CN214718051U - Glue injection supporting structure - Google Patents
Glue injection supporting structure Download PDFInfo
- Publication number
- CN214718051U CN214718051U CN202022810179.0U CN202022810179U CN214718051U CN 214718051 U CN214718051 U CN 214718051U CN 202022810179 U CN202022810179 U CN 202022810179U CN 214718051 U CN214718051 U CN 214718051U
- Authority
- CN
- China
- Prior art keywords
- support
- block
- glue injection
- pressing
- glue
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Tests Of Electronic Circuits (AREA)
Abstract
The utility model discloses an injection supporting structure, which relates to the field of electronic test and mechanical support, and comprises a bracket, a supporting block, an injection pressing block and a pressing component; the bracket is provided with an avoidance concave position; the support block is arranged on the bracket and is provided with a glue injection hole and a plurality of support columns; the glue injection pressing block is arranged above the supporting block; the pressing assembly is movably connected with the support and can be abutted to the glue injection pressing block. The glue injection supporting structure can better support the printed circuit board, and avoids the fracture or bending deformation of the printed circuit board caused by overlarge pressing pressure.
Description
Technical Field
The utility model relates to an electronic test and mechanical support field, in particular to injecting glue bearing structure.
Background
In the related art, the chip bonding pins are electrically connected to the pad points on the printed circuit board via the probes. When the chip needs to be conducted with the printed circuit board mainboard to test the performance of the chip, the chip compression probe needs to be pressed down, so that the probe can be well kept in contact with the chip welding pin and the printed circuit board mainboard pad point. The existing supporting structure can not meet the supporting requirement on the main board of the printed circuit board, and the problem that the main board of the printed circuit board is deformed due to insufficient bearing strength of the supporting block occurs.
SUMMERY OF THE UTILITY MODEL
The utility model discloses aim at solving one of the technical problem that exists among the prior art at least. Therefore, the utility model provides an injecting glue bearing structure can bear bigger pressure, avoids printed circuit board to take place to warp.
According to the utility model discloses injecting glue bearing structure, include support, supporting shoe, injecting glue briquetting and push down the subassembly. The bracket is provided with an avoidance concave position; the support block is arranged on the bracket and is provided with a glue injection hole and a plurality of support columns; the glue injection pressing block is arranged above the supporting block; the pressing assembly is movably connected with the support and can be abutted to the glue injection pressing block.
According to the utility model discloses injecting glue bearing structure has following beneficial effect at least:
the supporting block does not need to be mechanically manufactured into a thin supporting column, so that the mechanical manufacturing difficulty is reduced, and the mechanical manufacturing period is shortened. The supporting block and the printed circuit board are placed on the avoidance concave position of the support, the chip is pressed downwards through the cooperation of the pressing component and the glue injection pressing block which are movably connected with the support, and the probe can be well contacted with the chip welding pin and the printed circuit board mainboard soldering point. The curable glue is injected into the upper part of the supporting block, and the curable glue and the supporting columns can better support the printed circuit board, so that the printed circuit board is prevented from being broken or bent and deformed due to overlarge pressing pressure.
According to some embodiments of the utility model, at least two be provided with a injecting glue position between the support column.
According to some embodiments of the invention, the support block has a parallelism to the horizontal plane of less than or equal to 0.02 mm.
According to some embodiments of the utility model, the bottom surface of injecting glue briquetting is the plane.
According to some embodiments of the utility model, the subassembly that pushes down includes handle and swing arm, the handle is installed the upper portion of swing arm, the swing arm can with injecting glue briquetting butt.
According to some embodiments of the utility model, be provided with the screw hole on the support, the swing arm is worn to locate the screw hole.
According to some embodiments of the utility model, there are 7, 7 support columns be equipped with the interval between the support column.
According to some embodiments of the invention, the support block is an insulator.
Drawings
The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
fig. 1 is a schematic view of a glue injection support structure according to an embodiment of the present invention;
FIG. 2 is an exploded view of the glue injection support structure shown in FIG. 1;
fig. 3 is a front view of the glue injection support structure according to the embodiment of the present invention;
FIG. 4 is an enlarged partial schematic view of FIG. 3 circled at position A;
FIG. 5 is a schematic view of the support block;
FIG. 6 is a reverse schematic view of the support block.
Reference numerals:
the glue injection device comprises a bracket 110, an avoiding concave position 111, a glue injection press block 120, a downward pressing assembly 130, a handle 131, a rotary rod 132 and a printed circuit board 140; supporting block 210, injecting glue hole 211, support column 212, injecting glue position 220, screw hole 230.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present invention, and should not be construed as limiting the present invention.
