CN214701445U - Cooling device for semiconductor production and processing - Google Patents
Cooling device for semiconductor production and processing Download PDFInfo
- Publication number
- CN214701445U CN214701445U CN202120540182.7U CN202120540182U CN214701445U CN 214701445 U CN214701445 U CN 214701445U CN 202120540182 U CN202120540182 U CN 202120540182U CN 214701445 U CN214701445 U CN 214701445U
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- Prior art keywords
- fixedly connected
- wall
- cooling
- cooling device
- semiconductor production
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000001816 cooling Methods 0.000 title claims abstract description 55
- 239000004065 semiconductor Substances 0.000 title claims abstract description 38
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 14
- 238000012545 processing Methods 0.000 title claims abstract description 14
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 34
- 230000005540 biological transmission Effects 0.000 claims description 9
- 230000001681 protective effect Effects 0.000 claims description 6
- 230000008878 coupling Effects 0.000 claims description 3
- 238000010168 coupling process Methods 0.000 claims description 3
- 238000005859 coupling reaction Methods 0.000 claims description 3
- 230000017525 heat dissipation Effects 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 6
- 230000002146 bilateral effect Effects 0.000 abstract description 2
- 239000000463 material Substances 0.000 description 3
- 244000309464 bull Species 0.000 description 2
- 239000000498 cooling water Substances 0.000 description 2
- 238000001914 filtration Methods 0.000 description 2
- 238000007667 floating Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- 241000883990 Flabellum Species 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- -1 etc. Chemical compound 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 230000010365 information processing Effects 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Images
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- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
The utility model discloses a cooling device is used in semiconductor production and processing, including the cooler bin, two U templates of the equal fixedly connected with in both sides of cooler bin inner wall, sliding connection has the loading board between four U templates, the activity joint has the baffle between four U templates, two lantern rings of the equal fixedly connected with in both sides on loading board top, the equal fixedly connected with of outer wall of four lantern rings connects the rope, the bilateral symmetry fixedly connected with riser on loading board top, the top fixedly connected with handle of riser, lie in the one end of connecting the rope with two of one side respectively with the both sides fixed connection of the riser that corresponds, the top fixed interlude of cooler bin one side is connected with the protection casing, the fixed interlude in top of cooler bin opposite side is connected with the cold water pipe. The utility model discloses a cooperation of loading board, baffle, the lantern ring, connection rope and riser is used, has realized putting into the cooler bin with the semiconductor and has carried out refrigerated purpose to the convenience of semiconductor cooling operation has been improved.
Description
Technical Field
The utility model relates to a semiconductor processing technology field, in particular to cooling device is used in semiconductor production and processing.
Background
The semiconductor is a substance with conductivity between an insulator and a conductor, and the conductivity of the semiconductor is easy to control and can be used as an element material for information processing. Semiconductors are very important from the viewpoint of technological or economic development. The core elements of many electronic products, such as computers, mobile phones, and digital recorders, utilize the conductivity change of semiconductors to process information. Common semiconductor materials are silicon, germanium, gallium arsenide, etc., and silicon is the most influential of various semiconductor materials in commercial applications.
In the process of wafer semiconductor production, annealing cooling is often required to be carried out on a wafer heated at a high temperature, but the conventional cooling device is generally operated in a water cooling mode, when the semiconductor is cooled, the semiconductor is required to be in contact with cold water to transfer heat of a semiconductor body into the water, so that the heat of the semiconductor body is reduced, but the semiconductor floats in the water, so that the cooling effect is poor.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a cooling device is used in semiconductor production processing to solve the problem that proposes among the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a cooling device for semiconductor production and processing, includes the cooler bin, two U templates of the equal fixedly connected with in both sides of cooler bin inner wall, four sliding connection has the loading board between the U template, four the activity joint has the baffle between the U template, two lantern rings of the equal fixedly connected with in both sides on loading board top, four the equal fixedly connected with of outer wall of the lantern ring connects the rope, the bilateral symmetry fixedly connected with riser on loading board top, the top fixedly connected with handle of riser, the one end that lies in two connection ropes with one side respectively with the both sides fixed connection of the riser that corresponds, the fixed interlude in top of cooler bin one side is connected with the protection casing, the fixed interlude in top of cooler bin opposite side is connected with the cold water pipe.
