CN214645114U - Double-layer extruded plastic mold with strong heat dissipation effect - Google Patents
Double-layer extruded plastic mold with strong heat dissipation effect Download PDFInfo
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- CN214645114U CN214645114U CN202120463930.6U CN202120463930U CN214645114U CN 214645114 U CN214645114 U CN 214645114U CN 202120463930 U CN202120463930 U CN 202120463930U CN 214645114 U CN214645114 U CN 214645114U
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Abstract
The utility model discloses a double-deck extruded plastic mould that radiating effect is strong, comprising a main body, the top welding of main part has four support columns, and the top welding of support column has the roof, and the bottom of roof is equipped with the hydraulic pump, and the bottom of hydraulic pump is equipped with the mould, the top of main part is equipped with the lower mould, and the outside of lower mould is equipped with the cooler bin, and the both sides of cooler bin all are equipped with the connecting pipe, the bottom of main part is equipped with the collecting box, and a plurality of water conservancy diversion holes have been seted up at the top of collecting box, and the water conservancy diversion hole runs through the main part to extend to the inside of cooler bin. The utility model discloses a hydraulic pump makes and goes up the mould decline, and the coolant liquid of collecting box passes through among the connecting pipe gets into the cooler bin to carry out comprehensive cooling treatment to the lower mould, coolant liquid after the cooling simultaneously can get into the inside of collecting box once more through the water conservancy diversion hole, can carry out cyclic utilization, and the coolant liquid of water conservancy diversion downthehole portion can be carried out the cooling by the main part and handle, thereby the coolant liquid after the convenient to use carries out circulative cooling.
Description
Technical Field
The utility model relates to a plastic processing technology field especially relates to a double-deck extruded plastic mould that radiating effect is strong.
Background
The plastic mould is a combined mould for compression moulding, extrusion moulding, injection, blow moulding and low-foaming moulding, and can be used for processing a series of plastic parts with different shapes and sizes
Through the retrieval, chinese patent publication is CN 210758675U's patent, discloses a double-deck extruded plastic mould that radiating effect is strong, including base and lower mould, circulating water pump is installed to one side of base, and one side of circulating water pump installs the outlet pipe, the water storage tank is installed to the below of outlet pipe, and the inside upper and lower both sides of water storage tank all install the stainless steel filter screen, the inside of lower mould is provided with the aluminum pipe, and the lower mould is located the top of base, the cooling tank is installed to the opposite side of base, and the below of cooling tank installs the back flow, coupling spring is installed to the top of lower mould, and coupling spring's inside runs through there is the connecting pin.
The strong double-deck extruded plastic mould of radiating effect in above-mentioned patent exists following not enough: dispel the heat through the winding aluminum pipe, the radiating effect is relatively poor, can't carry out comprehensive heat dissipation to the device.
SUMMERY OF THE UTILITY MODEL
The utility model aims at solving the defects existing in the prior art and providing a double-layer extruded plastic mold with strong heat dissipation effect.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
the utility model provides a double-deck extruded plastic mould that radiating effect is strong, includes the main part, the top welding of main part has four support columns, and the top welding of support column has the roof, and the bottom of roof is equipped with the hydraulic pump, and the bottom of hydraulic pump is equipped with the mould, the top of main part is equipped with the lower mould, and the outside of lower mould is equipped with the cooler bin, and the both sides of cooler bin all are equipped with the connecting pipe, the bottom of main part is equipped with the collecting box, and a plurality of water conservancy diversion holes have been seted up at the top of collecting box, and the water conservancy diversion hole runs through the main part to extend to the inside of cooler bin.
Furthermore, a plurality of grooves are formed in the top end of the main body, springs are arranged inside the grooves, positioning columns are welded to the top ends of the springs, and the top ends of the positioning columns are welded to the lower die.
Furthermore, a water pump is arranged in the middle of the connecting pipe.
Furthermore, the outside welding of lower mould has a plurality of guide plates, and the guide plate is the heliciform, the water conservancy diversion hole is the slope form.
Further, a heat dissipation plate is welded at the bottom of the main body.
Further, a sponge block is arranged inside the collecting box, a first through hole is formed in the bottom of the collecting box, and a sealing plug is arranged at the first through hole.
Furthermore, a cooling box is welded at the bottom of the main body, a cooling pipe is arranged in the cooling box and is in a spiral shape, one end of the cooling pipe is fixedly connected with the connecting pipe, and the other end of the cooling pipe extends to the inside of the collecting box.
Further, a semiconductor condensation plate is arranged inside the cooling box.
Furthermore, rubber rings are bonded to the top and the inner top end of the cooling box, and the rubber rings are located outside the lower die.
