CN214705970U - Die bonder bonding head assembly - Google Patents
Die bonder bonding head assembly Download PDFInfo
- Publication number
- CN214705970U CN214705970U CN202121167087.3U CN202121167087U CN214705970U CN 214705970 U CN214705970 U CN 214705970U CN 202121167087 U CN202121167087 U CN 202121167087U CN 214705970 U CN214705970 U CN 214705970U
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- Prior art keywords
- sleeve
- control device
- drive control
- die bonder
- head assembly
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- 238000006073 displacement reaction Methods 0.000 claims description 7
- 230000006698 induction Effects 0.000 claims description 6
- 230000006835 compression Effects 0.000 claims 1
- 238000007906 compression Methods 0.000 claims 1
- 239000013078 crystal Substances 0.000 description 13
- 230000005540 biological transmission Effects 0.000 description 9
- 230000007246 mechanism Effects 0.000 description 8
- 230000006872 improvement Effects 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 3
- 238000005299 abrasion Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
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- 230000008447 perception Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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Abstract
The utility model provides a die bonder nation head subassembly, include: the solid brilliant machine of solid brilliant arm of getting, the first drive control device of the vertical motion of the solid brilliant machine of getting arm of control and the second drive control device of the solid brilliant machine of getting arm circumferential direction rotation of control, first drive control device includes: the lifting device and a lifting shaft driven by the lifting device; elevating gear and lift axle swing joint, elevating gear includes: the first servo motor, the propelling spring, the sleeve which is sleeved with the propelling spring and is externally arranged, and the limiting buckle which is arranged on the inner wall of the sleeve; a sliding piston is arranged between the propelling spring and the lifting shaft and slides in the sleeve; the limiting buckle limits the movement of the pushing spring, and the first servo motor drives the pushing spring to rotate along the inner wall of the sleeve and to do pushing movement along the axial direction of the sleeve. Through the utility model discloses a, simplified nation head drive control device's structure, the cost is reduced has improved the stability of solid brilliant machine operation.
Description
Technical Field
The utility model relates to a semiconductor paster encapsulation technical field, more specifically relate to a die bonder head subassembly.
Background
The die bonder is one of key mechanical devices necessary for a post-packaging process on an LED production line, and the mechanical part of the die bonder comprises a bonding head assembly, a thimble assembly, a wafer workbench assembly, an optical system, an oxide dispensing assembly and a rotary positioning mechanism assembly. The die bonding process of the die bonder is as follows: the substrate or PCB is transferred to the working position of the clamp by a manual or feeding mechanism, the position of the substrate or PCB, which needs a key box wafer, is glued by a glue dispensing mechanism, then the crystal taking arm moves from the original point position to the position of the wafer sucking, the wafer is placed on an expander wafer disc supported by a film, the suction nozzle moves downwards after the crystal taking arm is in place, the ejector pin moves upwards to jack up the wafer, and the original point position is bonded after the wafer is picked up, so that a complete bonding process is realized. The main working part in the crystal taking and fixing process is a bonding head assembly. The bonding head assembly generally comprises a driving mechanism and a crystal taking arm, wherein the driving mechanism plays an important role in the accuracy of crystal taking and the quality of crystal fixing. Traditional drive mode, motor pass through belt transmission, drive rotatory solid brilliant arm, and speed is higher when this kind of mode, because of solid brilliant arm is rotatory, belt and belt pulley rub easily, and the material that the belt ground out in addition falls into solid brilliant product easily, causes great influence to the product, and belt transmission overall structure is big simultaneously, and the drive accuracy is low, leaks the brilliant when easily causing to get the brilliant.
At present, most of driving mechanisms used on die bonder adopt a driving mode of utilizing a hinge connecting rod for transmission or utilizing a sliding rail and a sliding block for guiding, and the driving mode has the advantages of complex structure, difficulty in debugging and damage, intangible increase of cost and delay of production cycle.
In view of the above, there is a need for an improved transmission in the prior art to solve the above problems.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to disclose a solid brilliant quick-witted nation head subassembly, improve the stability of getting the rotation of brilliant arm and going up and down, improved the degree of accuracy of getting the brilliant.
