CN214670078U

CN214670078U - Coating device of tackifier

Info

Publication number: CN214670078U
Application number: CN202121253265.4U
Authority: CN
Inventors: 龚雪玲; 陈宇; 高孝琴
Original assignee: Yangzhou Jingxin Electronic Co ltd
Current assignee: Yangzhou Jingxin Electronic Co ltd
Priority date: 2021-06-04
Filing date: 2021-06-04
Publication date: 2021-11-09
Anticipated expiration: 2031-06-04

Abstract

The utility model discloses a coating unit of tackifier includes: the inner cavity is formed in the container, the air inlet pipe and the air outlet pipe are respectively arranged on the container, the wafer rack is arranged in the inner cavity and used for placing silicon wafers, the vessel is arranged in the inner cavity and used for containing a tackifier. The exhaust pipe exhausts the air in the inner cavity, so that the inner cavity is in a negative pressure state, and the tackifier is slightly adsorbed on the surface of the silicon wafer after being volatilized in a negative pressure environment, so that the purposes of reducing the using amount of the tackifier and coating the tackifier on the surface of the silicon wafer are achieved.

Description

Coating device of tackifier

Technical Field

The utility model relates to a semiconductor discrete device chip makes technical field, in particular to coating unit of tackifier.

Background

Photoetching is an important process in the manufacturing process of a semiconductor chip, and the thickness of a photoetching line represents the advanced degree of manufacturing of the semiconductor chip; the quality of the photoetching quality determines the qualified rate of products to a great extent. As a silicon material device, the surface of the photoresist, silicon and SiO2 must be firmly attached, especially when a deep groove is etched on the silicon, the etching time is long, and if the photoresist is not firmly attached, the photoresist is easily washed by corrosive liquid to be stripped, so that the pattern is damaged, and the product yield is seriously reduced.

In order to enhance the adhesion between the silicon wafer and the photoresist, the prior art method is to coat a layer of adhesion promoter Hexamethyldisilazane (also called Hexamethyldisilazane, abbreviated as HMDS) on the surface of the silicon wafer before the photoresist is coated. The tackifier is liquid at normal temperature, and can be coated on the surface of a silicon wafer in a dropping liquid rotating mode by using a glue evening machine, and the method has the following defects: the waste is caused, each silicon chip consumes about 1ml of tackifier, most of the tackifier is thrown away from the silicon chip and only a little remains on the silicon chip, and residual liquid cannot be reused after being discharged, thereby causing environmental pollution.

SUMMERY OF THE UTILITY MODEL

This application can realize practicing thrift the purpose of tackifier material through providing the coating unit of tackifier.

The embodiment of the application provides a coating unit of tackifier, includes:

the container is provided with an inner cavity, and an air inlet pipe and an air outlet pipe are respectively arranged on the container;

the wafer frame is arranged in the inner cavity and used for placing a silicon wafer;

a vessel, the vessel set up in the inner chamber, the vessel is used for holding the tackifier.

On the basis of the technical scheme, the utility model discloses can also do as follows the improvement:

further: further comprising: the support, the support set up in the inner chamber, the piece frame set up in on the support. The beneficial effect of this step: the support supports the sheet frame in the middle of the inner cavity, so that tackifier gas can be filled around the sheet frame.

Further: the vessel is arranged below the support. The beneficial effect of this step: so that the volatile gas in the vessel moves from bottom to top, and then passes through the upper rack as much as possible.

Further: a plurality of air passing holes are formed in the support. The beneficial effect of this step: the influence of the support on the gas flow is reduced through the air passing hole.

Further: and the air inlet pipe and the air outlet pipe are respectively provided with a valve for controlling on-off.

Further: the container includes: the gas inlet pipe and the gas outlet pipe are respectively connected with the cover.

Compared with the prior art, the beneficial effects of the utility model reside in that: the exhaust pipe exhausts the air in the inner cavity, so that the inner cavity is in a negative pressure state, and the tackifier is slightly adsorbed on the surface of the silicon wafer after being volatilized in a negative pressure environment, so that the purposes of reducing the using amount of the tackifier and coating the tackifier on the surface of the silicon wafer are achieved.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the embodiments or the technical solutions in the prior art will be briefly described below. Throughout the drawings, like elements or portions are generally identified by like reference numerals. In the drawings, elements or portions are not necessarily drawn to scale.

Fig. 1 is a schematic structural diagram of the present invention.

Wherein,

1 container, 101 inner cavity, 102 cover, 103 body;

2, a sheet frame;

3, vessels;

4, air inlet pipe;

5, an air outlet pipe;

6, a silicon wafer;

7, a valve;

8 supports, 801 transverse plates, 802 vertical plates and 803 air holes.