The utility model has the advantages that:
1. the upper die is lowered by the hydraulic pump through the arrangement of the cooling box, the connecting pipe and the flow guide hole, the cooling liquid of the collecting box enters the cooling box through the connecting pipe, so that the lower die is comprehensively cooled, and meanwhile, the cooled cooling liquid can enter the collecting box again through the flow guide hole and can be recycled;
2. by arranging the spring, when the upper die descends, the lower die is pushed to descend, so that the spring is compressed, and the upper die and the lower die are more attached by the spring;
3. the spiral guide plate and the inclined guide holes are arranged, so that the cooling liquid entering the cooling box can move downwards around the lower die by the spiral guide plate, the lower die is cooled and radiated comprehensively, and the contact time of the cooling liquid and the main body is prolonged conveniently by the inclined guide holes, so that the used cooling liquid is radiated better;
4. by arranging the sponge block and the sealing plug, the sponge block can filter the cooling liquid, and the cooling liquid can be discharged after the sealing plug is opened, so that the cooling liquid is convenient to replace;
5. by arranging the spiral cooling pipe, circulating cooling liquid can pass through the cooling pipe, so that the cooling liquid is subjected to heat dissipation treatment by the spiral cooling pipe, the heat dissipation effect is further enhanced, and the temperature in the cooling box can be reduced by electrifying the semiconductor condensation plate, so that the heat dissipation of the cooling pipe is facilitated;
6. through setting up the rubber circle, the rubber circle is in the outside of lower mould, and the rubber circle can prevent that the coolant liquid from spilling.
Drawings
Fig. 1 is a front sectional view of a dual-layer extruded plastic mold with a strong heat dissipation effect according to embodiment 1;
fig. 2 is a schematic cross-sectional view of a double-layer extruded plastic mold with a strong heat dissipation effect in embodiment 1;
fig. 3 is a schematic cross-sectional view of a double-layer extruded plastic mold with a strong heat dissipation effect in embodiment 2.
In the figure: the device comprises a main body 1, a support column 2, a cooling box 3, a flow guide plate 4, a lower die 5, an upper die 6, a movable plate 7, a hydraulic pump 8, a top plate 9, a connecting pipe 10, a semiconductor condensation plate 11, a cooling box 12, a cooling pipe 13, a collection box 14, a sponge block 15, a heat dissipation plate 16, a sealing plug 17, a spring 18, a positioning column 19, a flow guide hole 20 and a rubber ring 21.
Detailed Description
The technical solution of the present patent will be described in further detail with reference to the following embodiments.
Reference will now be made in detail to embodiments of the present patent, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present patent and are not to be construed as limiting the present patent.
In the description of this patent, it is to be understood that the terms "center," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in the orientations and positional relationships indicated in the drawings for the convenience of describing the patent and for the simplicity of description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and are not to be considered limiting of the patent.
In the description of this patent, it is noted that unless otherwise specifically stated or limited, the terms "mounted," "connected," and "disposed" are to be construed broadly and can include, for example, fixedly connected, disposed, detachably connected, disposed, or integrally connected and disposed. The specific meaning of the above terms in this patent may be understood by those of ordinary skill in the art as appropriate.
Example 1
Referring to fig. 1-2, a double-layer extruded plastic mold with a strong heat dissipation effect comprises a main body 1, four support columns 2 are welded on the top end of the main body 1, a top plate 9 is welded on the top end of each support column 2, a hydraulic pump 8 is arranged at the bottom of each top plate 9, an upper mold 6 is arranged at the bottom of each hydraulic pump 8, a lower mold 5 is arranged at the top end of the main body 1, a cooling box 3 is arranged outside each lower mold 5, connecting pipes 10 are arranged on two sides of each cooling box 3, a collecting box 14 is arranged at the bottom of the main body 1, a plurality of flow guide holes 20 are formed in the top of each collecting box 14, each flow guide hole 20 penetrates through the main body 1 and extends into the cooling box 3, the upper mold 6 descends through the hydraulic pump 8, cooling liquid of the collecting box 14 enters the cooling box 3 through the connecting pipes 10, so that the lower molds 5 are comprehensively cooled, and the cooled liquid can enter the collecting box 14 again through the flow guide holes 20, can carry out cyclic utilization, the inside coolant liquid of water conservancy diversion hole 20 can be carried out the heat dissipation by main part 1 and handle to the coolant liquid of being convenient for carries out circulative cooling.
Wherein, a plurality of recesses have been seted up on the top of main part 1, and the inside of recess is equipped with spring 18, and the top welding of spring 18 has reference column 19, and reference column 19's top and lower mould 5 welding, when going up mould 6 and descend, can promote lower mould 5 and descend, make the compression of spring 18, and spring 18 makes and goes up mould 6 and lower mould 5 and laminate more.