Preferably, one side fixedly connected with driving motor of protection casing inner wall, driving motor passes through external switch and external power source electric connection, driving motor's output shaft is connected with the bull stick through the shaft coupling transmission, the tip fixedly connected with flabellum of bull stick, one side on cooler bin top articulates through the hinge has the case lid, the louvre has been seted up to one side on case lid top.
Preferably, the bottom of the inner cavity of the cooling box is rotatably connected with a rotating shaft, the outer wall of the rotating shaft is fixedly connected with a connecting rod, one end of the rotating shaft penetrates through one side of the cooling box and extends to the outside, and a driven disc is fixedly sleeved on the outer wall of the rotating shaft.
Preferably, the fixed cover of outer wall of driving motor output shaft has connect initiative disc, the outer wall transmission of initiative disc is connected with the conveyer belt, the bottom of protection casing is run through to the one end of conveyer belt, just the inner wall of conveyer belt one end is connected with the outer wall transmission of driven disc.
Preferably, the equal fixedly connected with support column in four edges of cooler bin bottom, the bottom fixed interlude of cooler bin is connected with the cylindricality sleeve, the top sliding interlude of cylindricality sleeve inner chamber is connected with the filter screen.
Preferably, the bottom end of the cylindrical sleeve is fixedly connected with a circular truncated cone-shaped sleeve, the bottom end of the circular truncated cone-shaped sleeve is fixedly and alternately connected with a water outlet pipe, and a valve is arranged on one side of the water outlet pipe.
The utility model discloses a technological effect and advantage:
(1) the utility model realizes the purpose of putting the semiconductor into the cooling box for cooling by matching the bearing plate and the baffle, and the baffle limits the semiconductor to avoid the semiconductor from floating, thereby improving the cooling effect of the semiconductor;
(2) the utility model discloses a cooperation of cylindricality sleeve and filter screen is used, has realized carrying out filterable purpose to the cooling water to make the cooling water can be by reuse, improved the utilization ratio at water source.
Drawings
Fig. 1 is a schematic view of the three-dimensional structure of the present invention.
Fig. 2 is a schematic front sectional view of the present invention.
FIG. 3 is a schematic view of a local structure of the loading plate of the present invention.
In the figure: 1. a cooling tank; 2. a U-shaped plate; 201. a baffle plate; 3. a carrier plate; 4. a collar; 5. connecting ropes; 6. a vertical plate; 601. a handle; 7. a protective cover; 8. a cold water pipe; 9. a drive motor; 10. a fan blade; 11. a box cover; 12. a rotating shaft; 121. a connecting rod; 13. a conveyor belt; 14. a support pillar; 15. a cylindrical sleeve; 151. filtering with a screen; 16. a sleeve in the shape of a truncated cone; 17. and (5) discharging a water pipe.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
The utility model provides a cooling device for semiconductor production and processing as shown in figures 1-3, which comprises a cooling box 1, two U-shaped plates 2 are fixedly connected on both sides of the inner wall of the cooling box 1, a loading plate 3 is slidably connected between the four U-shaped plates 2, a baffle 201 is movably clamped between the four U-shaped plates 2, a clamping groove is arranged on one side of each of the four U-shaped plates 2, the baffle 201 can be bent, so that four corner decibels of the baffle 201 are clamped into the four clamping grooves for positioning, a plurality of water filtering holes are arranged on the top end of the baffle 201, the baffle 201 limits a semiconductor placed on the loading plate 3, the semiconductor is prevented from floating on the water surface and affecting the cooling effect, two lantern rings 4 are fixedly connected on both sides of the top end of the loading plate 3, connecting ropes 5 are fixedly connected on the outer walls of the four lantern rings 4, risers 6 are fixedly connected on both sides of the top end of the loading plate 3 symmetrically, the top ends of the vertical plates 6 are fixedly connected with handles 601, one ends of two connecting ropes 5 positioned on the same side are respectively and fixedly connected with the two sides of the corresponding vertical plates 6, the convenience of taking and placing the bearing plate 3 and the semiconductor is improved through the arrangement of the vertical plates 6, the top of the other side of the cooling box 1 is fixedly and alternately connected with cold water pipes 8, and cold water is added into the cooling box 1 through the cold water pipes 8 to cool the semiconductor;