In the description of the present invention, it should be understood that the orientation or positional relationship indicated with respect to the orientation description, such as up, down, front, rear, left, right, etc., is based on the orientation or positional relationship shown in the drawings, and is only for convenience of description and simplification of description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.
In the description of the present invention, a plurality of means are one or more, a plurality of means are two or more, and the terms greater than, less than, exceeding, etc. are understood as not including the present number, and the terms greater than, less than, within, etc. are understood as including the present number. If the first and second are described for the purpose of distinguishing technical features, they are not to be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated or implicitly indicating the precedence of the technical features indicated.
In the description of the present invention, unless there is an explicit limitation, the words such as setting, installation, connection, etc. should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meanings of the above words in combination with the specific contents of the technical solution.
Referring to fig. 1, fig. 2, fig. 3 and fig. 4, the embodiment of the utility model discloses a glue injection bearing structure, include: the support 110, the supporting block 210, the glue injection pressing block 120 and the pressing-down assembly 130.
The support 110 is provided with an avoiding concave position 111, the avoiding concave position 111 can accommodate the printed circuit board 140, and the avoiding concave position 111 provides a placing space position for the printed circuit board 140, that is, the printed circuit board 140 can be placed on the avoiding concave position 111 in the process of pressing down a chip on the printed circuit board 140. The supporting block 210 is disposed on the bracket 110, the supporting block 210 is provided with an injection hole 211 and a plurality of supporting columns 212, the supporting block 210 is disposed below the printed circuit board 140 and is used for supporting the printed circuit board 140, and the plurality of supporting columns 212 are used for supporting the printed circuit board 140 and raising the printed circuit board 140. The glue injection press block 120 is disposed above the supporting block 210, the bottom surface of the glue injection press block 120 is a plane, that is, the contact surface between the glue injection press block 120 and the printed circuit board 140 is a plane, and in the process of pressing down, the glue injection press block 120 is placed above the chip of the printed circuit board 140. The pressing assembly 130 is movably connected with the support 110, the pressing assembly 130 can be abutted against the glue injection pressing block 120, a threaded hole 230 is formed in the support 110, the pressing assembly 130 penetrates through the threaded hole 230 to be abutted against the glue injection pressing block 120, the pressing assembly 130 is separated from the glue injection pressing block 120, the lower portion of the pressing assembly 130 penetrating through the threaded hole 230 is abutted against the glue injection pressing block 120, the pressing assembly 130 is screwed into the threaded hole 230 and applies downward pressure to the glue injection pressing block 120 to complete pressing operation.
Referring to fig. 3 and 4, a glue injection position 220 is disposed between at least two support columns 212, that is, a space capable of injecting glue exists between the two support columns 212. Because the supporting columns 212 lift the printed circuit board 140, a gap exists between the supporting block 210 and the printed circuit board 140, curable glue is injected into the gap through the glue injection position 220 between the two supporting columns 212, and after the curable glue is cured, the curable glue and the supporting columns 212 support the printed circuit board 140 together. After curing, secondary glue injection is carried out through the glue injection holes 211 according to the condition of a glue body formed by the curable glue, so that the glue body achieves a full effect.
Referring to fig. 2, the push-down assembly 130 includes a handle 131 and a lever 132, the handle 131 is mounted on an upper portion of the lever 132, and the lever 132 can abut against the glue injection press block 120. The rotary rod 132 penetrates through a threaded hole 230 formed in the bracket 110, the lower portion of the rotary rod 132 abuts against the glue injection pressing block 120, the handle 131 is rotated to enable the rotary rod 132 to be screwed into the threaded hole 230 and apply downward pressure to the glue injection pressing block 120, and therefore a chip is pressed downwards, and the probe can be well contacted with a chip welding pin and a printed circuit board 140 mainboard pad point.
It is understood that in the present embodiment, the supporting block 210 is placed on the escape recess 111, and the printed circuit board 140 is placed on the supporting block 210 and supported by the supporting posts 212. The glue injection press block 120 is placed on the printed circuit for pressing down the chip. The rotary rod 132 penetrates through the threaded hole 230 on the bracket 110 to abut against the glue injection pressing block 120, and in the process of pressing down, the rotary rod 132 is connected with the glue injection pressing block 120, and the rotary rod 132 presses down the glue injection pressing block 120; the screw 132 can be unscrewed from the threaded hole 230 and separated from the gel injection press block 120. The handle 131 is installed at an upper portion of the lever 132 to facilitate rotation of the lever 132.
