CN214721479U - Crystal bar and wafer positioning device based on laser marking machine - Google Patents
Crystal bar and wafer positioning device based on laser marking machine Download PDFInfo
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- CN214721479U CN214721479U CN202120633389.9U CN202120633389U CN214721479U CN 214721479 U CN214721479 U CN 214721479U CN 202120633389 U CN202120633389 U CN 202120633389U CN 214721479 U CN214721479 U CN 214721479U
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- 239000013078 crystal Substances 0.000 title claims abstract description 39
- 238000010330 laser marking Methods 0.000 title claims abstract description 26
- 238000005303 weighing Methods 0.000 claims abstract description 28
- 230000002457 bidirectional effect Effects 0.000 claims description 30
- 238000009434 installation Methods 0.000 claims description 5
- 235000012431 wafers Nutrition 0.000 abstract description 38
- 239000002699 waste material Substances 0.000 abstract description 3
- 238000000034 method Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
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Abstract
The invention provides a crystal bar and wafer positioning device based on a laser marking machine, which comprises a bottom plate, a weighing component, an adjusting component, a clamping component, a marking component and a positioning component, wherein the weighing component is arranged on the bottom plate, the adjusting component is arranged on the weighing component, the clamping component comprises two clamping units, the two clamping units are both arranged on the adjusting component, the marking component is arranged on the bottom plate, the positioning component is arranged between the marking component and the adjusting component, the marking component comprises a laser head, and the output end of the laser head faces towards the clamping component. The crystal bar and wafer positioning device based on the laser marking machine solves the problems that the laser head of the existing laser marking technology for crystal bars, wafers and wafer baskets wastes time and labor when being aligned with the crystal bars and wafers, and the efficiency is low.
Description
Technical Field
The invention belongs to the technical field of semiconductors, and particularly relates to a crystal bar and wafer positioning device based on a laser marking machine.
Background
In the semiconductor processing field, the manual work is placed bar, wafer and piece basket and is beaten mark below the laser marking head and beat the mark, needs the manual work to drag the laser head and aim at the back and beat the mark, wastes time and energy, and work efficiency is low, consequently will carry out bar, wafer, piece basket fast, mark after the semi-automatic positioner of design needs to beat the mark. In the prior art, a method for positioning a crystal bar, a wafer and a wafer basket generally comprises the following steps: the crystal bar, the wafer and the wafer basket are manually placed below the laser head, and the laser head is manually moved to mark after alignment. The prior laser head of the laser marking technology of crystal bars, wafers and wafer baskets is time-consuming and labor-consuming when being aligned with the crystal bars and the wafers (focal length), and has low efficiency.
Disclosure of Invention
In view of this, the invention provides a laser marking machine-based crystal bar and wafer positioning device to solve the problems of time and labor waste and low efficiency when the laser head is aligned with the crystal bar and the wafer in the existing crystal bar, wafer and wafer basket laser marking technology.
In order to achieve the purpose, the technical scheme of the invention is realized as follows:
the utility model provides a crystal bar and wafer positioner based on laser marking machine, comprising a base plate, the subassembly of weighing, the adjusting part, the centre gripping subassembly, beat the mark subassembly, locating component, the subassembly of weighing is installed on the bottom plate, the adjusting part is installed on the subassembly of weighing, the centre gripping subassembly includes two centre gripping units, two centre gripping units are all installed on the adjusting part, it installs on the bottom plate to beat the mark subassembly, locating component installs on the bottom plate, locating component sets up and beats between mark subassembly and the adjusting part, it includes the laser head to beat the mark subassembly, the output of laser head sets up towards the centre gripping subassembly.
Further, the weighing component comprises a weighing instrument body, the weighing instrument body is installed on the bottom plate, a mounting plate is fixed to the top of the weighing instrument body, and the adjusting component is installed on the mounting plate.
Further, the adjusting assembly comprises a bidirectional screw rod, two bearing seats and two sliding blocks, the bearing seats penetrate through two ends of the bidirectional screw rod, the bearing seats are fixed on the mounting plate, the two sliding blocks are provided with threaded holes corresponding to the bidirectional screw rod, the two sliding blocks are arranged at two ends of the bidirectional screw rod and are in threaded connection with the bidirectional screw rod, and each sliding block is fixedly provided with a clamping unit.
