CN214684646U - Tinning equipment for pins of electronic components - Google Patents

Abstract

The electronic component pin tin plating equipment comprises a fixed support, a clamping die and a tin bath, wherein the clamping die is connected to the fixed support and moves back and forth between the fixed support and the tin bath; the clamping mould comprises a moving assembly which can be lifted and translated; two clamping plates which are arranged oppositely are connected to the moving assembly. The device of the utility model is simple in structure, it is with low costs, can be convenient carry out tin plating to the electronic component pin, avoided the emergence of the condition such as scald, simultaneously, the tinning quality is easily controlled, and tinning is efficient, can accomplish tin-plating work fast.

Description

Tinning equipment for pins of electronic components

Technical Field

The utility model belongs to the technical field of electronic components pin tin-plating, especially, relate to an electronic components pin tin-plating equipment.

Background

The tin plating of the pins of the electronic components is a basic process requirement for the assembly of the electronic components.

The most common reason for plating tin on the surface of a pin is to remove gold from the gold-plated surface of the electronic device and re-plate the gold to form a tin-lead surface. Another reason is that, for the elements left after previous use, as they have been stored for a long time, their solderability is reduced due to oxidation, or time problems, and it is not guaranteed that a strong connection is formed during the assembly process.

The process of tinning the pins of the electronic components comprises the following steps: and (3) placing the pins of the electronic components into the molten tin-lead solution, and staying for a proper time.

In the tin plating process, the length of the pins entering the solution needs to be controlled, so that the phenomenon that the electronic component shell is too close to the solution to form heat loss is avoided; meanwhile, the lead is prevented from being in the solution for too long time.

In addition, to keep the tin-lead solution in a molten state all the time, the solution needs to be kept at a relatively high temperature, and the process is labor-intensive if operated manually.

In the prior art, a system for automatically tinning pins of electronic components is available, but the system is often complex, inconvenient to maintain, too high in cost of the whole production line, and incapable of achieving a good tinning effect of the pins of the electronic components under the condition of the lowest cost.

Simultaneously, current automatic tinning equipment, the implementation mode is: set up the conveyer belt, will treat on tin-plated components and parts place the conveyer belt, when the conveyer belt reachd molten tin bath department, the molten tin bath rose, soaks the components and parts pin wherein, the weak point of this kind of mode lies in: 1. in addition to the high cost mentioned above; the high temperature in the tin bath is also involved, and the frequent lifting easily causes safety accidents. 2. For linear electronic components such as resistance wires, the resistance wires are required to be taken out by the equipment and then tinned again after being turned over. 3. Experimental studies using this method are not applicable.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing a simple structure, excellent in use effect's electronic components pin tinning equipment.

In order to solve the technical problem, the utility model provides a following technical scheme: the electronic component pin tin plating equipment comprises a fixed support, a clamping die and a tin bath, wherein the clamping die is connected to the fixed support and moves back and forth between the fixed support and the tin bath; the clamping mould comprises a moving assembly which can be lifted and translated; two clamping plates are connected to the moving assembly and arranged oppositely.

The movable assembly comprises a vertical upright rod, a vertical lead screw is arranged on the vertical upright rod, a vertical sliding block is arranged on the vertical lead screw, a first translation lead screw is arranged on the vertical sliding block, a horizontal sliding block is arranged on the first translation lead screw, a second translation lead screw vertically arranged with the first translation lead screw is arranged on the horizontal sliding block, the second translation lead screw is a bidirectional lead screw, two sections of threads of the second translation lead screw are respectively screwed with two matched sliding blocks, and clamping plates are respectively arranged on the matched sliding blocks.

The horizontal sliding block is provided with a rotating motor, an output shaft of the rotating motor is connected with a disc through a bearing, and the second translation screw rod is eccentrically arranged on the disc.

Establish the lower spacing arch of going up spacing arch and being located the protruding below of upper limit on arbitrary grip block, go up spacing arch and lower spacing arch and all set up along grip block width direction, go up spacing arch and be equipped with the mounting groove with the equal interval in the spacing arch down, go up the corresponding setting of the bellied mounting groove of upper limit and lower spacing, the mounting groove sets up along grip block direction of height.

Go up spacing arch and lower spacing arch and all follow the setting of grip block direction of height slip, simultaneously, be connected with the puller bolt between last spacing arch and the grip block, also be connected with the puller bolt between lower spacing arch and the grip block.