Wherein, the middle part of the connecting pipe 10 is provided with a water pump (not shown in the figure), which can extract the cooling liquid in the collecting tank 14 and fill the cooling tank 3, thereby recycling the cooling liquid.
Wherein, the outside welding of lower mould 5 has a plurality of guide plates 4, guide plate 4 is the heliciform, water conservancy diversion hole 20 is the slope form, it can make the coolant liquid that gets into 3 insides of cooler bin round 5 downstream of lower mould to be spiral helicine guide plate 4, thereby carry out comprehensive cooling heat dissipation to lower mould 5, the water conservancy diversion hole 20 that is the slope form is convenient for prolong the contact time of coolant liquid and main part 1, thereby the better coolant liquid to after using dispels the heat.
Wherein, the bottom welding of main part 1 has the heating panel 16, and the coolant liquid that water conservancy diversion hole 20 flowed out can flow on heating panel 16 to further heat dissipation handles, the coolant liquid cyclic utilization of being convenient for.
Wherein, the inside of collecting box 14 is equipped with sponge piece 15, and first through-hole has been seted up to the bottom of collecting box 14, and first through-hole department is equipped with sealing plug 17, and sponge piece 15 can carry out filtration treatment to the coolant liquid, can discharge the coolant liquid after sealing plug 17 is opened, the change of the coolant liquid of being convenient for.
Wherein, the welding of the bottom of main part 1 has cooling box 12, and the inside of cooling box 12 is equipped with cooling tube 13, and cooling tube 13 is the heliciform, and the one end and the connecting pipe 10 fixed connection of cooling tube 13, the other end of cooling tube 13 extend to the inside of collecting box 14, and the cooling tube 13 can be passed through to the circulating coolant liquid to by the inside heat dissipation treatment of heliciform cooling tube 13, further reinforcing radiating effect.
Wherein, the inside of cooling box 12 is equipped with semiconductor condensation board 11, through for semiconductor condensation board 11 circular telegram, can make the inside temperature of cooling box 12 reduce to be convenient for the heat dissipation of cooling tube 13.
The working principle is as follows: the upper die 6 is lowered through the hydraulic pump 8, the cooling liquid of the collecting box 14 enters the cooling box 3 through the connecting pipe 10, so that the lower die 5 is comprehensively cooled, and meanwhile, the cooled cooling liquid can enter the collecting box 14 again through the flow guide holes 20 and can be recycled, and the cooling liquid in the flow guide holes 20 can be subjected to heat dissipation treatment by the main body 1, so that the cooling liquid can be conveniently cooled circularly;
when the upper die 6 descends, the lower die 5 is pushed to descend, the spring 18 is compressed, and the upper die 6 is more attached to the lower die 5 through the spring 18;
the water pump can pump the cooling liquid in the collecting box 14 and fill the cooling box 3, so that the cooling liquid can be recycled;
the spiral flow guide plate 4 can enable the cooling liquid entering the cooling box 3 to move downwards around the lower die 5, so that the lower die 5 is cooled and radiated comprehensively, and the inclined flow guide holes 20 are convenient for prolonging the contact time of the cooling liquid and the main body 1, so that the used cooling liquid is better radiated;
the sponge block 15 can filter the cooling liquid, and the cooling liquid can be discharged after the sealing plug 17 is opened, so that the cooling liquid can be conveniently replaced;
the circulated cooling liquid passes through the cooling pipe 13 to be subjected to heat dissipation treatment by the spiral cooling pipe 13, so that the heat dissipation effect is further enhanced, and the temperature inside the cooling box 12 can be reduced by electrifying the semiconductor condensation plate 11, thereby facilitating the heat dissipation of the cooling pipe 13.
Example 2
Referring to fig. 3, compared with embodiment 1, in this embodiment, in order to increase the practicability of the device, the rubber ring 21 is bonded to the top and the inner top end of the cooling box 3, the rubber ring 21 is located outside the lower mold 5, and the rubber ring 21 can prevent the cooling liquid from leaking.