Further, two-way lead screw both sides still are equipped with linear guide, and linear guide passes through the installed part and installs on the mounting panel, and the centre gripping unit bottom is fixed with the slider that corresponds with linear guide, and the slider overlaps on linear guide through the through-hole of reserving.
Furthermore, a handle is further installed at one end of the bidirectional screw rod.
Furthermore, a piece basket positioning bottom plate is further arranged on the bidirectional screw rod between the two clamping units, mounting pieces corresponding to the bidirectional screw rod and the linear guide rail are fixed at the bottom of the piece basket positioning bottom plate, and the piece basket positioning bottom plate is mounted on the bidirectional screw rod and the linear guide rail through the mounting pieces.
Further, the centre gripping unit includes sliding plate, gyro wheel, slope mounting bar, and the sliding plate is fixed on the slider, and the slope mounting bar is fixed on the sliding plate, and the slope mounting bar on two sliding plates sets up relatively, and the rake of two slope mounting bars sets up back to the back, and the gyro wheel has a plurality ofly, and a plurality of gyro wheels are all installed on the rake of slope mounting bar through the installation axle.
Furthermore, one side of one of the sliding plates, which is far away from the standard reaching component, is also provided with a pointer, and the weighing component is provided with a scale which is aligned with the pointer and can be used for indicating the energy.
Furthermore, the marking assembly also comprises two U-shaped parts, an upper clamping block, a lower clamping block and vertical plates, the bottoms of the two vertical plates are fixed on the bottom plate, the upper part of each vertical plate is fixed with one U-shaped part, the lower clamping block is arranged in the U-shaped part, the upper clamping block and the lower clamping block are respectively provided with a groove corresponding to the laser head, both ends of the upper clamping block and the lower clamping block are respectively provided with a threaded hole, a screw passes through the upper clamping block through the threaded hole and extends into the threaded hole of the lower clamping block, and the laser head is arranged between the upper clamping block and the lower clamping block.
Furthermore, locating component includes the mounting bracket, the apron, fastening screw, one side that adjusting component was kept away from to the mounting bracket is fixed with the guide arm, it has the through-hole that corresponds with the guide arm to open on the apron, the guide arm runs through in through-hole and apron sliding connection, fastening screw tip passes through the bearing and is connected with the mounting bracket rotation, it has the screw hole that corresponds with fastening screw to open on the apron, fastening screw runs through in screw hole and apron threaded connection, one side that the mounting bracket is close to the apron is opened has the recess that is used for placing the wafer.
Compared with the prior art, the invention has the following beneficial effects:
(1) the crystal bar and wafer positioning device based on the laser marking machine effectively solves the problem of inaccurate manual marking position through the adjusting assembly, the clamping assembly and the positioning assembly, is more time-saving and labor-saving, and improves the working efficiency.
(2) The pointer is convenient for the interval between two clamping units of audio-visual understanding, is convenient for to clamping the subassembly and adjusts.
(3) The height of the laser head can be adjusted by adjusting the relative position of the upper clamping block and the U-shaped piece.
(4) The gyro wheel does not cause wearing and tearing to the crystal bar when can step up the crystal bar, and piece basket locating plate can fix a position the piece basket, and the practicality is higher.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and, together with the description, serve to explain the invention without limitation. In the drawings:
FIG. 1 is a schematic view illustrating an installation of a laser marking machine-based crystal bar and wafer positioning device according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of a laser marking machine-based crystal bar and wafer positioning device according to an embodiment of the present invention;
FIG. 3 is a schematic view of a marking assembly according to an embodiment of the present invention;
FIG. 4 is a schematic view of a positioning assembly according to an embodiment of the present invention;
fig. 5 is a schematic view of a wafer basket, a wafer and a crystal bar according to an embodiment of the present invention.
Description of reference numerals:
5. crystal bar; 6. wafer, 7, 8, weighing apparatus body; 9. mounting a plate; 10. a cam follower; 11. a sliding plate; 111. inclining the mounting bar; 12. a tablet basket positioning bottom plate; 13. a handle 1; 14. locking the bolt; 15. a bearing seat; 16. a bidirectional screw rod; 17. a slider; 18. a mounting member; 19. a linear guide rail; 20. a pointer; 21. a graduated scale; 22. a base plate; 23. a mounting frame; 24. a cover plate; 25. fastening screws; 26. a vertical plate; 27. a U-shaped member; 28. a lower clamping block; 29. an upper clamping block; 30. a tablet basket; 31. a wafer; 32. crystal bar; 33. and a strip-shaped through hole.