The upper limiting bulge and the lower limiting bulge are connected with first laser liquid level sensors, the signal output ends of the first laser liquid level sensors are connected with a microcontroller, and the microcontroller outputs signals to control the rotation of the vertical screw rod.

The molten tin bath comprises a container body and a heating wire arranged in the container body, and the microcontroller outputs signals to control the work of the heating wire.

And a second laser liquid level sensor is arranged above the container body, the second laser liquid level sensor transmits the collected liquid level information to the microcontroller, and the microcontroller is connected with an acousto-optic alarm circuit.

Through the technical scheme, the beneficial effects of the utility model are that: 1. the utility model has simple structure, is easy to operate, and can be used by researchers and trainers; 2. the equipment cost is low; meanwhile, on the basis of low cost, automatic tin plating is realized, and warning can be given out when the tin solution is insufficient; 3. in addition, the clamping die that this application set up can the centre gripping needs welded electronic component, when tin-plating to the pin of resistance, because the resistance is sharp form, can overturn the resistance, has saved the tin-plating time.

Drawings

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is a schematic diagram of a clamping plate structure;

FIG. 3 is a right side view of the clamping plate;

fig. 4 is a schematic circuit diagram of the present invention.

Detailed Description

An electronic component pin tin plating device is shown in figure 1 and comprises a fixing support, a clamping die and a tin bath. When the clamping device is used, the fixing support is used for supporting the clamping die, the clamping die clamps the electronic component in the clamping die and then conveys the electronic component to the tin bath, and therefore tin plating is carried out on pins of the electronic component.

The concrete structure is as follows:

the clamping die is connected to the fixed support and moves back and forth between the fixed support and the tin bath, so that the electronic component is installed and tin plating is achieved.

The clamping mould comprises a moving assembly which can be lifted and translated; two clamping plates 14 are connected to the moving assembly, the two clamping plates 14 are arranged oppositely, and the electronic element is clamped between the two clamping plates 14.

The moving assembly comprises a vertical upright rod 1, and a first driving motor 2 is arranged on the vertical upright rod 1; the method specifically comprises the following steps: the output shaft of the first driving motor 2 is assembled with the vertical lead screw 3, and the vertical lead screw 3 can be driven to rotate when the first driving motor 2 works.

A vertical sliding block 4 is arranged on the vertical lead screw 3, and an output shaft of the first driving motor 2 rotates to drive the vertical lead screw 3 to rotate; along with the rotation of the vertical screw rod 3, the vertical sliding block 4 moves along the length direction of the vertical screw rod 3.

The vertical sliding block 4 is connected with a second driving motor 5, an output shaft of the second driving motor 5 is provided with a first translation lead screw 6, and when the second driving motor 5 works, the first translation lead screw 6 can be driven to rotate.

A horizontal sliding block 7 is arranged on the first translation lead screw 6, when the device works, an output shaft of the second driving motor 5 rotates to drive the first translation lead screw 6 to rotate, and the horizontal sliding block 7 moves along the length direction of the first translation lead screw 6 along with the rotation of the first translation lead screw 6.

A rotating motor 8 is arranged on the horizontal sliding block 7, a disc 9 is connected to an output shaft of the rotating motor 8 through a bearing, and the rotating motor 8 drives the disc 9 to rotate. A third driving motor 11 is arranged on the disc 9, and a second translation screw 12 perpendicular to the first translation screw 6 is arranged on the third driving motor 11. Here, the first translation screw 6 and the second translation screw 12 are horizontally disposed, but one is in the X-axis direction and the other is in the Y-axis direction.

The second translation screw 12 is a bidirectional screw, two matching sliding blocks 13 are respectively screwed on two sections of threads of the second translation screw 12, two clamping plates 14 are respectively connected with the two matching sliding blocks 13, an output shaft of the third driving motor 11 rotates along with the work of the third driving motor 11 to drive the second translation screw 12 to rotate, the two matching sliding blocks 13 on the second translation screw 12 move in opposite directions, and finally the two clamping plates 14 are driven to be close to or away from each other.

An upper limiting bulge 17 and a lower limiting bulge are arranged on any clamping plate 14 of the two clamping plates 14, and the lower limiting bulge is positioned below the upper limiting bulge 17. Go up spacing arch 17 and lower spacing arch and all set up along the 14 width direction of grip block, go up spacing arch 17 and lower spacing arch and go up equal interval and be equipped with mounting groove 21, go up the protruding 17 mounting groove 21 of spacing and correspond the setting with the lower bellied mounting groove of spacing, both central points are on a straight line. The mounting grooves 21 are provided along the height direction of the clamping plate 14 so that the electronic components are sequentially distributed along the width direction of the clamping plate 14 as required, and the wires of the electronic components come out of the mounting grooves 21.