the top of one side of the cooling box 1 is fixedly inserted and connected with a protective cover 7, one side of the inner wall of the protective cover 7 is fixedly connected with a driving motor 9, the driving motor 9 is electrically connected with an external power supply through an external switch, an output shaft of the driving motor 9 is connected with a rotating rod through a coupling transmission, the end part of the rotating rod is fixedly connected with a fan blade 10, one side of the top end of the cooling box 1 is hinged with a box cover 11 through a hinge, the top end of the box cover 11 is fixedly connected with a handle, one side of the top end of the box cover 11 is provided with a heat dissipation hole, the driving motor 9 drives the fan blade 10 to rotate and blow to reduce the temperature inside the cooling box 1, the bottom of the inner cavity of the cooling box 1 is rotatably connected with a rotating shaft 12, the outer wall of the rotating shaft 12 is fixedly connected with a connecting rod 121, one end of the rotating shaft 12 penetrates through one side of the cooling box 1 and extends to the outside, a driven disc is fixedly sleeved on the outer wall of the output shaft of the rotating shaft 12, a driving disc is fixedly sleeved on the outer wall of the driving motor 9, the outer wall transmission of initiative disc is connected with conveyer belt 13, the bottom of protection casing 7 is run through to the one end of conveyer belt 13, and the inner wall of the one end of conveyer belt 13 is connected with the outer wall transmission of driven disc, driving motor 9 drives pivot 12 through conveyer belt 13 and rotates, thereby drive connecting rod 121 to rotate and stir water, thereby accelerate cooling, all fixedly connected with support column 14 in four edges of cooling box 1 bottom, the bottom of cooling box 1 fixedly alternates and is connected with cylindricality sleeve 15, the top of the cavity of cylindricality sleeve 15 slides and alternates and is connected with filter screen 151, set up filter screen 151 and filter the impurity that the aquatic contains after the cooling, thereby improved the convenience of water circulation, the bottom of cylindricality sleeve 15 fixedly connected with round platform shape sleeve 16, the bottom of round platform shape sleeve 16 fixedly alternates and is connected with outlet pipe 17, one side of round platform shape sleeve 17 is provided with the valve, the velocity of flow of control cold water pipe 8 is the same with outlet pipe 17, therefore, water flow always passes through the baffle 201 during cooling, one end of the water outlet pipe 17 is connected with the water cooling device, and water in the cooling box 1 enters the cooling circulation for use.
The utility model discloses the theory of operation: when the cooling box is used, a semiconductor to be cooled is placed at the top of the bearing plate 3, the box cover 11 is opened by pulling the handle, the bearing plate 3 is placed between the four U-shaped plates 2 and moves downwards along the four U-shaped plates 2, when the bearing plate 3 moves to the bottom of the U-shaped plates 2, the baffle 201 is clamped between the four U-shaped plates 2, so that the semiconductor is limited, cold water is added into the cooling box 1 through the cold water pipe 8 and does not pass through the baffle 201, the box cover 11 is covered, the switch of the driving motor 9 is opened, the output shaft of the driving motor 9 rotates to drive the rotating rod and the fan blades 10 to rotate and blow air, the driving disc is driven to rotate, the driving disc drives the conveyor belt 13 to rotate, the conveyor belt 13 drives the driven disc to rotate, the rotating shaft 12 and the connecting rod 121 are driven to rotate to stir water, so that the cooling efficiency is improved, and then the valve of the water outlet pipe 17 is opened, the water flow is filtered and purified by the filter screen 151, then flows out through the water outlet pipe 17, and is cooled by the cooling device, so that the water flow can enter the water circulation again.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications and variations can be made in the embodiments or in part of the technical features of the embodiments without departing from the spirit and the scope of the invention.
Claims (6)
1. The cooling device for semiconductor production and processing comprises a cooling box (1) and is characterized in that two U-shaped plates (2) are fixedly connected to the two sides of the inner wall of the cooling box (1), a bearing plate (3) is slidably connected between the four U-shaped plates (2), a baffle (201) is movably clamped between the four U-shaped plates (2), two lantern rings (4) are fixedly connected to the two sides of the top end of the bearing plate (3), connecting ropes (5) are fixedly connected to the outer walls of the four lantern rings (4), vertical plates (6) are symmetrically and fixedly connected to the two sides of the top end of the bearing plate (3), handles (601) are fixedly connected to the top ends of the vertical plates (6), one ends of the two connecting ropes (5) positioned on the same side are fixedly connected to the two sides of the corresponding vertical plates (6), and a protective cover (7) is fixedly and alternately connected to the top of one side of the cooling box (1), and a cold water pipe (8) is fixedly inserted and connected to the top of the other side of the cooling tank (1).
2. The cooling device for semiconductor production and processing according to claim 1, wherein a driving motor (9) is fixedly connected to one side of the inner wall of the protective cover (7), the driving motor (9) is electrically connected to an external power source through an external switch, an output shaft of the driving motor (9) is connected to a rotating rod through a coupling transmission, a fan blade (10) is fixedly connected to an end of the rotating rod, a case cover (11) is hinged to one side of the top end of the cooling case (1) through a hinge, a handle is fixedly connected to the top end of the case cover (11), and a heat dissipation hole is formed in one side of the top end of the case cover (11).
3. The cooling device for semiconductor production and processing according to claim 1, wherein a rotating shaft (12) is rotatably connected to the bottom of the inner cavity of the cooling box (1), a connecting rod (121) is fixedly connected to the outer wall of the rotating shaft (12), one end of the rotating shaft (12) penetrates through one side of the cooling box (1) and extends to the outside, and a driven disc is fixedly sleeved on the outer wall of the rotating shaft (12).
4. The cooling device for the semiconductor production and processing as claimed in claim 2, wherein a driving disc is fixedly sleeved on the outer wall of the output shaft of the driving motor (9), a conveyor belt (13) is connected to the outer wall of the driving disc in a transmission manner, one end of the conveyor belt (13) penetrates through the bottom end of the protective cover (7), and the inner wall of one end of the conveyor belt (13) is connected to the outer wall of the driven disc in a transmission manner.
5. The cooling device for semiconductor production and processing according to claim 1, wherein support columns (14) are fixedly connected to four corners of the bottom end of the cooling box (1), a cylindrical sleeve (15) is fixedly and alternately connected to the bottom end of the cooling box (1), and a filter screen (151) is slidably and alternately connected to the top of an inner cavity of the cylindrical sleeve (15).
6. The cooling device for semiconductor production and processing according to claim 5, wherein a truncated cone-shaped sleeve (16) is fixedly connected to the bottom end of the cylindrical sleeve (15), a water outlet pipe (17) is fixedly inserted and connected to the bottom end of the truncated cone-shaped sleeve (16), and a valve is arranged on one side of the water outlet pipe (17).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202120540182.7U CN214701445U (en) | 2021-03-16 | 2021-03-16 | Cooling device for semiconductor production and processing |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202120540182.7U CN214701445U (en) | 2021-03-16 | 2021-03-16 | Cooling device for semiconductor production and processing |
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Publication Number | Publication Date |
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CN214701445U true CN214701445U (en) | 2021-11-12 |
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CN202120540182.7U Expired - Fee Related CN214701445U (en) | 2021-03-16 | 2021-03-16 | Cooling device for semiconductor production and processing |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114935234A (en) * | 2022-07-26 | 2022-08-23 | 山东沂光集成电路有限公司 | Cooling device for integrated circuit semiconductor processing |
-
2021
- 2021-03-16 CN CN202120540182.7U patent/CN214701445U/en not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114935234A (en) * | 2022-07-26 | 2022-08-23 | 山东沂光集成电路有限公司 | Cooling device for integrated circuit semiconductor processing |
CN114935234B (en) * | 2022-07-26 | 2022-10-21 | 山东沂光集成电路有限公司 | Cooling device for integrated circuit semiconductor processing |
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GR01 | Patent grant | ||
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CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20211112 |
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CF01 | Termination of patent right due to non-payment of annual fee |