Detailed Description
It should be noted that the embodiments and features of the embodiments of the present invention may be combined with each other without conflict.
In the description of the present invention, it is to be understood that the terms "central," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in the orientation or positional relationship indicated in the drawings, which are merely for convenience in describing the invention and to simplify the description, and are not intended to indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and are therefore not to be construed as limiting the invention. Furthermore, the terms "first", "second", etc. are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first," "second," etc. may explicitly or implicitly include one or more of that feature. In the description of the invention, the meaning of "a plurality" is two or more unless otherwise specified.
In the description of the invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted", "connected" and "connected" are to be construed broadly, e.g. as being fixed or detachable or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the creation of the present invention can be understood by those of ordinary skill in the art through specific situations.
The invention will be described in detail with reference to the following embodiments with reference to the attached drawings.
As shown in fig. 1 and 2, a crystal bar 5 and wafer positioner based on laser marking machine, including bottom plate 22, the subassembly of weighing, the adjusting part, the centre gripping subassembly, mark the subassembly, the locating component, the subassembly of weighing is installed on bottom plate 22, the adjusting part is installed on the subassembly of weighing, the centre gripping subassembly includes two centre gripping units, two centre gripping units are all installed on the adjusting part, mark the subassembly and install on bottom plate 22, the locating component is installed on bottom plate 22, the locating component sets up between marking subassembly and adjusting component, mark the subassembly and include the laser head, the output of laser head sets up towards the centre gripping subassembly.
As shown in fig. 1 and 2, the weighing assembly comprises a weighing instrument body 8, the weighing instrument body 8 is installed on the bottom plate 22, a mounting plate is fixed on the top of the weighing instrument body 8, and the adjusting assembly is installed on the mounting plate.
As shown in fig. 1 and 2, the adjusting assembly comprises a bidirectional screw rod 16, bearing seats 15 and sliding blocks 17, the bearing seats 15 penetrate through two ends of the bidirectional screw rod, the bearing seats 15 are fixed on the mounting plate, the sliding blocks 17 are two, threaded holes corresponding to the bidirectional screw rod are formed in the two sliding blocks 17, the two sliding blocks 17 are arranged at two ends of the bidirectional screw rod and are connected with the bidirectional screw rod in a threaded manner, and a clamping unit is fixed on each sliding block 17.
As shown in fig. 1 and 2, linear guide rails 19 are further arranged on two sides of the bidirectional screw rod, the linear guide rails 19 are mounted on the mounting plate through mounting pieces 18, a sliding block 17 corresponding to the linear guide rails 19 is fixed at the bottom of the clamping unit, and the sliding block 17 is sleeved on the linear guide rails 19 through a reserved through hole.
As shown in fig. 1 and 2, a handle is further mounted at one end of the bidirectional screw rod.
As shown in fig. 1 and 2, a sheet basket positioning bottom plate 12 is further arranged on the bidirectional screw rod between the two clamping units, a mounting part 18 corresponding to the bidirectional screw rod and the linear guide rail 19 is fixed at the bottom of the sheet basket positioning bottom plate 12, and the sheet basket positioning bottom plate 12 is mounted on the bidirectional screw rod and the linear guide rail 19 through the mounting part 18.
As shown in fig. 1 and 2, the clamping unit includes a sliding plate 11, rollers, and inclined mounting bars 111, the sliding plate 11 is fixed on the sliding block 17, the inclined mounting bars 111 are fixed on the sliding plate 11, the inclined mounting bars 111 on the two sliding plates 11 are oppositely arranged, the inclined portions of the two inclined mounting bars 111 are oppositely arranged, the rollers are multiple, and the rollers are all mounted on the inclined portion of the inclined mounting bar 111 through mounting shafts.
As shown in fig. 2, a pointer 20 is further installed on one side of one of the sliding plates 11 away from the standard component, and a graduated scale 21 which is aligned with the pointer 20 and is energized is arranged on the weighing component. The pointer 20 facilitates visual understanding of the spacing between the two clamping units and facilitates adjustment of the clamping assembly.
