of adhesives of rubber adhesive, polyurethane adhesive mixed use, and its compatibility makes the removable characteristic that has that it can be fine.
In order to solve the technical problem, the utility model discloses a following technical scheme can solve: the utility model provides a high temperature resistant hot melt pressure sensitive adhesive, includes from the type layer, outwards is equipped with first gluing layer, second gluing layer and third gluing layer in proper order from the type layer, first gluing layer with third gluing layer is the rubber adhesive layer, the second gluing layer is the polyurethane adhesive layer.
Further preferably, the first adhesive layer and the third adhesive layer are one of an acrylic adhesive layer, a rubber adhesive layer and a polyurethane adhesive layer.
Preferably, the second adhesive layer is one of a rubber adhesive layer and a polyurethane adhesive layer.
Further preferably, the release layer is one of a silicon-based release film, silicon-based release paper and a non-silicon release film.
Further preferably, the first adhesive layer and the third adhesive layer are rubber adhesive layers, and the thickness of the first adhesive layer and the third adhesive layer is 50-300 μm.
Further preferably, the second adhesive layer is a polyurethane adhesive layer, and the thickness of the second adhesive layer is 20-100 μm.
Further preferably, the release layer is silicon-based release paper, and the thickness of the release layer is 60-140 μm.
The beneficial effects of the utility model reside in that: 1. the high-temperature-resistant hot-melt pressure-sensitive adhesive is preferably prepared from a rubber adhesive layer, a polyurethane adhesive layer, silicon release paper and the like, and the rubber adhesive and the polyurethane adhesive are mixed for use, so that the compatibility of the two adhesives enables the two adhesives to have good removability. 2. And various thickness specifications are provided for the customer to correspondingly provide.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required to be used in the description of the embodiments or the prior art will be discussed below, it is obvious that the technical solutions described in conjunction with the drawings are only some embodiments of the present invention, and for those skilled in the art, other embodiments and drawings can be obtained according to the embodiments shown in the drawings without creative efforts.
Fig. 1 is a schematic structural diagram of the high temperature resistant hot melt pressure sensitive adhesive of the present invention.
In the figure: first gluing layer 1, second gluing layer 2, third gluing layer 3, from type layer 4.
Detailed Description
The technical solutions of the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings, and it is to be understood that the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments described in the present disclosure, all other embodiments obtained by a person skilled in the art without creative efforts are within the scope of the present disclosure.
The embodiment of the utility model provides a high temperature resistant hot melt pressure sensitive adhesive, include from type layer 4, outwards be equipped with first gluing layer 1, second gluing layer 2 and third gluing layer 3 in proper order from type layer 4.
The first adhesive layer 1 and the third adhesive layer 3 are one of an acrylic adhesive layer, a rubber adhesive layer and a polyurethane adhesive layer.
The second adhesive layer 2 is one of a rubber adhesive layer and a polyurethane adhesive layer.
The release layer 4 is one of a silicon-based release film, silicon-based release paper and a non-silicon release film.
The first adhesive layer 1 and the third adhesive layer 3 are rubber adhesive layers, and the thickness of the rubber adhesive layers is 50-300 mu m.
The second adhesive layer 2 is a polyurethane adhesive layer, and the thickness of the second adhesive layer is 20-100 μm.
The release layer 4 is silicon-based release paper with a thickness of 60-140 μm.
The utility model discloses a preparation is carried out to following technology: putting the prepared rubber adhesive which is preferred into a hot melt adhesive machine, coating the rubber adhesive and the release layer 4 which is preferred to be silicon release paper in a slit extrusion mode, drying and rolling to obtain a first adhesive layer 1;
coating the prepared first adhesive layer 1 with a prepared polyurethane adhesive preferably in a slit extrusion mode of a hot melt adhesive, drying and rolling to prepare a second adhesive layer 2;
and coating the prepared second adhesive layer 2 with a prepared preferable rubber adhesive in a slit extrusion mode of a hot melt adhesive machine, drying and rolling to obtain the third adhesive layer 3. Thereby completing the preparation of the high-temperature-resistant hot-melt pressure-sensitive adhesive.
It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive. The scope of the invention is indicated by the appended claims, rather than the foregoing description, and all changes that come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (5)
1. The utility model provides a high temperature resistant hot melt pressure sensitive adhesive, includes from the type layer, its characterized in that: outwards be equipped with first gluing layer, second gluing layer and third gluing layer in proper order from the type layer, first gluing layer with the third gluing layer is the rubber adhesive layer, the second gluing layer is the polyurethane adhesive layer.
2. The high temperature resistant hot melt pressure sensitive adhesive of claim 1, wherein: the release layer is one of a silicon-based release film, silicon-based release paper and a non-silicon release film.
3. The high temperature resistant hot melt pressure sensitive adhesive of claim 2, wherein: the thickness of the first adhesive layer and the third adhesive layer is 50-300 μm.
4. The high temperature resistant hot melt pressure sensitive adhesive of claim 3, wherein: the thickness of the second adhesive layer is 20-100 μm.
5. The high temperature resistant hot melt pressure sensitive adhesive of claim 4, wherein: the release layer is silicon-based release paper with a thickness of 60-140 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022558093.3U CN214735541U (en) | 2020-11-09 | 2020-11-09 | High-temperature-resistant hot-melt pressure-sensitive adhesive |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022558093.3U CN214735541U (en) | 2020-11-09 | 2020-11-09 | High-temperature-resistant hot-melt pressure-sensitive adhesive |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214735541U true CN214735541U (en) | 2021-11-16 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022558093.3U Active CN214735541U (en) | 2020-11-09 | 2020-11-09 | High-temperature-resistant hot-melt pressure-sensitive adhesive |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214735541U (en) |
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2020
- 2020-11-09 CN CN202022558093.3U patent/CN214735541U/en active Active
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