CN214672595U - Multi-point bonding structure of lead frame - Google Patents
Multi-point bonding structure of lead frame Download PDFInfo
- Publication number
- CN214672595U CN214672595U CN202121026209.7U CN202121026209U CN214672595U CN 214672595 U CN214672595 U CN 214672595U CN 202121026209 U CN202121026209 U CN 202121026209U CN 214672595 U CN214672595 U CN 214672595U
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- China
- Prior art keywords
- lead frame
- bonding
- chip
- point
- bonding wire
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- Wire Bonding (AREA)
Abstract
The utility model discloses a multi-point bonding structure of lead frame for the middle part welding of every bonding wire of bonding is in the bonding point of chip, and the both ends of every bonding wire are welded two different solder joints at the lead frame respectively, and two solder joints of lead frame are not at same water flat line and same plumb line. The utility model discloses any bonding point that can ensure the chip all has reliable and simple electricity to be connected with the lead frame, and the bonding wire of this end of chip need not be cuted moreover, can not destroy the chip owing to cut the maloperation.
Description
Technical Field
The utility model relates to a lead frame structure shape that microelectronics trade used.
Background
The lead frame is used as a chip carrier of an integrated circuit, and is a key structural member which realizes the electrical connection between the leading-out end of an internal circuit of a chip and an external lead by means of bonding materials (gold wires, aluminum wires and copper wires) to form an electrical circuit. The lead frame plays a role of a bridge connected with an external wire, and most of semiconductor integrated blocks need to use the lead frame, which is an important basic material in the electronic information industry.
The lead frame is mainly produced by a die stamping method and a chemical etching method and mainly comprises a chip carrying area (carrying a chip), pins (connecting an external circuit) and a side rib (cutting off at the later stage).
Disclosure of Invention
The purpose of the invention is as follows:
the multi-point bonding structure of the lead frame is reliable in connection of bonding materials without changing the structure of the lead frame.
The technical scheme is as follows:
in the multi-point bonding structure of the lead frame, the middle part of each bonding wire (bonding materials such as gold wire, silver wire, aluminum wire, copper wire and the like) is welded at the bonding point of a chip (one chip can have 2 or 3 bonding points, for example, a triode chip, and then a base electrode, a collector electrode and an emitter electrode are respectively connected with different bonding wires); the middle part can be a sharp corner point or a segment of line segment according to the size of a chip bonding point, and the connection is firmer at the moment.
Two ends of each bonding wire are respectively welded at two different welding points of the lead frame, when one welding point is bonded and is desoldered, the other welding point is not desoldered, and the bonding wire can be reliably connected with the lead frame.
The two welding points of the lead frame can be slightly staggered and are not positioned on the same horizontal line and the same plumb line, so that the two welding points are separated by a certain distance and basically do not contact or overlap each other.
Has the advantages that:
the utility model discloses such bonded structure can ensure that arbitrary bonding point of chip all has reliable and simple electricity to be connected with the lead frame, need not increase the quantity of bonding wire moreover, and the bonding wire of this end of chip does not need to be cuted moreover, can not destroy the chip because shearing tool's maloperation. Two ends of a traditional bonding wire are welded in a single-point mode, one section of the traditional bonding wire is bonded to a chip bonding point, the other section of the traditional bonding wire is bonded to a lead frame, and the length exceeding the length needs to be cut off respectively.
Drawings
FIG. 1 is a schematic structural view of the present invention applied to a workpiece;
in the figure, 1-slide holder; 2-positioning the hole; 3-upper edge bead (to be cut off); 4-lower positioning holes; 5-pin; 6-lower edge rib; 7-one solder joint; 8-another welding spot; 9-a bond site; 20-lead.
Detailed Description
The multi-point bonding structure of the lead frame shown in fig. 1 is used for connecting a chip and the lead frame, the middle part of each bonding wire is welded at the bonding point of the chip, the two ends of each bonding wire are respectively welded at two different welding points of the lead frame, and the two welding points can be slightly dislocated, are not on the same horizontal line and are not on the same plumb line.
Claims (3)
1. A multi-point bonding structure of a lead frame is used for connecting a chip and the lead frame, and is characterized in that: the middle part of each bonding wire is welded at the bonding point of the chip, and the two ends of each bonding wire are respectively welded at two different welding points of the lead frame.
2. The multi-bond structure of a lead frame of claim 1, wherein: the middle part of each bonding point is a line segment.
3. The multi-bonding structure of a lead frame according to claim 1 or 2, characterized in that: two welding points of the lead frame can be slightly staggered and are not on the same horizontal line or the same plumb line.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121026209.7U CN214672595U (en) | 2021-05-14 | 2021-05-14 | Multi-point bonding structure of lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121026209.7U CN214672595U (en) | 2021-05-14 | 2021-05-14 | Multi-point bonding structure of lead frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214672595U true CN214672595U (en) | 2021-11-09 |
Family
ID=78475874
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121026209.7U Active CN214672595U (en) | 2021-05-14 | 2021-05-14 | Multi-point bonding structure of lead frame |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214672595U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116698878A (en) * | 2023-05-26 | 2023-09-05 | 广州丰江微电子有限公司 | Lead frame plating layer detection equipment and detection method thereof |
-
2021
- 2021-05-14 CN CN202121026209.7U patent/CN214672595U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116698878A (en) * | 2023-05-26 | 2023-09-05 | 广州丰江微电子有限公司 | Lead frame plating layer detection equipment and detection method thereof |
| CN116698878B (en) * | 2023-05-26 | 2024-02-13 | 广州丰江微电子有限公司 | Lead frame plating layer detection equipment and detection method thereof |
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