CN214669969U

CN214669969U - LED heat dissipation backlight unit

Info

Publication number: CN214669969U
Application number: CN202022815178.5U
Authority: CN
Inventors: 谭继波; 王成宝
Original assignee: Shenzhen Kichy Liquid Crystal Display Technology Co ltd
Current assignee: Shenzhen Kichy Liquid Crystal Display Technology Co ltd
Priority date: 2020-11-27
Filing date: 2020-11-27
Publication date: 2021-11-09
Anticipated expiration: 2030-11-27

Abstract

The utility model relates to a LED backlight unit technical field that dispels heat just discloses a LED backlight unit that dispels heat, including the chase, the top of chase is provided with anti-the piece of sweeping, the top of anti-sweeping the piece is provided with glues the frame, the top of gluing the frame is provided with the light guide plate, the top of light guide plate is provided with the diffusion barrier, the top of diffusion barrier is provided with down the brightness enhancement piece. This LED backlight unit dispels heat, because the coefficient of heat conductivity of graphite alkene is 5300W/(mk), the thickness of graphite alkene dope layer is 20 ~ 50 mu m, the chase can the high heat radiation performance and the effect of high heat conductivity performance of full play graphite alkene, distribute away the heat that the LED subassembly produced, tear centrifugal paper during production and paste the FPC board of LED subassembly on the chase, let the two fully contact, there is better heat conductivity than original subsides on the shading glue, constitute LCM display module when this heat dissipation backlight unit is in the same place with LCD laminating, install the back of working on equipment, high-efficient radiating effect has been reached.

Description

LED heat dissipation backlight unit

Technical Field

The utility model relates to a LED backlight unit that dispels heat technical field specifically is a LED backlight unit that dispels heat.

Background

The TFT liquid crystal display screen has the characteristics of low power consumption, high definition, long service life, light weight, good optical property and the like, is an ideal display device at present, and is widely applied to various instruments and meters.

Liquid crystal displays are passive light emitting elements and the display screen itself does not emit light but is illuminated by a backlight system underneath it. The backlight source and the liquid crystal display screen are combined together to form the liquid crystal display module. The liquid crystal backlight is a planar uniform lighting device, and the LED light bars as light sources are arranged on one side of the whole backlight source.

The light source, the light guide plate, the reflector plate and the optical film form a backlight source of the liquid crystal display. When the light emitted by the liquid crystal display panel irradiates on the liquid crystal display panel, the light can upwards penetrate through the lower polarizing plate, and the light can be converted into the polarization direction according to the mechanism of the different liquid crystal display panels. Then the light contacts the color filter to generate color, and finally enters the upper polaroid. After the polarization direction is converted by the liquid crystal, part of light can be emitted, and part of light can be absorbed. Each pixel on the whole liquid crystal panel can respectively determine the intensity of the emergent light, so that an image is generated.

The step of updating hardware facilities in the mobile phone is accelerated continuously, the heat dissipation requirement on the mobile phone is also improved continuously, and poor heat dissipation can cause the temperature in the mobile phone and the temperature of the rear cover to be too high, so that the service life of hardware and a power supply of the mobile phone is influenced.

The development of technology is more and more advanced, and the trend of electronic devices is more and more light and thin, and the trend of internal electronic components is more and more sophisticated, so that the difficulty of heat dissipation of the internal components is increased, and the electrical characteristics among the components must be considered to avoid short circuit, especially the problem of heat generation is related to the life of the product and the amount of energy required for the performance of the product. In view of the above, a better heat dissipation mechanism is needed to solve the high heat problem of the electronic products with small size and light weight.

Therefore, the applicant proposes an LED heat dissipation backlight module to solve the above-mentioned problem of the prior art that the conventional LED backlight module does not have a heat dissipation function.

SUMMERY OF THE UTILITY MODEL

Technical problem to be solved

Not enough to prior art, the utility model provides a LED heat dissipation backlight unit possesses advantages such as heat dissipation function, has solved the problem that traditional LED backlight unit who mentions in the above-mentioned background art does not possess the heat dissipation function.

(II) technical scheme

In order to achieve the above object, the utility model provides a following technical scheme: an LED heat-dissipation backlight module comprises an iron frame, wherein a reverse sweeping sheet is arranged at the top of the iron frame, a rubber frame is arranged at the top of the reverse sweeping sheet, a light guide plate is arranged at the top of the rubber frame, a diffusion film is arranged at the top of the light guide plate, a lower brightness enhancement sheet is arranged at the top of the diffusion film, an upper brightness enhancement sheet is arranged at the top of the lower brightness enhancement sheet, light shielding glue is arranged at the top of the upper brightness enhancement sheet, an LED assembly is pasted on the upper brightness enhancement sheet, a graphene adhesive is arranged between the LED assembly and the rubber frame, a graphene coating layer is arranged at the bottom of the iron frame, and centrifugal paper is arranged at the top of the graphene adhesive;

the LED assembly comprises an FPC board, and an LED lamp is welded on the FPC board.

Preferably, the thickness of the graphene coating layer is 20-50 μm.

Preferably, the projection area of the centrifugal paper is equal to the projection area of the FPC board.

Preferably, the centrifugal paper is not present at the same time as the FPC board.

Compared with the prior art, the utility model provides a LED heat dissipation backlight unit possesses following beneficial effect:

1. this LED backlight unit dispels heat, because the coefficient of heat conductivity of graphite alkene is 5300W/(mk), the thickness of graphite alkene dope layer is 20 ~ 50 mu m, the chase can the high heat radiation performance and the effect of high heat conductivity performance of full play graphite alkene, distribute away the heat that the LED subassembly produced, tear centrifugal paper during production and paste the FPC board of LED subassembly on the chase, let the two fully contact, there is better heat conductivity than original subsides on the shading glue, constitute LCM display module when this heat dissipation backlight unit is in the same place with LCD laminating, install the back of working on equipment, high-efficient radiating effect has been reached.