As shown in fig. 3, the marking assembly further includes two U-shaped members, an upper clamping block, a lower clamping block, and vertical plates, the bottoms of the two vertical plates are fixed on the bottom plate 22, the upper portion of each vertical plate is fixed with one U-shaped member, the lower clamping block is disposed in the U-shaped member, the upper clamping block and the lower clamping block are respectively provided with a groove corresponding to the laser head, both ends of the upper clamping block and the lower clamping block are respectively provided with a threaded hole, a screw passes through the upper clamping block through the threaded hole and extends into the threaded hole of the lower clamping block, and the laser head is arranged between the upper clamping block and the lower clamping block. The height of the laser head can be adjusted by adjusting the relative position of the upper clamping block and the U-shaped piece.
As shown in fig. 4, the positioning assembly includes a mounting frame 23, a cover plate 24, and a fastening screw, a guide rod is fixed on one side of the mounting frame 23 away from the adjusting assembly, a through hole corresponding to the guide rod is formed in the cover plate 24, the guide rod penetrates through the through hole and is connected with the cover plate 24 in a sliding manner, an end portion of the fastening screw is connected with the mounting frame 23 in a rotating manner through a bearing, a threaded hole corresponding to the fastening screw is formed in the cover plate 24, the fastening screw penetrates through the threaded hole and is connected with the cover plate 24 in a threaded manner, and a groove for placing a wafer is formed in one side of the mounting frame 23 close to the cover plate 24.
A laser marking machine based crystal bar 5 and wafer positioning device operation comprises the following steps:
step 1: the two-way lead screw of twist grip rotation removes two rows of gyro wheels to the assigned position, puts into crystal bar 5, pushes away to contact with the dog, carries out laser marking (can compatible not crystal bar 5 of equidimension) to crystal bar 5.
Step 2: the two rows of rollers are manually moved in opposite directions, the chip basket positioning plate is clamped to the guide rail, and then the chip basket is placed into the guide rail for laser marking.
And step 3: and rotating the fastening screw to place the wafer in the groove of the positioning assembly, and then loosening the spring clamping block to position the wafer.
The gyro wheel does not cause wearing and tearing to crystal bar 5 when can step up crystal bar 5, and piece basket locating plate can fix a position the piece basket, and the practicality is higher.
The positioning device and the positioning method for the crystal bar 5, the wafer and the wafer basket based on the laser marking have the advantages that the positioning and marking of the crystal bar 5, the wafer and the wafer basket in various sizes can be realized, the problem of inaccurate manual marking position is effectively solved, time and labor are saved, and the working efficiency is improved.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and should not be taken as limiting the invention, so that any modifications, equivalents, improvements and the like, which are within the spirit and principle of the present invention, should be included in the scope of the present invention.
Claims (10)
1. The utility model provides a crystal bar and wafer positioner based on laser marking machine which characterized in that: including bottom plate (22), the subassembly of weighing, the adjusting part, the centre gripping subassembly, beat the mark subassembly, locating component, the subassembly of weighing is installed on bottom plate (22), the adjusting part is installed on the subassembly of weighing, the centre gripping subassembly includes two centre gripping units, two centre gripping units are all installed on the adjusting part, beat the mark subassembly and install on bottom plate (22), locating component installs on bottom plate (22), locating component sets up and beats between mark subassembly and the adjusting part, it includes the laser head to beat the mark subassembly, the output of laser head sets up towards the centre gripping subassembly.
2. The laser marking machine-based crystal bar and wafer positioning device of claim 1, wherein: the weighing component comprises a weighing instrument body (8), the weighing instrument body (8) is installed on the bottom plate (22), the top of the weighing instrument body (8) is fixed with a mounting plate, and the adjusting component is installed on the mounting plate.
3. The laser marking machine-based crystal bar and wafer positioning device of claim 1, wherein: the adjusting assembly comprises a bidirectional lead screw (16), two bearing seats (15) and two sliding blocks (17), wherein one bearing seat (15) penetrates through the two ends of the bidirectional lead screw, the bearing seats (15) are fixed on the mounting plate, the two sliding blocks (17) are provided with two threaded holes corresponding to the bidirectional lead screw, the two sliding blocks (17) are arranged at the two ends of the bidirectional lead screw and are in threaded connection with the bidirectional lead screw, and a clamping unit is fixed on each sliding block (17).