In order to achieve the above object, the utility model provides a die bonder head assembly, include: the device comprises a crystal taking arm of the die bonder, a first drive control device for controlling the vertical movement of the crystal taking arm of the die bonder and a second drive control device for controlling the circumferential rotation of the crystal taking arm of the die bonder;
the first drive control device includes: the lifting device and a lifting shaft driven by the lifting device;
elevating gear and lift axle swing joint, elevating gear includes: the first servo motor, the propelling spring, the sleeve which is sleeved with the propelling spring and is externally arranged, and the limiting buckle which is arranged on the inner wall of the sleeve;
a sliding piston is arranged between the propelling spring and the lifting shaft and slides in the sleeve;
the limit buckle limits the movement of the propelling spring, and the first servo motor drives the propelling spring to rotate along the inner wall of the sleeve and to do propelling movement along the axial direction of the sleeve;
the second drive control device includes: the second servo motor, the shaft coupling, the rotating shaft coupling with crankshaft of the second servo motor through the shaft coupling;
the second drive control device is fixedly connected with the first drive control device through a rotating shaft.
As a further improvement of the present invention, the propulsion spring has a telescopic property, and in an initial state, the propulsion spring is compressed by the limit buckle.
As a further improvement of the present invention, the rotation axis is fixedly connected to the outer end of the sleeve.
As a further improvement, the sliding piston is provided with a displacement sensor, and the displacement sensor tracks the displacement of the lifting shaft.
As a further improvement, the one end that is close to the shaft coupling on the rotation axis is equipped with the induction element of perception rotation axis, still be equipped with the sensor that transmits induction signal for the computer on the induction element.
As a further improvement of the utility model, the sleeve outer end is equipped with the lantern ring, the lantern ring with rotation axis fixed connection.
Compared with the prior art, the beneficial effects of the utility model are that:
(1) the bonding head assembly of the die bonder changes the traditional mode that the bonding head assembly drives the die taking arm to rotate through transmission of other parts, simplifies the structure of a bonding head driving control device, and reduces the cost.
(2) The lifting shaft is driven to move up and down by the movement of the propelling spring in the sleeve, the transmission mode is direct, the kinetic energy loss is reduced, and the driving stability of the first driving control device is improved.
(3) The driving mode of the invention is up and down, the rotation is directly driven, the action frequency of the crystal taking arm can be improved, and the precision is high.
(4) The bonding head assembly of the die bonder is a plurality of main body parts without redundant transmission mechanisms, so that the bonding head provided by the invention has long service life and does not need frequent maintenance due to frequent abrasion of part of parts.
Drawings
Fig. 1 is a perspective view of a bonding head assembly of a die bonder of the present invention.
In the figure: 1. a crystal taking arm of a crystal fixing machine; 2. a first drive control device; 3. a second drive control device; 21. a lifting device; 22. a lifting shaft; 210. a first servo motor; 211. a propulsion spring; 212. a sleeve; 2120. a collar; 31. a second servo motor; 32. a coupling; 33. a rotating shaft.
Detailed Description
The present invention is described in detail with reference to the embodiments shown in the drawings, but it should be understood that these embodiments are not intended to limit the present invention, and those skilled in the art should understand that the functions, methods, or structural equivalents or substitutions made by these embodiments are within the scope of the present invention.
It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict.
In the description of the present application, it is to be understood that the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in the orientation or positional relationship indicated in the drawings for convenience in describing the present application and for simplicity in description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed in a particular orientation, and be operated in a particular manner, and are not to be considered limiting of the scope of the present application. Furthermore, the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first," "second," etc. may explicitly or implicitly include one or more of that feature. In the description of the invention, unless otherwise specified, "a plurality" means two or more.
In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art through specific situations.
In order to facilitate understanding of the present invention, the present invention will be described more fully hereinafter with reference to the accompanying drawings. The preferred embodiments of the present invention are shown in the drawings. The invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
The utility model provides a die bonder bonding head assembly.
Fig. 1 shows a specific embodiment of a die bonder head assembly according to the present invention.
Referring to fig. 1, in this embodiment, a die bonder head assembly includes: solid brilliant machine gets brilliant arm 1, the first drive control device 2 of the vertical motion of the brilliant arm 1 of control solid brilliant machine and the second drive control device 3 of the brilliant arm 1 circumferential direction of control solid brilliant machine, first drive control device 2 includes: a lifting device 21 and a lifting shaft 22 driven by the lifting device 21; elevating gear 21 and lift axle 22 swing joint, elevating gear 21 includes: a first servo motor 210, a push spring 211, a sleeve 212 sleeved with the push spring 211 and externally arranged, and a limit buckle (not shown in the figure) arranged on the inner wall of the sleeve 212; a sliding piston (not shown) is arranged between the propelling spring 211 and the lifting shaft 22 and slides in the sleeve 212; the limit buckle limits the movement of the push spring 211, and the first servo motor 210 drives the push spring 211 to rotate along the inner wall of the sleeve 212 and to make a push movement along the axial direction of the sleeve 212; the second drive control device 3 includes: a second servomotor 31, a coupling 32, a rotary shaft 33 connected to a crankshaft of the second servomotor 31 through the coupling 32; the second drive control device 3 is fixedly connected to the first drive control device 2 via a rotary shaft 33. The push spring 211 has elasticity, and in an initial state, the push spring 211 is compressed by the limit buckle. The rotating shaft 33 is fixedly connected to the outer end of the sleeve 212. The sliding piston is provided with a displacement sensor (not shown) which tracks the displacement of the lifting shaft 22. A sensing unit (not shown) for sensing the rotating shaft 33 is disposed at one end of the rotating shaft 33 close to the coupling 32, and a sensor for transmitting a sensing signal to a computer is disposed on the sensing unit. The sleeve 212 is provided at its outer end with a collar 2120, and the collar 2120 is fixedly connected to the rotary shaft 33.