Detailed Description

In this application, unless expressly stated or limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integral; the mechanical connection can be realized by selecting a proper connection mode in the prior art, such as welding, riveting, threaded connection, bonding, pin connection, key connection, elastic deformation connection, buckle connection, interference connection and injection molding; or an electrical connection, transmitting energy or signals by electricity; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

DETAILED DESCRIPTION OF EMBODIMENT (S) OF INVENTION

As shown in fig. 1, an apparatus for applying a tackifier includes: container 1, rack 2, household utensils 3, inner chamber 101 has been seted up to container 1, is provided with intake pipe 4 and outlet duct 5 on the container 1 respectively, and rack 2 sets up in inner chamber 101, and rack 2 is used for placing silicon chip 6, and household utensils 3 sets up in inner chamber 101, and household utensils 3 is used for holding the tackifier.

As shown in fig. 1, among others, a container 1 includes: a cover 102 and a body 103, wherein the cover 102 is mounted on the body 103, the cavity 101 is opened in the body 103, and the cavity 101 is sealed by the cover 102, for example, by adopting a structure that one end of the cover 102 is hinged to the body 103, the cover 102 is connected with the body 103 by a buckle, and a sealing member (such as a sealing ring or a sealing strip) is arranged between the joint surfaces of the cover 102 and the body 103, so that when the cover 102 is covered on the body 103, the sealing between the cover 102 and the body 103 is realized by the sealing member; intake pipe 4, outlet duct 5 is connected respectively in ware lid 102, outlet duct 5 is connected with air extraction equipment, if be connected with the vacuum system in the factory building, make to be the negative pressure state in inner chamber 101 through bleeding, in addition also can be alone with vacuum pump connection, make the tackifier volatilize more easily through the evacuation, intake pipe 4 still installs the valve 7 that is used for controlling the break-make respectively with outlet duct 5, the meaning that sets up valve 7 lies in, when outlet duct 5 is connected with the vacuum system in the factory building, because the vacuum system in the factory building is in operating condition always, thereby need control the break-make of vacuum system and inner chamber 101 through valve 7.

As shown in fig. 1, the coating apparatus further includes: support 8, support 8 sets up in inner chamber 101, sheet frame 2 sets up on support 8, support 8 includes diaphragm 801, riser 802 is connected in diaphragm 801's below, support diaphragm 801 in inner chamber 101 middle part through riser 802, sheet frame 2 is placed on diaphragm 801, household utensils 3 are uncovered structure, household utensils 3 are placed under diaphragm 801, a plurality of gas holes 803 have been seted up on the support 8, be convenient for reduce the gaseous motion production's of tackifier that volatilizees in support 8 to household utensils 3 and block, and is concrete, support 8 can adopt the grid board to make, thereby very big reduction support 8 is to the interference of gas motion.

As shown in fig. 1, a plurality of slots are arranged on the wafer frame 2 at intervals in the transverse direction, the slots are used for inserting the silicon wafers 6, and intervals are arranged among the silicon wafers 6, so that tackifier gas diffused in the inner cavity 101 can be attached to the surfaces of the silicon wafers 6 after passing through the intervals, through grooves are further formed in the bottom surface and the side wall of the wafer frame 2, and the HMDS gas can be conveniently diffused into the intervals through the through grooves.

When the tackifier coating device is used, the following steps are adopted:

s1, adding a proper amount of tackifier liquid into the vessel, placing the vessel at the central position in the container, and then placing the support in the inner cavity;

s2, inserting the silicon wafer to be coated on the wafer rack, placing the silicon wafer on a support inside the container, and covering the silicon wafer with a cover;

s3, opening a valve on the air outlet pipe, keeping the valve on the air inlet pipe closed, and exhausting air from the inner cavity through a vacuum system (the vacuum system requires that the vacuum negative pressure is 50-70 cmHg);

s4, after air is extracted for 15 minutes, closing a valve on the air outlet pipe, and opening a valve on the air inlet pipe to balance the air pressure in the inner cavity with the external air pressure;

and S5, opening the cover after waiting for two minutes, and taking out the silicon wafer together with the wafer rack.

Practice proves that 50ml of tackifier is added according to the existing device, after 5000 silicon wafers with the diameter of 100mm are processed cumulatively for 20-25 days, the tackifier is volatilized, 0.01ml of tackifier is consumed by each silicon wafer on average, the amount of tackifier is only 1% of the amount of tackifier directly coated in a dropping liquid rotating mode, and material consumption is greatly saved. The photoresist coated by the method is firmly combined with the silicon wafer, is used for masking and corroding a deep groove with the thickness of 70 mu m, and still obtains a perfect pattern.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; such modifications and substitutions do not substantially depart from the scope of the embodiments of the present invention, and are intended to be covered by the claims and the specification.

Claims

1. An adhesion promoter applicator, comprising:

2. The coating apparatus of claim 1, further comprising: the support, the support set up in the inner chamber, the piece frame set up in on the support.

3. A coating apparatus as in claim 2, wherein said vessel is disposed below said support.

4. The coating apparatus as claimed in claim 2, wherein the support has a plurality of air holes formed therein.

5. The coating device as claimed in claim 1, wherein the air inlet pipe and the air outlet pipe are respectively provided with a valve for controlling on-off.

6. A coating apparatus as in claim 1, wherein said container comprises: the gas inlet pipe and the gas outlet pipe are respectively connected with the cover.