CN214701420U - Sublimation defrosting system, refrigerating system and refrigerating equipment - Google Patents

Abstract

The application relates to a sublimation defrosting system, a refrigerating system and refrigerating equipment. The dehumidification air duct and the semiconductor refrigeration component are arranged in the evaporation chamber of the refrigeration equipment, so that in a defrosting mode, the air flowing through the dehumidification air duct can be cooled and dehumidified through the semiconductor refrigeration component, the humidity in the evaporation chamber is reduced, thereby providing absolute humidity required for sublimation of the frost layer on the evaporator and latent heat required for sublimation of the frost layer through the refrigerant, so that the defrosting requirement can be met by providing less heat for the evaporator, when the frost layer on the surface of the evaporator and the ambient air form a certain absolute humidity difference and the temperature of the frost layer reaches the required condition for sublimation, the frost layer can be sublimated, and the temperature of the frost layer on the surface of the evaporator is highest, so that the temperature of the frost layer is gradually reduced from the root part to the outside, the frost layer can be sublimated from the root part, and then the whole body is peeled off, thereby greatly shortening the defrosting time and having obvious advantages compared with the traditional electric heating defrosting.

Description

Sublimation defrosting system, refrigerating system and refrigerating equipment

Technical Field

The application relates to the technical field of refrigeration equipment defrosting, in particular to a sublimation defrosting system, a refrigeration system and refrigeration equipment.

Background

At present, the defrosting mode of refrigeration equipment, such as a refrigerator, is electric heating defrosting, an electric heating pipe of the refrigeration equipment is arranged below an evaporator, and air is heated by the electric heating pipe to form natural convection and heat radiation of the electric heating pipe to defrost the evaporator.

Therefore, how to improve the defrosting efficiency and reduce the chamber return temperature is a problem to be solved urgently at present.

Disclosure of Invention

The application provides a sublimation defrosting system, a refrigerating system and refrigerating equipment, which are used for solving the problems of low defrosting efficiency, high power consumption and high chamber return temperature of the existing defrosting method.

The above object of the present application is achieved by the following technical solutions:

in a first aspect, an embodiment of the present application provides a sublimation defrosting system, which is disposed in an evaporation chamber of a refrigeration device;

the sublimation defrosting system comprises a dehumidification air channel and a semiconductor refrigeration assembly;

the dehumidification air channel comprises an air inlet and an air outlet which are communicated with the evaporation chamber, and the semiconductor refrigeration assembly is arranged in the dehumidification air channel;

when the refrigeration equipment operates in a defrosting mode, latent heat required by sublimation of a frost layer is provided by a refrigerant, and the semiconductor refrigeration assembly is electrified to operate so as to reduce the humidity in the evaporation chamber through the dehumidification air channel.

Optionally, the semiconductor refrigeration assembly is disposed on one side of the dehumidification air duct, which is close to the air outlet.

Optionally, the semiconductor refrigeration assembly includes a first temperature varying end and a second temperature varying end, the first temperature varying end is located in the dehumidification air duct, and the second temperature varying end is located outside the dehumidification air duct;

when the refrigeration equipment operates in the defrosting mode, the first temperature changing end is a cold end, and the second temperature changing end is a hot end.

Optionally, after the defrosting mode of the refrigeration device is finished, the first temperature varying end is changed into a hot end, and the first temperature varying end is used for melting a frost layer formed when the first temperature varying end performs refrigeration.

Optionally, the semiconductor refrigeration assembly further comprises a drain pipe, and one end of the drain pipe is located at the first variable temperature end and is used for draining water formed by defrosting at the first variable temperature end.

Optionally, the first temperature changing end and the second temperature changing end are both provided with fins.

Optionally, the number of the semiconductor refrigeration components is at least one.

In a second aspect, embodiments of the present application further provide a refrigeration system, which includes a circulation loop formed by a compressor, a condenser, a capillary tube and an evaporator connected in sequence by a pipeline; the outlet of the compressor is also connected with the inlet of the evaporator through a bypass pipeline;

a first control valve is arranged on a pipeline between the compressor and the condenser, and a second control valve is arranged on the bypass pipeline;

the evaporator is arranged in an evaporation chamber of the refrigeration equipment, and the sublimation defrosting system in any one of the first aspect is also arranged in the evaporation chamber;

when the refrigeration equipment runs in a refrigeration mode, the first control valve is opened, and the second control valve is closed; when the refrigeration equipment operates in the defrosting mode, the first control valve is closed, and the second control valve is opened.

Optionally, the bottom of the evaporation chamber comprises a shutter structure which can be opened and closed, and the shutter structure is positioned below the evaporator;

the frost layer, which comes off the evaporator during defrosting, falls on the baffle structure to open the baffle structure, and leaves the evaporation chamber through the opened baffle structure.

Optionally, the refrigeration system further includes a mechanical chamber disposed below the evaporation chamber, the mechanical chamber is communicated with the evaporation chamber through the baffle structure, a frost collecting plate is disposed in the mechanical chamber, and the frost collecting plate is disposed below the baffle structure.

Optionally, the semiconductor refrigeration assembly further comprises a heat radiation fan arranged on the side surface of the second temperature changing end;

when the refrigeration equipment operates in the defrosting mode, the heat radiation fans operate simultaneously to blow hot air near the second variable temperature end to the defrosting tray for defrosting.

In a third aspect, embodiments of the present application further provide a refrigeration apparatus including a refrigeration system as set forth in any one of the second aspect.

Optionally, the refrigeration appliance comprises a refrigerator.

The technical scheme provided by the embodiment of the application can have the following beneficial effects:

in the technical scheme provided by the embodiment of the application, the dehumidification air duct and the semiconductor refrigeration assembly are arranged in the evaporation chamber of the refrigeration equipment, so that in the defrosting mode, the air flowing through the dehumidification air duct can be cooled and dehumidified through the semiconductor refrigeration assembly to reduce the humidity in the evaporation chamber, and further the absolute humidity required by sublimation of a frost layer on the evaporator is provided, and the latent heat required by sublimation of the frost layer is provided through the refrigerant, so that the defrosting requirement can be met by providing less heat for the evaporator, when the frost layer on the surface of the evaporator and the ambient air form a certain absolute humidity difference and the temperature of the frost layer reaches the required sublimation condition, the frost layer can be sublimated, and because the temperature of the frost layer on the surface of the evaporator is highest, the temperature of the frost layer is gradually decreased from the root outwards, at the moment, the frost layer can be sublimated from the root, and further the frost layer is integrally peeled off, thereby greatly shortening the defrosting time, when the defrosting time is shortened, on one hand, the energy consumed in the defrosting process can be reduced, on the other hand, the temperature return of the middle chamber in the defrosting process is less, and the power consumption of the refrigeration mode can be reduced to a certain extent.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the application.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and together with the description, serve to explain the principles of the application.

Fig. 1 is a cross-sectional view of an evaporation chamber of a refrigeration apparatus according to an embodiment of the present application;

FIG. 2 is an enlarged view of the semiconductor refrigeration assembly;

fig. 3 is a schematic structural diagram of a refrigeration system according to an embodiment of the present application;

fig. 4 is a flowchart illustrating a control method of a refrigeration apparatus according to an embodiment of the present application.

Detailed Description

Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, like numbers in different drawings represent the same or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present application. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the present application, as detailed in the appended claims.

In order to solve the problems mentioned in the background art, namely the problems of high power consumption and low efficiency in electric heating defrosting, the application provides a sublimation defrosting scheme, which has the principle that when a frost layer on the surface of an evaporator and ambient air form a certain absolute humidity difference and the temperature of the frost layer reaches a certain condition, the frost layer can be sublimated, and when the temperature of the frost layer decreases gradually from the root to the outside, the frost layer can be sublimated from the root and then integrally peeled off, so that the defrosting time can be shortened, and the defrosting efficiency can be improved. Based on this, the underlying object of the present application is to provide the absolute humidity difference and the temperature difference required for sublimation. To achieve the above objects, the present application provides a sublimation defrost system and a specific application thereof. The following examples are given for the purpose of illustration.

Examples

Referring to fig. 1, fig. 1 is a cross-sectional view of an evaporation chamber of a refrigeration apparatus according to an embodiment of the present disclosure. As shown in fig. 1, an evaporator 2 is disposed in an evaporation chamber 1, refrigerant evaporates and absorbs heat when passing through the evaporator 2, so as to reduce the temperature of ambient air, the evaporation chamber 1 includes a supply air outlet 91 and a return air inlet 92, when the refrigeration equipment operates in a refrigeration mode, cold air at the evaporator 2 in the evaporation chamber 1 enters a compartment of the refrigeration equipment through the supply air outlet 91 under the action of a fan 3, and returns to the evaporation chamber 1 from the return air inlet 92, so as to realize refrigeration of the compartment. In the above process, the water vapor in the evaporation chamber 1 is condensed into frost and adheres to the surface of the evaporator 2, and when the frost layer is too thick, the heat exchange efficiency of the evaporator 2 is seriously affected, so that the evaporator 2 needs to be defrosted by switching the defrosting mode at a proper time.

On the basis, in the solution provided by the present embodiment, as shown in fig. 1, a sublimation defrosting system is disposed in the evaporation chamber 1, and the sublimation defrosting system includes a dehumidification air duct 4 and a semiconductor refrigeration assembly 6; the dehumidifying air duct 4 comprises an air inlet 93 and an air outlet 94 for communicating with the evaporation chamber 1, and the semiconductor refrigeration assembly 6 is disposed in the dehumidifying air duct 4, preferably on one side of the dehumidifying air duct 4 close to the air outlet 94 (as shown in fig. 1); optionally, in practical application, as shown in fig. 1, a foaming layer 5 (i.e., a heat insulating layer) may be further disposed on a side surface (a side far away from the evaporator) of the dehumidification air duct 4 to isolate external heat, so as to ensure the working efficiency of the sublimation defrosting system;

when the refrigeration equipment operates in the defrosting mode, the refrigerant enters the evaporator 2 in the evaporation chamber 1 to provide latent heat required by sublimation of a frost layer on the evaporator 2, the semiconductor refrigeration assembly 6 is powered on to operate, air in the evaporation chamber 1 enters the dehumidification air duct 4 from the air inlet 93, and returns to the evaporation chamber 1 from the air outlet 94 after being cooled and dehumidified at the semiconductor refrigeration assembly 6, so that the humidity in the evaporation chamber 1 is reduced, and the absolute humidity required by sublimation of the frost layer is provided.

Specifically, after the refrigerant enters the evaporator 2 to provide heat required for defrosting, the frost layer is melted to form water drops and water vapor, so that the humidity of the evaporation chamber 1 is increased, and the requirement of frost layer sublimation cannot be met, and therefore dehumidification is required. So, only need provide less heat for evaporimeter 2 and can satisfy the defrosting demand, form certain absolute humidity difference and frost layer temperature when sublimation required condition with ambient air when 2 surperficial frost layers of evaporimeter, the frost layer alright take place the sublimation, and because the frost layer temperature on 2 surperficial evaporators is the highest, consequently, frost layer temperature is for descending progressively from the root outwards, at this moment, the frost layer can be followed the root sublimation, and then whole peeling off, thereby shorten the defrosting time greatly, when defrosting time shortens, the energy that the defrosting in-process consumed can reduce on the one hand, on the other hand, make the rewarming of defrosting in-process intermediate chamber very little, also can reduce the consumption of refrigeration mode to a certain extent.

Further, referring to fig. 2, fig. 2 is an enlarged view of the semiconductor cooling module. As shown in fig. 2, the semiconductor cooling assembly 6 comprises a first temperature-changing end 62 and a second temperature-changing end 64, and a semiconductor element 63 arranged between the first temperature-changing end 62 and the second temperature-changing end 64, wherein fins 61/65 can be arranged on each of the first temperature-changing end 62 and the second temperature-changing end 64 to accelerate the heat exchange efficiency with the ambient air; after the semiconductor refrigeration assembly 6 is powered on, one of the first variable temperature end 62 and the second variable temperature end 64 is a cold end, and the other is a hot end, wherein the cold end is determined by the direction of current flowing through the semiconductor refrigeration assembly 6;

when the refrigeration equipment operates in the defrosting mode, the first temperature-changing end 62 is a cold end and is used for cooling and dehumidifying air in the dehumidification air duct 4, and the second temperature-changing end 64 is a hot end; moreover, because the first temperature-changing end 62 can generate frost during refrigeration, in order to avoid the reduction of refrigeration efficiency caused by frost during the next refrigeration, after the defrosting mode is finished, the current of the semiconductor refrigeration assembly 6 can be controlled to be reversed, so that the first temperature-changing end 62 is changed into a hot end, and the frost formed during the refrigeration of the first temperature-changing end 62 is melted.

In addition, as shown in fig. 2, the semiconductor cooling assembly 6 further comprises a drain 68, and one end of the drain 68 is located at the first variable temperature end 62 and is used for draining water formed by defrosting at the first variable temperature end 62.

It should be noted that, in the above embodiment, the number of the semiconductor cooling assemblies 6 is at least one, that is, one, or a plurality of semiconductor cooling assemblies may be provided, and the number may be set according to actual requirements.

In addition, on the basis of the sublimation defrosting system provided by the embodiment, the embodiment of the application further provides a refrigerating system.

Referring to fig. 3, fig. 3 is a schematic structural diagram of a refrigeration system according to an embodiment of the present application. As shown in fig. 3, the refrigeration system includes a circulation loop formed by a compressor 13, a condenser 11, a capillary tube 12 and an evaporator 2 connected in sequence by pipes; the outlet of the compressor 13 is also connected to the inlet of the evaporator 2 via a bypass line; a first control valve K1 is arranged on a pipeline between the compressor 13 and the condenser 11, and a second control valve K2 is arranged on a bypass pipeline;

the evaporator 2 is arranged in an evaporation chamber 1 of the refrigeration equipment shown in fig. 1, and the sublimation defrosting system in the embodiment is also arranged in the evaporation chamber; when the refrigeration equipment operates in a refrigeration mode, the first control valve K1 is opened, and the second control valve K2 is closed; when the refrigeration apparatus operates in the defrosting mode, the first control valve K1 is closed and the second control valve K2 is opened. Wherein, the first control valve K1 and the second control valve K2 can adopt stop valves.

Specifically, during the circulation of the normal cooling mode, the refrigerant circulation circuit is the compressor 13 → the condenser 11 → the capillary tube 12 → the evaporator 2 → the compressor 13, and therefore the temperature of the refrigerant entering the evaporator 2 is low and cannot satisfy the heat demand at the time of defrosting, and based on this, in order to make the refrigerant entering the evaporator 2 provide the latent heat required for sublimation of the frost layer on the evaporator 2, in the defrosting mode, the first control valve K1 is controlled to be closed, and the second control valve K2 is controlled to be opened, and at this time, the circulation circuit is changed to the compressor 13 → the evaporator 2 → the compressor 13, and therefore the temperature of the refrigerant entering the evaporator 2 can satisfy the demand.

In addition, on the basis of the above scheme, in order to reduce the humidity of the evaporation chamber 1 and the compartment and prolong the defrosting period, in some embodiments, as shown in fig. 1, the bottom of the evaporation chamber 1 includes an openable and closable baffle structure 10, and the baffle structure 10 is located below the evaporator 2, in consideration of that after the frost layer falls off, if the frost layer continues to remain in the evaporation chamber 1, the fallen frost layer melts and forms water vapor again, so that the frost is condensed on the evaporator 2, or the compartment humidity is increased due to the fact that the frost layer enters the compartment through the air supply opening 91; the frost layer, which is released from the evaporator 2 during defrosting, falls on the baffle structure 10 to open the baffle structure 10, and leaves the evaporation chamber 1 through the opened baffle structure 10.

That is to say, the baffle structure 10 at the bottom of the evaporation chamber 1 is in a closed state under normal conditions, so as to ensure that the evaporation chamber 1 is isolated from the outside, and when the frost layer falls on the baffle structure 10, the baffle structure 10 is opened under the action of gravity, and the frost layer slides to the outside of the evaporation chamber 1, so that the water vapor formed after the frost layer melts cannot enter the evaporation chamber 1 again. Wherein, the connection between the baffle structure 10 and the evaporation chamber 1 can be provided with an elastic member, so that the baffle structure 10 can be kept closed when no external force is applied.

In addition, in some embodiments, as shown in fig. 1, the refrigeration system further includes a mechanical chamber 7 disposed below the evaporation chamber, the mechanical chamber 7 is communicated with the evaporation chamber 1 through a baffle structure 10, a frost collecting tray 8 is disposed in the mechanical chamber 7, and the frost collecting tray 8 is disposed below the baffle structure 10, so that the dropped frost layer falls into the frost collecting tray 8, and is convenient for centralized processing.

On the basis of the above scheme, as shown in fig. 2, the semiconductor refrigeration assembly 6 further includes a heat radiation fan 67 disposed on the side surface of the second variable temperature end 64; when the refrigeration equipment operates in the defrosting mode, the heat radiation fan 67 operates simultaneously to blow the hot air near the second variable temperature end 64 to the defrosting pan 8 for defrosting.

Specifically, in the defrost mode, the first variable temperature end 62 is a cold end and the second variable temperature end 64 is a hot end. In order to fully utilize the heat generated by the hot end, in the embodiment, the hot air near the hot end is blown to the frost collecting plate 8 by the heat radiation fan 67, so that the frost layer falling into the frost collecting plate 8 is quickly melted.

On the basis, the embodiment of the application also provides a refrigeration device which comprises the refrigeration system shown in fig. 3. Wherein the refrigeration device may be a refrigerator.

Further, the embodiment of the application also provides a control method of the refrigeration equipment, namely a method for controlling the refrigeration equipment. Referring to fig. 4, fig. 4 is a schematic flowchart of a control method of a refrigeration apparatus according to an embodiment of the present application. As shown in fig. 4, the method at least comprises:

s401: when the defrosting condition is met, controlling the refrigeration equipment to enter a defrosting mode, wherein the defrosting mode comprises controlling a sublimation defrosting system to start running;

specifically, in the cooling mode, the first control valve K1 is opened, the second control valve K2 is closed, and the refrigerant circulates normally; the air supply outlet 91 and the air return outlet 92 are both kept in an open state, the air inlet 93 and the air outlet 94 are both kept in a closed state, at the moment, cold air around the evaporator 2 enters a compartment of the refrigeration equipment from the air supply outlet 91 under the action of a fan, the temperature of the compartment is reduced, and the air inlet 93 and the air outlet 94 are both kept closed, so that the dehumidification air duct 4 cannot be affected.

When the defrosting condition is met, closing the first control valve K1, opening the second control valve K2, and directly entering the evaporator 2 after the refrigerant flows out of the compressor 13 so as to meet the temperature condition required by sublimation of the frost layer on the surface of the evaporator 2; close supply-air outlet 91 and return-air inlet 92 simultaneously, open air intake 93 and air outlet 94 to start semiconductor refrigeration subassembly 6 and refrigerate to falling wet air duct 4, at this moment, the air in evaporation chamber 1 passes through air intake 93 and air outlet 94 and realizes the circulation, and by semiconductor refrigeration subassembly 6 cooling dehumidification, reduces the humidity in evaporation chamber 1, in order to satisfy the required absolute humidity of frost layer sublimation. The opening and closing of the air supply opening 91, the air return opening 92, the air intake opening 93 and the air outlet 94 can be realized by opening and closing air doors provided at corresponding positions. In addition, the process of detecting whether the defrosting condition is met can adopt the prior art (for example, the process can be a process of entering the defrosting mode after the refrigeration mode continuously operates for a certain time), and the process can not be improved by the method and device, so that the process is not repeated.

In the defrosting process, if the heat dissipation fan 67 is arranged, the heat generated by the hot end (the second variable temperature end 64) of the semiconductor refrigeration assembly 6 can be sent to the defrosting pan 8 by the heat dissipation fan 67 for defrosting.

S402: when the condition of quitting the defrosting is detected to be met, controlling the refrigeration equipment to quit the defrosting mode;

the defrosting condition can also be determined by the prior art, for example, a thermal bulb is arranged on the evaporator 2, and whether defrosting is completed (whether a frost layer falls off) is determined according to the temperature rise condition of the thermal bulb, or other methods can be used without limitation. After the condition of quitting the defrosting is met, the sublimation defrosting is stopped, and the frost of the first temperature-changing end 62 of the semiconductor refrigeration assembly 6 needs to be removed, so that the current of the semiconductor refrigeration assembly 6 can be controlled to be reversed, and the first temperature-changing end 62 becomes a hot end. And, the air inlet 93 and the air outlet 94 are closed at the same time to prevent the water vapor in the defrosting process from entering the evaporation chamber 1. The melted water formed after defrosting can be discharged to a water collection tray 66 provided in the machine room 7 through a drain pipe 68, and can be discharged to the outside of the refrigeration apparatus if necessary.

Specifically, the defrosting time of the first temperature changing end 62 can adopt a preset value T, and the preset value T can be obtained through a preliminary experiment; or whether defrosting is finished or not can be determined by detecting the temperature of the first temperature changing end 62 through the temperature sensing bulb in a manner similar to the 'exit defrosting condition'.

In addition, in some embodiments, when the refrigeration equipment is controlled to exit the defrosting mode, the method further includes: the compressor 13 is controlled to stop (i.e., the refrigerant is stopped from circulating to reduce power consumption).

In addition, after the defrosting mode exits and the defrosting step of the first temperature changing end 62 is finished, the refrigeration equipment can be controlled to enter the refrigeration mode according to actual needs, that is, the semiconductor refrigeration assembly 6 is powered off, the compressor 13 is started, the first control valve K1 is started, the second control valve K2 is closed, and the air supply outlet 91 and the air return inlet 92 are started.

Through above-mentioned scheme, can realize the sublimation defrosting of evaporimeter, for traditional electrical heating defrosting mode, defrosting efficiency is high, the time is short, the low power dissipation, and the room temperature returned that leads to because of stopping refrigeration is still less.

It is understood that the same or similar parts in the above embodiments may be mutually referred to, and the same or similar parts in other embodiments may be referred to for the content which is not described in detail in some embodiments.

It should be noted that, in the description of the present application, the terms "first", "second", etc. are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. Further, in the description of the present application, the meaning of "a plurality" means at least two unless otherwise specified.

Any process or method descriptions in flow charts or otherwise described herein may be understood as representing modules, segments, or portions of code which include one or more executable instructions for implementing specific logical functions or steps of the process, and the scope of the preferred embodiments of the present application includes other implementations in which functions may be executed out of order from that shown or discussed, including substantially concurrently or in reverse order, depending on the functionality involved, as would be understood by those reasonably skilled in the art of the present application.

It should be understood that portions of the present application may be implemented in hardware, software, firmware, or a combination thereof. In the above embodiments, the various steps or methods may be implemented in software or firmware stored in memory and executed by a suitable instruction execution system. For example, if implemented in hardware, as in another embodiment, any one or combination of the following techniques, which are known in the art, may be used: a discrete logic circuit having a logic gate circuit for implementing a logic function on a data signal, an application specific integrated circuit having an appropriate combinational logic gate circuit, a Programmable Gate Array (PGA), a Field Programmable Gate Array (FPGA), or the like.

It will be understood by those skilled in the art that all or part of the steps carried by the method for implementing the above embodiments may be implemented by hardware related to instructions of a program, which may be stored in a computer readable storage medium, and when the program is executed, the program includes one or a combination of the steps of the method embodiments.

In addition, functional units in the embodiments of the present application may be integrated into one processing module, or each unit may exist alone physically, or two or more units are integrated into one module. The integrated module can be realized in a hardware mode, and can also be realized in a software functional module mode. The integrated module, if implemented in the form of a software functional module and sold or used as a stand-alone product, may also be stored in a computer readable storage medium.

The storage medium mentioned above may be a read-only memory, a magnetic or optical disk, etc.

In the description herein, reference to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the application. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

Although embodiments of the present application have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present application, and that variations, modifications, substitutions and alterations may be made to the above embodiments by those of ordinary skill in the art within the scope of the present application.

Claims (13)

1. A sublimation defrosting system is characterized in that the system is arranged in an evaporation chamber of refrigeration equipment;

the sublimation defrosting system comprises a dehumidification air channel and a semiconductor refrigeration assembly;

the dehumidification air channel comprises an air inlet and an air outlet which are communicated with the evaporation chamber, and the semiconductor refrigeration assembly is arranged in the dehumidification air channel;

when the refrigeration equipment operates in a defrosting mode, latent heat required by sublimation of a frost layer is provided by a refrigerant, and the semiconductor refrigeration assembly is electrified to operate so as to reduce the humidity in the evaporation chamber through the dehumidification air channel.

2. The system of claim 1, wherein the semiconductor cooling component is disposed inside the moisture reducing duct on a side thereof adjacent to the air outlet.

3. The system of claim 1, wherein the semiconductor refrigeration assembly comprises a first variable temperature end and a second variable temperature end, the first variable temperature end being located within the dehumidification air duct, the second variable temperature end being located outside the dehumidification air duct;

when the refrigeration equipment operates in the defrosting mode, the first temperature changing end is a cold end, and the second temperature changing end is a hot end.

4. The system of claim 3, wherein the first variable temperature end is changed to a hot end after the defrosting mode of the refrigeration equipment is finished, for melting a frost layer formed when the first variable temperature end is refrigerated.

5. The system of claim 4, wherein the semiconductor refrigeration assembly further comprises a drain having one end located at the first variable temperature end for draining water formed by defrosting at the first variable temperature end.

6. The system of claim 3, wherein the first variable temperature end and the second variable temperature end each have fins disposed thereon.

7. The system of any one of claims 1-6, wherein the number of semiconductor refrigeration components is at least one.

8. A refrigeration system is characterized by comprising a circulating loop formed by a compressor, a condenser, a capillary tube and an evaporator which are sequentially connected through pipelines; the outlet of the compressor is also connected with the inlet of the evaporator through a bypass pipeline;

a first control valve is arranged on a pipeline between the compressor and the condenser, and a second control valve is arranged on the bypass pipeline;

the evaporator is arranged in an evaporation chamber of the refrigeration equipment, and the sublimation defrosting system of any one of claims 1-7 is further arranged in the evaporation chamber;

when the refrigeration equipment runs in a refrigeration mode, the first control valve is opened, and the second control valve is closed; when the refrigeration equipment operates in the defrosting mode, the first control valve is closed, and the second control valve is opened.

9. The system of claim 8, wherein the bottom of the evaporation chamber comprises an openable and closable baffle structure, the baffle structure being located below the evaporator;

the frost layer, which comes off the evaporator during defrosting, falls on the baffle structure to open the baffle structure, and leaves the evaporation chamber through the opened baffle structure.

10. The system of claim 9, further comprising a machine chamber disposed below the evaporation chamber, the machine chamber being in communication with the evaporation chamber through the baffle structure, the machine chamber having a frost collection pan disposed therein, the frost collection pan being disposed below the baffle structure.

11. The system of claim 10, wherein the semiconductor refrigeration assembly further comprises a heat dissipation fan disposed on a side of the second variable temperature end;

when the refrigeration equipment operates in the defrosting mode, the heat radiation fans operate simultaneously to blow hot air near the second variable temperature end to the defrosting tray for defrosting.

12. Refrigeration device, characterized in that it comprises a refrigeration system according to any of claims 8 to 11.

13. The refrigeration appliance of claim 12 wherein the refrigeration appliance comprises a refrigerator.

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