4. The apparatus of claim 3, wherein the apparatus comprises: two sides of the bidirectional screw rod are also provided with linear guide rails (19), the linear guide rails (19) are installed on the installation plate through installation pieces (18), sliding blocks (17) corresponding to the linear guide rails (19) are fixed at the bottoms of the clamping units, and the sliding blocks (17) are sleeved on the linear guide rails (19) through reserved through holes.
5. The apparatus of claim 3, wherein the apparatus comprises: one end of the bidirectional screw rod is also provided with a handle.
6. The laser marking machine-based crystal bar and wafer positioning device of claim 1, wherein: a piece basket positioning bottom plate (12) is further arranged on the bidirectional screw rod between the two clamping units, mounting pieces (18) corresponding to the bidirectional screw rod and the linear guide rail (19) are fixed at the bottom of the piece basket positioning bottom plate (12), and the piece basket positioning bottom plate (12) is mounted on the bidirectional screw rod and the linear guide rail (19) through the mounting pieces (18).
7. The laser marking machine-based crystal bar and wafer positioning device of claim 1, wherein: the clamping unit comprises a sliding plate (11), rollers and inclined mounting strips (111), wherein the sliding plate (11) is fixed on a sliding block (17), the inclined mounting strips (111) are fixed on the sliding plate (11), the inclined mounting strips (111) on the two sliding plates (11) are arranged oppositely, inclined portions of the two inclined mounting strips (111) are arranged in a back-to-back mode, the rollers are multiple, and the rollers are all installed on the inclined portions of the inclined mounting strips (111) through installation shafts.
8. The apparatus of claim 7, wherein the apparatus comprises: one side of one of the sliding plates (11) far away from the standard reaching component is also provided with a pointer (20), and the weighing component is provided with a scale (21) which can be calibrated with the pointer (20).
9. The laser marking machine-based crystal bar and wafer positioning device of claim 1, wherein: the marking assembly also comprises a U-shaped part, an upper clamping block, a lower clamping block and two vertical plates, the bottoms of the two vertical plates are fixed on a bottom plate (22), the upper part of each vertical plate is fixed with a U-shaped part, the lower clamping block is arranged in the U-shaped part, the upper clamping block and the lower clamping block are respectively provided with a groove corresponding to the laser head, both ends of the upper clamping block and the lower clamping block are respectively provided with a threaded hole, a screw passes through the upper clamping block through the threaded hole and extends into the threaded hole of the lower clamping block, and the laser head is arranged between the upper clamping block and the lower clamping block.
10. The laser marking machine-based crystal bar and wafer positioning device of claim 1, wherein: locating component includes mounting bracket (23), apron (24), fastening screw, one side that adjusting component was kept away from in mounting bracket (23) is fixed with the guide arm, it has the through-hole that corresponds with the guide arm to open on apron (24), the guide arm runs through in through-hole and apron (24) sliding connection, fastening screw tip passes through the bearing and is connected with mounting bracket (23) rotation, it has the screw hole that corresponds with fastening screw to open on apron (24), fastening screw runs through in screw hole and apron (24) threaded connection, one side that mounting bracket (23) are close to apron (24) is opened there is the recess that is used for placing the wafer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120633389.9U CN214721479U (en) | 2021-03-29 | 2021-03-29 | Crystal bar and wafer positioning device based on laser marking machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120633389.9U CN214721479U (en) | 2021-03-29 | 2021-03-29 | Crystal bar and wafer positioning device based on laser marking machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214721479U true CN214721479U (en) | 2021-11-16 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120633389.9U Active CN214721479U (en) | 2021-03-29 | 2021-03-29 | Crystal bar and wafer positioning device based on laser marking machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214721479U (en) |
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2021
- 2021-03-29 CN CN202120633389.9U patent/CN214721479U/en active Active
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| GR01 | Patent grant | ||
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Address after: 214200 Dongjia Avenue, Yixing Economic and Technological Development Zone, Wuxi City, Jiangsu Province Patentee after: Zhonghuan Leading Semiconductor Technology Co.,Ltd. Country or region after: China Patentee after: TIANJIN ZHONGHUAN ADVANCED MATERIAL TECHNOLOGY Co.,Ltd. Address before: 214200 Dongjia Avenue, Yixing Economic and Technological Development Zone, Wuxi City, Jiangsu Province Patentee before: Zhonghuan leading semiconductor materials Co.,Ltd. Country or region before: China Patentee before: TIANJIN ZHONGHUAN ADVANCED MATERIAL TECHNOLOGY Co.,Ltd. |
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