The distance between adjacent mounting grooves 21 is to ensure that pins of common electronic components such as a triode, a diode, a resistor 18, a capacitor and the like penetrate through the mounting grooves, the thickness of the upper limiting bulge 17 and the thickness of the lower limiting bulge are as small as possible, and if the thickness of the upper limiting bulge 17 and the thickness of the lower limiting bulge are 10-20 mm, enough pins can penetrate out of the mounting grooves as far as possible.

In this embodiment, the upper limiting protrusion 17 and the lower limiting protrusion are mainly used to limit the position of the electronic component, so that the electronic component is clamped between the upper limiting protrusion 17 and the lower limiting protrusion to be stable.

In order to tin-plate two pins of a linear electronic component such as the resistor 18, in this embodiment, the upper limiting protrusion 17 and the lower limiting protrusion are required to be capable of sliding along the height direction of the clamping plate 14, so that when the pins of the resistor 18 are tin-plated, the upper limiting protrusion 17 and the lower limiting protrusion can slide to enable the upper limiting protrusion 17 and the lower limiting protrusion to clamp the resistor 18 therein.

Wherein, the fixing mode after the upper limit bulge 17 and the lower limit bulge slide on the clamping plate 14 is as follows: set up the puller bolt on spacing arch 17, utilize the puller bolt to realize going up spacing arch 17 and spacing arch down fixed on grip block 14, on the puller bolt wears to locate spacing arch 17 and spacing arch down respectively, the terminal and the grip block 14 laminating of puller bolt.

In order to limit the height between the electronic element and the molten tin liquid level during tin plating, a first laser liquid level sensor J1 is connected to the outer surfaces of the upper limit protrusion 17 and the lower limit protrusion, the signal output end of the first laser liquid level sensor J1 is connected with a microcontroller, and the microcontroller outputs a signal to control the rotation of the vertical lead screw 3.

The microcontroller comprises a singlechip U1 (model is STM32F103 RXT) and a singlechip U1 minimum system, the singlechip U1 minimum system is mature prior art, and the description is omitted in this embodiment.

When the device is used, the first laser liquid level sensor J1 collects the distance between the limiting bulge 17 and the liquid level and transmits the collected distance to the single chip microcomputer U1, the single chip microcomputer U1 compares the received value with a threshold value, so that the distance between the first laser liquid level sensor J1 and the liquid level is proper, and when the distance is too large, the single chip microcomputer U1 outputs a signal to the vertical lead screw 3 to enable the vertical lead screw 3 to rotate and drive the clamping plate 14 to ascend; otherwise, it decreases.

In order to start the operation, the microcontroller is connected with 3 keys, namely a first key S1, a second key S2 and a third key S3.

The first ends of the first key S1, the second key S2 and the third key S3 are all grounded, the second ends of the first key S1, the second key S2 and the third key S3 are connected with a direct current power supply, and meanwhile, the second ends of the first key S1, the second key S2 and the third key S3 are also respectively connected with signal input ends (pins are P3.1, P3.4 and P3.5 respectively) of the single chip microcomputer U1.

The start information is inputted to the single chip microcomputer through the first button S1, the second button S2 and the third button S3, for example, the first button is a resistor type element that needs to be turned over, the second button is a general type element that does not need to be turned over, and the third button is a special element that is easily damaged by heat, such as a triode and a diode.

After the single chip microcomputer receives the information of the first key S1, the second key S2 and the third key S3, the single chip microcomputer outputs signals to enable the first translation lead screw, the second translation lead screw and the vertical lead screw to act, and the specific implementation mode is as follows:

and a signal output end of the single chip microcomputer U1 is connected with a first driving motor driving circuit, a second driving motor driving circuit and a third driving motor driving circuit.

The first driving motor driving circuit, the second driving motor driving circuit and the third driving motor driving circuit have the same structure, and the first driving motor driving circuit is taken as an example for explanation: the first driving motor driving circuit comprises a motor driving chip (L298N), signal input ends (pins IN1, IN2, IN3 and IN 4) of the motor driving chip are respectively connected with signal output ends (pins P1.0-P1.3) of the single chip microcomputer, and signal output ends (pins OUT1, OUT2, OUT3 and OUT 4) of the motor driving chip are connected with a motor M1.