2. This LED backlight unit that dispels heat through setting up graphite alkene adhesive, graphite alkene dope layer and centrifugal paper, makes LED subassembly and graphite alkene adhesive fully contact through tearing centrifugal paper when using to carry out high-efficient heat conduction through graphite alkene dope layer, overall structure and production technology are all simple.

Drawings

FIG. 1 is a diagram of a conventional backlight module;

FIG. 2 is a side view of a conventional backlight module;

FIG. 3 is a side view of the heat-dissipating backlight module of the present invention;

fig. 4 is an enlarged side view of the bezel of the heat-dissipating backlight module of the present invention.

Wherein: 101. an iron frame; 102. reversely sweeping the sheet; 103. a rubber frame; 104. a light guide plate; 105. a diffusion membrane; 106. a lower brightness enhancement film; 107. an upper brightness enhancement film; 108. shading glue; 109. an LED assembly; 1091. an LED lamp; 1092. an FPC board; 201. a graphene adhesive; 202. a graphene coating layer; 203. centrifuging the paper.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-4, an LED heat dissipation backlight module includes an iron frame 101, a reverse scanning sheet 102 is disposed on the top of the iron frame 101, a rubber frame 103 is disposed on the top of the reverse scanning sheet 102, a light guide plate 104 is disposed on the top of the rubber frame 103, a diffusion film 105 is disposed on the top of the light guide plate 104, a lower brightness enhancement film 106 is disposed on the top of the diffusion film 105, an upper brightness enhancement film 107 is disposed on the top of the lower brightness enhancement film 106, a light shielding adhesive 108 is disposed on the top of the upper brightness enhancement film 107, an LED assembly 109 is adhered on the upper brightness enhancement film 107, a graphene adhesive 201 is disposed between the LED assembly 109 and the rubber frame 103, a graphene coating layer 202 is disposed on the bottom of the iron frame 101, and centrifugal paper 203 is disposed on the top of the graphene adhesive 201;

the LED assembly 109 includes an FPC board 1092, and an LED lamp 1091 is soldered to the FPC board 1092.

According to the technical scheme, the heat conductivity coefficient of graphene is 5300W/(mk), the thickness of the graphene coating layer 202 is 20-50 microns, the iron frame 101 can fully exert the functions of high heat radiation performance and high heat conductivity of the graphene, heat generated by the LED assembly 109 is dissipated, the centrifugal paper 203 is torn off to paste the FPC board 1092 of the LED assembly 109 on the iron frame 101 during production, the FPC board and the iron frame 101 are in full contact, the heat conductivity is better than that of the heat conductivity achieved by original pasting on the light shielding glue 108, when the heat dissipation backlight module and the LCD are pasted together, an LCM display module is formed, and after the heat dissipation backlight module is mounted on equipment and works, the efficient heat dissipation effect is achieved; the backlight module is characterized in that the structure except the graphene adhesive 201, the graphene coating layer 202 and the centrifugal paper 203 is the inherent structure of a common backlight module, and the connection modes are mature technologies.

Specifically, the thickness of the graphene coating layer 202 is 20-50 μm.

Through above-mentioned technical scheme, the thickness of graphite alkene dope layer 202 can not influence the whole thickness of whole device when the installation.

Specifically, the projection area of the centrifugal paper 203 is equal to the projection area of the FPC board 1092.

Through the technical scheme, the FPC board 1092 can be in complete contact with the graphene adhesive 201, so that the heat dissipation effect of the device is improved.

Specifically, the centrifugal paper 203 and the FPC board 1092 are not present at the same time.

Through the technical scheme, the centrifugal paper 203 is used for preventing the graphene adhesive 201 from being adhered in the production process, and the centrifugal paper 203 can be torn off when the FPC board 1092 is installed, so that the FPC board 1092 can be completely attached to the graphene adhesive 201.

When the LED module is used, the centrifugal paper 203 is torn off during production, the FPC 1092 of the LED module 109 is adhered to the iron frame 101, the LED module and the FPC are in full contact, and when the heat dissipation backlight module and the LCD are adhered together, the LCM display module is formed.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a LED backlight unit that dispels heat, includes chase (101), its characterized in that: the LED backlight module is characterized in that a reverse scanning sheet (102) is arranged at the top of the iron frame (101), a rubber frame (103) is arranged at the top of the reverse scanning sheet (102), a light guide plate (104) is arranged at the top of the rubber frame (103), a diffusion film (105) is arranged at the top of the light guide plate (104), a lower light intensifying sheet (106) is arranged at the top of the diffusion film (105), an upper light intensifying sheet (107) is arranged at the top of the lower light intensifying sheet (106), a light shielding adhesive (108) is arranged at the top of the upper light intensifying sheet (107), an LED assembly (109) is adhered to the upper light intensifying sheet (107), a graphene adhesive (201) is arranged between the LED assembly (109) and the rubber frame (103), a graphene coating layer (202) is arranged at the bottom of the iron frame (101), and centrifugal paper (203) is arranged at the top of the graphene adhesive (201);

the LED component (109) comprises an FPC board (1092), and an LED lamp (1091) is welded on the FPC board (1092).

2. The LED heat dissipation backlight module of claim 1, wherein: the thickness of the graphene coating layer (202) is 20-50 mu m.

3. The LED heat dissipation backlight module of claim 1, wherein: the projection area of the centrifugal paper (203) is equal to the projection area of the FPC board (1092).

4. The LED heat dissipation backlight module of claim 1, wherein: the centrifugal paper (203) and the FPC board (1092) do not exist at the same time.