The working principle is as follows: the upper die 6 is lowered through the hydraulic pump 8, the cooling liquid of the collecting box 14 enters the cooling box 3 through the connecting pipe 10, so that the lower die 5 is comprehensively cooled, and meanwhile, the cooled cooling liquid can enter the collecting box 14 again through the flow guide holes 20 and can be recycled, and the cooling liquid in the flow guide holes 20 can be subjected to heat dissipation treatment by the main body 1, so that the cooling liquid can be conveniently cooled circularly;
when the upper die 6 descends, the lower die 5 is pushed to descend, the spring 18 is compressed, and the upper die 6 is more attached to the lower die 5 through the spring 18;
the water pump can pump the cooling liquid in the collecting box 14 and fill the cooling box 3, so that the cooling liquid can be recycled;
the spiral flow guide plate 4 can enable the cooling liquid entering the cooling box 3 to move downwards around the lower die 5, so that the lower die 5 is cooled and radiated comprehensively, and the inclined flow guide holes 20 are convenient for prolonging the contact time of the cooling liquid and the main body 1, so that the used cooling liquid is better radiated;
the sponge block 15 can filter the cooling liquid, and the cooling liquid can be discharged after the sealing plug 17 is opened, so that the cooling liquid can be conveniently replaced;
the circulated cooling liquid passes through the cooling pipe 13, so that the cooling liquid is subjected to heat dissipation treatment by the spiral cooling pipe 13, the heat dissipation effect is further enhanced, and the temperature in the cooling box 12 can be reduced by electrifying the semiconductor condensation plate 11, so that the heat dissipation of the cooling pipe 13 is facilitated;
the rubber ring 21 is positioned outside the lower mold 5, and the rubber ring 21 can prevent the cooling liquid from leaking.
The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.
Claims (9)
1. The utility model provides a double-deck extruded plastic mould that radiating effect is strong, includes main part (1), its characterized in that, four support columns (2) of top fixedly connected with of main part (1), top fixedly connected with roof (9) of support column (2), the bottom of roof (9) is equipped with hydraulic pump (8), and the bottom of hydraulic pump (8) is equipped with mould (6), the top of main part (1) is equipped with lower mould (5), and the outside of lower mould (5) is equipped with cooler bin (3), and the both sides of cooler bin (3) all are equipped with connecting pipe (10), the bottom of main part (1) is equipped with collecting box (14), and a plurality of water conservancy diversion holes (20) have been seted up at the top of collecting box (14), and water conservancy diversion hole (20) run through main part (1) to extend to the inside of cooler bin (3).
2. The double-layer extrusion plastic mold with strong heat dissipation effect as recited in claim 1, wherein a plurality of grooves are formed at the top end of the main body (1), springs (18) are arranged inside the grooves, positioning columns (19) are fixedly connected to the top ends of the springs (18), and the top ends of the positioning columns (19) are welded to the lower mold (5).
3. The double-layer extrusion plastic mold with strong heat dissipation effect as recited in claim 1, wherein a water pump is disposed in the middle of the connection pipe (10).
4. The double-layer extruded plastic mold with strong heat dissipation effect as recited in claim 1, wherein a plurality of flow deflectors (4) are fixedly connected to the outside of the lower mold (5), the flow deflectors (4) are spiral, and the flow guiding holes (20) are inclined.
5. The double-layer extrusion plastic mold with strong heat dissipation effect as claimed in claim 4, wherein a heat dissipation plate (16) is fixedly connected to the bottom of the main body (1).
6. The double-layer extruded plastic mold with the strong heat dissipation effect as recited in claim 1, wherein a sponge block (15) is arranged inside the collection box (14), a first through hole is formed in the bottom of the collection box (14), and a sealing plug (17) is arranged at the first through hole.
7. The double-layer extrusion plastic mold with strong heat dissipation effect as recited in claim 1, wherein a cooling box (12) is fixedly connected to the bottom of the main body (1), a cooling pipe (13) is disposed inside the cooling box (12), the cooling pipe (13) is spiral, one end of the cooling pipe (13) is fixedly connected to the connecting pipe (10), and the other end of the cooling pipe (13) extends to the inside of the collecting box (14).
8. The mold for plastic molding with high heat dissipation effect as claimed in claim 7, wherein the cooling box (12) is provided with a semiconductor cold plate (11) inside.
9. The double-layer extrusion plastic mold with strong heat dissipation effect as recited in claim 2, wherein rubber rings (21) are bonded to the top and the inner top end of the cooling box (3), and the rubber rings (21) are located outside the lower mold (5).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120463930.6U CN214645114U (en) | 2021-03-04 | 2021-03-04 | Double-layer extruded plastic mold with strong heat dissipation effect |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120463930.6U CN214645114U (en) | 2021-03-04 | 2021-03-04 | Double-layer extruded plastic mold with strong heat dissipation effect |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214645114U true CN214645114U (en) | 2021-11-09 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120463930.6U Active CN214645114U (en) | 2021-03-04 | 2021-03-04 | Double-layer extruded plastic mold with strong heat dissipation effect |
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| Country | Link |
|---|---|
| CN (1) | CN214645114U (en) |
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2021
- 2021-03-04 CN CN202120463930.6U patent/CN214645114U/en active Active
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