After the single chip microcomputer receives the key information, signals are output to the first driving motor driving circuit, the second driving motor driving circuit and the third driving motor driving circuit to drive the first translation lead screw, the second translation lead screw and the vertical lead screw to make corresponding actions, and therefore the distance between the element and the liquid level is proper.

The molten tin bath is used for containing molten tin, the molten tin bath comprises a container body 15 and a heating wire arranged in the container body 15, and the singlechip U1 outputs signals to control the work of the heating wire. Meanwhile, a temperature sensor J3 (with the model of DS18B 20) is arranged inside the container body 15, the temperature sensor J3 collects temperature signals and transmits the collected temperature information to the single chip microcomputer U1, and the single chip microcomputer U1 outputs signals to control the heating wires to work according to the received temperature values.

The realization mode that the singlechip U1 output signal controls the work of the heating wire is as follows: the signal output part of singlechip U1 connects the heater strip drive circuit, heater strip drive circuit includes the coil of second triode Q2 and second relay, the base of second triode Q2 is connected to singlechip U1's signal output part, DC power supply is connected to second triode Q2's collecting electrode, the coil ground of second relay is passed through to second triode Q2's projecting pole, the normally open contact K2 series connection of second relay is in heater strip JR's power supply circuit.

In order to monitor the liquid level of molten tin in the tin bath, prevent that the molten tin is too little and the situation that does not in time add from appearing, establish second laser level sensor J2 above container body 15, singlechip U1 is transmitted to the liquid level information that second laser level sensor J2 will gather, is connected with audible and visual alarm circuit on the singlechip U1. The second laser liquid level sensor J2 collects liquid level information and transmits the collected information to the single chip microcomputer U1, the single chip microcomputer U1 compares the received value with a threshold value, and then sends a signal to the sound-light alarm circuit, and when the liquid level is insufficient, a sound-light alarm is sent.

The acousto-optic alarm circuit comprises a first triode Q1, a light-emitting diode D1 and a horn; the signal output end of the singlechip U1 is respectively connected with the base electrode of a first triode Q1, the collector electrode of the first triode Q1 is connected with the negative electrode of a light-emitting diode D1, and the positive electrode of the light-emitting diode D1 is connected with a direct-current power supply; meanwhile, an emitting electrode of the first triode Q1 is connected with a coil of the first relay, and a normally open contact of the first relay is connected in a power circuit of the horn.

As a modification of this embodiment, in order to further improve the usability of the device, a pressure sensor is connected between the two clamping plates 14, and the pressure sensor collects pressure information received by the electronic component to prevent the electronic component from being squeezed. Pressure sensor gathers pressure information to pressure information transmission to singlechip U1 will gather, singlechip U1 compares with the pressure threshold value according to the information that receives, thereby output signal controls the rotation of third driving motor 11, makes two grip blocks suitable to electronic component's clamping-force.

In order to further protect the electronic components, a rubber layer is arranged on the opposite surfaces of the two clamping plates 14, so that the electronic components are effectively prevented from being damaged by extrusion.

The working process is as follows: the description will be given by taking a capacitive electronic element as an example: firstly, pressing a capacitor key, sensing the information by the singlechip U1, enabling the rotating motor 8, the first driving motor 2, the second driving motor 5 and the third driving motor 11 to work, clamping the capacitor by the clamping plates, and enabling the second driving motor to rotate for a set number of turns to enable the two clamping plates 14 to be positioned above the side of the tin bath; the two clamping plates 14 are opened and are positioned at positions vertical to the working position, capacitors are placed on the clamping plates 14 with the limiting bulges 17, a plurality of capacitors are placed on the lower limiting block, so that the pins extend out of the mounting groove, and meanwhile, the upper limiting block is moved, so that the lower part of the upper limiting block is attached to the top of the capacitors, and the stability of the capacitors is ensured;

after the capacitor is placed, the start button is pressed, the singlechip U1 receives the information, and the singlechip U1 outputs signals to enable the first driving motor 2 and the second driving motor 5 to rotate for set turns respectively, so that the clamping plate 14 is finally positioned at the upper inner part of the container body 15; the rotating motor 8 works to enable the capacitor pins to face downwards and extend into molten tin, the first laser liquid level sensor controls the capacitor pins to prevent the capacitor pins from being too close or too far, the tin plating effect is guaranteed, after set time is reached, the single chip microcomputer U1 outputs signals to enable the first driving motor 2 to rotate for set turns to drive the clamping plate 14 to ascend, the second driving motor 5 rotates for set turns to drive the clamping plate 14 to horizontally move to the side of the container body 15, and the rotating motor 8 rotates for set turns to enable the clamping plate 14 to be in a position perpendicular to a working position; finally, the third driving motor 11 is rotated for a set number of turns, so that the clamping plate 14 is opened, and the capacitor is taken down.