The bonding head assembly of the die bonder changes the traditional mode that the die bonder is driven by other parts to drive the die taking arm 1 to rotate, simplifies the structure of a bonding head driving control device and reduces the cost. The structure is simple, the lifting shaft 22 is pushed to move up and down by the movement of the propelling spring 211 in the sleeve 212, the transmission mode is direct, the kinetic energy loss is reduced, and the driving stability of the first driving control device 2 is improved.
The driving mode is vertical, the rotation is direct driving, the action frequency of the crystal taking arm 1 of the die bonder can be improved, and the precision is high. The bonding head assembly of the die bonder only comprises a plurality of main body parts and has no redundant transmission mechanism, so that the bonding head provided by the invention has long service life and does not need frequent maintenance due to frequent abrasion of part of parts.
The above list of details is only for the practical implementation of the present invention, and they are not intended to limit the scope of the present invention, and all equivalent implementations or modifications that do not depart from the technical spirit of the present invention should be included in the scope of the present invention.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (7)
1. A die bonder bonding head assembly, comprising: solid brilliant machine gets brilliant arm, the first drive control device of the vertical motion of the brilliant arm of control solid brilliant machine and the second drive control device of the brilliant arm circumferential direction rotation of control solid brilliant machine, its characterized in that:
the first drive control device includes: the lifting device and a lifting shaft driven by the lifting device;
elevating gear and lift axle swing joint, elevating gear includes: the first servo motor, the propelling spring, the sleeve which is sleeved with the propelling spring and is externally arranged, and the limiting buckle which is arranged on the inner wall of the sleeve;
a sliding piston is arranged between the propelling spring and the lifting shaft and slides in the sleeve;
the limit buckle limits the movement of the propelling spring, and the first servo motor drives the propelling spring to rotate along the inner wall of the sleeve and to do propelling movement along the axial direction of the sleeve;
the second drive control device includes: the second servo motor, the shaft coupling, the rotating shaft coupling with crankshaft of the second servo motor through the shaft coupling;
the second drive control device is fixedly connected with the first drive control device through a rotating shaft.
2. The die bonder bonding head assembly of claim 1, wherein: the propelling spring has elasticity, and under the initial state, the propelling spring receives spacing buckle compression.
3. The die bonder bonding head assembly of claim 1, wherein: the rotating shaft is fixedly connected with the outer end of the sleeve.
4. The die bonder bonding head assembly of claim 2, wherein: and a displacement sensor is arranged on the sliding piston and is used for tracking the displacement of the lifting shaft.
5. The die bonder bonding head assembly of claim 3, wherein: and one end of the rotating shaft, which is close to the coupler, is provided with an induction unit for sensing the rotating shaft, and the induction unit is also provided with a sensor for transmitting an induction signal to a computer.
6. The die bonder bonding head assembly of claim 3, wherein: the sleeve outer end is equipped with the lantern ring, the lantern ring with rotation axis fixed connection.
7. The die bonder bonding head assembly of claim 2, wherein: one end of the limiting buckle is conical.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121167087.3U CN214705970U (en) | 2021-05-28 | 2021-05-28 | Die bonder bonding head assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121167087.3U CN214705970U (en) | 2021-05-28 | 2021-05-28 | Die bonder bonding head assembly |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214705970U true CN214705970U (en) | 2021-11-12 |
Family
ID=78554223
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121167087.3U Expired - Fee Related CN214705970U (en) | 2021-05-28 | 2021-05-28 | Die bonder bonding head assembly |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214705970U (en) |
-
2021
- 2021-05-28 CN CN202121167087.3U patent/CN214705970U/en not_active Expired - Fee Related
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20211112 |