CN214722904U

CN214722904U - Wafer end grinds frock

Info

Publication number: CN214722904U
Application number: CN202121265757.5U
Authority: CN
Inventors: 李健儿; 冯永; 张正; 胡仲波; 鲜贵容
Original assignee: Sichuan Shangte Technology Co ltd
Current assignee: Sichuan Shangte Technology Co ltd
Priority date: 2021-06-08
Filing date: 2021-06-08
Publication date: 2021-11-16
Anticipated expiration: 2031-06-08

Abstract

A wafer end grinding tool comprises: the end grinding device comprises a base plate, an adjusting component and an end grinding component, wherein the adjusting component is arranged at one end of the base plate, the end grinding component is arranged on the base plate, and the adjusting component and the end grinding component are matched with each other and used for polishing the end face of a wafer. The utility model discloses in wafer processing, can polish the operation to the terminal surface of wafer, improve the quality of wafer terminal surface polishing and the effect of polishing, can avoid external dust to cause the influence to the polishing of wafer simultaneously, have stronger practicality.

Description

Wafer end grinds frock

Technical Field

The utility model relates to a wafer processing equipment correlation technique field especially relates to a wafer end grinds frock.

Background

With the continuous development of integrated circuit manufacturing technology, the chip feature size is smaller and smaller, the number of interconnection layers is larger and larger, and the diameter of a wafer is also increased. To realize multilayer wiring, the wafer surface must have extremely high flatness, smoothness and cleanliness, and therefore polishing of the wafer end face is required.

The existing device has the defects that the polishing efficiency is low when the end face of the wafer is polished, the polishing process is easily influenced by external dust particles, and the end face of the wafer is low in finish degree after polishing is finished, so that the processing efficiency of the wafer is influenced.

SUMMERY OF THE UTILITY MODEL

The utility model provides a frock is ground to wafer end to solve the not enough of above-mentioned prior art, in wafer processing, can polish the operation to the terminal surface of wafer, improved the quality of wafer terminal surface polishing and the effect of polishing, can avoid external dust to cause the influence to the polishing of wafer simultaneously, have stronger practicality.

In order to realize the purpose of the utility model, the following technologies are adopted:

a wafer end grinding tool comprises:

a bottom plate, a plurality of first connecting plates,

the adjusting component is arranged at one end of the bottom plate;

end grinds subassembly, locate the bottom plate, including installing in the drive bearing frame of bottom plate one end, driving motor is installed to the drive bearing frame, driving motor's output shaft has the drive wheel, the drive wheel cover is equipped with the driving band, the other end of driving band is equipped with from the driving wheel, the fixed chassis is installed to the bottom plate, fixed chassis upwards extends and installs the bracing piece with being the circumference array, the upper end of bracing piece is equipped with the hanging wall, the ring gear is installed to the upper end of hanging wall, the upper end from the driving wheel is connected with the centre wheel, the centre wheel is that the meshing of circumference array ground has a plurality of planet wheel, the planet wheel lower extreme is equipped with the connecting piece, the planet wheel all meshes in the ring gear, the upper end of planet wheel has been offered with the circumference array ground and has been placed the circular slot, the wafer is arranged in and is placed the circular slot.

Further, the adjusting part is including installing in a pair of overhanging bottom plate of bottom plate one end, and a pair of regulation bearing frame is all installed upwards extending at the both ends of overhanging bottom plate, and every is all equipped with four guide bars between every to the regulation bearing frame, and the regulation bearing frame that is located the outside end all installs accommodate motor, and accommodate motor's output shaft all is connected with accommodate the lead screw, and accommodate the lead screw all has adjusted the seat soon, adjusts the upper end of seat and installs the motion upper plate, and the motion upper plate is equipped with lift adjustment mechanism.

Further, lift adjustment mechanism is including installing in the lift cylinder of motion upper plate, and lift adjustment plate is installed to the expansion end of lift cylinder, and lift adjustment plate's both sides are equipped with a pair of pterygoid lamina, and the pterygoid lamina all is equipped with downwardly extending and inserts the post, inserts the post and all wears in the motion upper plate, and lift adjustment plate's the other end is equipped with the disc.

Further, the lower wall of the disc is provided with polishing flannelette.

The technical scheme has the advantages that:

the utility model discloses in wafer processing, can polish the operation to the terminal surface of wafer, improve the quality of wafer terminal surface polishing and the effect of polishing, can avoid external dust to cause the influence to the polishing of wafer simultaneously, have stronger practicality.

Drawings

Fig. 1 shows a perspective view of a first embodiment.