By arranging the avoiding concave position 111, an accommodating space can be provided for circuit boards of different specifications, and more circuit boards of different specifications can be pressed down. The bottom surface of the glue injection pressing block 120 is a plane, so that the glue injection pressing block 120 can be attached to a chip, the chip can be pressed down better, the pressing pressure can be uniformly distributed on the chip, and the damage to the chip caused by uneven pressure is avoided. The curable adhesive is injected into the supporting block 210 to support the printed circuit board 140 to complete the pressing operation. The supporting columns 212 and the curable adhesive on the supporting block 210 provide a larger supporting area for the printed circuit board 140, so that the printed circuit board 140 can be prevented from being broken or bent and deformed in the process of pressing the chip down, the strength of the printed circuit board 140 is ensured, the supporting block 210 does not need to mechanically manufacture the superfine supporting columns 212, the difficulty of mechanical manufacture is reduced, and the mechanical manufacturing period is shortened.
In some embodiments of the present invention, the pressing assembly 130 and the glue injection pressing block 120 are fixedly connected, i.e. the glue injection pressing block 120 is fixed at the lower portion of the pressing assembly 130. It can be understood that the injection press block 120 connects the lower press assembly 130 passing through the screw hole 230 to the bracket 110, and since the injection press block 120 is fixed at the lower portion of the lower press assembly 130 and the injection press block 120 is bulky, the lower press assembly 130 is difficult to be unscrewed through the screw hole 230. The pressing assembly 130 and the glue injection pressing block 120 are connected to the support 110, the pressing assembly 130, the glue injection pressing block 120 and the support 110 can be combined together, the pressing assembly 130 and the glue injection pressing block 120 are not prone to being lost, and the fact that the pressing assembly 130 and the glue injection pressing block 120 cannot be found in the pressing operation process is avoided.
In some embodiments of the present invention, the hold-down assembly 130 is a "T" bar structure (not shown) formed by two rotary bars 132 connected together. The first rotating rod is placed in the vertical direction, the second rotating rod is placed in the horizontal direction, and the first rotating rod is connected with the middle of the second rotating rod. The second rotating rod arranged in the horizontal direction can better screw the pressing component 130 into or out of the threaded hole 230, so that the operation speed is increased, and the working efficiency is improved.
In some embodiments of the present invention, a groove (not shown) is disposed on the bracket 110 in a vertical direction, and the pressing assembly 130 slides into the bracket 110 through the groove and abuts against the glue injection pressing block 120. The groove is tightened by the tightening assembly, i.e., the pressing assembly 130 is fixed in the groove, the groove provides a pressing track for the pressing assembly 130, the pressing assembly 130 is pressed down to a position where the probes can keep good contact with the chip soldering pins and the motherboard pads of the printed circuit board 140, and the pressing assembly 130 is tightened and fixed by the groove. After the electronic test is completed, the recess is released to allow the push-down assembly 130 to move away from the recess, and the push-down assembly 130 can be removed from the recess. Can make push down subassembly 130 fix on support 110 and accomplish the push down operation through the recess, push down the operation and finish or need not to push down, push down subassembly 130 can take out through the recess fast, can effectively improve work efficiency.
Referring to fig. 5 and 6, in some embodiments of the present invention, there are 7 support columns 212, there is a space between 7 support columns 212, each support column 212 is independently disposed on the support block 210, and the support columns 212 are distributed around the glue injection holes 211. The bottom surface of the supporting block 210 is a plane, and the parallelism between the supporting block 210 and the horizontal plane is small, for example, in the embodiment, the parallelism between the supporting block 210 and the horizontal plane is less than or equal to 0.02 mm.
The more parallel the supporting block 210 is to the horizontal plane, the more beneficial the uniform distribution of the pressure on the chip, and the situation that the chip is damaged due to uneven pressure can be avoided. A space is provided between the 7 support columns 212, and the glue injection position 220 can be selected from the spaces between the 7 support columns 212, that is, the glue injection position 220 can be between any two support columns 212 of the 7 support columns 212, and the space between the 7 support columns 212 can also be the glue injection position 220. In the process of injecting glue, the glue injection position 220 can be flexibly selected, so that the curable glue can fully fill the area above the supporting block 210, the curable glue can be attached to the supporting column 212, and the printed circuit board 140 can be better supported.