Taking the resistor 18 as an example for explanation, on the basis of a capacitive electronic element, after a set time is reached in a tin plating process, the single chip microcomputer U1 outputs a signal to enable the first driving motor 2 to rotate for a set number of turns to drive the clamping plate 14 to ascend; the rotating motor 8 rotates for a set number of turns to enable the clamping plate 14 to rotate 180 degrees, and finally the pin on the other side of the resistor 18 faces downwards; the single chip microcomputer U1 output signal makes the first driving motor 2 rotate to drive the clamping plate 14 to descend, and then tin plating is carried out again.

The device of the utility model is simple in structure, it is with low costs, can be convenient carry out tin-plating to the electronic component pin, avoided the emergence of the condition such as scald, simultaneously, tin-plating quality easily controls, and tin-plating is efficient, to resistance class two side tin-plated pins of needs, in one side pin tin-plating completion back, need not take off just can tin-plating to one side pin in addition again, has improved tin-plating efficiency.

Claims (8)

1. Electronic components pin tinning equipment, its characterized in that: the tin bath clamping device comprises a fixed support, a clamping die and a tin bath, wherein the clamping die is connected to the fixed support and moves back and forth between the fixed support and the tin bath; the clamping mould comprises a moving assembly which can be lifted and translated; two clamping plates are connected to the moving assembly and arranged oppositely.

2. The electronic component pin tin plating apparatus as recited in claim 1, wherein: the movable assembly comprises a vertical upright rod, a vertical lead screw is arranged on the vertical upright rod, a vertical sliding block is arranged on the vertical lead screw, a first translation lead screw is arranged on the vertical sliding block, a horizontal sliding block is arranged on the first translation lead screw, a second translation lead screw vertically arranged with the first translation lead screw is arranged on the horizontal sliding block, the second translation lead screw is a bidirectional lead screw, two sections of threads of the second translation lead screw are respectively screwed with two matched sliding blocks, and clamping plates are respectively arranged on the matched sliding blocks.

3. The electronic component pin tin plating apparatus as recited in claim 2, wherein: the horizontal sliding block is provided with a rotating motor, an output shaft of the rotating motor is connected with a disc through a bearing, and the second translation screw rod is eccentrically arranged on the disc.

4. The electronic component pin tin plating apparatus as recited in claim 3, wherein: establish the lower spacing arch of going up spacing arch and being located the protruding below of upper limit on arbitrary grip block, go up spacing arch and lower spacing arch and all set up along grip block width direction, go up spacing arch and be equipped with the mounting groove with the equal interval in the spacing arch down, go up the corresponding setting of the bellied mounting groove of upper limit and lower spacing, the mounting groove sets up along grip block direction of height.

5. The electronic component pin tin plating apparatus as recited in claim 4, wherein: go up spacing arch and lower spacing arch and all follow the setting of grip block direction of height slip, simultaneously, be connected with the puller bolt between last spacing arch and the grip block, also be connected with the puller bolt between lower spacing arch and the grip block.

6. The electronic component pin tin plating apparatus as recited in claim 5, wherein: the upper limiting bulge and the lower limiting bulge are connected with first laser liquid level sensors, the signal output ends of the first laser liquid level sensors are connected with a microcontroller, and the microcontroller outputs signals to control the rotation of the vertical screw rod.

7. The electronic component pin tin plating apparatus as recited in any one of claims 1 to 6, wherein: the molten tin bath comprises a container body and a heating wire arranged in the container body, and the microcontroller outputs signals to control the work of the heating wire.

8. The electronic component pin tin plating apparatus as recited in claim 7, wherein: and a second laser liquid level sensor is arranged above the container body, the second laser liquid level sensor transmits the collected liquid level information to the microcontroller, and the microcontroller is connected with an acousto-optic alarm circuit.

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