Fig. 2 shows a perspective view of the second embodiment.

Fig. 3 shows a three-dimensional structure of one embodiment.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention, as generally described and illustrated in the figures herein, may be arranged and designed in a wide variety of different configurations.

Thus, the following detailed description of the embodiments of the present invention, presented in the accompanying drawings, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.

In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. indicate the position or positional relationship based on the position or positional relationship shown in the drawings, or the position or positional relationship which is usually placed when the products of the present invention are used, and are only for convenience of describing the present invention and simplifying the description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention.

The terms "first," "second," and the like are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance.

The terms "parallel", "perpendicular", etc. do not require that the components be absolutely parallel or perpendicular, but may be slightly inclined. For example, "parallel" merely means that the directions are more parallel relative to "perpendicular," and does not mean that the structures are necessarily perfectly parallel, but may be slightly tilted.

Furthermore, the terms "substantially", and the like are intended to indicate that the relative terms are not necessarily strictly required, but may have some deviation. For example: "substantially equal" does not mean absolute equality, but because absolute equality is difficult to achieve in actual production and operation, certain deviations generally exist. Thus, in addition to absolute equality, "substantially equal" also includes the above-described case where there is some deviation. In this case, unless otherwise specified, terms such as "substantially", and the like are used in a similar manner to those described above.

In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

As shown in fig. 1-3, a wafer end grinding tool includes: a bottom plate 1, an adjusting component 2 and an end mill component 3. The adjusting component 2 and the end grinding component 3 are matched with each other for polishing the end face of the wafer.

And the adjusting component 2 is arranged at one end of the bottom plate 1. It is including installing in a pair of overhanging bottom plate 20 of 1 one end of bottom plate, a pair of regulation bearing frame 21 is all installed upwards extending at the both ends of overhanging bottom plate 20, every is every all to be equipped with four guide bars 22 between the regulation bearing frame 21, the regulation bearing frame 21 that is located the outside end all installs accommodate motor 23, accommodate motor 23's output shaft all is connected with accommodate screw 24, accommodate screw 24 all has adjusted the seat 25 soon, adjust the upper end of seat 25 and install motion upper plate 26, motion upper plate 26 is equipped with lift adjustment mechanism. The lifting adjusting mechanism comprises a lifting cylinder 27 mounted on the moving upper plate 26, a lifting adjusting plate 28 is mounted at the movable end of the lifting cylinder 27, a pair of wing plates 29 are arranged on two sides of the lifting adjusting plate 28, inserting columns 290 are arranged on the wing plates 29 in a downward extending mode, the inserting columns 290 penetrate through the moving upper plate 26, and a disc 291 is arranged at the other end of the lifting adjusting plate 28. The lower wall of the disc 291 is provided with a polishing fleece.

End grinds subassembly 3, locate bottom plate 1, including installing in the drive bearing frame 30 of bottom plate 1 one end, drive motor 31 is installed to drive bearing frame 30, drive motor 31's output shaft has drive wheel 32, drive wheel 32 cover is equipped with driving band 33, the other end of driving band 33 is equipped with from the driving wheel, bottom plate 1 installs fixed chassis 34, fixed chassis 34 upwards extends and installs bracing piece 35 in the circumference array, the upper end of bracing piece 35 is equipped with hanging wall 36, ring gear 37 is installed to hanging wall 36's upper end, the upper end of following wheel is connected with centre wheel 38, centre wheel 38 meshes a plurality of planet wheel 39 in the circumference array ground, planet wheel 39 lower extreme is equipped with the connecting piece, planet wheel 39 all meshes in ring gear 37, the upper end of planet wheel 39 has been seted up in the circumference array ground and has been placed circular slot 390, the wafer is placed in placing circular slot 390.

The device carries out grinding and polishing operation on the end face of the wafer through the bottom plate 1, the adjusting assembly 2 and the end grinding assembly 3 according to the problems in the prior art. Wherein adjusting part 2 can adjust the polishing cloth and move, and close in the lid of end mill subassembly 3 upper end, thereby avoid external dust to cause the influence to the grinding and polishing effect of wafer dish in the operation of grinding and polishing, simultaneously in order to realize the degree of automation of wafer terminal surface grinding and polishing, consequently set up corresponding polishing cream and polish liquid automatic control system on adjusting part 2, carry out the control of polishing process through this system, end mill subassembly 3 can drive the wafer dish and rotate, when the wafer dish rotates, will accomplish the operation of grinding and polishing of wafer terminal surface through adjusting part 2.

Specifically, when the adjusting assembly 2 drives the main components of the polishing machine to move, the adjusting motor 23 is started, the adjusting screw rod 24 is driven by the adjusting motor 23 to rotate, the adjusting screw rod 24 rotates to drive the adjusting seat 25 to move along the axial direction of the guide rod 22, the adjusting seat 25 moves to adjust the position of the disc 291, and finally the disc 291 is located right above the gear ring 37, and the stability of the disc 291 can be ensured by the adoption of the transmission mode of the adjusting screw rod 24. When disc 291 moves to right above end grinding assembly 3, lift cylinder 27 is started, lift adjusting plate 28 carries out lifting movement under lift cylinder 27's drive, and the setting of inserting column 290 can avoid the wafer to rock when the terminal surface, and lift adjusting plate 28 is when the downstream for the terminal surface contact of polishing flannelette and wafer, then start end grinding assembly 3, then control the flow of polishing cream and polishing solution through polishing cream and polishing solution automatic control system, until the end grinding operation is accomplished.

Specifically, when end grinds subassembly 3 and drives the wafer and rotate, start driving motor 31, drive wheel 32 rotates under driving motor 31's drive, and the rotation of drive wheel 32 will drive the rotation from the driving wheel through driving band 33, and the rotation from the driving wheel will drive each planet wheel 39 and rotate round the axial of ring gear 37, and simultaneously, each lower extreme carries out the rotation through planet wheel 39 that the connecting piece is connected to together, and this kind of rotation mode of planet wheel 39 can ensure the quick completion end of wafer and grinds the operation, wherein place placing of circular slot 390 can carry out the wafer dish, and the degree of depth of placing circular slot 390 is less than the thickness of wafer dish, fix a position the wafer dish through placing circular slot 390, and this kind of mode makes things convenient for taking out of wafer dish.

The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and it is obvious that those skilled in the art can make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims and their equivalents, the present invention is also intended to include such modifications and variations.

Claims

1. The utility model provides a wafer end grinds frock which characterized in that includes:

a bottom plate (1),

the adjusting component (2) is arranged at one end of the bottom plate (1);

an end grinding assembly (3) arranged on the base plate (1) and comprising a driving bearing seat (30) arranged at one end of the base plate (1), a driving motor (31) is arranged on the driving bearing seat (30), an output shaft of the driving motor (31) is connected with a driving wheel (32), the driving wheel (32) is sleeved with a driving belt (33), the other end of the driving belt (33) is provided with a driven wheel, a fixed chassis (34) is arranged on the base plate (1), the fixed chassis (34) extends upwards and is provided with supporting rods (35) in a circumferential array manner, an upper disc (36) is arranged at the upper end of each supporting rod (35), a gear ring (37) is arranged at the upper end of each upper disc (36), the upper end of each driven wheel is connected with a central wheel (38), the central wheel (38) is meshed with a plurality of planet wheels (39) in a circumferential array manner, connecting pieces are arranged at the lower ends of the planet wheels (39) and are all meshed with the gear ring (37), the upper end of the planet wheel (39) is provided with circular placing grooves (390) in a circumferential array, and the wafer is placed in the circular placing grooves (390).

2. The wafer end grinding tool according to claim 1, wherein the adjusting assembly (2) comprises a pair of overhanging bottom plates (20) installed at one end of the bottom plate (1), a pair of adjusting bearing seats (21) are installed at two ends of the overhanging bottom plates (20) in an upward extending mode, four guide rods (22) are arranged between each pair of adjusting bearing seats (21), adjusting motors (23) are installed on the adjusting bearing seats (21) located at the outer ends, output shafts of the adjusting motors (23) are connected with adjusting screw rods (24), the adjusting screw rods (24) are respectively screwed with adjusting seats (25), a moving upper plate (26) is installed at the upper ends of the adjusting seats (25), and lifting adjusting mechanisms are arranged on the moving upper plate (26).

3. The wafer end grinding tool according to claim 2, wherein the lifting adjusting mechanism comprises a lifting cylinder (27) mounted on the moving upper plate (26), a lifting adjusting plate (28) is mounted at the movable end of the lifting cylinder (27), a pair of wing plates (29) are arranged on two sides of the lifting adjusting plate (28), each wing plate (29) is provided with an inserting column (290) in a downward extending manner, each inserting column (290) penetrates through the moving upper plate (26), and a disc (291) is arranged at the other end of the lifting adjusting plate (28).

4. The wafer end grinding tool according to claim 3, characterized in that the lower wall of the disc (291) is provided with polishing cloth.