In some embodiments of the present invention, the support block 210 and the curable glue are insulators, and the support posts 212 disposed on the support block 210 are also insulators. In the process of performing the electronic test, the chip is pressed down onto the printed circuit board 140, the probe is kept in contact with the chip soldering pin and the pad point of the printed circuit board 140 motherboard, the power-on test is performed, the pad of the printed circuit board 140 can be contacted with the supporting block 210 and the curable adhesive, and the supporting block 210 and the curable adhesive are insulators to avoid the short circuit phenomenon.
The embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made without departing from the spirit of the present invention within the knowledge of those skilled in the art.
Claims (8)
1. The utility model provides a injecting glue bearing structure which characterized in that includes:
the bracket is provided with an avoidance concave position;
the support block is arranged on the bracket and is provided with a glue injection hole and a plurality of support columns;
the glue injection pressing block is arranged above the supporting block;
the pressing assembly is movably connected with the support and can be abutted to the glue injection pressing block.
2. A support structure for injecting glue according to claim 1, wherein a glue injection position is provided between at least two of the support columns.
3. The support structure of claim 1, wherein the support block is less than or equal to 0.02 mm parallel to the horizontal plane.
4. A support structure for injecting glue according to claim 1, wherein the bottom surface of the injection pressure block is planar.
5. A support structure for injecting glue according to claim 1, wherein the hold-down assembly comprises a handle and a lever, the handle being mounted on an upper portion of the lever, the lever being capable of abutting against the injection pressure block.
6. A glue injection support structure according to claim 5, wherein the bracket is provided with a threaded hole, and the rotary rod penetrates through the threaded hole.
7. A support structure for injecting glue according to claim 1 or 2, wherein 7 support columns are provided, and a space is provided between 7 support columns.
8. A support structure for injecting glue according to claim 1, wherein the support block is an insulator.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022810179.0U CN214718051U (en) | 2020-11-27 | 2020-11-27 | Glue injection supporting structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022810179.0U CN214718051U (en) | 2020-11-27 | 2020-11-27 | Glue injection supporting structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214718051U true CN214718051U (en) | 2021-11-16 |
Family
ID=78618550
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022810179.0U Active CN214718051U (en) | 2020-11-27 | 2020-11-27 | Glue injection supporting structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214718051U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115889123A (en) * | 2022-11-03 | 2023-04-04 | 睿励科学仪器（上海）有限公司 | Method for dispensing and curing by using lens dispensing device |
-
2020
- 2020-11-27 CN CN202022810179.0U patent/CN214718051U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115889123A (en) * | 2022-11-03 | 2023-04-04 | 睿励科学仪器（上海）有限公司 | Method for dispensing and curing by using lens dispensing device |
| CN115889123B (en) * | 2022-11-03 | 2023-11-10 | 睿励科学仪器（上海）有限公司 | Method for dispensing and solidifying by using lens dispensing device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR100747336B1 (en) | Connecting structure of PCB using anisotropic conductive film, manufacturing method thereof and estimating method of connecting condition thereof | |
| US20080174326A1 (en) | Probe, probe assembly and probe card for electrical testing | |
| US6994586B2 (en) | Printed circuit board supporting structure | |
| CN101604000B (en) | Component for testing device for electronic component and testing method of the electronic component | |
| CN214718051U (en) | Glue injection supporting structure | |
| JPH10221374A (en) | Perpendicularly operating probe card and probe unit used in the same and manufacture of probe unit | |
| CN107422804B (en) | Main board assembly | |
| US6500010B2 (en) | Electrical circuit connector with resilient pressure pads | |
| CN200987238Y (en) | Fixing clamp for circuit board Circuit board fixing clamp | |
| JPWO2009017079A1 (en) | Socket and burn-in board equipped with this socket | |
| JPH11176546A (en) | Socket for electronic component | |
| CN117214484B (en) | Chip test socket | |
| US20180098447A1 (en) | Side clamping bga socket | |
| CN105122952A (en) | Substrate reinforcing structure | |
| CN201966440U (en) | Electric connector assembly | |
| US7004762B2 (en) | Socket for electrical parts | |
| JP4487755B2 (en) | Printed circuit board support structure | |
| CN215375667U (en) | Conductive assembly and testing device | |
| KR100293624B1 (en) | Contact devices removably mount electrical elements, especially integrated circuits, on printed circuit boards | |
| US20040002233A1 (en) | Method of assembling an interconnect device assembly and apparatus therefor | |
| CN113702808A (en) | PCB protection device and corresponding IC chip test system and method | |
| CN2757328Y (en) | Press type application combining device of package chip | |
| CN219761501U (en) | Double-substrate pressurizing jig | |
| CN219122261U (en) | Novel general quick change digital assembly test fixture | |
| CN201004494Y (en) | Electric connector |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |